Report an Error

AMD Banks

Banks PRO
Banks PRO
Block Diagram
Block Diagram
CU Diagram
CU Diagram
LDS Diagram
LDS Diagram
AMD's Banks GPU uses the GCN 1.0 architecture and is made using a 28 nm production process at TSMC. With a die size of 77 mm² and a transistor count of 1,040 million it is a very small chip. Banks supports DirectX 12.0 (Feature Level 11_1). It features 320 shading units, 20 texture mapping units and 8 ROPs.
Further reading: GCN 1.0 Architecture Whitepaper, Sea Islands Instruction Set Architecture

Graphics Processor

GPU Name
Banks
Architecture
GCN 1.0
Foundry
TSMC
Process Size
28 nm
Transistors
1,040 million
Density
13.5M / mm²
Die Size
77 mm²
Released
Apr 18th, 2017

Graphics Features

DirectX
12.0 (11_1)
OpenGL
4.6
OpenCL
1.2
Vulkan
1.1.101
Shader Model
5.1
Compute
GFX6
ROCm
No

Render Config

Shading Units
320
TMUs
20
ROPs
8
Compute Units
5
ACEs
2
GEs
1
L1 Cache
16 KB per CU
L2 Cache
128 KB
Max. TDP
50 W

All GCN 1.0 GPUs

Graphics cards using the AMD Banks GPU

Name Chip Memory Shaders TMUs ROPs GPU Clock Memory Clock
AMD Radeon 520 Mobile Banks PRO 2 GB 320 20 8 1030 MHz 1000 MHz
AMD Radeon 520 Mobile Banks PRO 2 GB 320 20 8 1030 MHz 1125 MHz
AMD Radeon 610 Mobile Banks PRO 2 GB 320 20 8 1030 MHz 1125 MHz

Banks GPU Notes

Architecture Codename: Sea Islands
Chip Variant: Hainan
CLRX Version: GCN 1.0
Graphics/Compute: GFX6 (gfx601)
Display Core Engine: No Support
Unified Video Decoder: No Support
Video Compression Engine: No Support