• Welcome to TechPowerUp Forums, Guest! Please check out our forum guidelines for info related to our community.

Samsung Develops Industry's First 12-Layer 3D-TSV Chip Packaging Technology

btarunr

Editor & Senior Moderator
Staff member
Joined
Oct 9, 2007
Messages
37,490 (8.53/day)
Location
Hyderabad, India
Processor AMD Ryzen 7 2700X
Motherboard MSI B450 Gaming Pro Carbon AC
Cooling AMD Wraith Prism
Memory 2x 16GB Corsair Vengeance LPX DDR4-3000
Video Card(s) AMD Radeon RX 5700 XT
Storage Western Digital Black NVMe 512GB
Display(s) Samsung U28D590 28-inch 4K UHD
Case Corsair Carbide 100R
Audio Device(s) Creative Sound Blaster Recon3D PCIe
Power Supply Antec EarthWatts Pro Gold 750W
Mouse Razer Abyssus
Keyboard Microsoft Sidewinder X4
Software Windows 10 Pro
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung's new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.

The thickness of the package (720 µm) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products, which is a substantial advancement in component design. This will help customers release next-generation, high-capacity products with higher performance capacity without having to change their system configuration designs. In addition, the 3D packaging technology also features a shorter data transmission time between chips than the currently existing wire bonding technology, resulting in significantly faster speed and lower power consumption.



"Packaging technology that secures all of the intricacies of ultra-performance memory is becoming tremendously important, with the wide variety of new-age applications, such as artificial intelligence (AI) and High Power Computing (HPC)," said Hong-Joo Baek, executive vice president of TSP (Test & System Package) at Samsung Electronics.

"As Moore's law scaling reaches its limit, the role of 3D-TSV technology is expected to become even more critical. We want to be at the forefront of this state-of-the-art chip packaging technology."

Relying on its 12-layer 3D-TSV technology, Samsung will offer the highest DRAM performance for applications that are data-intensive and extremely high-speed.

Also, by increasing the number of stacked layers from eight to 12, Samsung will soon be able to mass produce 24-gigabyte (GB)* High Bandwidth Memory, which provides three times the capacity of 8GB high bandwidth memory on the market today.

Samsung will be able to meet the rapidly growing market demand for high-capacity HBM solutions with its cutting-edge 12-layer 3D TSV technology and it hopes to solidify its leadership in the premium semiconductor market.

View at TechPowerUp Main Site
 
Joined
Apr 30, 2011
Messages
1,422 (0.46/day)
Location
Greece
Processor AMD FX-8350 4GHz@1.3V
Motherboard Gigabyte GA-970A UD3 Rev3.0
Cooling Zalman CNPS5X Performa
Memory 2*4GB Patriot Venom RED DDR3 1600MHz CL9
Video Card(s) XFX RX580 GTS 4GB
Storage Sandisk SSD 120GB, 2 Samsung F1 & F3 (1TB)
Display(s) LG IPS235
Case Zalman Neo Z9 Black
Audio Device(s) Via 7.1 onboard
Power Supply OCZ Z550
Mouse Zalman ZM-M401R
Keyboard Trust GXT280
Software Win 7 sp1 64bit
Benchmark Scores CB R15 64bit: single core 99p, multicore 647p WPrime 1.55 (8 cores): 9.0 secs
Intel might be another main reason for that, apart from HBM RAM chips' packaging. 2022 in the earliest for the sale of anything related to this manufacturing method.
 
Joined
Jun 2, 2017
Messages
1,215 (1.40/day)
System Name Best AMD Computer
Processor AMD TR4 1920X
Motherboard MSI X399 SLI Plus
Cooling Alphacool Eisbaer 420 x2 Noctua NHU-14S TR4
Memory Gskill RIpjaws 4 3000MHZ 48GB
Video Card(s) Sapphire Vega 64 Nitro, Gigabyte Vega 64 Gaming OC
Storage 6 x NVME 480 GB, 2 x SSD 2TB, 5TB HDD, 2 TB HDD, 2x 2TB SSHD
Display(s) Acer 49BQ0k 4K monitor
Case Thermaltake Core X9
Audio Device(s) Corsair Void Pro, Logitch Z523 5.1
Power Supply Corsair HX1200!
Mouse Logitech g7 gaming mouse
Keyboard Logitech G510
Software Windows 10 Pro 64 Steam. GOG, Uplay, Origin
Benchmark Scores Firestrike: 24955 Time Spy: 13500
Wondering if this will be memory for the "Big Navi".
 
Joined
Sep 11, 2019
Messages
72 (1.85/day)
Processor i7 - 9700K
Motherboard Asus H370M Plus
Cooling Arctic Freezer 13
Memory 32GB G-Skill @ 2666Mhz CL15
Video Card(s) 5700 XT (Gigabyte Aftermarket)
Storage 970 EVO 500GB, 860 EVO 2TB, 840 Pro 256GB
Display(s) Samsung C32HG70 - 1440p, Freesync 2
Case Silverstone GD-07B
Audio Device(s) Schiit Modi 2 Uber - Schiit Magni 2 Uber - Sennheiser HD595's
Power Supply Seasonic S12II 620W
Mouse Steelseries Sensei 310
Keyboard Corsair K70 LUX (Brown Switches), Razer Orbweaver Chroma Stealth
Wondering if this will be memory for the "Big Navi".
Uh.....I would hope "Big Navi" is further along in development than designing around a memory technology that was just announced today.
 
Joined
Jun 2, 2017
Messages
1,215 (1.40/day)
System Name Best AMD Computer
Processor AMD TR4 1920X
Motherboard MSI X399 SLI Plus
Cooling Alphacool Eisbaer 420 x2 Noctua NHU-14S TR4
Memory Gskill RIpjaws 4 3000MHZ 48GB
Video Card(s) Sapphire Vega 64 Nitro, Gigabyte Vega 64 Gaming OC
Storage 6 x NVME 480 GB, 2 x SSD 2TB, 5TB HDD, 2 TB HDD, 2x 2TB SSHD
Display(s) Acer 49BQ0k 4K monitor
Case Thermaltake Core X9
Audio Device(s) Corsair Void Pro, Logitch Z523 5.1
Power Supply Corsair HX1200!
Mouse Logitech g7 gaming mouse
Keyboard Logitech G510
Software Windows 10 Pro 64 Steam. GOG, Uplay, Origin
Benchmark Scores Firestrike: 24955 Time Spy: 13500
Uh.....I would hope "Big Navi" is further along in development than designing around a memory technology that was just announced today.
I know what you mean but while we are just learning of this today. Companies with agreements (like AMD) may have already been privy to this information.
 
Joined
Sep 11, 2019
Messages
72 (1.85/day)
Processor i7 - 9700K
Motherboard Asus H370M Plus
Cooling Arctic Freezer 13
Memory 32GB G-Skill @ 2666Mhz CL15
Video Card(s) 5700 XT (Gigabyte Aftermarket)
Storage 970 EVO 500GB, 860 EVO 2TB, 840 Pro 256GB
Display(s) Samsung C32HG70 - 1440p, Freesync 2
Case Silverstone GD-07B
Audio Device(s) Schiit Modi 2 Uber - Schiit Magni 2 Uber - Sennheiser HD595's
Power Supply Seasonic S12II 620W
Mouse Steelseries Sensei 310
Keyboard Corsair K70 LUX (Brown Switches), Razer Orbweaver Chroma Stealth
I know what you mean but while we are just learning of this today. Companies with agreements (like AMD) may have already been privy to this information.
If Navi 12 is going into production anytime soon, they would've needed to start taping-out roughly a year ago. The actual chip design was probably 2 years ago.

I doubt you'll see this in an actual shipping product anytime before 2021, and even that might be optimistic.
 

TechLurker

New Member
Joined
Jul 7, 2019
Messages
8 (0.08/day)
I wonder if this upgraded stack would potentially allow for AMD to add one in to feed the GPU side of their APUs, or for some setups where one later adds in a dedicated GPU, allow for disabling of the onboard GPU and using the HBM instead for the CPU as L4 cache.
 
Top