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Intel 3rd Gen Xeon Scalable Launch Event Liveblog

Intel today is launching its 3rd Generation Xeon Scalable processor bringing its first major IPC uplift to the enterprise space in five years. The Xeon Scalable processors are built on the 10 nm SuperFin process, and the "Ice Lake-SP" microarchitecture that bring new "Sunny Cove" CPU cores to the server space, including support for PCI-Express 4.0 I/O capabilities, a wider memory interface, and a more feature-rich AVX-512 instruction-set, along with DLBoost for HPC. join us for its launch live-blog.

14:59 UTC: CEO Pat Gelsinger and Data Platforms group head Navin Shenoy are expected to take centerstage. Xeon and memory group head Lisa Spelman could announce relevant platform products. This is Gelsinger's first major launch since taking office.

15:01 UTC: What will you solve for?

Intel 12th Generation Alder Lake Platform Reportedly Brings 20% Single-Threaded Performance Uplift

Intel only just announced their 11th generation Rocket Lake-S desktop processors last week but we are already receiving information about the next generation Alder Lake-S platform which will finally make the jump to 10 nm. Intel slides for the upcoming family of processors have been leaked and they reveal some interesting information including a claimed 20% single-threaded performance increases from the new Golden Cove core design and 10 nm SuperFin node. The processors will feature Intel Hybrid Technology with a mix of small low-performance cores and large high-performance cores with a maximum of eight each for sixteen total cores. The processors will also include the latest connectivity with both PCIe 4.0 and PCIe 5.0 support along with DDR4 and DDR5 4800 MHz compatibility.

Intel will also be launching a new socket type called LGA1700 with a new package size which will render existing cooling solutions for LGA115X and LGA1200 sockets incompatible. The processors will also come with the launch of a new 600 Series chipset with PCIe 3.0 and PCIe 4.0 support along with the usual complement of USB, SATA, and networking. The entry-level 600-series motherboards will only support DDR4 memory at up to 3200 MHz while high-end Z690 motherboards will include DDR5 support. Intel has confirmed that they intend to launch Alder Lake later this year but it is yet to be known if they are referring to the desktop or mobile series.

HPE Lists 40-Core Intel Ice Lake-SP Xeon Server Processor

Hewlett Packard Enterprise, the company focused on making enterprise hardware and software, has today mistakenly listed some of Intel's upcoming 3rd generation Xeon Scalable processors. Called Ice Lake-SP, the latest server processor generation is expected to launch sometime in the coming days, with a possible launch date being the March 23rd "Intel Unleashed" webcast. The next generation of processors will finally bring a new vector of technologies Intel needs in server space. That means the support for PCIe 4.0 protocol for higher speed I/O and octa-channel DDR4 memory controller for much greater bandwidth. The CPU lineup will for the first time use Intel's advanced 10 nm node called 10 nm SuperFin.

Today, in the leaked HPE listing, we get to see some of the Xeon models Intel plans to launch. Starting from 32-core models, all the way to 40-core models, all SKUs above 28 cores are supposed to use dual die configuration to achieve high core counts. The limit of a single die is 28 cores. HPE listed a few models, with the highest-end one being the Intel Xeon Platinum XCC 8380 processor. It features 40 cores with 80 threads and a running frequency of 2.3 GHz. If you are wondering about TDP, it looks like the 10 nm SuperFin process is giving good results, as the CPU is rated only for 270 Watts of power.

Intel to Unveil "Tiger Lake-H" and "Rocket Lake-S" on March 18

Intel is expected to unveil its 11th generation Core "Tiger Lake-H" performance-segment mobile processor, and the highly anticipated 11th Gen Core "Rocket Lake-S" desktop processor family on March 18, 2021. The two will be launched on the sidelines of the 2021 GDC (Game Developers Conference), an online event. The agenda page of GDC mentions both "Tiger Lake-H" and "Rocket Lake." The "Tiger Lake-H" family of processors begin with quad-core SKUs based on the 4-core "Tiger Lake" silicon, extending to 6-core and 8-core ones based on a newer 8-core silicon. Both dies are built on the 10 nm SuperFin node, and combine Intel's highest-IPC "Willow Cove" CPU cores with a Gen 12 Xe iGPU.

The 11th Gen Core "Rocket Lake-S" has been unveiled back at the 2021 International CES (online event) in January, and is heading toward a mid/late-March launch. The chips pack up to eight "Cypress Cove" CPU cores, which are a back-port of Intel's 10 nm CPU core architectures to the 14 nm node, bringing the first IPC increase on the client desktop platform from Intel since 2015. At GDC, we expect Intel to detail individual SKUs within the 11th Gen Core processor family, giving us a broader idea of what chips will launch this month. The GDC backdrop also foreshadows the marketing strategy for Intel with both these platforms—gaming. The company will take advantage of the IPC uplift to present its processors as being better for gaming, and sufficiently fast in most client-relevant tasks. The GDC backdrop could also let Intel show off the ISV relations it's built with game developers, detailing how certain popular game engines are optimized for Intel.

Intel "Lunar Lake" Microarchitecture Hits the Radar, Possible "Meteor Lake" Successor

Intel published Linux kernel driver patches that reference a new CPU microarchitecture, codenamed "Lunar Lake." The patch comments refer to "Lunar Lake" as a client platform, and VideoCardz predicts that it could succeed "Meteor Lake." the microarchitecture that follows "Alder Lake," which was recently announced by Intel.

Targeting both mobile and desktop platforms, "Alder Lake" will herald a new 1,700-pin LGA socket for the client desktop, and debut hybrid CPU cores on the form-factor. Expected to be built on a newer silicon fabrication node, such as the 10 nm SuperFin, the chip will combine high-performance "Golden Cove" big cores, with "Gracemont" low-power cores. Its commercial success will determine if Intel continues to take the hybrid-core approach to client processors with future "Meteor Lake" and "Lunar Lake," or whether it will have sorted out its foundry woes and build "Lunar Lake" with a homogeneous CPU core type. With "Alder Lake" expected to debut toward the end of 2021 and "Meteor Lake" [hopefully] by 2022, "Lunar Lake" would only follow by 2023-24.

Intel Plans a Sizable 11th Gen Core "Tiger Lake-H" Mobile Processor Lineup

Intel's new 8-core "Tiger Lake" silicon will play a major role in holding the company's dominance in the mobile processor space, with plans for new 6-core and 8-core SKUs being in motion. OneRaichu on Twitter, a reliable source with Intel leaks, points to several unreleased model numbers. The 8-core "Tiger Lake-H" die is expected to be built on the same 10 nm SuperFin process as the "Tiger Lake-U" silicon. The lineup is led by the Core i9-11980HK, an 8-core/16-thread processor that uses eight "Willow Cove" CPU cores, 2.60 GHz nominal- and 5.00 GHz max-Turbo frequency, and 3.30 GHz AVX512 frequency. This chip will be in a class of its own, as its TDP is rated at 65 W, significantly above the 35-45 W TDP range that constitutes the H-segment. It will likely power large gaming notebooks with elaborate cooling solutions. It will also come with an unlocked base-clock multiplier.

The Core i9-11900H is the next chip in the lineup, with slightly lower clock speeds of 2.50 GHz base, 4.90 GHz max-Turbo, and 2.10 GHz AVX512. This chip features a much lower 35 W TDP, and will come with aggressive power management compared to the i9-11980HK. The Core i7-11800H will be the slowest 8-core part, with clock speeds of 2.40 GHz nominal, 4.60 GHz max-Turbo, and 2.00 GHz AVX512. It comes with the same 35 W TDP as the i9-11900H. Next up, are 6-core/12-thread parts, likely under the Core i5 brand. These include the i5-11400H, clocked at 2.70 GHz nominal, 4.50 GHz max-Turbo, and 2.20 GHz AVX512. At the bottom of the pile is the i5-11260H, clocked at 2.60 GHz, with 4.40 GHz max-Turbo, and 2.10 GHz AVX512. Both Core i5 parts are 35-Watt.

Intel Rocket Lake-S Lands on March 15th, Alder Lake-S Uses Enhanced 10 nm SuperFin Process

In the latest round of rumors, we have today received some really interesting news regarding Intel's upcoming lineup of desktop processors. Thanks to HKEPC media, we have information about the launch date of Intel's Rocket Lake-S processor lineup and Alder Lake-S details. Starting with Rocket Lake, Intel did not unveil the exact availability date on these processors. However, thanks to HKEPC, we have information that Rocket Lake is landing in our hands on March 15th. With 500 series chipsets already launched, consumers are now waiting for the processors to arrive as well, so they can pair their new PCIe 4.0 NVMe SSDs with the latest processor generation.

When it comes to the next generation Alder Lake-S design, Intel is reported to use its enhanced 10 nm SuperFin process for the manufacturing of these processors. This would mean that the node is more efficient than the regular 10 nm SuperFin present on Tiger Lake processors, and some improvements like better frequencies are expected. Alder Lake is expected to make use of big.LITTLE core configuration, with small cores being Gracemont designs, and the big cores being Golden Cove designs. The magic of Golden Cove is expected to result in 20% IPC improvement over Willow Cove, which exists today in Tiger Lake designs. Paired with PCIe 5.0 and DDR5 technology, Alder Lake is looking like a compelling upgrade that is arriving in December of this year. Pictured below is the LGA1700 engineering sample of Alder Lake-S processor.

Intel Xe DG1 SDV PCB Pictured, Looks Desolate

Here are some of the first pictures of the Intel Xe DG1 SDV, taken apart to reveal its rather desolate PCB. The Xe DG1 SDV isn't commercially available, but rather distributed by Intel to ISVs, so they can begin optimizing or developing for the Gen12 Xe graphics architecture. The board features a GPU ASIC that's nearly identical to the Iris Xe MAX mobile discrete GPUs, and four LPDDR4 memory chips making up 8 GB of video memory.

The Xe DG1 GPU is based on the Xe LP graphics architecture, and the silicon is built on the 10 nm SuperFin silicon fabrication node. The chip features 96 execution units (768 unified shaders); and apparently makes do with the 75 W power supplied by the PCI-Express slot. A frugal 2-phase VRM powers the GPU. The GPU uses conventional 4-pin PWM to control the fan, which ventilates a simple aluminium mono-block heatsink. Three DisplayPorts and one HDMI 2.1 make up the output configuration. While you won't be able to buy a Xe DG1 SDV in the market (unless an ISV decides to break their NDA and put one up on eBay), Intel has allowed a small number of board partners to develop custom-design cards. ASUS is ready with one. Igor's Lab has more pictures, a list of benchmark fails, and other interesting commentary in the source link below.

Intel "Alder Lake-S" Due for September 2021

2021 is shaping up to be a big year for Intel in the DIY desktop space, with the company preparing to launch not one, but two generations of desktop processors. Having announced them in January, the 11th Gen Core "Rocket Lake-S" desktop processors in the LGA1200 package, will release to market in March, with the company claiming a restoration in gaming performance leadership away from AMD's Ryzen 5000 series. Sources tell Uniko's Hardware that the company will announce its 12th Gen successor, the Core "Alder Lake-S" in September 2021.

"Alder Lake-S" will be Intel's first mainstream desktop processor built on its new 10 nm SuperFin silicon fabrication process. The chip is expected to be a "hybrid" processor, combining an equal number of larger "Golden Cove" cores, and smaller "Gracemont" cores, to offer significantly improved energy efficiency. Built in the new Socket LGA1700 package, "Alder Lake-S" is expected to feature more general-purpose SoC connectivity than LGA1200 chips. It will also herald new platform standards, such as DDR5 memory and possibly even mainstreaming of ATX12VO. The processor will launch alongside new Intel 600-series chipset. AMD's response is expected to be the "Zen 4" microarchitecture, a new silicon built on the 5 nm process, and the new AM5 socket that introduces DDR5 memory support.

Intel Announces Four New Processor Families

In a world where computing is pervasive and intelligence is distributed across every surface - from the cloud to the network to the intelligent edge - Intel today at CES 2021 highlighted how it is driving technology leadership to define the future of computing for people, business and society. To help people navigate through this extraordinary time, Intel introduced new processors for business, education, mobile and gaming computing platforms - all designed to offer the premium PC experiences people deserve, with the most choices and no limits.

"Only Intel has the breadth of products spanning multiple architectures; the large, open ecosystem; sheer scale of manufacturing footprint; and deep technical expertise customers need to unlock opportunities in this era of distributed intelligence," said Intel Executive Vice President Gregory Bryant. "With an intense focus on execution for our core products and across our broader portfolio, we're introducing a series of leadership products at CES with more following throughout the year."

Intel Expands 10nm Manufacturing Capacity

In response to incredible customer demand, Intel has doubled its combined 14 nm and 10 nm manufacturing capacity over the past few years. To do this, the company found innovative ways to deliver more output within existing capacity through yield improvement projects and significant investments in capacity expansion. This video recounts that journey, which even included re-purposing existing lab and office space for manufacturing.

"Over the last three years, we have doubled our wafer volume capacity, and that was a significant investment. Moving forward, we're not stopping… We are continuing to invest into factory capacity to ensure we can keep up with the growing needs of our customers," says Keyvan Esfarjani, senior vice president and general manager of Manufacturing and Operations at Intel. The company also ramped its new 10 nm process this year. Intel currently manufactures 10 nm products in high volumes at its Oregon and Arizona sites in the U.S. and its site in Israel.

Alleged Intel Sapphire Rapids Xeon Processor Image Leaks, Dual-Die Madness Showcased

Today, thanks to the ServeTheHome forum member "111alan", we have the first pictures of the alleged Intel Sapphire Rapids Xeon processor. Pictured is what appears to be a dual-die design similar to Cascade Lake-SP design with 56 cores and 112 threads that uses two dies. The Sapphire Rapids is a 10 nm SuperFin design that allegedly comes even in the dual-die configuration. To host this processor, the motherboard needs an LGA4677 socket with 4677 pins present. The new LGA socket, along with the new 10 nm Sapphire Rapids Xeon processors are set for delivery in 2021 when Intel is expected to launch its new processors and their respective platforms.

The processor pictured is clearly a dual-die design, meaning that Intel used some of its Multi-Chip Package (MCM) technology that uses EMIB to interconnect the silicon using an active interposer. As a reminder, the new 10 nm Sapphire Rapids platform is supposed to bring many new features like a DDR5 memory controller paired with Intel's Data Streaming Accelerator (DSA); a brand new PCIe 5.0 standard protocol with a 32 GT/s data transfer rate, and a CXL 1.1 support for next-generation accelerators. The exact configuration of this processor is unknown, however, it is an engineering sample with a clock frequency of a modest 2.0 GHz.

Intel 11th Generation Core Tiger Lake-H Processor Appears

Intel has launched its Tiger Lake-U lineup of products back in September, with the availability of the first products in October. The launched lineup was part of the "U" variant of ultra-portable devices that stretched only to four core, eight threaded configurations. However, given that the new competitor in mobile space, AMD, has a wide portfolio of offerings that are coming with up to 8C/16T variants, Intel needs a proper response to that. Despite having a better single-threaded performance, the multi-threaded capability of the Ryzen 4000 series is delivering better performance. Thanks to the popular hardware leaker, TUM APISAK, we have the first appearance of Intel's 11th generation Tiger Lake-H processor.

Appearing in Userbenchmark, the processor was tested on a platform codenamed "Insyde TigerLake". The processor was spotted running 8 cores and 16 threads, at the average frequency of 2.75 GHz. This is only an engineering sample, meaning that these clocks do not represent the final frequencies of the processor. As a reminder, Intel's Tiger Lake CPU is a Willow Cove based design manufactured on Intel's 10 nm SuperFin silicon node. We are yet to see the capabilities of the new node and how the chip performs once the reviews arrive.

Intel Alder Lake-S Processor Pictured

Intel has just recently announced its next-generation Rocket Lake-S processor specifications designed to bring improved performance and newer platform technologies like PCIe 4.0. However, we are yet to see the first 10 nm CPU for desktop users. Today, thanks to the sources over at VideoCardz, we have the first look at Intel's next-next-generation processor called Alder Lake. The Alder Lake-S is a platform that brings many of the "firsts" for Intel. It will be the first architecture being built on the company's 10 nm SuperFin architecture. Alongside the new node, the platform will transition to the next-generation of technologies. Rumored are the transitions to PCIe 5.0 and perhaps, most importantly - DDR5.

Another new approach will be Intel's adaptation of Arm's big.LITTLE heterogeneous core structure. The processor will feature a few of the "little" cores for light tasks, and fire up the "big" cores for heavy computing. All of that will require a new socket to house the processor, which is the LGA1700. You can see the new processor below, compared to LGA1200 CPU from the previous generation.

Intel Storms into 1080p Gaming and Creator Markets with Iris Xe MAX Mobile GPUs

Intel today launched its Iris Xe MAX discrete graphics processor for thin-and-light notebooks powered by 11th Gen Core "Tiger Lake" processors. Dell, Acer, and ASUS are launch partners, debuting the chip on their Inspiron 15 7000, Swift 3x, and VivoBook TP470, respectively. The Iris Xe MAX is based on the Xe LP graphics architecture, targeted at compact scale implementations of the Xe SIMD for mainstream consumer graphics. Its most interesting feature is Intel DeepLink, and a powerful media acceleration engine that includes hardware encode acceleration for popular video formats, including HEVC, which should make the Iris Xe MAX a formidable video content production solution on the move.

The Iris Xe MAX is a fully discrete GPU built on Intel's 10 nm SuperFin silicon fabrication process. It features an LPDDR4X dedicated memory interface with 4 GB of memory at 68 GB/s of bandwidth, and uses PCI-Express 4.0 x4 to talk to the processor, but those are just the physical layers. On top of these are what Intel calls Deep Link, an all encompassing hardware abstraction layer that not only enables explicit multi-GPU with the Xe LP iGPU of "Tiger Lake" processors, but also certain implicit multi-GPU functions such as fine-grained division of labor between the dGPU and iGPU to ensure that the right kind of workload is split between the two. Intel referred to this as GameDev Boost, and we detailed it in an older article.

Intel "Tiger Lake" Based Pentium and Celeron to Feature AVX2, an Instruction the Entry-Level Brands were Deprived Of

Intel's next-generation Pentium Gold and Celeron entry-level processors based on the "Tiger Lake" microarchitecture could finally receive the AVX2 instruction set. Intel had segmented AVX and AVX2 to be exclusive to the Core and Xeon brands, with the Pentium Gold and Celeron products based on the same microarchitectures to artificially lack these instructions.

Intel updated its ARK product information database with entries for "Tiger Lake" based Pentium Gold and Celeron products. The page for the Pentium Gold 7505 and Celeron 6305, mention support for AVX2 besides SSE4. Both are mobile chips with 15 W TDP, and are built on the same 10 nm SuperFin process as the rest of the 11th Gen Core "Tiger Lake" processor family.

Intel Alder Lake-S CPU Has Been Pictured

Intel has been preparing the launch of its 10 nm processors for desktop users for some time now, and today we are getting the first pictures of the Alder Lake-S CPU backside. Featuring a package with a size of 37.5×45 mm, the Alder Lake CPU uses more of its area for a pin count increase. Going up from 1200 pins in the LGA1200 socket, the new Alder Lake-S CPU uses 1700 CPU pins, which slots in the LGA1700 socket. In the picture below, there is an engineering sample of the Alder Lake-S CPU, which we see for the first time. While there is no much information about the processor, we know that it will use Intel's 10 nm SuperFin design, paired with hybrid core technology. That means that there will be big (Golden Cove) and little (Gracemont) cores in the design. Other features such as PCIe 5.0 and DDR5 should be present as well. The new CPU generation and LGA1700 motherboards are scheduled to arrive in second half of 2021.

Intel 11th Gen Core "Tiger Lake" & Xe Graphics Launch Event: Live Blog

Intel today launches its 11th Gen Core "Tiger Lake" mobile processors that introduce several new technologies on the backs of new IP. As described in the Architecture Day, "Tiger Lake" is built on the 10 nm SuperFin process, and combines new "Willow Cove" CPU cores with the first commercial debut of the Xe Gen12 graphics architecture that Intel is betting big on, to make a stab at the consumer graphics and scalar compute markets. Join us in this live-blog.

Update 16:00 UTC: GB (Gregory Bryant, EVP Client), leads the event from the comfort of his home.
Update 16:04 UTC: Here it is, the "world's best processor for thin and light laptops. You'll notice that like most Intel U-segment chips, this is an MCM of the processor and PCH die. Intel bases its "world's best" claims on a per-segment basis.

Intel 11th Gen Core "Tiger Lake" Promotional Videos Leak

Promotional videos of Intel 11th Gen Core "Tiger Lake" processors leaked to the web courtesy h0x0d on Twitter. It confirms the new corporate identity of Intel, along with its new logo artistic language. It also confirms the new EVO Powered by Core brand extension, along with a separate case badge for notebooks that use Iris Xe discrete graphics (DG1) in addition to the Xe Gen12 iGPU of "Tiger Lake." Intel has a technology that can get the Xe LP iGPU and dGPU to work in tandem. VideoCardz compiled some interesting frames from the promotional videos, revealing bits such as clock speeds of up to 4.80 GHz (boost), 3.11 GHz (base), the first "Tiger Lake" parts being 4-core/8-thread, the new 10 nm SuperFin transistor, wafer- and die shots of "Tiger Lake" 4c+96EU die, and unless we're mistaken, pictures of a "Tiger Lake" package that uses a DRAM (HBM?) stack on-package, using EMIB. h0x0d also posted videos of the Lenovo Yoga 9i and HP Spectre notebooks based on "Tiger Lake."

Xe HPG is Real, Intel's Gaming GPU Releases in 2021, without HBM

Intel on Thursday at its 2020 Architecture Day event announced a high performance gaming variant of its Xe graphics architecture, which it calls Xe HPG. The Xe architecture is designed to scale between tiny iGPUs and mobile discrete GPUs as Xe LP, up to scalar compute processors under Xe HP, and beyond to HPCs and supercomputers, under Xe HPC. The combination of the client graphics feature-set of Xe LP, with the scale of Xe HP, results in Xe HPG. Intel is designing Xe HPG for a third-party semiconductor foundry, and hopes to debut it in 2021.

In our older graphics detailing the Xe LP, we tried to explain just how easy it is for Intel scale up the iGPU to a discrete GPU SoC. This is done by simply dialing up the Xe slices, and dropping in dGPU ancillaries such as a PCI-Express host interface and memory controllers for the prevalent client-segment discrete graphics, namely GDDR6. There will be additional components, such as ray-tracing hardware. Intel is gunning for DirectX 12 Ultimate logo compliance, and ray-tracing forms a big part of that.

Intel "Willow Cove" Core, Xe LP iGPU, and "Tiger Lake" SoC Detailed

A lot is riding for Intel on its 11th Gen Core "Tiger Lake" system-on-chip (SoC), which will launch exclusively on mobile platforms, hoping to dominate the 7 W thru 15 W ultraportable form-factors in 2020, while eventually scaling up to the 25 W thru 45 W H-segment form-factors in 2021, with a variant that is rumored to double core-counts. The chip is built on Intel's new 10 nm SuperFin silicon fabrication node that enables a double digit percentage energy efficiency growth over 10 nm, allowing Intel to significantly dial up clock speeds without impacting the power envelope. The CPU and iGPU make up the two key components of the "Tiger Lake" SoC.

The CPU component on the "Tiger Lake" processors that launch in a few weeks from now features four "Willow Cove" CPU cores. Coupled with HyperThreading, this ends up being a 4-core/8-thread setup, although much of Intel's innovation is in giving these cores significant IPC increases over the "Skylake" core powering "Comet Lake" processors, and compared to the "Sunny Cove" cores powering "Ice Lake" a minor IPC (although major net performance increase from clock speeds). The "Willow Cove" CPU core appears to be a derivative of the "Sunny Cove" core, designed to take advantage of the 10 nm SuperFin node, along with three key innovations.

Intel 10nm SuperFin Process Goes up Against TSMC 7nm

Intel on Thursday made several technological disclosures about its latest silicon fabrication process, the 10 nm SuperFin. With this, the company is changing the nomenclature of its node refinements, away from the ## nm++ naming scheme (with each "+" denoting a refinement, or internode), to a more descriptive naming scheme. The new 10 nm SuperFin node is the first refinement of the company's 10 nm node that debuted with the company's 10th Gen Core "Ice Lake" processors last year, and promises energy efficiency in the ballpark of 7 nm-class nodes by competitors TSMC and Samsung. While past generations of internodes (refinements) delivered energy efficiency improvements of around 3-5%, 10 nm SuperFin offers the kind of improvements expected from a brand new node, according to Intel.

The 10 nm SuperFin node is composed of two key innovations, the SuperMIM capacitor and a redesigned FinFET transistor. The new SuperMIM (metal insulator metal) capacitor offers a 5x increase in capacitance compared to devices in this class. The redesigned FinFET introduces a new barrier that reduces via resistance by 30%. Combined, the 10 nm SuperFin node affords chips a V/F curve comparable to a die-shrink to a whole new silicon fabrication node, without any change in transistor density. The first product built on 10 nm SuperFin is the upcoming Core "Tiger Lake" processor addressing the client-segment. The company is already working on enhancements of this node relevant for data-center processors.
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