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Thermal Compound Review Roundup

Discussion in 'Overclocking & Cooling' started by Sasqui, Jan 26, 2012.

  1. Sasqui

    Sasqui

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    10 Year Member at TPU Crunching for Team TPU
  2. Sir B. Fannybottom

    Sir B. Fannybottom

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    They tested chocolate before Ic Diamond 7?
     
  3. Jetster

    Jetster

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    Its about right. Basically there is little difference in compounds. Just dont use Chocolate, nothing or stupid shit and you will be ok
     
  4. the54thvoid

    the54thvoid

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  5. LagunaX

    LagunaX

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    bmaverick and Sasqui say thanks.
  6. RejZoR

    RejZoR

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    No Coollaboratory Liquid Pro/Ultra ?!
     
    10 Year Member at TPU
  7. natr0n

    natr0n

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    arctic alumina is my fav, quick curing too.
     
  8. entropy13

    entropy13

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  9. claylomax

    claylomax

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    Hardware Secrets does very good PSU reviews. They do these thermal compound rounds every month or so I believe, check out for the other materials they use sometimes: toothpaste, lipstick, etc ... :laugh:
     
  10. bmaverick

    bmaverick

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    Indeed this link shows more valued information. The contact pressure to temperature alone shows how well these pastes work. Fining a paste that works well under poor pressure (hold-down hardware) and then better at clamp down pressure is ideal. In other words, if your CPU, GPUs and NB blocks have different clamping loads, a thermal paste that can cover all of those loads would save the user on costs and applications.
     

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