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ATI R700

Default
R700
Die Shot
Die Shot
Block Diagram
Block Diagram
Block Diagram 2
Block Diagram 2
ATI's R700 GPU uses the TeraScale architecture and is made using a 55 nm production process at TSMC. With a die size of 256 mm² and a transistor count of 956 million it is a medium-sized chip. R700 supports DirectX 10.1 (Feature Level 10_1). For GPU compute applications, OpenCL version 1.1 can be used. It features 800 shading units, 40 texture mapping units and 16 ROPs.
Further reading: R700 Series Instruction Set Architecture

Graphics Processor

Released
Aug 12th, 2008
GPU Name
R700
Codename
Wekiva
Architecture
TeraScale
Foundry
TSMC
Process Size
55 nm
Transistors
956 million
Density
3.7M / mm²
Die Size
256 mm²

Graphics Features

DirectX
10.1 (10_1)
OpenGL
3.3
OpenCL
1.1
Vulkan
N/A
Shader Model
4.1
WDDM
1.1
Compute
GFX3
DCE
3.1
UVD
2.0

Render Config

Shading Units
800
TMUs
40
ROPs
16
Compute Units
10
Z-Stencil
64
L1 Cache
16 KB per CU
L2 Cache
256 KB
Max. TDP
286 W

All TeraScale GPUs

ATI GPU Architecture History

Graphics cards using the ATI R700 GPU

Name Chip Memory Shaders TMUs ROPs GPU Clock Memory Clock
ATI Radeon HD 4870 X2
R700 XT 1024 MB 800 40 16 750 MHz 900 MHz
ATI Radeon HD 4850 X2
R700 PRO 512 MB 800 40 16 625 MHz 995 MHz

R700 GPU Notes

Codename: Wekiva
Graphics/Compute: GFX3
Display Core Engine: 3.1
Unified Video Decoder: 2.0
Apr 19th, 2024 05:09 EDT change timezone

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