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AMD Heathrow

Default
Heathrow
Block Diagram
Block Diagram
CU Diagram
CU Diagram
LDS Diagram
LDS Diagram
AMD's Heathrow GPU uses the GCN 1.0 architecture and is made using a 28 nm production process at TSMC. With a die size of 123 mm² and a transistor count of 1,500 million it is a small chip. Heathrow supports DirectX 12.0 (Feature Level 11_1). It features 640 shading units, 40 texture mapping units and 16 ROPs.
Further reading: GCN 1.0 Architecture Whitepaper, Southern Islands Instruction Set Architecture

Graphics Processor

GPU Name
Heathrow
Architecture
GCN 1.0
Foundry
TSMC
Process Size
28 nm
Transistors
1,500 million
Density
12.2M / mm²
Die Size
123 mm²
Released
Apr 24th, 2012

Graphics Features

DirectX
12.0 (11_1)
OpenGL
4.6
OpenCL
1.2
Vulkan
1.1.101
Shader Model
5.1
Compute
GFX6
ROCm
No

Render Config

Shading Units
640
TMUs
40
ROPs
16
Compute Units
10
Z-Stencil
64
ACEs
2
GEs
1
L1 Cache
16 KB per CU
L2 Cache
256 KB
Max. TDP
45 W

All GCN 1.0 GPUs

Graphics cards using the AMD Heathrow GPU

Name Chip Memory Shaders TMUs ROPs GPU Clock Memory Clock
AMD Radeon HD 7850M Heathrow PRO 2 GB 640 40 16 675 MHz 1000 MHz
AMD Radeon HD 7870M Heathrow XT 2 GB 640 40 16 800 MHz 1000 MHz
AMD FirePro M6000 Heathrow XT GL 2 GB 640 40 16 800 MHz 1000 MHz

Heathrow GPU Notes

Architecture Codename: Southern Islands
Chip Variant: Cape Verde
CLRX Version: GCN 1.0
Graphics/Compute: GFX6 (gfx601)
Display Core Engine: 6.0
Unified Video Decoder: 4.0
Video Compression Engine: 1.0