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Recurring problem after repasting Radeon RX580

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Hi,
I have the Sapphire RX 580 8GB OC Pulse graphics card (SKU# 11265-05-41G)


My problem is that after applying new thermal paste and new thermal pads my temperature remains normal (73C to 75C) for a month and then returns to abnormal temperatures after (82C to 84C).
If I repaste (keeping the thermal pads same) the problem goes away again but comes back again after a month or so; I have been doing this for some time now, not knowing what to do better.

Is the problem with the thermal paste or thermal pad thickness?
I have tried Corsair TM30 as well as Noctua NT-H1, both stop working; Corsair TM30 lasts a fortnight while Noctua NT-H1 a month.
This is what happens after a month:


Is this what is called a thermal paste pump out? If yes then what is causing it? I have to mention that my original thermal pads were thicker than the one I am using now, they were like .75mm and I am using
.5mm now. Could not find any .75mm thermal pads and flattening 1mm thermal pads still results in very high temperatures.
Should I put .15mm thermal pads on top of the .5mm thermal pads to make them .65mm thickness, is it recommended, I mean is it you guys normally do if thermal pad of desired thickness is not found? And
also, is it okay to combine two thermal pads of different thermal conductivity ratings (5W/mK and 3W/mK)?

I have been reading on techpowerup forums and came across this thread
Where poster nguyen makes comment about viscosity of thermal paste and poster AOne makes comment about max temperature of thermal paste. Could my problem be also related to the low viscosity and
less max operating temperature of both my thermal pastes?

So what should I do: change thermal pad thickness, change thermal paste or both?

Any help would be greatly appreciated, thank you!
 
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this is indeed "pump out"

normally it has two factors
Bad/cheap silicone thermal paste.
AND what is much more important. a light heatsink that expands more under thermal cycles and "pumps" out the thermal paste.

in your case i'd start with manually spreading the paste and use more paste. (make a thick layer and the paste that gets squeezed out over the edge of the die is like a barrier for the rest on the die.)
 
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way too much applied; tim is just to fill v.small gaps not to have a layer between chip&hs....
 
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this is indeed "pump out"

normally it has two factors
Bad/cheap silicone thermal paste.
AND what is much more important. a light heatsink that expands more under thermal cycles and "pumps" out the thermal paste.

in your case i'd start with manually spreading the paste and use more paste. (make a thick layer and the paste that gets squeezed out over the edge of the die is like a barrier for the rest on the die.)

I did use good amount of thermal paste sometimes even using a lot; you could see the thermal paste remnants on the SMDs well past the die in my second picture on the left side of it.
Is NTH1 considered a bad silicone thermal paste? Please do recommend one. What about max working temp and viscosity of the thermal paste?

way too much applied; tim is just to fill v.small gaps not to have a layer between chip&hs....
I have done this about 5 times this 5 months, used varying amounts from a small drop in the middle of the die to large amounts but same result, stops working after a month.
 
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I did use good amount of thermal paste sometimes even using a lot; you could see the thermal paste remnants on the SMDs well past the die in my second picture on the left side of it.
Is NTH1 considered a bad silicone thermal paste? Please do recommend one. What about max working temp and viscosity of the thermal paste?
the more you put the worse the result; as i mentioned you had to put a v. small amount ; a perfect contact for max. heat dissipation will have only traces of tim on chip and hs contact area....

basically all is swimming in tim there; you put more than needed and in one month that layer start to dry out and act as insulator...

check the flatness of hs also and if not flat make it
 
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I'd say this is a screw torque problem. There is a reason why they have a torque rating for every card, and your problem is tightly related to it. Did you modify the retention mechanism in any way, other than screwing too tight?
 
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I'd say this is a screw torque problem. There is a reason why they have a torque rating for every card, and your problem is tightly related to it. Did you modify the retention mechanism in any way, other than screwing too tight?
No did not modify the retention mechanism, also did not screw tight as well. The only changes are thermal paste, thermal pad and thermal pad thickness.

the more you put the worse the result; as i mentioned you had to put a v. small amount ; a perfect contact for max. heat dissipation will have only traces of tim on chip and hs contact area....

basically all is swimming in tim there; you put more than needed and in one month that layer start to dry out and act as insulator...

check the flatness of hs also and if not flat make it

Only once did I use an extreme amount of thermal paste in desperation but on other occassions I used appropriate amount of thermal paste.
 
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No did not modify the retention mechanism, also did not screw tight as well. The only changes are thermal paste, thermal pad and thermal pad thickness.



Only once did I use an extreme amount of thermal paste in hopelessness but on other occassions I used appropriate amount of thermal paste.
sorry but i see no appropriate amount there ...with all that tim i see around gpu and on hs i can re-paste 10 times....; have you ever removed the hs to check contact area after applying tim? contact area shall be almost without tim if is a good contact...
 
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sorry but i see no appropriate amount there ...with all that tim i see around gpu and on hs i can re-paste 10 times....; have you ever removed the hs to check contact area after applying tim? contact area shall be almost without tim if is a good contact...
Oh, is that so?
I did check remove hs to check contact area after applying tim; I applied thermal paste put four main screws (with the spring loaded mechanism) and waited 15 mins and then removed the heatsink again, thermal paste on top the die and heatsink but after a month thermal paste moves onto the side of the die and slides off it. Also, it doesn't dry out it just slides off the gpu die.

Could this be considered good enough contact, just did it now, DID NOT SCREW only put the heatsink on top the die and removed it after 10 seconds:
 
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the more you put the worse the result; as i mentioned you had to put a v. small amount ; a perfect contact for max. heat dissipation will have only traces of tim on chip and hs contact area....

basically all is swimming in tim there; you put more than needed and in one month that layer start to dry out and act as insulator...

check the flatness of hs also and if not flat make it

Actually I think with GPU's you want to make sure the paste covers the entire chip as its direct die, so having more is better than not enough.
 
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Oh, is that so?
I did check remove hs to check contact area after applying tim; I applied thermal paste put four main screws (with the spring loaded mechanism) and waited 15 mins and then removed the heatsink again, thermal paste on top the die and heatsink but after a month thermal paste moves onto the side of the die and slides off it. Also, it doesn't dry out it just slides off the gpu die.

Could this be considered good enough contact, just did it now, DID NOT SCREW only put the heatsink on top the die and removed it after 10 seconds:


ypu had a partial good contact- area marked in red - rest in not good enough:

1605716795547.png


contact can be checked when hs is properly attached..
 
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Oh, is that so?
I did check remove hs to check contact area after applying tim; I applied thermal paste put four main screws (with the spring loaded mechanism) and waited 15 mins and then removed the heatsink again, thermal paste on top the die and heatsink but after a month thermal paste moves onto the side of the die and slides off it. Also, it doesn't dry out it just slides off the gpu die.

Could this be considered good enough contact, just did it now, DID NOT SCREW only put the heatsink on top the die and removed it after 10 seconds:

How are you tightening the heatsink back on? Make sure you're doing it in a "star" pattern, like how you would put a tire on your car because the spread from your first picture is very uneven. And don't torque all the way down right away. Torque them down like 80 percent of the way then hit the opposite side, and its torqued down evenly then you can torque them down the rest of the way in the same pattern
 
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How are you tightening the heatsink back on? Make sure you're doing it in a "star" pattern, like how you would put a tire on your car because the spread from your first picture is very uneven. And don't torque all the way down right away. Torque them down like 80 percent of the way then hit the opposite side, and its torqued down evenly then you can torque them down the rest of the way in the same pattern
Yes I did just like you said but still after a month temperature becomes high.

ypu had a partial good contact- area marked in red - rest in not good enough:

View attachment 176141

contact can be checked when hs is properly attached..
So what should I do next; Repaste with the same thermal paste (Noctua NT-H1) but put very little amount of it? Also keep the .5mm thermal pad?

contact can be checked when hs is properly attached..
How?
 
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You don't want a part of the gpu die to be uncovered by paste, as it can create a hotspot and possibly cause damage according to Gamersnexus.

H1 should be good enough. Have you tried spreading the paste so its coving the die evenly before putting the HS back?
 
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You don't want a part of the gpu die to be uncovered by paste, as it can create a hotspot and possibly cause damage according to Gamersnexus.

H1 should be good enough. Have you tried spreading the paste so its coving the die evenly before putting the HS back?
From later part of may onwards till now I have tried almost every method, the spread, the drop, the line. This is bad it wouldn't even burn up and die, no closure!
 
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memory thermal pad thickness may not let the hs to make a perfect contact also; once you screw back completely the hs take it down to check contact between gpu&hs; good contact shall be as i pointed in the picture; depending where you'll see bad contact try to make the pads thinner to allow the hs closer to gpu.
 
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memory thermal pad thickness may not let the hs to make a perfect contact also; once you screw back completely the hs take it down to check contact between gpu&hs; good contact shall be as i pointed in the picture; depending where you'll see bad contact try to make the pads thinner to allow the hs closer to gpu.
Yes, thank you laszlo. I will repaste exactly as you say, please do answer the following:
#1 Your method of repasting? (small drop in the middle, spread etc and amount to use)
#2 Other precautions/thoughts...
Also, I would say that for the results we might have to wait another month.
 
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Yes, thank you laszlo. I will repaste exactly as you say, please do answer the following:
#1 Your method of repasting? (small drop in the middle, spread etc and amount to use)
#2 Other precautions/thoughts...
Also, I would say that for the results we might have to wait another month.


#1 for a small die like a gpu is enough if you spread evenly on the surface completely a v.v. thin layer ; the hs when seated will do the rest and press out all unnecessary tim
#2 screwing back the hs should be made evenly at all points as you have direct die contact ; once you'll be satisfied with results (after checking-taking it down) you will know what do- repeat all
 
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#1 for a small die like a gpu is enough if you spread evenly on the surface completely a v.v. thin layer ; the hs when seated will do the rest and press out all unnecessary tim
#2 screwing back the hs should be made evenly at all points as you have direct die contact ; once you'll be satisfied with results (after checking-taking it down) you will know what do- repeat all
Ok. I will report back in a month.
 
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@laszlo There has been an accident; I have uploaded the the pictures of a different time and might be even different thermal paste. They were I think of August-September timeframe ones. Actually, these are the correct pictures:
one.png

Sorry for the confusion.
two.png

Please do take a look again, do you still think this is not classic pump-out of thermal paste? The part encircled by a red line: I think this is not good contact, its I don't know maybe the part devoid of TIM (which has slid off the die and settled onto the outer side of the die).
@nguyen @AOne
If I have annoyed anyone then I do apologize beforehand.
 
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Hi,
To keep pump out effect at a minimum you can increase the GPU fans speed to keep GPU temperature low (and therefore the TIM also).

If you used thermal pads with different thickness, it caused uneven mounting pressure on the GPU silicon, and it shows in your picture.

So my suggestions:
1. Use the 0.5mm thermal pads for VRAM and put some thermal paste on them.
2. Manually spread the thermal paste on the GPU silicon
3. When mounting the cooler, tighten the 4 screws in the X order and slowly, hold the screwdriver with only your fingers and tighten the screws until they top out.
4. Increase the fans speed to keep temp low.
 
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where you have good contact you should barely see paste between hs and gpu die; tim is only for filling v.small gaps ...

now looking at the new picture - the part you encircled in red on die - is clean or it has small amounts of tim? i can't see well maybe the die is acting like a mirror

the hs is quite rough as i see and ; have you checked the flatness of it? take a blade and check it; i don't like the fact i saw tim in the un-circled part but the edges are clean; this kind of behavior usually appear when the hs is concave in that area...

so 1st check the flatness of hs and we can take it from there step by step
 
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To keep pump out effect at a minimum you can increase the GPU fans speed to keep GPU temperature low (and therefore the TIM also).

Thank you nguyen for helping.
Sorry may I ask if you read my original post, not the post you were tagged in? Please do read it, and could you answer my other questions there. Increasing fan speed doesn't work the thermal paste just stops working after a month, my card has always been in the 73C to 75C @ 55 to 62% fan speed. After a month 100% fan is not enough to stop the core going past 84C and throttle severely! It does work for a month (without fail) and then it doesn't!

If you used thermal pads with different thickness, it caused uneven mounting pressure on the GPU silicon, and it shows in your picture.

No didn't use thermal pads of different thicknesses, my thermal pads are .5mm all of them.

So my suggestions:
1. Use the 0.5mm thermal pads for VRAM and put some thermal paste on them.

2. Manually spread the thermal paste on the GPU silicon

3. When mounting the cooler, tighten the 4 screws in the X order and slowly, hold the screwdriver with only your fingers and tighten the screws until they top out.

1. Already done.
2. Already done once but not with the Noctua NT-H1, it was the Corsair TM30 that I did it, same result.
3. Yes I always do like that.

now looking at the new picture - the part you encircled in red on die - is clean or it has small amounts of tim? i can't see well maybe the die is acting like a mirror

I have already wiped clean the die but as this has happened more than 6 times I can say with absolute certainty that there is no TIM, its some form of sediment byproduct of the thermal paste.

so 1st check the flatness of hs and we can take it from there step by step

I called my brother and his friend too, brought a new high quality blade and even used an unused tempered glass to check for flatness. Yes the heatsink is flat. Watched many times from different angles and yes flat.
 
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Thank you nguyen for helping.
Sorry may I ask if you read my original post, not the post you were tagged in? Please do read it, and could you answer my other questions there. Increasing fan speed doesn't work the thermal paste just stops working after a month, my card has always been in the 73C to 75C @ 55 to 62% fan speed. After a month 100% fan is not enough to stop the core going past 84C and throttle severely! It does work for a month (without fail) and then it doesn't!

Well what I suggested was forcing higher fans speed to keep the GPU temp low right after you repaste, keeping the TIM in good condition. Low fans speed --> higher GPU temp --> higher TIM temp --> faster pump out effect. After the TIM pump out, there is not enough TIM left on the silicon so forcing 100% fan speed doesn't help anymore.

Or you could buy a new TIM, I think Kingpin KPx or Thermalright TF-X would suit your GPU well.
 
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Well what I suggested was forcing higher fans speed to keep the GPU temp low right after you repaste, keeping the TIM in good condition. Low fans speed --> higher GPU temp --> higher TIM temp --> faster pump out effect. After the TIM pump out, there is not enough TIM left on the silicon so forcing 100% fan speed doesn't help anymore.

Or you could buy a new TIM, I think Kingpin KPx or Thermalright TF-X would suit your GPU well.

Yes, keeping temp at 60C too causes the same issue. 25-35days it just keeps coming back. I am from a very hot and humid part of a very hot country. I am able to lock temperature at 70C (while gaming) @100% fan but never lower (maybe 69C in winter maybe), this is not practical. I am making this clear again that I am not using the exact thickness thermal pad that were in my graphics card originally, they were like ~.65mm and I could not find any thermal pads with that thickness. Also, 1mm pads don't work at all I tried even while flattened with a rolling pin. Kingpin KPx right, I will order this soon and report back.
Thanks again.
 
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