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AMD RV670

Default
RV670
AMD's RV670 GPU uses the TeraScale architecture and is made using a 55 nm production process at TSMC. With a die size of 192 mm² and a transistor count of 666 million it is a small chip. RV670 supports DirectX 10.0. It features 320 shading units, 16 texture mapping units and 16 ROPs.

Graphics Processor

GPU Name
RV670
Architecture
TeraScale
Foundry
TSMC
Process Size
55 nm
Transistors
666 million
Density
3.5M / mm²
Die Size
192 mm²
Released
Nov 8th, 2007

Graphics Features

DirectX
10.0
OpenGL
3.3
OpenCL
N/A
Vulkan
N/A
Shader Model
4.1
Compute
GFX3

Render Config

Shading Units
320
TMUs
16
ROPs
16
Compute Units
4
L2 Cache
256 KB
Max. TDP
105 W

All TeraScale GPUs

Graphics cards using the AMD RV670 GPU

Name Chip Memory Shaders TMUs ROPs GPU Clock Memory Clock
AMD FireStream 9170 2 GB 320 16 16 800 MHz 800 MHz

RV670 GPU Notes

Codename: Boom
Graphics/Compute: GFX3
Display Core Engine: 2.0
Unified Video Decoder: 1.0