Tkpenalty's X1950~HD4k Clubhouse

[binormalkilla]

Will double-sided tape conduct heat?

Grab some double side thermal tape, like the stuff that comes pre-installed on RAMsinks.
BTW, do you have a link for that backplate you ordered for the VRMs? Is is shorter than a RAMsink? I'm thinking about getting something to cool my PULSE chips......
Thermal tape link:
http://www.thermaflo.com/ifmat_tape.shtml
BTW from what I've heard, using any kind of thermal paste on IC chips isn't a good idea. That stuff is usually capacitive (not very conductive though) and can cause problems if they span across a live circuit on the PCB.

That link I showed has descriptions for the applications involved. It has some pretty good stuff there, such as thermal conductivity, elasticity, etc. This way you can find something that conducts well, but doesn't need support after it's been applied. If you want something to attach a VRM sink with I would use something that doesn't permanently bond to the IC, in case you have to RMA.

 

[tkpenalty]

Grab some double side thermal tape, like the stuff that comes pre-installed on RAMsinks.
BTW, do you have a link for that backplate you ordered for the VRMs? Is is shorter than a RAMsink? I'm thinking about getting something to cool my PULSE chips......
Thermal tape link:
http://www.thermaflo.com/ifmat_tape.shtml
BTW from what I've heard, using any kind of thermal paste on IC chips isn't a good idea. That stuff is usually capacitive (not very conductive though) and can cause problems if they span across a live circuit on the PCB.

That link I showed has descriptions for the applications involved. It has some pretty good stuff there, such as thermal conductivity, elasticity, etc. This way you can find something that conducts well, but doesn't need support after it's been applied. If you want something to attach a VRM sink with I would use something that doesn't permanently bond to the IC, in case you have to RMA.

Nah, Powercolor said I can keep the VRM plate on if I need to RMA and send me a new X1950PRO with the VRM plate.

 

[micron]

That stuff is usually capacitive

ca·pac·i·tance Pronunciation (k-ps-tns)

1. Symbol C The ratio of charge to potential on an electrically charged, isolated conductor.
2. Symbol C The ratio of the electric charge transferred from one to the other of a pair of conductors to the resulting potential difference between them.

I think what you're really talking about is thermal epoxy......regardless, the stuff neither capacitive or conductive.

 

[erocker]

Hey! I'm wondering what people are getting for 3dMark06 scores with thier x1950 AGP cards.

Here's mine:

 

[tkpenalty]

Hey! I'm wondering what people are getting for 3dMark06 scores with thier x1950 AGP cards.

Here's mine:

Thats a good score

 

[tkpenalty]

Grab some double side thermal tape, like the stuff that comes pre-installed on RAMsinks.
BTW, do you have a link for that backplate you ordered for the VRMs? Is is shorter than a RAMsink? I'm thinking about getting something to cool my PULSE chips......
Thermal tape link:
http://www.thermaflo.com/ifmat_tape.shtml
BTW from what I've heard, using any kind of thermal paste on IC chips isn't a good idea. That stuff is usually capacitive (not very conductive though) and can cause problems if they span across a live circuit on the PCB.

That link I showed has descriptions for the applications involved. It has some pretty good stuff there, such as thermal conductivity, elasticity, etc. This way you can find something that conducts well, but doesn't need support after it's been applied. If you want something to attach a VRM sink with I would use something that doesn't permanently bond to the IC, in case you have to RMA.

I know about thermal tape obviously that stuff probably is hard to obtain, and Shin-Etsu is better.
Thermal tape by all means is never capacitive FYI, why do they have it for RAM chips?!

 

[Pinchy]

Hey! I'm wondering what people are getting for 3dMark06 scores with thier x1950 AGP cards.

Here's mine:

Nice score considering 3dmark06 is HEAVILY CPU dependant

 

[tkpenalty]

Grab some double side thermal tape, like the stuff that comes pre-installed on RAMsinks.
BTW, do you have a link for that backplate you ordered for the VRMs? Is is shorter than a RAMsink? I'm thinking about getting something to cool my PULSE chips......
Thermal tape link:
http://www.thermaflo.com/ifmat_tape.shtml
BTW from what I've heard, using any kind of thermal paste on IC chips isn't a good idea. That stuff is usually capacitive (not very conductive though) and can cause problems if they span across a live circuit on the PCB.

That link I showed has descriptions for the applications involved. It has some pretty good stuff there, such as thermal conductivity, elasticity, etc. This way you can find something that conducts well, but doesn't need support after it's been applied. If you want something to attach a VRM sink with I would use something that doesn't permanently bond to the IC, in case you have to RMA.

I know about thermal tape, obviously that stuff is decent and hard to obtain. Shin-Etsu is wayyyy better.
Thermal tape by all means is never capacitive FYI, why do they have it for RAM chips?!



http://vizo.com.tw/index.php?main_page=vizo_product_info&products_id=31&tab=1

Get these, the plate will not fit on the HIS IceQIII, its only meant for acceleroX2 + X1950PRO (non-palit). Then you will have spares to cool other mofsets, etc. Btw, get the DDR400 variant and not the DDR2.

 

[binormalkilla]

While it is not electrically conductive, the compound is very slightly capacitive and could potentially cause problems if it bridges two close-proximity electrical paths.)

From Arctic's website on AS5
http://www.arcticsilver.com/as5.htm
I'm a junior level electrical engineering student, so you don't have to explain capacitance to me

 

[tkpenalty]

...oh geez.... AS5 is silver-based, thus there would be SOME potential to be capacitive. Ceramic thermal pastes prevent any conduction and thermal pads/tape/epoxy usually prevent any capacitive characteristics (unless you are talking about special purpose types).

 

[binormalkilla]

Yea I know the tape isn't capacitive or electrically conductive, only thermally. I thought you mentioned using some ceramic based stuff earlier, and I've always read that any thermal compound is risky on IC chips. It's better to use tape on IC chips, compound on cores.

Anyhow, I think it's gonna be a tight fit if I do decide to sink these PULSE chips. Look how close they are to the fan! I may be able to get an old CPU heatsink and take it to a machine shop. This way they can trim it down to clear the fan. I really don't know of any RAMsinks that will fit under that clearance.

 

[tkpenalty]

Which faggotised bastard just one-starred our thread and 5 starred the others?!!! :shadedshu, doing that doesn't make you have a big e-penis you wanker/tosser.

 

[tkpenalty]

Um Binormalkilla, the SLEET VIZO heatsinks I recommended will not fit D=. Try to get copper heatsinks that have the fin broadside 90* away from the fan. Alu is fine, but at that size not really great.

EDIT: If some mod walks past, edit the title, adding [X1950 series support] to it. Sticky pl0x

 

[Zubasa]

I guess [X1950 Series Clubhouse & Support] will be better. lol

 

[binormalkilla]

doing that doesn't make you have a big e-penis you wanker/tosser.

ROFLMAO

 

[leopr]

They aren't over the VRM modules. Its better to cool them than let them burn. @125 degrees they will be likely to malfunction

So which are the VRM modules ? i thought they were under those black ceramic heat spreaders.

 

[technicks]

Will double-sided tape conduct heat?

Yes it will, but you have to get it as thin as possible.

I bought some for 50 cents and it works just as good as the stuff they sell at your pc store.

 

[tkpenalty]

Heatsink the two Pulse/VTEC chips.

 

[tkpenalty]

So which are the VRM modules ? i thought they were under those black ceramic heat spreaders.

Honestly, on the powercolor model, they seem concealed or aren't cooled. Apart from that the VTEC and PULSE chips get too hot for my liking.

 

[binormalkilla]

I don't think that I'm going to bother sinking the PULSE chips because they don't get very hot on mine. I touched them after a run on the artifact scanner and they don't get that hot. I still want to see exactly how hot they are while scanning so I'm gonna try to get an infrared thermometer.

 

[tkpenalty]

I was thinking that too. The VRMs on the X1950PRO Powercolor are heatsinked by two ceramic black plates... HOWEVER they aren't sufficient. People who switch from stock to VF900CU are going to get an unpleasant surprise. There is no heatsink!!!

 

[tkpenalty]

UPDATE:

26/2/07

URGENT TO PEOPLE USING X1950PRO WHO WISH TO SWITCH TO A VF900CU

Please remember to buy heatsinks, due to the fact that the VRMS DO NOT have cooling after you remove the stock cooler. This is an exception to the X1950PROs from the following manufactures/model, Powercolor Extreme 256/512, HIS ICEQIII, PALIT, GIGABYTE, HIS (standard) PCI-E.

Other brands not mentioned WILL NEED heatsinks.

VF900CU users SHOULD invest in extra heatsinks for the VRMs, I would recommend these http://www.newegg.com/Product/Product.asp?Item=N82E16835118220 (same as the ones that come with your VF900CU LOL) Extra ones can go onto the MOFSET on the GPU/Motherboard.

After removal of the standard cooler that part of the PCB should look like this

That is how the reference cooler looks like, anything similar after removal WILL NEED VRM HEATSINKING!


For AcceleroX2 Users (if it doesn't come with it): http://cgi.ebay.com/VR-Heat-Spreade...9009786QQihZ017QQcategoryZ80151QQcmdZViewItem
.

DO NOT INSTALL THE VF900 CU WITHOUT HEATSINKING THE VRMS. THIS MAKES THE VF900CU BAD BECAUSE THEY DID NOT THINK ABOUT SUPPORT FOR X1950PRO.

 

[binormalkilla]

Yea LOL I installed a VF900 on my Sapphire and it had black screens even in the CCC preview! I'm not getting rid of my Arctic IceQ3 cooler though, because it's great.

 

[Zalmann]

I guess I must be lucky with my Gigabyte GV-RX195P256D-RH, X1950 Pro. I don't have the same problems as others do on this thread with VRM's overheating. My VC uses discrete components (ie mosfets) instead of integrated VR modules. Using PWM power circuitry is more efficient than using voltage regulators. These surface mount MOSFETS are mounted and soldered onto the circuit-board which acts as a heatsink.

With this VC, Gigabyte decided not to go with the reference ATI design and designed their own PCB.

A top view with my VF900-CU

From the back, you can clearly see the mosfets and the solid state, low ESR capacitors and the inductors which make up the power circuitry. No VRM's here.

 

[tkpenalty]

Yes indeed. But no voltage control is possible.
Damn... I should have went one day earlier to buy the Gigabyte one... but they were sold out the day I went... so I had to settle for this one.
The gigabyte will be VERY EASY to volt mod.