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AMD Hainan

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Hainan
Block Diagram
Block Diagram
CU Diagram
CU Diagram
LDS Diagram
LDS Diagram
AMD's Hainan GPU uses the GCN 1.0 architecture and is made using a 28 nm production process at TSMC. With a die size of 56 mm² and a transistor count of 690 million it is a very small chip. Hainan supports DirectX 12 (Feature Level 11_1). For GPU compute applications, OpenCL version 1.2 can be used. It features 320 shading units, 20 texture mapping units and 8 ROPs.
Further reading: GCN 1.0 Architecture Whitepaper , Sea Islands Instruction Set Architecture

Graphics Processor

GPU Name
Hainan
Architecture
GCN 1.0
Foundry
TSMC
Process Size
28 nm
Transistors
690 million
Density
12.3M / mm²
Die Size
56 mm²
Released
May 5th, 2015

Graphics Features

DirectX
12 (11_1)
OpenGL
4.6
OpenCL
1.2
Vulkan
1.2
Shader Model
5.1
Compute
GFX6
ROCm
No

Render Config

Shading Units
320
TMUs
20
ROPs
8
Compute Units
5
ACEs
2
GEs
1
L1 Cache
16 KB per CU
L2 Cache
128 KB
Max. TDP
50 W

All GCN 1.0 GPUs

AMD GPU Architecture History

Graphics cards using the AMD Hainan GPU

Name Chip Memory Shaders TMUs ROPs Base Clock Boost Clock Memory Clock
AMD Radeon R5 330 OEM 2 GB 320 20 8 830 MHz 855 MHz 900 MHz
AMD Radeon R5 435 OEM 2 GB 320 20 8 1030 MHz 1000 MHz

Hainan GPU Notes

Architecture Codename: Sea Islands
CLRX Version: GCN 1.0
Graphics/Compute: GFX6 (gfx601)
Display Core Engine: No Support
Unified Video Decoder: No Support
Video Compression Engine: No Support
Jul 2nd, 2022 00:37 EDT change timezone

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