• Welcome to TechPowerUp Forums, Guest! Please check out our forum guidelines for info related to our community.

Samsung Starts Mass Producing Industry's First 3D Vertical NAND Flash

btarunr

Editor & Senior Moderator
Staff member
Joined
Oct 9, 2007
Messages
34,496 (9.18/day)
Likes
17,519
Location
Hyderabad, India
#1
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry's first three-dimensional (3D) Vertical NAND (V-NAND) flash memory, which breaks through the current scaling limit for existing NAND flash technology. Achieving gains in performance and area ratio, the new 3D V-NAND will be used for a wide range of consumer electronics and enterprise applications, including embedded NAND storage and solid state drives (SSDs).

Samsung's new V-NAND offers a 128 gigabit (Gb) density in a single chip, utilizing the company's proprietary vertical cell structure based on 3D Charge Trap Flash (CTF) technology and vertical interconnect process technology to link the 3D cell array. By applying both of these technologies, Samsung's 3D V-NAND is able to provide over twice the scaling of 20nm-class planar NAND flash.



"The new 3D V-NAND flash technology is the result of our employees' years of efforts to push beyond conventional ways of thinking and pursue much more innovative approaches in overcoming limitations in the design of memory semiconductor technology," said Jeong-Hyuk Choi, senior vice president, flash product & technology, Samsung Electronics. "Following the world's first mass production of 3D Vertical NAND, we will continue to introduce 3D V-NAND products with improved performance and higher density, which will contribute to further growth of the global memory industry."

For the past 40 years, conventional flash memory has been based on planar structures that make use of floating gates. As manufacturing process technology has proceeded to the 10nm-class* and beyond, concern for a scaling limit arose, due to the cell-to-cell interference that causes a trade-off in the reliability of NAND flash products. This also led to added development time and costs.

Samsung's new V-NAND solves such technical challenges by achieving new levels of innovation in circuits, structure and the manufacturing process through which a vertical stacking of planar cell layers for a new 3D structure has been successfully developed. To do this, Samsung revamped its CTF architecture, which was first developed in 2006. In Samsung's CTF-based NAND flash architecture, an electric charge is temporarily placed in a holding chamber of the non-conductive layer of flash that is composed of silicon nitride (SiN), instead of using a floating gate to prevent interference between neighboring cells.

By making this CTF layer three-dimensional, the reliability and speed of the NAND memory have improved sharply. The new 3D V-NAND shows not only an increase of a minimum of 2X to a maximum 10X higher reliability, but also twice the write performance over conventional 10nm-class floating gate NAND flash memory.

Also, one of the most important technological achievements of the new Samsung V-NAND is that the company's proprietary vertical interconnect process technology can stack as many as 24 cell layers vertically, using special etching technology that connects the layers electronically by punching holes from the highest layer to the bottom. With the new vertical structure, Samsung can enable higher density NAND flash memory products by increasing the 3D cell layers without having to continue planar scaling, which has become incredibly difficult to achieve.

After nearly 10 years of research on 3D Vertical NAND, Samsung now has more than 300 patent-pending 3D memory technologies worldwide. With the industry's first completely functional 3D Vertical NAND memory, Samsung has strengthened its competitiveness in the memory industry as well as set the foundation for more advanced products including one terabit (Tb) NAND flash, while setting a faster pace for industry growth.

According to IHS iSuppli, the global NAND flash memory market is expected to reach approximately US $30.8 billion in revenues by the end of 2016, from approximately US $23.6 billion in 2013 with a CAGR of 11 percent, in leading growth of the entire memory industry.
 
Joined
Nov 1, 2008
Messages
423 (0.13/day)
Likes
122
System Name It does stuff
Processor AMD FX-8320
Motherboard Gigabyte GA-970A-DS3
Cooling Antec Kuhler 620 + Fans Everywhere
Memory 16GB Crucial 1600Mhz DDR3
Video Card(s) Sapphire RX 580 Nitro+ 4GB
Storage Samsung 840 Pro 256GB, Seagate Barracuda 3TB
Display(s) Viewsonic VX2757, AOC 2243W
Case Antec Three Hundred Version Two
Audio Device(s) ASUS Xonar DG PCI / Sony MDR-XB500s
Power Supply EVGA 600W
Mouse Redragon Phoenix
Keyboard Steelseries Apex Raw
Software Win10 64 Professional
#2
Samsung 850 series SSDs soon? :laugh:
 
Joined
Dec 9, 2007
Messages
746 (0.20/day)
Likes
88
#3
Haha, probably, yes! :toast:

But seriously, this sounds a lot like Micron's 3D memory "cube" stacking technology, only instead of DRAM it appears Samsung applied it to NAND chips. Pretty interesting stuff. :)
 
Joined
Nov 10, 2006
Messages
4,529 (1.11/day)
Likes
6,082
Location
Washington, US
System Name Lappy
Processor i7 6700k
Motherboard Sager NP9870
Cooling A lot smaller than I'd like
Memory Samsung 4x8GB DDR4-2133 SO-DIMM
Video Card(s) GTX 980 (MXM)
Storage 2xSamsung 950 Pro 256GB | 2xHGST 1TB 7.2K
Display(s) 17.3" IPS 1080p G-SYNC
Audio Device(s) Sound Blaster X-FI MB 5, Foster 2.1 channel integrated
Power Supply 330w Brick
Mouse Razer Deathadder
Keyboard 3-zone RGB integrated
Software Windows 10 Pro
Benchmark Scores Not slow
#4
Curious to know if heat will be an issue. Any idea when we'll start seeing these in production?
 
Joined
Dec 1, 2011
Messages
343 (0.15/day)
Likes
34
Location
Ft Stewart
System Name Queen Bee
Processor 3570k @ 4.0GHz
Motherboard Gigabyte UD3 Z77
Cooling Water Loop by EK
Memory 8GB Corsair 1600 DDR3
Video Card(s) MSI GTX 970 Gaming WaterCooled
Storage 1x Western Digital 500GB Black 1x Intel 20GB 311 SSD
Display(s) BenQ XL2420G
Case CoolTek W2
Power Supply Corsair 650Watt
Software Windows 7 Pro
#5
I wonder if production cost for this type of chip is any higher than a stranded production? If not then the cost of an SSD from Samsung would go down (fewer chips on said PCB for said capacity), and I'm all for that :rockout: