• Welcome to TechPowerUp Forums, Guest! Please check out our forum guidelines for info related to our community.

Samsung Develops Industry's First 12-Layer 3D-TSV Chip Packaging Technology

btarunr

Editor & Senior Moderator
Staff member
Joined
Oct 9, 2007
Messages
46,277 (7.69/day)
Location
Hyderabad, India
System Name RBMK-1000
Processor AMD Ryzen 7 5700G
Motherboard ASUS ROG Strix B450-E Gaming
Cooling DeepCool Gammax L240 V2
Memory 2x 8GB G.Skill Sniper X
Video Card(s) Palit GeForce RTX 2080 SUPER GameRock
Storage Western Digital Black NVMe 512GB
Display(s) BenQ 1440p 60 Hz 27-inch
Case Corsair Carbide 100R
Audio Device(s) ASUS SupremeFX S1220A
Power Supply Cooler Master MWE Gold 650W
Mouse ASUS ROG Strix Impact
Keyboard Gamdias Hermes E2
Software Windows 11 Pro
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung's new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.

The thickness of the package (720 µm) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products, which is a substantial advancement in component design. This will help customers release next-generation, high-capacity products with higher performance capacity without having to change their system configuration designs. In addition, the 3D packaging technology also features a shorter data transmission time between chips than the currently existing wire bonding technology, resulting in significantly faster speed and lower power consumption.



"Packaging technology that secures all of the intricacies of ultra-performance memory is becoming tremendously important, with the wide variety of new-age applications, such as artificial intelligence (AI) and High Power Computing (HPC)," said Hong-Joo Baek, executive vice president of TSP (Test & System Package) at Samsung Electronics.

"As Moore's law scaling reaches its limit, the role of 3D-TSV technology is expected to become even more critical. We want to be at the forefront of this state-of-the-art chip packaging technology."

Relying on its 12-layer 3D-TSV technology, Samsung will offer the highest DRAM performance for applications that are data-intensive and extremely high-speed.

Also, by increasing the number of stacked layers from eight to 12, Samsung will soon be able to mass produce 24-gigabyte (GB)* High Bandwidth Memory, which provides three times the capacity of 8GB high bandwidth memory on the market today.

Samsung will be able to meet the rapidly growing market demand for high-capacity HBM solutions with its cutting-edge 12-layer 3D TSV technology and it hopes to solidify its leadership in the premium semiconductor market.

View at TechPowerUp Main Site
 
Joined
Apr 30, 2011
Messages
2,648 (0.56/day)
Location
Greece
Processor AMD Ryzen 5 5600@80W
Motherboard MSI B550 Tomahawk
Cooling ZALMAN CNPS9X OPTIMA
Memory 2*8GB PATRIOT PVS416G400C9K@3733MT_C16
Video Card(s) Sapphire Radeon RX 6750 XT Pulse 12GB
Storage Sandisk SSD 128GB, Kingston A2000 NVMe 1TB, Samsung F1 1TB, WD Black 10TB
Display(s) AOC 27G2U/BK IPS 144Hz
Case SHARKOON M25-W 7.1 BLACK
Audio Device(s) Realtek 7.1 onboard
Power Supply Seasonic Core GC 500W
Mouse Sharkoon SHARK Force Black
Keyboard Trust GXT280
Software Win 7 Ultimate 64bit/Win 10 pro 64bit/Manjaro Linux
Intel might be another main reason for that, apart from HBM RAM chips' packaging. 2022 in the earliest for the sale of anything related to this manufacturing method.
 
Joined
Jun 2, 2017
Messages
7,797 (3.13/day)
System Name Best AMD Computer
Processor AMD 7900X3D
Motherboard Asus X670E E Strix
Cooling In Win SR36
Memory GSKILL DDR5 32GB 5200 30
Video Card(s) Sapphire Pulse 7900XT (Watercooled)
Storage Corsair MP 700, Seagate 530 2Tb, Adata SX8200 2TBx2, Kingston 2 TBx2, Micron 8 TB, WD AN 1500
Display(s) GIGABYTE FV43U
Case Corsair 7000D Airflow
Audio Device(s) Corsair Void Pro, Logitch Z523 5.1
Power Supply Deepcool 1000M
Mouse Logitech g7 gaming mouse
Keyboard Logitech G510
Software Windows 11 Pro 64 Steam. GOG, Uplay, Origin
Benchmark Scores Firestrike: 46183 Time Spy: 25121
Wondering if this will be memory for the "Big Navi".
 
Joined
Sep 11, 2019
Messages
184 (0.11/day)
Processor Intel 13700K
Motherboard Asus Z690 DDR4
Memory 32GB DDR4 3600Mhz CAS16
Video Card(s) Gigabyte 4070 Ti
Display(s) Samsung C32HG70 - 32" 1440p
Case Silverstone GD-07B
Audio Device(s) Schiit Modi+Magni 2 Uber - Sennheiser HD595
Wondering if this will be memory for the "Big Navi".
Uh.....I would hope "Big Navi" is further along in development than designing around a memory technology that was just announced today.
 
Joined
Jun 2, 2017
Messages
7,797 (3.13/day)
System Name Best AMD Computer
Processor AMD 7900X3D
Motherboard Asus X670E E Strix
Cooling In Win SR36
Memory GSKILL DDR5 32GB 5200 30
Video Card(s) Sapphire Pulse 7900XT (Watercooled)
Storage Corsair MP 700, Seagate 530 2Tb, Adata SX8200 2TBx2, Kingston 2 TBx2, Micron 8 TB, WD AN 1500
Display(s) GIGABYTE FV43U
Case Corsair 7000D Airflow
Audio Device(s) Corsair Void Pro, Logitch Z523 5.1
Power Supply Deepcool 1000M
Mouse Logitech g7 gaming mouse
Keyboard Logitech G510
Software Windows 11 Pro 64 Steam. GOG, Uplay, Origin
Benchmark Scores Firestrike: 46183 Time Spy: 25121
Uh.....I would hope "Big Navi" is further along in development than designing around a memory technology that was just announced today.

I know what you mean but while we are just learning of this today. Companies with agreements (like AMD) may have already been privy to this information.
 
Joined
Sep 11, 2019
Messages
184 (0.11/day)
Processor Intel 13700K
Motherboard Asus Z690 DDR4
Memory 32GB DDR4 3600Mhz CAS16
Video Card(s) Gigabyte 4070 Ti
Display(s) Samsung C32HG70 - 32" 1440p
Case Silverstone GD-07B
Audio Device(s) Schiit Modi+Magni 2 Uber - Sennheiser HD595
I know what you mean but while we are just learning of this today. Companies with agreements (like AMD) may have already been privy to this information.
If Navi 12 is going into production anytime soon, they would've needed to start taping-out roughly a year ago. The actual chip design was probably 2 years ago.

I doubt you'll see this in an actual shipping product anytime before 2021, and even that might be optimistic.
 
Joined
Jul 7, 2019
Messages
821 (0.48/day)
I wonder if this upgraded stack would potentially allow for AMD to add one in to feed the GPU side of their APUs, or for some setups where one later adds in a dedicated GPU, allow for disabling of the onboard GPU and using the HBM instead for the CPU as L4 cache.
 
Top