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AMD RV670

Default
RV670
Die Shot
Die Shot
Block Diagram
Block Diagram
AMD's RV670 GPU uses the TeraScale architecture and is made using a 55 nm production process at TSMC. With a die size of 192 mm² and a transistor count of 666 million it is a small chip. RV670 supports DirectX 10.1 (Feature Level 10_1). It features 320 shading units, 16 texture mapping units and 16 ROPs.
Further reading: R600 Series Instruction Set Architecture

Graphics Processor

GPU Name
RV670
Architecture
TeraScale
Foundry
TSMC
Process Size
55 nm
Transistors
666 million
Density
3.5M / mm²
Die Size
192 mm²
Released
Nov 8th, 2007

Graphics Features

DirectX
10.1 (10_1)
OpenGL
3.3
OpenCL
N/A
Vulkan
N/A
Shader Model
4.1
Compute
GFX3

Render Config

Shading Units
320
TMUs
16
ROPs
16
Compute Units
4
Z-Stencil
32
Vertex Cache
32 KB
Texture Cache
32 KB
Tex L1 Cache
32 KB per 4 SPs
L2 Cache
256 KB
Max. TDP
105 W

All TeraScale GPUs

Graphics cards using the AMD RV670 GPU

Name Chip Memory Shaders TMUs ROPs GPU Clock Memory Clock
AMD FireStream 9170 2 GB 320 16 16 800 MHz 800 MHz

RV670 GPU Notes

Codename: Boom
Graphics/Compute: GFX3
Display Core Engine: 2.0
Unified Video Decoder: 1.0