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TechPowerUp! Official IC Diamond Test

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got mine today as well. time for some testing then.

Ant tank you very much.
 
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ON MY HONOR IN EXCHANGE FOR FREE COMPOUND I DO SOLEMNLY SWEAR TO TEST AND POST MY RESULTS

currently running an i7 2600k overclocked to 4.7 and a 1.340 vcore asrock z77 extreme9 with NT-H1 pea in the center method and a corsair H80, Intel burn in test shoots up to 81C degrees and BF3 is 70C, ambient temperature is 30 degrees humidity has been 80% lately (Beijing China, can you ship international?)
I also got 2 HD6950 in crossfire with NT-H1 that are about 64-70C on load.
 
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hey icd, i was part of these tests a while back on another forum and while it continued to work great on the 8800gts it did degrade after extreme voltages on my cpu.

1.7vcore to my q9550 for a few hours benching turned the tim to mostly powder with a couple of stone like bits in it. it was also under a mount which had been mod'd for very high mounting pressure.

not arsed about the pitt marks it left on the cpu or heatsink tbh but i thought i would let you know it had happened.
 

IC Diamond

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marsey99 - I remember you - Not the forum but the name.

So What temps were you running? We do our reliability testing @ 125C 1000 hours with thermal cycling with no problem - Max recommended is 150C with short spikes to 200C. above 150C the polymeric binders break down under extended use is about the only way to get to a powder.

I have one guy at Anandtech who is 4 years on the same mount with no change in Temp and he runs in the 40's C range. On notebook review I have several in the 1-2-3 years running in the 60's to 70's C range with little or no degradation.

Contact is a real issue when you are looking at long term reliability as it relates to the watt density, for example say you 100% contact with 1.75 sq inches running 150 W . I have some images on files that are less than .25 inches contact so now apply 150 W to .25 sq inches and you have a soldering iron effect, the compound that is in the contact area will degrade faster as it is over stressed and when that fails the heat is then transferred inefficiently through the low contact area compound causing failure across the whole joint. the compound "sees" some multiple of power with reduced vs full contact.

I would note that some of the imprints posted here on TechPowerup have high pressure in the contact areas above the 85 lb pressure limit of the paper while contact is perhaps only in the 25% to 50% range. High pressure improves performance and is the dominate factor but the joint will not reach full potential without good contact.

I only have a couple of examples of rock hard solvent insoluble IC Diamond on a dismount and at least from the limited samples they were determined to be contamination from the factory something like a residue flux or industrial cleaner. But we have always recommended cleaning the IHS and Sink I think people look at a new sink and just assume it's clean, A view that they would not have if they saw the process first hand.


Is high viscosity (thickness) a desirable characteristic in a thermal compound?
Yes, OEM's Spec bulk loadings actually recommend above a 90+ % for reliability. IC Diamond boasts a 94% bulk loading which includes 92% diamond + miscellanous material.


There are different kinds of thermal resistance. One is contact resistance which the retail compounds mostly rely on by being of higher liquid content so they flow real nice into the voids and air gaps and with great or low contact resistance enhances thermal performance so that out of the gate many users are thrilled with the performance. Instant gratification

Low viscosity, highly liquid thermal pastes enjoy an ititial success but also make them susceptible to Pump Out. Pump Out occurs when the system heats up, the joint compresses, and a little of the liquid is pushed out. After a sufficient number of cycles, the paste has shruken in size leaving voids and causing a contact resistance failure. A variant of compound failure, Bake Out , occurs when consistently high thermal stress causes thermal degradation of the liquid. Pump Out and Bake Out reflect the research of many in the thermal community and hundreds of technical papers on the exist on the well-document issue.


Liquid is a necessary component where thermal pastes are concerned otherwise you would be applying a powder. IC Diamond uses much less liquid so consequently is much less prone to failures as the liquid is wicked or baked away The shrinkage of the compound is almost non existent due to the low liquid volume content to begin with and so maintains contact/ thermal performance for extended periods and by design to set up into a crayon like consistency over time, still pliable and relying on the high bulk Diamond conductivity for performance as you are left with basically diamond held coherently together with the polymeric binders and is easily removed when re-liquefied with a solvent

So in short the reason it is thick is that it is harder to pump a solid than a liquid and provides a basis for long term extended reliability.

High viscosity or thickness of compound is a positive feature to seek out and necessary for for long term reliability

It's easy to design a compound for performance and it is also easy to design for reliability

It is very hard to do both in one package
 

IC Diamond

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ON MY HONOR IN EXCHANGE FOR FREE COMPOUND I DO SOLEMNLY SWEAR TO TEST AND POST MY RESULTS

Currently rocking MX-4. Was part of the testing at OCF for the IC7.

3770K
DDR3 2666Mhz
GTX680 Lightning
Seasonic 1KW PSU


@ Stinger/ IC Diamond - How good is this product with sub-zero cooling? Has that been tested yet? Does it hold up its cooling properties with DI temps? LN2? LHe?
http://innovationcooling.com/gilgamesh1.htm

Works well follow the link - I would let the compound cure at room temp to give it time to spread minimum 10 min with a re-torque if it is a screw mount.
 
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ON MY HONOR IN EXCHANGE FOR FREE COMPOUND I DO SOLEMNLY SWEAR TO TEST AND POST MY RESULTS .

I currently am using arctic ceramique and would love to give your compound a try! Sounds like fun !!
 
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hm if i receive some i'm going to remount this Zalman cnps10x extreme

i have recently discovered that my cooler was missing the back-plate, so i'm going to bug both overclockers.co.uk and Zalman about it, as obviously someone either removed the plate from the box or it wasn't in there, so i'm owed at least an explanation :mad:
 
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Just got mine. Will do some tests tonight :)

Edit: Have you guys tried it on a GPU yet? is it beneficial there aswell?
 
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ON MY HONOR IN EXCHANGE FOR FREE COMPOUND I DO SOLEMNLY SWEAR TO TEST AND POST MY RESULTS!

Giving this lurker a reason to post. :D
 
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On my honour, in exchange for free compound, I do solemnly swear to test and post my results.

I'll be testing it with my 2500K @ 4.8GHz, with an NH-D14. I'm currently using Noctua's NT-H1, but I believe I applied it wrong since my temperatures are worse than my previous Corsair A70 :eek:. I'll reapply it to test, then apply the IC Diamond 24 afterwards to test and compare. My intent would be to decrease my temperatures a bit with the IC Diamond 24 to bump up my clocks more.
 
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was going to do the pressure test again but my kids gots the b papers :(
 
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I still didn't get it :-(
 
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I just got my thermal compound direct at my doorstep! :)
Thanks a lot. I have fever now. Will try it very soon.
Thanks a lot again. :)
 

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damn wish i had been a member for 3 months or had 50 posts im using arctic sliver 5 and would love to try something better
 
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Okay so I still don't have a system up and running, but I will soon. Managed to buy a Maximus IV Gene w/ a glitchy PCI-E slot and RMAed it. Once that gets back I'll be able to test the TIM. The good thing is I have a Thermaltake Water2.0 Extreme coming in, so that'll be a great cooler to pair the IC Diamond with.
 
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Today, I tried the thermal compound on my friends laptop.
It is definitely good.
Application is slightly difficult as it is the direct on-chip application.
Have a suggestion. Make the thermal compound's density slightly less.
I mean it should be more viscous. :)
More tests coming.
Including the pressure tests on my desktop.
AMD Phenom II X4 955 CPU.
So stay tuned. :)
 

Random Murderer

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Stinger, is it too late to hop in on this?
Running the OC I am, every degree helps:roll:
System tested would be my X79 rig in my specs to the left.
 

IC Diamond

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Today, I tried the thermal compound on my friends laptop.
It is definitely good.
Application is slightly difficult as it is the direct on-chip application.
Have a suggestion. Make the thermal compound's density slightly less.
I mean it should be more viscous. :)
More tests coming.
Including the pressure tests on my desktop.
AMD Phenom II X4 955 CPU.
So stay tuned. :)
The high viscosity relates to high reliability.

Is high viscosity (thickness) a desirable characteristic in a thermal compound?

Yes, OEM's Spec bulk loadings actually recommend above a 90+ % for reliability. IC Diamond boasts a 94% bulk loading which includes 92% diamond + miscellaneous material.


There are different kinds of thermal resistance. One is contact resistance which the retail compounds mostly rely on by being of higher liquid content so they flow real nice into the voids and air gaps and with great or low contact resistance enhances thermal performance so that out of the gate many users are thrilled with the performance. Instant gratification

Low viscosity, highly liquid thermal pastes enjoy an initial success but also make them susceptible to Pump Out. Pump Out occurs when the system heats up, the joint compresses, and a little of the liquid is pushed out. After a sufficient number of cycles, the paste has shrunken in size leaving voids and causing a contact resistance failure. A variant of compound failure, Bake Out , occurs when consistently high thermal stress causes loss of the liquid by evaporation. Pump Out and Bake Out reflect the research of many in the thermal community and hundreds of technical papers on the exist on the well-documented issue.


Liquid is a necessary component where thermal pastes are concerned otherwise you would be applying a powder. IC Diamond uses much less liquid so consequently is much less prone to failures as the liquid is wicked or baked away The shrinkage of the compound is almost non existent due to the low liquid volume content to begin with and so maintains contact/ thermal performance for extended periods and by design to set up into a crayon like consistency over time, still pliable and relying on the high bulk Diamond conductivity for performance as you are left with basically diamond held coherently together with the polymeric binders and is easily removed when re-liquefied with a solvent

So in short the reason it is thick is that it is harder to pump a solid than a liquid and provides a basis for long term extended reliability.

High viscosity or thickness of compound is a positive feature to seek out and necessary for for long term reliability

It's easy to design a compound for performance and it is also easy to design for reliability

It is very hard to do both in one package
 

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plenty of tubes available
ON MY HONOR IN EXCHANGE FOR FREE COMPOUND I DO SOLEMNLY SWEAR TO TEST AND POST MY RESULTS

Thanks, and I'll be emailing Andrew any time now.
EDIT: Email sent.
 
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Do we have any conclusive results on this yet? Graphs and comparisons ftw.. ^^
Been using AC5 for a long time and it's treated me well. Dare I move on? I'm waiting to see..
 
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got my tube today. I was thinking we'd get 5 grams or something but it's pretty big :)
 
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