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AMD Hainan

Default
Hainan
Block Diagram
Block Diagram
CU Diagram
CU Diagram
LDS Diagram
LDS Diagram
AMD's Hainan GPU uses the GCN 1.0 architecture and is made using a 28 nm production process at TSMC. With a die size of 90 mm² and a transistor count of 1,040 million it is a very small chip. Hainan supports DirectX 12.0 (Feature Level 11_1). It features 320 shading units, 20 texture mapping units and 8 ROPs.
Further reading: GCN 1.0 Architecture Whitepaper , Sea Islands Instruction Set Architecture

Graphics Processor

GPU Name
Hainan
Architecture
GCN 1.0
Foundry
TSMC
Process Size
28 nm
Transistors
1,040 million
Density
11.6M / mm²
Die Size
90 mm²
Released
May 5th, 2015

Graphics Features

DirectX
12.0 (11_1)
OpenGL
4.6
OpenCL
1.2
Vulkan
1.1.101
Shader Model
5.1
Compute
GFX6
ROCm
No

Render Config

Shading Units
320
TMUs
20
ROPs
8
Compute Units
5
ACEs
2
GEs
1
L1 Cache
16 KB per CU
L2 Cache
128 KB
Max. TDP
50 W

All GCN 1.0 GPUs

Graphics cards using the AMD Hainan GPU

Name Chip Memory Shaders TMUs ROPs Base Clock Boost Clock Memory Clock
AMD Radeon R5 330 OEM 2 GB 320 20 8 830 MHz 855 MHz 900 MHz
AMD Radeon R5 435 OEM 2 GB 320 20 8 1030 MHz 1000 MHz

Hainan GPU Notes

Architecture Codename: Sea Islands
CLRX Version: GCN 1.0
Graphics/Compute: GFX6 (gfx601)
Display Core Engine: No Support
Unified Video Decoder: No Support
Video Compression Engine: No Support