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TechPowerUp! Official IC Diamond Test

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Do this count for stock cooling? If so, I'll be testing on a AMD Athlon x3 450 unlocked to AMD Phenom ii x4 B50 @3.2ghz, plus 2 120mm fans(1 intake and exhaust). I'll do my first testing.

Edit: I just email support@innovationcooling.com my info
 
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I received my paste a week ago and I will be testing within this week... I've been really busy with work lately so I'll be probably be doing the test on my day off... Thank you very much IC! :toast:
 
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This is the best thermal compound I have used so far!
Results:

By itsakjt at 2012-09-16


By itsakjt at 2012-09-16


By itsakjt at 2012-09-16


By itsakjt at 2012-09-16


By itsakjt at 2012-09-16


By itsakjt at 2012-09-16

Before IC Diamond 24(Cooler Master Thermal Fusion 400)


By itsakjt at 2012-09-16

After IC Diamond 24


By itsakjt at 2012-09-16

So you can see that is a straight 1 degree C difference with the fan speed lower as well.
I am sure the difference will be more drastic with a better cooler(I am using the stock AMD cooler).

My specs are on the left.
NOTE: The day I tested the Cooler Master was cooler(2-3 degree C) than today. So my conclusion is IC Diamond 24 is the best thermal compound I have used so far. :)
Next test coming- My Sapphire Radeon HD 6770 1 GB DDR5.
And if you can, can you please tell me the proper method of application on GPUs and laptop CPUs(direct on-die)?
 
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UPDATE:
It seems that the thermal compound is doing even more awesome under high overclocks.
Previously, I could not get to 3.8 GHz as the CPU temp exceeded 64 degree C.
Today I tried 3.8 GHz even with the IMC at 2834 MHz and the RAM at 1744 MHz.
System is super stable. :)
Temps didn't go above 61 degree C even after 1 hr of Prime95.
I am going to buy an IC Diamond 24 after this one's finished and post a pic of it here.
Love you guys at IC Diamond!
All the best. :)
 
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I'm tempted to put on my GPU as well but I take it you just but far less on it then you did for the CPU.
 
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I'm tempted to put on my GPU as well but I take it you just but far less on it then you did for the CPU.
used a 3mm dot on gpu in spec
results for GPU run
from rig in specs
GPU:core 1070 mem 1400 stk voltage stk fan profile
Before Compound: MX4
Ambient Temp:30c 08/8/12 9pm
Idle Temp:38c
Load Temp:92c @stk_FurMarkv1.9.1 fan profile Auto [avg 3 runs]

ICD
Ambient Temp:29c 26/08/12 7pm
Idle Temp:36c
Load Temp:76c @stk_FurMarkv1.9.1 fan profile Auto [avg 3 runs]



GPU_o/c 1100core/1500mem stk voltage fan 95%
Before Compound: MX4
Ambient Temp:30c 08/8/12 9pm
Idle Temp: 35c
Load Temp:84c FurMarkv1.9.1 [avg 3 runs]


ICD
Ambient Temp:29c 26/08/12 7pm
Idle Temp:35c
Load Temp:78c FurMarkv1.9.1 [avg 3 runs]
source
 

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damn, now I know I'll be reapplying the paste on my cards. still on the stock gunk!
 
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I'm curious does this use lab diamonds or the old fashion sort?
 
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i used IC Diamond 7 in the past, but its to expensive for me atm, it does work great i tell you that,
my xeons would love to try 24 type :)
 
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How much cure time should I allow for the IC24? It seems that my temps didn't improve, at least not the idle temps. I left the PC on overnight and the temps are the same still.

I was using IC7, so maybe IC24 it isn't a big improvement over it? Should I "bake" the TIM? maybe run OCCT for a few hours or something?
 

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How much cure time should I allow for the IC24? It seems that my temps didn't improve, at least not the idle temps. I left the PC on overnight and the temps are the same still.

I was using IC7, so maybe IC24 it isn't a big improvement over it? Should I "bake" the TIM? maybe run OCCT for a few hours or something?
I haven't received mine yet but was wondering as well. Maybe you have to heat cycle the 'puter like with AS5? You know, cold boot, heat it up nice and toasty(Intel Burn test or similar), let it idle til temps drop again, shut down and let the system cool to ambient. Rinse and repeat a few times.
Not sure if this stuff requires the same sort of burn-in, but it sure helps set AS5 a hell of a lot quicker(~five heat cycles versus up to a month of regular computing)
 
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I haven't received mine yet but was wondering as well. Maybe you have to heat cycle the 'puter like with AS5? You know, cold boot, heat it up nice and toasty(Intel Burn test or similar), let it idle til temps drop again, shut down and let the system cool to ambient. Rinse and repeat a few times.
Not sure if this stuff requires the same sort of burn-in, but it sure helps set AS5 a hell of a lot quicker(~five heat cycles versus up to a month of regular computing)
I'd like to know too. Yesterday I saw a 1C improvement in load temps but it could have been the weather as it rained. I've run four cold-hot cycles already.
 

IC Diamond

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I haven't received mine yet but was wondering as well. Maybe you have to heat cycle the 'puter like with AS5? You know, cold boot, heat it up nice and toasty(Intel Burn test or similar), let it idle til temps drop again, shut down and let the system cool to ambient. Rinse and repeat a few times.
Not sure if this stuff requires the same sort of burn-in, but it sure helps set AS5 a hell of a lot quicker(~five heat cycles versus up to a month of regular computing)
Process of curing is a function of heat and pressure where the compound resolves down to the average particle size- We initially tested curing time by using a synthetic IHS clamped between two glass slides with 4 binder clips at approx 60 PSI with IC Diamond applied at ambient room temp and then with a micrometer at one min intervals measured the compound's bond line thickness (BLT) after 5 min we were at 98% of the average particle size overnight 100%.

Most of the C/P images on TPU have been exceptionally light so cure times can vary and some may be so light that the final BLT may never be reached.

Pressure does impact your cure time as well as your final performance so a delayed cure would be an indicator of light pressure and room for improvement in the mount.

 
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IC Diamond

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I'm curious does this use lab diamonds or the old fashion sort?
Synthetic Diamond in selected multiple sizes to maximize contact between particles optimized for the best heat transfer.

Not as simple as one would think as a single size perhaps for example a 9 micron particle compound would give you the same performance or worse than a stock compound.
 
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The pressure paper did show an extremely light pressure, as if the heatsink was concave. The fact that is mounted horizontally might affect that too as gravity would pull away from the mount. I drew a crossed circle on the heatsink and lapped with 1500 grit until it was erased and the pressure improved somewhat but still there's a lot of light pressure on the center.

I'll try with the board outside the case to let the heatsink rest on the socket.
 

IC Diamond

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The pressure paper did show an extremely light pressure, as if the heatsink was concave. The fact that is mounted horizontally might affect that too as gravity would pull away from the mount. I drew a crossed circle on the heatsink and lapped with 1500 grit until it was erased and the pressure improved somewhat but still there's a lot of light pressure on the center.

I'll try with the board outside the case to let the heatsink rest on the socket.
Remember that the sink is only 1/2 the contact equation the other half being the IHS. In some cases the IHS may be so deformed that good contact is not possible without lapping the IHS also.

It may be that the sink is deflected by it's weight but there should be adequate pressure to secure it tightly so this should no be an issue so perhaps a shim of some sort?

Over tightening can be an problem also - Some end users tell me that with water blocks they tighten to the point we the board begins to bend and then back off a bit, if the board is bent this will pull the processor away from the sink losing contact.

Enough to try the patience of the most dedicated mechanic.

Ideally you would lap the IHS and sink together with a lapping compound for a perfect fit like they used to do with the old Saab engine block and head so they needed no head gasket.
 
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My CPU is lapped as well:



I'll try to lap the heatsink more over the weekend.
 
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Ok, SABERTOOTH x58 i7 920 at stock cmos:

Idle at desktop: 35
Intel Stress Test from Extreme Tuning Utility: 43
F@H 8 threads: 56

This is using 4GB 1333 DDR3 Triple Channel, and an old application of IC Diamond.

I will remove Dell heatsink, clean, and check with C/P.
 
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I just finished with my tests. I'll post results now.
 
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This thermal compound is awesome.
I have got a HP-430 laptop and so do my college friends-given by our college. The Pentium Dual Core Sandy Bridge model.
In my laptop, I used my Cooler Master Thermal Fusion 400 and the max temp is 79 degree C.
Today I applied IC Diamond 24 in my friend's laptop and believe it his maximum temperature is now 64 degree C that is a straight 15 degree C difference.
 
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ON MY HONOR IN EXCHANGE FOR FREE COMPOUND I DO SOLEMNLY SWEAR TO TEST AND POST MY RESULTS

Currently rocking MX-4. Was part of the testing at OCF for the IC7.

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@ Stinger/ IC Diamond - How good is this product with sub-zero cooling? Has that been tested yet? Does it hold up its cooling properties with DI temps? LN2? LHe?
Ok...... the eagle landed last week and went up H2H with MX-4....

Environment was 21C under custom water for the tests. I remounted the Diamond a couple times to make sure i was getting a good spread/mount as this stuff is STICKY and doesnt spread well it seems. That said after a good contact I saw these results:

Stock:
MX-4 idle - 27C (average across cores)
IC D idle - 27C ( " " " )
MX-4 load - 54C ( " " " )
ICD load - 53C ( " " " )

Overclocked - 4.9Ghz 1.5v - (no power saving on constant v and clocks)
MX4 idle - 30C
ICD idle - 29C
MX4 load - 93C
ICD load - 91C


Ugh, the viscosity and the ability of this stuff to spread is thick, wow. It doesnt even like to spread with a credit card or anything it just like clumps and rolls off the processor. Gotta do something about that if possible with the materials you use!

Thanks for the sample, solid product guys. :) :toast:
 
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Who can tell me where, other than SensorProducts (in their various incarnations) where I might buy the Fuji Prescale, or similar, without having to commit to several hundred dollars worth of product?
 

Random Murderer

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Received mine today, but I won't be able to test until this weekend.
It wasn't mentioned anywhere else in this thread that I saw, but it came with two envelopes of pressure paper labeled "A" and "B," and both contain the same size squares. The pressure paper was mentioned, but what's with the two separate envelopes, I thought it just turned pink/red where the pressure is applied? What am I missing here? Am I supposed to use one of each?:confused: I've never used pressure paper before, I feel dumb now, lol.:banghead:

Oh, and thanks again Stinger and Andrew!
 

theonedub

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IC Diamond looks to be performing well, will reevaluate the temps after a few days of use:

On Low:


On High
 
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