TheLostSwede
News Editor
- Joined
- Nov 11, 2004
- Messages
- 17,536 (2.40/day)
- Location
- Sweden
System Name | Overlord Mk MLI |
---|---|
Processor | AMD Ryzen 7 7800X3D |
Motherboard | Gigabyte X670E Aorus Master |
Cooling | Noctua NH-D15 SE with offsets |
Memory | 32GB Team T-Create Expert DDR5 6000 MHz @ CL30-34-34-68 |
Video Card(s) | Gainward GeForce RTX 4080 Phantom GS |
Storage | 1TB Solidigm P44 Pro, 2 TB Corsair MP600 Pro, 2TB Kingston KC3000 |
Display(s) | Acer XV272K LVbmiipruzx 4K@160Hz |
Case | Fractal Design Torrent Compact |
Audio Device(s) | Corsair Virtuoso SE |
Power Supply | be quiet! Pure Power 12 M 850 W |
Mouse | Logitech G502 Lightspeed |
Keyboard | Corsair K70 Max |
Software | Windows 10 Pro |
Benchmark Scores | https://valid.x86.fr/yfsd9w |
Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production for the industry's thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16 GB LPDDR5X DRAM packages, solidifying its leadership in the low-power DRAM market. Leveraging its extensive expertise in chip packaging, Samsung is able to deliver ultra-slim LPDDR5X DRAM packages that can create additional space within mobile devices, facilitating better airflow. This supports easier thermal control, a factor that is becoming increasingly critical especially for high-performance applications with advanced features such as on-device AI.
"Samsung's LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market."
With the new LPDDR5X DRAM packages, Samsung offers the industry's thinnest 12 nm-class LPDDR DRAM in a 4-stack structure, reducing the thickness by approximately 9% and improving heat resistance by about 21.2%, compared to the previous generation product.
By optimizing printed circuit board (PCB) and epoxy molding compound (EMC) techniques, the new LPDDR DRAM package is as thin as a fingernail at 0.65 millimeters (mm), the thinnest among existing LPDDR DRAM of 12 GB or above. Samsung's optimized back-lapping process is also used to minimize the package height.
Samsung plans to continue expanding the low-power DRAM market by supplying its 0.65 mm LPDDR5X DRAM to mobile processor makers as well as mobile device manufacturers. As demand for high-performance, high-density mobile memory solutions in smaller package sizes continues to grow, the company plans to develop 6-layer 24 GB and 8-layer 32 GB modules into the thinnest LPDDR DRAM packages for future devices.
View at TechPowerUp Main Site | Source
"Samsung's LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market."
With the new LPDDR5X DRAM packages, Samsung offers the industry's thinnest 12 nm-class LPDDR DRAM in a 4-stack structure, reducing the thickness by approximately 9% and improving heat resistance by about 21.2%, compared to the previous generation product.
By optimizing printed circuit board (PCB) and epoxy molding compound (EMC) techniques, the new LPDDR DRAM package is as thin as a fingernail at 0.65 millimeters (mm), the thinnest among existing LPDDR DRAM of 12 GB or above. Samsung's optimized back-lapping process is also used to minimize the package height.
Samsung plans to continue expanding the low-power DRAM market by supplying its 0.65 mm LPDDR5X DRAM to mobile processor makers as well as mobile device manufacturers. As demand for high-performance, high-density mobile memory solutions in smaller package sizes continues to grow, the company plans to develop 6-layer 24 GB and 8-layer 32 GB modules into the thinnest LPDDR DRAM packages for future devices.
View at TechPowerUp Main Site | Source