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x570s Chipset Cooling. Any Ideas?

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Hello everyone!

Since the newest variant of x570 chipsets have fanless design, they can be real hot in this summer conditions. In the 25C room condition, the chipset runs at 60-65 degree Celcius. In order to increase the life expectancy of my motherboard, I decided to take apart the chipset and change to paste or thermal pad. However, I couldn't decide about which substance should I use. Would you prefer thermal pad of 1mm thickness or a thermal grease of a very high heat conductivity?

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If it had a thermal pad, use a thermal pad of same thickness.
 
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id use thermal paste its better heat transfer.
 
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As thick as the old um, clay was hehe, I'd go with a pad. Unless the sink will tighten down enough to make using paste a viable option(without being sloppy).
 
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Would you prefer slightly thicker pad (1,5mm for example)?
 
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I would go for thermal paste, but you would need to test first if going for thermal paste
Apply the paste, press the heatsink onto it, remove to check the paste spread, if it doesn't spread well, the spacing between the heatsink and chip might be too large for thermal paste
 
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i mod cams for deep sky imaging and when i do a cooling mod which puts a cold finger on the back of the chip i put a 1mm thick thermal pad with the middle cut out and fill it with paste and have the best of both worlds it works without mess , just thought id mention it.
 
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just put it as it was before just put thermal paste and zip tie small fan lol
actually heatsink is quite big maybe 60x60 fan i used those on x58 days worked rly well
 
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I see no one suggesting the K5-PRO ?
In theory, it should work. (unless the pad is over 3mm thick?)
 
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am i the only one bothered that he rips his chipset heatsink off because it runs nice and cool but for some odd reason not enough?
 
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65c if fine with that ambient temperature. Get a pad of the same thickness, with the highest W/mK possible.
 
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Ok, I'm getting a new pad from Thermal grizzly since it has the highest thermal conductivity. But what does the thickness should be? The default thickness is 1mm. Should I buy 1,5mm or 0,5mm. Which one is better?
 
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Ok, I'm getting a new pad from Thermal grizzly since it has the highest thermal conductivity. But what does the thickness should be? The default thickness is 1mm. Should I buy 1,5mm or 0,5mm. Which one is better?
1 mm.
 
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Ok, I'm getting a new pad from Thermal grizzly since it has the highest thermal conductivity. But what does the thickness should be? The default thickness is 1mm. Should I buy 1,5mm or 0,5mm. Which one is better?
The principle is the thicker the pad the better the heat transfer to a certain degree.

The principle is the thicker the pad the better the heat transfer to a certain degree.
The Pad you had on the chipset before looks like it is 2mm though.
 

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65c if fine with that ambient temperature. Get a pad of the same thickness, with the highest W/mK possible.

I want to know is it normal ? mine only hits 60c if it's about 92f+ in the room lmao.

Maybe there is some bad contact there.
 
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am i the only one bothered that he rips his chipset heatsink off because it runs nice and cool but for some odd reason not enough?
I did find it "puzzling". IMO, this is one of those scenarios where it is best to follow one of the basic tenets of electronics operation and maintenance - "If it ain't broke, don't fix it!"

But since we are already past that, I will say this - it is much more important to "properly" apply new TIM (thermal interface material) than deciding which TIM to apply. Proper application includes thoroughly cleaning the mating surfaces of old TIM and other contaminants before applying new TIM. Also, it is critical to ensure proper ESD precautions are observed. Then applying as thin a layer as possible while still providing complete coverage. If using a pad, I would use the same thickness. The motherboard engineers/designers chose that specific thickness for specific technical reasons. It was not some arbitrary decision based on a roll of the dice.

The principle is the thicker the pad the better the heat transfer to a certain degree.
Sorry, but actually, that is not true - the opposite is.

The most efficient transfer of heat occurs with direct metal-to-metal contact. It is important to remember the primary purpose for using any thermal interface material is to compensate for any irregularities in the flatness of the mating surfaces - that is, to fill unevenness and any microscopic pits and valleys that may trap unwanted "insulating" air between those surfaces. Any excess TIM is actually in the way and counterproductive to the most efficient transfer of heat.

So why use thicker pads? They are used to compensate for mechanical constraints - to act like a "shim" or spacer so proper and even mounting pressures for the heatsink are applied. In some cases, a single heatsink may be used to cool more than one device that are not exactly the same height. For example, a thick pad may be used on a RAM stick where a single heat sink is used to cool 8 memory chips. A thicker pad will compensate for any height differences.

For additional information, see heat - Thermal pad thickness - Electrical Engineering Stack Exchange and temperature - Thermal pads, their thickness and conductivity - Electrical Engineering Stack Exchange

In order to increase the life expectancy of my motherboard
:( Sadly, there is a lot of misinformation being spewed out there by some "influencers" and wannabe experts who have had no formal education in electronics and should not even be talking about electronics. The idea that "cooler is always better" is one of those.

While keeping our electronics properly cooled is absolutely essential and critically important, cooler does NOT automatically mean better. As long as the electronics are being operated comfortably within their normal operating temperatures, there is no reason to expect cooler temps will make it perform better, be more stable, or have a longer life expectancy. In those scenarios, all you really get is bragging rights.

Your specs do not say which Asus Tuf case you have (assuming the computer in your specs is the one we are discussing here). Nevertheless, it must be noted it is the case's responsibility to provide a sufficient supply of cool air flowing through the case. The various component heatsinks must extract the heat from the device, but it is the air flow provided by the case cooling that must exhaust that heat out of the case.

While some may consider 65°C quite warm, it is not "hot!" So if me, and if I wanted to lower those temps, I would have looked at my case cooling first and to increasing the air flowing through my case. I might have added another case fan, or upgraded the existing case fans with fans that move more air. My point is, I would have done this before second guessing the MSI engineers and risk collateral damage through ESD or accidental mishandling during disassembling and assembling of that cooler - especially since replacing the TIM may have no significant impact on the chipset cooling at all! :(
 

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More case flow would help, no?
 
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More case flow would help, no?
yeah it will help, but better you try step by step, like using better thermal pad/thermal paste then more airflow to remove the heat
 
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The Pad you had on the chipset before looks like it is 2mm though
Do you think it is 2mm? I measure it as 1mm after disassembly
 
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Temps reflect your bios settings - so you cant compare unless you have the same case etc. and bios settings - my temps was all over the map with my Radeon VII card and old settings in bios
 
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60c is the normal temp of active cooled chipset.
 

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Put thermal paste, a 4'' pad and an ice cube. Sorted.
 
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Replaced the thermal pad with Thermal Grizzly, but there is little change. I thought MSI wouldn't bother to put a good thermal pad, but I was wrong.
 

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Keyboard Logitech G213
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Benchmark Scores Yes
Needs more CFM’s :)
 
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