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AMD Hawaii

Default
Hawaii
Hawaii PRO
Hawaii PRO
Hawaii XT
Hawaii XT
Die Shot
Fritzchens Fritz
Die Shot
Block Diagram
Block Diagram
SE Diagram
SE Diagram
AMD's Hawaii GPU uses the GCN 2.0 architecture and is made using a 28 nm production process at TSMC. With a die size of 438 mm² and a transistor count of 6,200 million it is a very big chip. Hawaii supports DirectX 12 (Feature Level 12_0). For GPU compute applications, OpenCL version 2.0 can be used. It features 2816 shading units, 176 texture mapping units and 64 ROPs.

Graphics Processor

GPU Name
Hawaii
Architecture
GCN 2.0
Foundry
TSMC
Process Size
28 nm
Transistors
6,200 million
Density
14.2M / mm²
Die Size
438 mm²
Released
Oct 24th, 2013

Graphics Features

DirectX
12 (12_0)
OpenGL
4.6
OpenCL
2.0
Vulkan
1.2
Shader Model
6.3
Compute
GFX7
ROCm
Yes

Render Config

Shading Units
2816
TMUs
176
ROPs
64
Compute Units
44
Z-Stencil
256
ACEs
8
GEs
4
L1 Cache
16 KB per CU
L2 Cache
1024 KB
Max. TDP
580 W

All GCN 2.0 GPUs

AMD GPU Architecture History

Graphics cards using the AMD Hawaii GPU

Name Chip Memory Shaders TMUs ROPs GPU Clock Memory Clock
AMD Radeon R9 290 Hawaii PRO 4 GB 2560 160 64 947 MHz 1250 MHz
AMD Radeon R9 290X Hawaii XT 4 GB 2816 176 64 1000 MHz 1250 MHz
AMD FirePro W9100 Hawaii GL44 16 GB 2816 176 64 930 MHz 1250 MHz
AMD Radeon R9 290X2 Hawaii XT 4 GB 2816 176 64 1000 MHz 1350 MHz
AMD FirePro W8100 Hawaii GL40 8 GB 2560 160 64 824 MHz 1250 MHz
AMD FirePro S9150 Hawaii GL44 16 GB 2816 176 64 900 MHz 1250 MHz
AMD FirePro S9100 Hawaii GL40 12 GB 2560 160 64 824 MHz 1250 MHz
AMD FirePro S9170 Hawaii XT GL 32 GB 2816 176 64 930 MHz 1250 MHz

Hawaii GPU Notes

Architecture Codename: Volcanic Islands
Codename: Ibiza
CLRX Version: GCN 1.1
Graphics/Compute: GFX7 (gfx701 GL) / (gfx702)
Display Core Engine: 8.5
Unified Video Decoder: 4.2
Video Compression Engine: 2.0