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Thermal adhesive backing vs. Thermal compound better bond?

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To avoid private messaging MORE people ( you know you are :)) in attempts to get second opinions...


I have lightweight copper sinks that are going to be set on the board MOSFETS.

They come with a thermal adhesive backing. You remove the film, hold in place ten seconds bla bla etc.

Should I strip the sink, clean it up and then use Ceramique compound?

The performance would be better. I just wonder which will hold them in place more efficiently over time.
 
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ah I thought you meant it used thermal pads.. I think the adhesive would be best that liquid something pro brand of stuff sells an adhesive you can use too.. its like a sticky pad but it literally is a glue that glues the mosfets to your ram/board I think its damm near imposable to remove too.

Hopefully you get a more professional opinion, since I dont know much about it and have never used Ceramique to know its texture :p.

heres a link to the glue pads.. but theses one you have to let melt and literally glue, sorry I couldnt be more help lol.
http://www.frozencpu.com/cat/l3/g8/...Interface_Materials-Coollaboratory-Page1.html
 
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if you dont mind them being permanent use artic silver thermal adhesive, its a 2 part epoxy like stuff, sets to a metal alloy and is permanent, thermal paste will not hold them on, i have used the arctic adhesive to bond headsinks to radiators, and they aint budging, good stuff imo, have used them on ramsinks on vid cards b4
 
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I know what I can buy to serve this purpose, however I am asking, between the stock adhesive backing and the Ceramique compound, which is going to hold longer.
 
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Ceramique is a thermal grease isn't it? This has no adhesive properties at all, so unless you make a retention device, i'd say the adhesive backing will hold longer ;)
 
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I wouldn't trust a compound to hold heatsink on man, I mean if you bump your case and one falls of onto the board then its pretty certain you will see some smoke escape from your case followed by a really not very nice burny smell!!! :eek:

The adhesive ones will be fine, and they will stick, like the other guys said you can use AS thermal adhesive, I found if you only use a small dot of it you can actually break the sinks off later on with out damaging anything...
 
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Right, the compound should serve maybe as a suction, but not an adhesive.

That's what I wanted to confirm.

Since I may be returning this board for a program deal, I don't want to PERMANENTLY adhere anything so I will probably end up using this :

http://www.chilledpc.co.uk/shop/product_info.php?cPath=66&products_id=158


I just have the fun of cutting it into tiny tiny MOSFET sized pieces..joy!
 
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