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AMD Polaris 30

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Polaris 30
Polaris 30 XT
Polaris 30 XT
Die Shot
Fritzchens Fritz
Die Shot
Block Diagram
Block Diagram
AMD's Polaris 30 GPU uses the GCN 4.0 architecture and is made using a 12 nm production process at GlobalFoundries. With a die size of 232 mm² and a transistor count of 5,700 million it is a medium-sized chip. Polaris 30 supports DirectX 12.0 (Feature Level 12_0). It features 2304 shading units, 144 texture mapping units and 32 ROPs.
Further reading: Polaris Architecture Whitepaper

Graphics Processor

GPU Name
Polaris 30
Architecture
GCN 4.0
Foundry
GlobalFoundries
Process Size
12 nm
Transistors
5,700 million
Density
24.6M / mm²
Die Size
232 mm²
Released
Nov 15th, 2018

Graphics Features

DirectX
12.0 (12_0)
OpenGL
4.6
OpenCL
2.0
Vulkan
1.1.119
Shader Model
6.4
Compute
GFX8
ROCm
Yes

Render Config

Shading Units
2304
TMUs
144
ROPs
32
Compute Units
36
ACEs
4
HWSs
2
SEs
4
L1 Cache
16 KB per CU
L2 Cache
2048 KB
Max. TDP
175 W

All GCN 4.0 GPUs

Graphics cards using the AMD Polaris 30 GPU

Name Chip Memory Shaders TMUs ROPs Base Clock Boost Clock Memory Clock
AMD Radeon RX 590 Polaris 30 XT 8 GB 2304 144 32 1469 MHz 1545 MHz 2000 MHz

Polaris 30 GPU Notes

Architecture Codename: Arctic Islands
Codename: Ellesmere
CLRX Version: GCN 1.2
Graphics/Compute: GFX8 (gfx803)
Display Core Engine: 11.2
Unified Video Decoder: 6.3
Video Compression Engine: 3.4

This chip comes in both Samsung 11nm and GlobalFoundries 12nm.