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Research Proposal - Socket AM4 - Heatsink Orientation

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I'll be brief - I'm offering a hypothesis if anyone can test it. The hypothesis is as follows: one should attempt to orient the heatsink so that the heatpipes are not going across both CPU core modules if possible. Examples below.

Ryzen 3000

Like this

131563


Not like this

131564


Ryzen 1000-2000 & APUs

Like this

131566


Not like this

131565


What do you think? Anyone who can test?
 
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Level1Techs had something to say about this in a recent video. I'm pretty sure it was this one:
 
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Don't think it'll make that great of a difference. 2c would be within margin of error.

The soldered IHS plate takes care of surface area quite well. The heat sink orientation will matter less than ambient temps along with case flow ect.
 
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Don't think it'll make that great of a difference. 2c would be within margin of error.

The soldered IHS plate takes care of surface area quite well. The heat sink orientation will matter less than ambient temps along with case flow ect.
Well that would be obviously be the null hypothesis. How did you determine a margin of error?
 
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How can you even test this, considering most heatsinks can only be mounted one way on AM4 boards.
 
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How is that even a question?
If 99% of heatsinks can only be mounted one way, that's most, no?
But please, go ahead and find some suitable heatsinks to test your theory.
 
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If 99% of heatsinks can only be mounted one way, that's most, no?
But please, go ahead and find some suitable heatsinks to test your theory.
If 99% of heatsinks can only be mounted one way, then you test with the 1%.
 
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If 99% of heatsinks can only be mounted one way, then you test with the 1%.
And in regards to 99% of other test cases your research will be completely useless.
 
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If 99% of heatsinks can only be mounted one way, then you test with the 1%.
Since it's your idea, why don't you find a suitable heatsink and test it and show us the results?
I'm sure lots of people would be interested.
Personally, I'm not going to waste time or money on it.
 
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And in regards to 99% of other test cases your research will be completely useless.
Well thanks, I hadn't realized that.

No, it's not useless to increase the knowledge of how to best cool these CPUs.

Since it's your idea, why don't you find a suitable heatsink and test it and show us the results?
I'm sure lots of people would be interested.
Personally, I'm not going to waste time or money on it.
Because I'm hoping someone in the community already has one and can test it.
 
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Well I'm out of the running for the test since my heatsink base isn't direct contact heatpipes, and there is only one orientation.
proxy.duckduckgo.com.jpg
 
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131612

Hyper 212Evo would be perfect for this.
I dont have new ryzen yet to check myself though...
I guess there is also an airflow issue which could potentially invalidate results.
Front intake - back exhaust cases might profit more from vertical orientation.
 
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Well I'm out of the running for the test since my heatsink base isn't direct contact heatpipes, and there is only one orientation.
View attachment 131611
Same. And I don't think AMD chips need this much user intervention to get good cooling either. They use solder with good quality heat-spreader if going by past Ryzen implementations, and their IHS is somewhat flat that doesn't need lapping.

Most of the Ryzen 3000 temp problems stems from immature 7nm process, high voltage requirement imho.
 
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View attachment 131612
Hyper 212Evo would be perfect for this.
I dont have new ryzen yet to check myself though...
I guess there is also an airflow issue which could potentially invalidate results.
Front intake - back exhaust cases might profit more from vertical orientation.
Does its mounting kit enable both orientations?

Well I'm out of the running for the test since my heatsink base isn't direct contact heatpipes, and there is only one orientation.
View attachment 131611
That could be another variable - whether the extra heatspreader on the heatsink removes any difference.
 
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Does its mounting kit enable both orientations?
0002874_hyper-212-plusevo-accessories-kit_625.jpeg
This X looking thing pins the heatsink to the board,
since heatpipes are quite packed (compared to noctua d15 f.e.),
You can position them either side.
I havent done AM4 but I did both orientations on AM3+
 
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I think it would be minimal, if there's any difference at all, as long as there's a heat spreader between the pipes and the die.

If the pipes are exposed to the chip, there could be some difference; in that case, the orientation that has the maximal contact area with the die is going to cool better.
The more coverage, the better the heat transfer.

Even a thin heatspreader (2-4mm copper,~1mm aluminum) will negate the effect, tho.
 
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How many days have you been awake? put the pipe down and go and get some sleep... :laugh:
 
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You won’t find ANY heatsink that can do this due to the obvious obstruction called a heat pipe.

You can test with it sitting on the CPU and a solid connection with thermal paste, but that’ll prove nothing as you cannot do it mounted, regardless of how hard you try.

The difference will be close to zero, and as said, within a margin of error. Different thermal paste application variance will cause the difference alone.
 
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Well that would be obviously be the null hypothesis. How did you determine a margin of error?
Magin of error. 1c id about 2f degree. Room temp can fluctuate that much easily.
Changing thermal paste can be that far off or even more if burn in time is required.

The heat spreader is soldered and does its job quite well as a result.
Turning the heat sink wont make any real difference.

That is all....

P.S. Im one of the only active users running a lid-less pga 2700x and have done plenty of testing.

I can tell you first hand that even a 10c drop in temps will not bring your max clocks any higher.
 
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P.S. Im one of the only active users running a lid-less pga 2700x and have done plenty of testing.

I can tell you first hand that even a 10c drop in temps will not bring your max clocks any higher.
From what I read lower temp plays a very important role in Ryzen 3000's updated boost algorithm.
 
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The boost is partially temp reliant. The other is voltage.
The more volts the more heat and back to square one.

The initial boost may be higher until throttle point is reached in temps and then the clocks lower under load.

But turning a heat sink has nothing to do with bios updates.

The argument is testing turning a heatsink for slightly better temps.
If you squeeze 2c from turning the heat sink... You wont be getting anything special from it.
 
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Its in german but He answers all your questions. In Short: " Higher flowrate in Case of watercoolers Matters more than orientation or Design."

And
 
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Ryzen's 3000 clocks can be affected by temps, boost and all core. Dont mix 3000 with previous gens. Yes, maybe there is a disfuction in clocks algorithm, affecting boost, and AMD claims to resolve it but in spite of that alone, temps adding further mis-targeting.
For example mine (4200 rated) boosting to 4125~4150 and not more when temp is in low 50s (C), or even below 50C . After that, 4100 is the max posible.

Any way... the OP's and Level1Techs's point do have some reason in that thought but we are talking about 1~2 degrees maybe, as stated by others.
In order to avoid temperature throtling eventually you need better cooling solution, and/or lower ambient temp... and not heatsink orientation. It wont help...
 
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