- Joined
- Jun 20, 2007
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System Name | Widow |
---|---|
Processor | Ryzen 7600x |
Motherboard | AsRock B650 HDVM.2 |
Cooling | CPU : Corsair Hydro XC7 }{ GPU: EK FC 1080 via Magicool 360 III PRO > Photon 170 (D5) |
Memory | 32GB Gskill Flare X5 |
Video Card(s) | GTX 1080 TI |
Storage | Samsung 9series NVM 2TB and Rust |
Display(s) | Predator X34P/Tempest X270OC @ 120hz / LG W3000h |
Case | Fractal Define S [Antec Skeleton hanging in hall of fame] |
Audio Device(s) | Asus Xonar Xense with AKG K612 cans on Monacor SA-100 |
Power Supply | Seasonic X-850 |
Mouse | Razer Naga 2014 |
Software | Windows 11 Pro |
Benchmark Scores | FFXIV ARR Benchmark 12,883 on i7 2600k 15,098 on AM5 7600x |
To avoid private messaging MORE people ( you know you are ) in attempts to get second opinions...
I have lightweight copper sinks that are going to be set on the board MOSFETS.
They come with a thermal adhesive backing. You remove the film, hold in place ten seconds bla bla etc.
Should I strip the sink, clean it up and then use Ceramique compound?
The performance would be better. I just wonder which will hold them in place more efficiently over time.
I have lightweight copper sinks that are going to be set on the board MOSFETS.
They come with a thermal adhesive backing. You remove the film, hold in place ten seconds bla bla etc.
Should I strip the sink, clean it up and then use Ceramique compound?
The performance would be better. I just wonder which will hold them in place more efficiently over time.