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ATI RV790

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RV790
Die Diagram
Die Diagram
ATI's RV790 GPU uses the TeraScale architecture and is made using a 55 nm production process at TSMC. With a die size of 282 mm² and a transistor count of 959 million it is a medium-sized chip. RV790 supports DirectX 10.1 (Feature Level 10_1). For GPU compute applications, OpenCL version 1.1 can be used. It features 800 shading units, 40 texture mapping units and 16 ROPs.
Further reading: R700 Series Instruction Set Architecture

Graphics Processor

Released
Apr 2nd, 2009
GPU Name
RV790
Codename
Wekiva Plus
Alt. Codename
Spartan
Architecture
TeraScale
Foundry
TSMC
Process Size
55 nm
Transistors
959 million
Density
3.4M / mm²
Die Size
282 mm²

Graphics Features

DirectX
10.1 (10_1)
OpenGL
3.3
OpenCL
1.1
Vulkan
N/A
Shader Model
4.1
WDDM
1.1
Compute
GFX3
DCE
3.1
UVD
2.0

Render Config

Shading Units
800
TMUs
40
ROPs
16
Compute Units
10
Z-Stencil
64
L1 Cache
16 KB per CU
L2 Cache
256 KB
Max. TDP
190 W

All TeraScale GPUs

ATI GPU Architecture History

Graphics cards using the ATI RV790 GPU

Name Chip Memory Shaders TMUs ROPs GPU Clock Memory Clock
ATI Radeon HD 4890
RV790 XT 1024 MB 800 40 16 850 MHz 975 MHz
ATI Radeon HD 4860
RV790 GT 512 MB 640 32 16 700 MHz 750 MHz

RV790 GPU Notes

Codename: Wekiva Plus (Spartan)
Graphics/Compute: GFX3
Display Core Engine: 3.1
Unified Video Decoder: 2.0
Apr 24th, 2024 21:43 EDT change timezone

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