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Samsung Unveils First 16GB ‘Very Low Profile’ Module in IBM’s Newest Blade Server


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Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it will demonstrate for the first time a 16-Gigabyte (GB), very low profile (VLP) memory module at the VM World 2010 in an IBM H22V blade server, running on Intel Xeon™ 5600-series processors.

Based on 4-gigabit (Gb), 40 nanometer (nm)-class DDR3, the new modules use 18 4Gb dual-die packaged (DDP) chips, and operate on 1.35 volts of electrical current. The 16GB 40nm-class DDR3 memory provides a powerful green solution, consuming 70 percent less power than four 4GB DDR3 modules and over 40 percent less than two 8GB modules, in setting a new “standard” for lower power consumption in servers. The module’s very low profile (18.75 mm high) allows it to be used in extremely compact blade servers.

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