• Welcome to TechPowerUp Forums, Guest! Please check out our forum guidelines for info related to our community.

Samsung Electronics Begins Mass Production of Industry's Thinnest LPDDR5X DRAM Packages

TheLostSwede

News Editor
Joined
Nov 11, 2004
Messages
17,536 (2.40/day)
Location
Sweden
System Name Overlord Mk MLI
Processor AMD Ryzen 7 7800X3D
Motherboard Gigabyte X670E Aorus Master
Cooling Noctua NH-D15 SE with offsets
Memory 32GB Team T-Create Expert DDR5 6000 MHz @ CL30-34-34-68
Video Card(s) Gainward GeForce RTX 4080 Phantom GS
Storage 1TB Solidigm P44 Pro, 2 TB Corsair MP600 Pro, 2TB Kingston KC3000
Display(s) Acer XV272K LVbmiipruzx 4K@160Hz
Case Fractal Design Torrent Compact
Audio Device(s) Corsair Virtuoso SE
Power Supply be quiet! Pure Power 12 M 850 W
Mouse Logitech G502 Lightspeed
Keyboard Corsair K70 Max
Software Windows 10 Pro
Benchmark Scores https://valid.x86.fr/yfsd9w
Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production for the industry's thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16 GB LPDDR5X DRAM packages, solidifying its leadership in the low-power DRAM market. Leveraging its extensive expertise in chip packaging, Samsung is able to deliver ultra-slim LPDDR5X DRAM packages that can create additional space within mobile devices, facilitating better airflow. This supports easier thermal control, a factor that is becoming increasingly critical especially for high-performance applications with advanced features such as on-device AI.

"Samsung's LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market."




With the new LPDDR5X DRAM packages, Samsung offers the industry's thinnest 12 nm-class LPDDR DRAM in a 4-stack structure, reducing the thickness by approximately 9% and improving heat resistance by about 21.2%, compared to the previous generation product.

By optimizing printed circuit board (PCB) and epoxy molding compound (EMC) techniques, the new LPDDR DRAM package is as thin as a fingernail at 0.65 millimeters (mm), the thinnest among existing LPDDR DRAM of 12 GB or above. Samsung's optimized back-lapping process is also used to minimize the package height.

Samsung plans to continue expanding the low-power DRAM market by supplying its 0.65 mm LPDDR5X DRAM to mobile processor makers as well as mobile device manufacturers. As demand for high-performance, high-density mobile memory solutions in smaller package sizes continues to grow, the company plans to develop 6-layer 24 GB and 8-layer 32 GB modules into the thinnest LPDDR DRAM packages for future devices.

View at TechPowerUp Main Site | Source
 
Joined
Jan 1, 2021
Messages
36 (0.03/day)
Location
France
System Name Enter name here
Processor Ryzen 7 3700x w/ PBO
Motherboard Asus Prime B550 Plus
Cooling Bequiet dark rock 4
Memory 2x16 Crucial Ballistix 3200 Micron E-die@3800Mhz 1,41 18-16-20-18-38-58
Video Card(s) MSI RX 6800 Trio X
Storage Samsung 980 1Tb + Crucial mx500 250go + Toshiba HDDs
Display(s) Dell s2721ds
Case MSI Mag Forge 100R
Power Supply Coolermaster MWE bronze 650w
Benchmark Scores CInebench R20: 5085
Is there enough airflow in a phone to make this significant? /doubt
Yes clearly there won't be any airflow there because the screen happens to be there.
Even if Oled displays becomes thinner than LCD counterparts, there isn't enough room for proper airflow.
 
Joined
Mar 7, 2011
Messages
4,528 (0.91/day)
Is there enough airflow in a phone to make this significant? /doubt
Generally speaking most phone makers simply use the screen along with frame as heatsink these days and there are some "gaming" handsets which do have open vents and fans for cooling purposes.
 
Top