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AMD Polaris 30

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Polaris 30
Die Shot
Fritzchens Fritz
Die Shot
Block Diagram
Block Diagram
AMD's Polaris 30 GPU uses the GCN 4.0 architecture and is made using a 12 nm production process at GlobalFoundries. With a die size of 232 mm² and a transistor count of 5,700 million it is a medium-sized chip. Polaris 30 supports DirectX 12 (Feature Level 12_0). For GPU compute applications, OpenCL version 2.1 can be used. It features 2304 shading units, 144 texture mapping units and 32 ROPs.
Further reading: Polaris Architecture Whitepaper

Graphics Processor

Released
Nov 15th, 2018
GPU Name
Polaris 30
Codename
Ellesmere
Generation
Arctic Islands/Polaris
Architecture
GCN 4.0
Foundry
GlobalFoundries
Process Size
12 nm
Transistors
5,700 million
Density
24.6M / mm²
Die Size
232 mm²
Package
BGA-1401

Graphics Features

DirectX
12 (12_0)
OpenGL
4.6
OpenCL
2.1
Vulkan
1.3
Shader Model
6.7
WDDM
3.1
Compute
GFX8 (gfx803)
DCE
11.2
UVD
6.3
VCE
3.4
SDMA
3.0.0
CLRX
GCN 1.2.0

Render Config

Shading Units
2304
TMUs
144
ROPs
32
Compute Units
36
ACEs
4
HWSs
2
SEs
4
L1 Cache
16 KB per CU
L2 Cache
2048 KB
Max. TDP
175 W

All GCN 4.0 GPUs

AMD GPU Architecture History

Graphics cards using the AMD Polaris 30 GPU

Name Chip Memory Shaders TMUs ROPs Base Clock Boost Clock Memory Clock
AMD Radeon RX 590
Polaris 30 XT 8 GB 2304 144 32 1469 MHz 1545 MHz 2000 MHz

Polaris 30 GPU Notes

Generation: Polaris
Codename: Ellesmere
Graphics/Compute: GFX8 (gfx803)
Display Core Engine: 11.2
Unified Video Decoder: 6.3
Video Compression Engine: 3.4
System DMA: 3.0.0
CLRX: GCN 1.2.0

This chip comes in both Samsung 11nm and GlobalFoundries 12nm.
Apr 25th, 2024 14:02 EDT change timezone

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