Super Micro Computer, Inc., a global leader in high-performance, high-efficiency server technology and green computing, releases its next generation, ultra low power, compact form factor embedded server platform (5017P-TLN4F) based on their new Mini-ITX (6.7" x 6.7") motherboard (X9SPV-F/LN4F). Compared to the previous generation architecture, this solution delivers 15% more processing performance, up to 50% more 3D graphics performance supporting the latest graphic APIs - DirectX 11, OpenCL 1.1 and OpenGL 3.1 and new features such as Intel Smart Response Technology enabling increased storage I/O performance with SSD caching. The X9SPV-F/LN4F embedded server platform features the following: Mobile, 3rd generation Intel Core i7/i5/i3 processors and Mobile Intel QM77 Express Chipset Dual/Quad core 1.6GHz to 2.7GHz 35W and 25W M Series and 17W U Series processor options Up to 16GB ECC DDR3-1066/1333MHz in dual vertical SO-DIMMs 1 PCI-E 3.0 x16 slot (i3 2.0 only) 2 SATA 6Gbs/ and 4 SATA 3Gbs/ Ports (RAID 0/1/5/10) VGA Output; Matrox G200eW (default) or Intel Integrated Graphics (DX11) via BIOS setup Quad Gigabit LAN Ports (4x 82574L) IPMI 2.0 with dedicated LAN 4 USB 3.0 ports, 6 USB 2.0 ports (4 rear, 2 header) SATA DOM (Disk on Module) Power connector When combined with Supermicro's newest compact short-depth enclosure (SC504-203B) featuring 1x 3.5" or 2x 2.5" SATA2 drive bays, a 200W high-efficiency Supermicro power supply and PCI Express 3.0 x16 expansion capability on riser, the resulting embedded server appliance (5017P-TLN4F) is ideal for applications such as storage head nodes, media transcoding, HD video conferencing, network monitoring, security and firewall management and a variety of other space and power constrained applications. "Supermicro offers server class reliability and performance to the embedded server appliance market with low power solutions and long-life cycle support and availability," said Wally Liaw, Vice President Sales, International at Supermicro. "Our latest compact solution is optimized to deliver maximum performance with increased energy efficiency and offers full support of 3rd generation Intel Core processors based on Intel's 22nm process technology and 3D Tri-Gate transistors. Supermicro provides our embedded customers first to market advantages with ready to deploy, advanced technology platforms." "Customers today are looking for feature rich, off-the-shelf solutions that offer low power and better energy efficiency without compromising performance," said Matt Langman, director of marketing, Intel Intelligent Systems Group. "Embedded server appliances, like those from Supermicro, use the 3rd generation Intel Core processor family to provide unprecedented performance and breakthrough I/O capabilities. The platform enables highly optimized solutions for customers across a broad spectrum of workloads and segments, including Green Computing." For complete information on Supermicro's wide range of flexible, high-performance Embedded Server Building Block Solutions, visit www.supermicro.com/Embedded. For more information, visit the product pages of 5017P-TLN4F server and X9SPV-LN4F system board.