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ATI RV610

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RV610
RV610 LE
RV610 LE
Die Shot
Shane Phillips
Die Shot
Block Diagram
Block Diagram
ATI's RV610 GPU uses the TeraScale architecture and is made using a 65 nm production process at TSMC. With a die size of 85 mm² and a transistor count of 180 million it is a very small chip. RV610 supports DirectX 10.0 (Feature Level 10_0). For GPU compute applications, OpenCL version N/A can be used. It features 40 shading units, 4 texture mapping units and 4 ROPs.
Further reading: R600 Series Instruction Set Architecture

Graphics Processor

Released
2007
GPU Name
RV610
Mobile Variant
M72 / M74
Codename
Laka
Architecture
TeraScale
Foundry
TSMC
Process Size
65 nm
Transistors
180 million
Density
2.1M / mm²
Die Size
85 mm²
Package
FCBGA-632

Graphics Features

DirectX
10.0 (10_0)
OpenGL
3.3
OpenCL
N/A
Vulkan
N/A
Shader Model
4.0
WDDM
1.1
Compute
GFX3
DCE
2.0
UVD
1.0

Render Config

Shading Units
40
TMUs
4
ROPs
4
Compute Units
2
Vertex Cache
32 KB
Texture Cache
32 KB
Tex L1 Cache
32 KB per 4 SPs
L2 Cache
32 KB
Max. TDP
25 W

All TeraScale GPUs

ATI GPU Architecture History

Graphics cards using the ATI RV610 GPU

Name Chip Memory Shaders TMUs ROPs GPU Clock Memory Clock
RV610 PRO 256 MB 40 4 4 650 MHz 500 MHz
256 MB 40 4 4 525 MHz 400 MHz
RV610 LE 512 MB 40 4 4 525 MHz 400 MHz
RV610 LE AGP 256 MB 40 4 4 525 MHz 400 MHz
RV610 LE 256 MB 40 4 4 525 MHz 400 MHz
E2400 128 MB 40 4 4 600 MHz 700 MHz
256 MB 40 4 4 519 MHz 396 MHz
256 MB 40 4 4 398 MHz 495 MHz

RV610 GPU Notes

Mobile Variant: M72 / M74
Codename: Laka
Graphics/Compute: GFX3
Display Core Engine: 2.0
Unified Video Decoder: 1.0
Apr 19th, 2024 22:57 EDT change timezone

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