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The Official Thermal Interface Material thread

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That was Intel's first year using paste instead of solder. Probably didn't have a good formula nailed down yet.
 
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Incomplete list of Intel Soldered/Not Soldered processors for your immediate convenience!!

 
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A comment from @Shrek was here a moment ago that stated;
"Some people argue that the TIM is the weak point, but I beg to differ as the TIM might get one 2°C while a better CPU cooler might get one more.

So, I got me a new CPU cooler for $11 that should get me more than 2°C"
I happen to agree. No TIM can or will ever overcome the limitations of the cooling mechanism. Improve the cooler, improve the cooling. Basic cooling physics.
Well, he is correct...a good TIM, applied as instructed (in thin layer) might have the best results.

But putting a cooler with more TDP W, will get you better results. I can confirm that!
& do not go with "bigger cooler"...as bigger is not always better! & just stresses your motherboard & CPU.
As you should not go with "more expensive TIMs", as money is not measure of better W/mK...but maybe better quality?! :confused:

I did the same thing on previous systems...& got the similar results.
How much of it is 'cause of a new paste? That is also a question, but it was the same paste (back then, not so good MX-4).
 
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I didn't and wouldn't disagree with that.
Check the Shrek previous formula, few pages back...it says just that! ;)
Of course, that's just basic physics and common sense.
It is as a putting a more gravity into the same orbit...or putting larger suction fan on a same volume of canister with same smaller hole (smaller hole being the TIM). :cool:
 
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