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Should i liquid metal cool my laptop

Lei

Joined
Jul 3, 2021
Messages
811 (1.42/day)
Processor 3900x - bykski waterblock
Motherboard msi b450m mortar max
Cooling αcool 560 rad - 2xPhanteks F140XP
Memory micron 32gb 3200mhz ddr4
Video Card(s) Colorful 3090 ADOC active backplate cooling
Storage WD SN850 2tb ,HP EX950 1tb, WD UltraStar Helioseal 18tb
Display(s) 24“ HUION pro 4k 10bit
Case aluminium extrusions copper panels, 60 deliveries for every piece down to screws
Audio Device(s) sony stereo mic, logitech c930, xbox series s white controller
Power Supply Corsair RM1000x
Mouse pen display, no mouse no click
Keyboard Microsoft aio media embedded touchpad
Software Win 11 build 25276
Benchmark Scores cine23 20000
The only way a hs gets cooler is cool air being blown onto it to remove heat quicker
I understand, what Andy is looking for, is a K and area to achieve 5 degrees difference between hs and heat source.

With that 3x3 area and thickness of 0.05, he will get 5 degrees if he uses a material with 5.5/5 wmk. That's 1.1 which means filling the gap with clay will give the desired output :D

 
Last edited:
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@OctupleGolf001
Given that picture, you might get a little benefit from LM, but it's not likely to be much. That system is bottlenecked by the cooling parts themselves.
 
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Colorado, U.S.A.
System Name HP Compaq 8000 Elite CMT
Processor Intel Core 2 Quad Q9550
Motherboard Hewlett-Packard 3647h
Memory 16GB DDR3
Video Card(s) NVIDIA GeForce GT 1030 GDDR5 (fan-less)
Storage 2TB Seagate Firecuda 3.5"
Display(s) Dell P2416D (2560 x 1440)
Power Supply 12V HP proprietary
Software Windows 10 Pro 64-bit
I understand, what Andy is looking for, is a K and area to achieve 5 degrees difference between hs and heat source.

With that 3x3 area and thickness of 0.05, he will get 5 degrees if he uses a material with 5.5/5 wmk. That's 1.1 which means filling the gap with clay will give the desired output :D


That works!
 
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