• Welcome to TechPowerUp Forums, Guest! Please check out our forum guidelines for info related to our community.

Should i liquid metal cool my laptop

Lei

Joined
Jul 3, 2021
Messages
117 (0.56/day)
System Name Lei
Processor 3900x
Motherboard msi b450m
Cooling acool 560mm bykski phanteks f140xp
Memory micron 32gb 3200mhz ddr4
Video Card(s) 1070 8gb
Storage hp ex950 1tb ssd, wd 6tb blue, wd 18tb
Display(s) huion kamvas pro
Case aluminium extrusions copper panels
Audio Device(s) sony stereo mic, logitech c930, xbox series s controller
Power Supply corsair rm650x
Mouse pen display
Keyboard microsoft aio media embedded touchpad
Software win 11
Benchmark Scores cine23 20000
The only way a hs gets cooler is cool air being blown onto it to remove heat quicker
I understand, what Andy is looking for, is a K and area to achieve 5 degrees difference between hs and heat source.

With that 3x3 area and thickness of 0.05, he will get 5 degrees if he uses a material with 5.5/5 wmk. That's 1.1 which means filling the gap with clay will give the desired output :D

 
Last edited:
Joined
Jul 5, 2013
Messages
17,329 (5.54/day)
Location
USA
@OctupleGolf001
Given that picture, you might get a little benefit from LM, but it's not likely to be much. That system is bottlenecked by the cooling parts themselves.
 
Joined
Mar 21, 2021
Messages
1,576 (5.04/day)
Location
Colorado, U.S.A.
System Name HP Compaq 8000 Elite CMT
Processor Intel Core 2 Quad Q9550
Motherboard Hewlett-Packard 3647h
Memory 16GB DDR3
Video Card(s) NVIDIA GeForce GT 1030 GDDR5 (fan-less)
Storage 2TB Seagate Firecuda 3.5"
Display(s) Dell P2416D (2560 x 1440)
Power Supply 12V HP proprietary
Software Windows 10 Pro 64-bit
I understand, what Andy is looking for, is a K and area to achieve 5 degrees difference between hs and heat source.

With that 3x3 area and thickness of 0.05, he will get 5 degrees if he uses a material with 5.5/5 wmk. That's 1.1 which means filling the gap with clay will give the desired output :D


That works!
 
  • Haha
Reactions: Lei
Top