News Posts matching #12 nm

Return to Keyword Browsing

Phison Delivers Fastest PCIe Gen 4x4 NVMe SSD Controller, the E18 Series

Phison Electronics, the industry leader in flash controller technology, is delivering the storage industry's fastest PCIe Gen 4x4 NVMe SSD solution, its second generation PS5018-E18 (E18) PCIe 4.0 controller. The E18 succeeds the PS5016-E16 released in late 2019.

Phison designed the new E18 from the ground up on the efficient TSMC 12 nm process node. This provides SSD manufacturers with a state-of-the-art controller solution in an increasingly competitive field. The controller utilizes Phison's proprietary CoXProcessor 2.0 technology, an innovative SSD architecture that enables E18 to deliver exceptional performance and power efficiency. Phison architecture is also primed for AI-assisted storage, where its distributed architecture uses many small cores to perform the workload in parallel. The E18 is ideal for gamers, content creators, and computing enthusiasts, which demand the best experience. This ultra-low latency is possible only with NVMe SSDs.

AMD Ryzen 3000C-series Processors Based on Existing "Zen+" IP, Heavy TDP Optimization

AMD earlier today announced its Ryzen 3000C-series processors targeted at Chromebooks, a segment where the company feels it can bring more to the table than Intel's entry-level Celeron, Pentium Silver, and Pentium Gold mobile processors. Responding to a questionnaire by TechPowerUp, AMD revealed a handful details about these processors. The Ryzen 3000C-series processors are based on the 12 nm "Picasso" silicon, while the Athlon Gold and Athlon Silver parts are based on 14 nm. The "Picasso" based parts combine up to 4 "Zen+" CPU cores, with an iGPU based on the "Vega" graphics architecture, with up to 10 NGCUs. AMD has optimized all SKUs for a 15 W TDP target.

Responding to a question on storage specification or possible collaboration with MediaTek on WLAN controllers, AMD responded that it wishes a diverse hardware ecosystem for its OEM partners, without getting into specifics. There was no denial on the MediaTek bit. The Ryzen 7 3700C practically maxes out the "Picasso" silicon within the 15 W TDP envelope, which got us wondering if AMD has its eyes on the premium Chromebook segment, possibly even Google's first-party Chromebook Pixel brand. To this company responded that while the 3700C has a solid feature-set for premium Chromebooks, there are no first-party Pixel products on the anvil. AMD has just entered the market, and possibly wants to make a dent on the bulk of the Chromebook market first.

TSMC Details 3nm N3, 5nm N5, and 3DFabric Technology

TSMC on Monday kicked off a virtual tech symposium, where it announced its new 12 nm N12e node for IoT edge devices, announced the new 3DFabric Technology, and detailed progress on its upcoming 5 nm N5 and 3 nm N3 silicon fabrication nodes. The company maintains that the N5 (5 nm) node offers the benefits of a full node uplift over its current-gen N7 (7 nm), which recently clocked over 1 billion chips shipped. The N5 node incorporates EUV lithography more extensively than N6/N7+, and in comparison to N7 offers 30% better power at the same performance, 15% more performance at the same power, and an 80% increase in logic density. The company has commenced high-volume manufacturing on this node.

2021 will see the introduction and ramp-up of the N5P node, an enhancement of the 5 nm N5 node, offering a 10% improvement in power at the same performance, or 5% increase in performance at the same power. A nodelet of the N5 family of nodes, called N4, could see risk production in Q4 2021. The N4 node is advertised as "4 nm," although the company didn't get into its iso-power/iso-performance specifics over the N5 node. The next major node for TSMC will be the 3 nm N3 node, with massive 25%-30% improvement in power at the same performance, or 10%-15% improvement in performance at same power, compared to N5. It also offers a 70% logic density gain over N5. 3DFabric technology is a new umbrella term for TSMC's CoWoS (chip on wafer on substrate), CoW (chip on wafer), and WoW (wafer on wafer) 3-D packaging innovations, with which it plans to offer packaging innovations that compete with Intel's various new 3D chip packaging technologies on the anvil.

TSMC Announces the N12e Enhanced 12nm FF Node for 5G and IoT Edge Devices

TSMC on Monday announced the N12e silicon fabrication node. An enhancement of its 12 nm FinFET node, N12e is designed for value 5G application processors, MODEMs, and IoT edge devices, such as true-wireless earbuds, smartwatch processors, wearables, VR HMDs, entry-level and mainstream SoCs, etc. The node has been derived from the company's 12FFC+_ULL node, and fits into the 12-16 nm class of nodes. It's intended to succeed the company's 22ULL node (in terms of pricing), offering a 76% increase in logic density, 49% increase in clock speed at a given power, 55% improvement in power draw at a given speed, 50% reduction in SRAM leakage current, and low Vdd, with support for logic voltages as low as 0.4 V. That last bit in particular should make the node suitable for tiny, battery-powered devices such as wearables.

DigiTimes Research: China 14th 5-year Plan to see IC Foundry Capacity Expand 40%

China's upcoming 14th five-year plan (2021-2025) will continue to highlight technology and capacity upgrades as the core of its semiconductor self-sufficiency strategy, with foundry capacity projected to expand 40% from the preceding plan and fabrication process expected to advance to 7 nm, according to Digitimes Research.

Bolstered by national policies in the 13th five-year plan, China's IC manufacturing industry is expected to see combined revenues double to CNY240 billion (US$34.28 million) in 2020 from 2016, and may also move 12 nm to production by the end of the year after having volume produced 14 nm process.

AMD Announces Renoir for Desktop: Ryzen 4000G, PRO 4000G, and Athlon PRO 3000G

AMD today announced its 4th Generation Ryzen 4000G and Ryzen PRO 4000G desktop processors for pre-built OEM desktops. The company also expanded its entry-level Athlon 3000G series and debuted the Athlon PRO 3000G series. The Ryzen 4000G and PRO 4000G mark the Socket AM4 desktop debut of the 7 nm "Renoir" silicon, which combines up to 8 CPU cores based on the "Zen 2" microarchitecture, with a Radeon Vega 8 iGPU. These processors benefit from the 65 W TDP and increased power limits of the desktop platform to dial up CPU- and iGPU engine clock speeds significantly over the Ryzen 4000U and 4000H mobile processors based on the same silicon. The new Athlon 3000G-series and Athlon PRO 3000G-series parts are based on a 12 nm die that has "Zen+" CPU cores.

All of the processor models announced today are OEM-only, meaning that you'll only find them on pre-built consumer- and commercial desktops by the likes of HP, Lenovo, Dell, etc. Not even the system-integrator (SI) channel (eg: Maingear, Origin PC, etc.,) gets these chips. OEMs will pair these processors with motherboards based on the AMD B550 chipset, although the chips are compatible with the X570 chipset, too. The Ryzen PRO 4000G processors are targeted at commercial desktops that are part of large business environments, and launches along with the new AMD PRO565 chipset. Since they are OEM-only, the company did not reveal pricing for any of these chips. They did however mention that for the DIY retail channel, they do plan to update their product stack with processors that have integrated graphics at a later time (without going into specifics of the said time).

GLOBALFOUNDRIES Announces 12LP+ Enhanced 12nm Silicon Fabrication Node

GLOBALFOUNDRIES (GF), the world's leading specialty foundry, today announced its most advanced FinFET solution, 12LP+, has completed technology qualification and is ready for production. GF's differentiated 12LP+ solution is optimized for artificial intelligence (AI) training and inference applications. Built on a proven platform with a robust production ecosystem, 12LP+ offers chip designers an efficient development experience and a fast time-to-market.

Contributing to its best-in-class combination of performance, power and area, 12LP+ introduces new features including an updated standard cell library, an interposer for 2.5D packaging, and a low-power 0.5 V Vmin SRAM bitcell that supports the low latency and power-efficient shuttling of data between the AI processors and memory. The result is a semiconductor solution engineered to meet the specific needs of the fast-growing AI market.

GALAX Extends Pink Edition Treatment to Even RTX 2080 Super

In a quick follow-up to our story from yesterday about the GALAX GeForce RTX 2070 Super EX Pink Edition graphics card, we are learning that the company is ready with a GeForce RTX 2080 Super graphics card based on the same board design. Bearing the model number "28ISL6MD71PE," the card is a costmetic variant of the company's RTX 2080 Super EX graphics card, featuring a bubblegum pink paintjob on the cooler shroud and back-plate. The PCB, although of the same design as the EX (1-click OC), is now fully white, like the HOF series. The RGB LED fans glow hot-pink out of the box. The Pink Edition card ships with factory-overclocked speeds of 1845 MHz GPU Boost (vs. 1815 MHz reference), and its software-based 1-click OC feature enables 1860 MHz boost frequencies. The memory is untouched, at 15.5 Gbps (GDDR6-effective).

The GeForce RTX 2080 Super maxes out the 12 nm "TU104" silicon, featuring 3,072 "Turing" CUDA cores, 192 TMUs, 64 ROPs, and a 256-bit wide GDDR6 memory interface holding 8 GB of memory. Much like its RTX 2070 Super sibling, this card pulls power from a combination of 8-pin and 6-pin PCIe power connectors; while its display outputs include three DisplayPorts and one HDMI. Expect an identical product to be launched under the KFA2 brand in certain markets. The company didn't reveal pricing.

AMD Updates Ryzen 3 1200 CPU with Zen+ Architecture

AMD has reportedly updated its Ryzen 3 1200 CPU with Zen+ architecture and is now offering it to consumers. Featuring a configuration of 4 cores with 4 threads, this CPU can operate anywhere from 3.1 GHz (base) to 3.4 GHz in boost frequency. Having originally launched in July of 2017, just under three years ago, AMD decided to refresh this CPU with Zen+ architecture, which brought improvements like a tiny IPC increase, better turbo boost speeds, faster caches and better memory controller for better support of faster DDR4 modules.

The new "Zen+" revision has the same specifications as the older model, however, the only difference is the newer 12 nm manufacturing process and some of the architecture changes of Zen+. The rest of the specifications like clock speeds are the same. The CPU is listed by a German supplier for €54.73 or about $60. This revision carries a different part number, under the code "YD1200BBM4KAFBOX", where the older 14 nm model was "YD1200BBM4KAEBOX".
AMD Ryzen 3 1200 12nm Zen+ Edition

Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm

Everspin Technologies, Inc., the world's leading developer and manufacturer of Magnetoresistive RAM (MRAM), today announced an amendment of its Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) with GLOBALFOUNDRIES (GF ), the world's leading specialty foundry. Everspin and GF have been partners on 40 nm, 28 nm, and 22 nm STT-MRAM development and manufacturing processes and have now updated their agreement to set the terms for a future project on an advanced 12 nm FinFET MRAM solution. Everspin is in production of discrete STT-MRAM solutions on 40 and 28 nm, including its award winning 1 Gb DDR4 device. GF recently announced it has achieved initial production of embedded MRAM (eMRAM) on its 22FDX platform.

AMD Radeon RX 590 GME is a Dressed Up RX 580: No more 12nm, Lower Performance

When AMD pushed out the Radeon RX 590 in late-2018, its key spec was that the "Polaris 20" die had been ported to GlobalFoundries 12LPP (12 nm) silicon fabrication node, yielding headroom to dial up clock speeds over the 14 nm RX 580. The underlying silicon was labeled "Polaris 30" as it was the second major version of the "Polaris 10" die. NVIDIA's GeForce GTX 16-series beat the RX 590 both in performance and price, with even the GTX 1650 Super performing on-par, and the GTX 1660 beating it. It turns out that AMD has a lot of unsold 14 nm "Polaris 20" inventory to go around, and it wants to release them out as the new RX 590 GME.

An Expreview review of an XFX-branded RX 590 GME confirms that the the chip is indeed based on the "Polaris 20 XTR" silicon which is built on the 14 nm process. The card has GPU clock speeds that appear similar to reference clock speeds of the RX 590, with 1460 MHz base compared to 1469 MHz of the original RX 590. But this is where the similarities end. In its testing, Expreview found that the RX 590 GME is on average 5% slower than the RX 590, and performs halfway between the RX 580 and the original RX 590, which are differentiated by a roughly 10% performance gap. The 5% performance deficit would put the RX 590 GME on par with the new RX 5500 XT 4 GB, and trading blows with the GTX 1650 Super. Thankfully, the RX 590 GME is priced lower than RX 590 cards (about 7.7% cheaper), and could be very region-specific. The fact that the RX 590 GME is being sold with full AIB partner branding and retail packaging, shows that this isn't an OEM-only product. Read the complete review in the source link below.
RX 590 GME Front View RX 590 GME PCB RX 590 GME Polaris 20 GPU RX 590 GME GPU-Z RX 590 GME Performance

AMD Gives Itself Massive Cost-cutting Headroom with the Chiplet Design

At its 2020 IEEE ISSCC keynote, AMD presented two slides that detail the extent of cost savings yielded by its bold decision to embrace the MCM (multi-chip module) approach to not just its enterprise and HEDT processors, but also its mainstream desktop ones. By confining only those components that tangibly benefit from cutting-edge silicon fabrication processes, namely the CPU cores, while letting other components sit on relatively inexpensive 12 nm, AMD is able to maximize its 7 nm foundry allocation, by making it produce small 8-core CCDs (CPU complex dies), which add up to AMD's target core-counts. With this approach, AMD is able to cram up to 16 cores onto its AM4 desktop socket using two chiplets, and up to 64 cores using eight chiplets on its SP3r3 and sTRX4 sockets.

In the slides below, AMD compares the cost of its current 7 nm + 12 nm MCM approach to a hypothetical monolithic die it would have had to build on 7 nm (including the I/O components). The slides suggest that the cost of a single-chiplet "Matisse" MCM (eg: Ryzen 7 3700X) is about 40% less than that of the double-chiplet "Matisse" (eg: Ryzen 9 3950X). Had AMD opted to build a monolithic 7 nm die that had 8 cores and all the I/O components of the I/O die, such a die would cost roughly 50% more than the current 1x CCD + IOD solution. On the other hand, a monolithic 7 nm die with 16 cores and I/O components would cost 125% more. AMD hence enjoys a massive headroom for cost-cutting. Prices of the flagship 3950X can be close to halved (from its current $749 MSRP), and AMD can turn up the heat on Intel's upcoming Core i9-10900K by significantly lowering price of its 12-core 3900X from its current $499 MSRP. The company will also enjoy more price-cutting headroom for its 6-core Ryzen 5 SKUs than it did with previous-generation Ryzen 5 parts based on monolithic dies.

Intel Rumored to be Courting GlobalFoundries for Some CPU Manufacturing

With its own silicon fabrication facilities pushed to their capacity limits, Intel is looking for third-party semiconductor foundries to share some of its supply load, and according to a WCCFTech report, its latest partner could be GlobalFoundries, which has a 14 nm-class fab in Upstate New York. If it goes through, the possible Intel-GloFo deal could see contract manufacturing commence within 2020.

GloFo's fab offers 14 nm FinFET and 12LPP, a refinement that's marketed as 12 nm. According to the report, Intel could use GloFo for manufacturing CPU dies, specifically its entry-level chips such as Core i3, Pentium, and Celeron. Intel is also known to shed its own manufacturing workload by contracting foundries for 14 nm core-logic (chipsets). In a bid to maximize 14 nm fab allocation for its CPUs, Intel also started making some of its 300-series chipsets on the older 22 nm process, which goes to show the company's appetite for 14 nm.

Kingston Teases "Grandview," its Upcoming Mid-range PCIe 4.0 M.2 SSD, and Current-Gen "Seccos"

Kingston at the 2020 International CES shows us their upcoming mid-range M.2 NVMe SSD that has the latest PCI-Express 4.0 x4 host interface and NVMe 1.4 protocol, codenamed "Grandview." Later this year, this drive will be launched as a high cost-performance product under the company's marquee or HyperX brand. Available in capacities ranging between 500 GB and 2 TB, the drive is powered by Marvell "Whistler Plus" 12 nm controller that has 4 flash channels, and 1.2 GT/s per channel bandwidth. They wouldn't tell us if it's TLC or QLC NAND flash in use, or the manufacturer-rated performance numbers. The PCIe to M.2 adapter in these pictures will not be part of the package.

Also on display was "Seccos," their new PCI-Express 3.0 x4 drive that uses an unnamed 8-channel controller (likely Marvell), and 3D TLC NAND flash, with capacities ranging between 250 GB to 2 TB. Kingston put out some CDM numbers for the 1 TB model of Seccos: 3,449 MB/s sequential reads, and 2,839 MB/s sequential writes. The manufacturer-rates performance numbers are up to 3,500 MB/s reads, and up to 3,000 MB/s writes.

AMD Announces Ryzen 9 3950X, Details 3rd Gen Ryzen Threadripper, unlocked Athlon 3000G

AMD today announced four new desktop processors across three very diverse markets. To begin with, the company crowned its socket AM4 mainstream desktop platform with the mighty new Ryzen 9 3950X processor. Next up, it released its new baseline entry-level APU, the Athlon 3000G. Lastly, it detailed the 3rd generation Ryzen Threadripper HEDT processor family with two initial models, the Ryzen Threadripper 3960X and the flagship Ryzen Threadripper 3970X. The company also formally released its AGESA Combo PI 1.0.0.4B microcode, and with it, introduced a killer new feature for all "Zen 2" based Ryzen processors, called ECO Mode.

The Ryzen 9 3950X is a 16-core/32-thread processor in the AM4 package, compatible with all socket AM4 motherboards, provided they have the latest BIOS update with AGESA Combo PI 1.0.0.4B microcode. The processor comes with clock-speeds of 3.50 GHz base, with 4.70 GHz maximum boost frequency, and the same 105 W TDP as the 12-core Ryzen 9 3900X. With 512 KB of dedicated L2 cache per core, and 64 MB of shared L3 cache, the chip has a mammoth 72 MB of "total cache."

NVIDIA Could Launch Next-Generation Ampere GPUs in 1H 2020

According to the sources over at Igor's Lab, NVIDIA could launch its next generation of GPUs, codenamed "Ampere", as soon as first half of the 2020 arrives. Having just recently launched GeForce RTX Super lineup, NVIDIA could surprise us again in the coming months with replacement for it's Turing lineup of graphics cards. Expected to directly replace high-end GPU models that are currently present, like GeForce RTX 2080 Ti and RTX 2080 Super, Ampere should bring many performance and technology advancements a new graphics card generation is usually associated with.

For starters, we could expect a notable die shrink to take place in form of 7 nm node, which will replace the aging 12 nm process that Turing is currently being built on. This alone should bring more than 50% increase in transistor density, resulting in much more performance and lower power consumption compared to previous generation. NVIDIA's foundry of choice is still unknown, however current speculations are predicting that Samsung will manufacture Ampere, possibly due to delivery issues that are taking place at TSMC. Architectural improvements should take place as well. Ray tracing is expected to persist and get enhanced with possibly more hardware allocated for it, along with better software to support the ray tracing ecosystem of applications.

NVIDIA Launches the GeForce RTX 2080 Super Graphics Card

NVIDIA today launched the GeForce RTX 2080 Super graphics card, priced at USD $699. The card replaces the RTX 2080 from this price-point, which will be sold at discounted prices of around $630, while stocks last. The RTX 2080 Super is based on the same 12 nm "TU104" silicon as the original, but is bolstered on three fronts: first, it maxes out the "TU104" by enabling all 3,072 CUDA cores. Second, it comes with increased GPU Boost frequency of 1815 MHz, compared to 1710 MHz of the original; and lastly it comes with the highest-clocked 15.5 Gbps GDDR6 memory solution.

The card ships with 8 GB of memory across a 256-bit wide memory bus, which at 15.5 Gbps works out to roughly 496 GB/s of memory bandwidth, a 11 percent increase over the original RTX 2080. Other specifications of the GeForce RTX 2080 Super include 192 TMUs, 64 ROPs, 48 RT cores, and 384 Tensor cores. NVIDIA is allowing its board partners to launch custom-design boards that start at the same $699 baseline.
Our launch-day GeForce RTX 2080 Super coverage includes the following content: NVIDIA GeForce RTX 2080 Super Founders Edition review | MSI GeForce RTX 2080 Super Gaming X Trio review | ZOTAC GeForce RTX 2080 Super AMP Extreme review

AMD 3rd Gen Threadripper Coming This October to Take on Intel's New HEDT Lineup?

AMD is planning to surprise Intel by unveiling its 3rd generation Ryzen Threadripper HEDT (high-end desktop) processor lineup around the same time Intel launches its 10th generation Core "Cascade Lake-X" processor and the "Glacial Falls" HEDT platform, according to sources in the motherboard industry, speaking with DigiTimes. We're fairly sure the sources aren't referring to AMD's 16-core Ryzen 9 3950X processor, because it has already been announced and will be available in September.

The 3rd generation Ryzen Threadripper will likely be a derivative of the company's "Rome" multi-chip module, and compatible with existing socket TR4 motherboards with a BIOS update, although a new chipset could also be launched to enable PCI-Express gen 4.0. AMD has the option to deploy up to 64 CPU cores across eight 7 nm "Zen 2" chiplets, while the 12 nm I/O controller die will be likely reconfigured for the HEDT platform with a monolithic 4-channel DDR4 memory interface and 64 PCIe gen 4.0 lanes. It's capable of 8 memory channels on the 2nd generation EPYC.

ZOTAC Rolls Out a Low-profile GeForce GTX 1650 Graphics Card

ZOTAC rolled out its first low-profile GeForce GTX 1650 graphics card, close to a month after MSI released the very first card of its kind. ZOTAC's 16 cm-long card uses a 2-slot thick chunky aluminium heatsink to cool the GPU, memory, and a portion of the VRM. This heatsink is ventilated by two 40 mm fans. The card relies on the PCI-Express slot for all its power, and runs the GPU at NVIDIA-reference clock speeds of 1665 MHz boost, and 8 Gbps GDDR5 memory. The card uses 4 GB of memory across a 128-bit wide memory bus. Based on the 12 nm "TU117" silicon, the GTX 1650 packs 896 CUDA cores, 56 TMUs, and 32 ROPs. Display outputs include one each of HDMI, DisplayPort, and DVI-D. The company didn't reveal pricing.

NVIDIA GeForce RTX 2080 Super Features 10 Percent Faster Memory

NVIDIA's upcoming GeForce RTX 2080 Super graphics card doesn't just max out the 12 nm "TU104" silicon and add higher GPU clock-speeds, but also features the highest-clocked GDDR6 memory solution on the market, to make the most of the 256-bit wide memory bus of the silicon. NVIDIA deployed 15.5 Gbps GDDR6 memory, which is 10.7 percent faster than the 14 Gbps memory used on the original RTX 2080 and other RTX 20-series graphics cards. The memory real-clock is set at 1937 MHz compared to 1750 MHz on the original RTX 2080. At this memory frequency, the RTX 2080 Super enjoys a memory bandwidth just a touch short of 500 GB/s, at 496 GB/s.

Besides memory, the RTX 2080 Super maxes out the "TU104" silicon by enabling all 3,072 CUDA cores physically present, as opposed to just 2,944 of them being enabled on the original RTX 2080. The card is also endowed with 192 TMUs, 64 ROPs, 384 Tensor cores, and 48 RT cores. The GPU frequencies are set at 1650 MHz with 1815 MHz GPU Boost, compared to 1515/1710 MHz of the original RTX 2080. NVIDIA is launching the RTX 2080 Super at an MSRP of USD $699, with availability slated for July 23. The company's add-in card (AIC) partners are allowed to design custom-design cards that come with improved cooling solutions and higher clocks.

NVIDIA Manufacturing Turing GPUs at Samsung Korea Fab, 11nm?

During our disassembly of the GeForce RTX 2060 Super, we noticed a shocking detail. The 12 nm "TU106" GPU on which it is based, has the marking "Korea." We know for a fact that TSMC does not have any fabs there. The only Korean semiconductor manufacturer capable of contract-manufacturing a piece of silicon as complex as a GPU, for a designer with the energy-efficiency OCD as NVIDIA, is Samsung.

What makes this interesting is that Samsung does not officially have a 12 nm FinFET process. It has 14 nm, and the 11LPP, a 11 nm nodelet, which the company designed to compete with TSMC 12 nm. It would hence be really interesting to hear from NVIDIA on whether they've scaled out the "TU106" to 14LPP, or down to 11LPP at Samsung. It's interesting to note that the shrink in transistor sizes in these nodelets doesn't affect die-sizes. We hence see no die-size difference between these Korea-marked chips, and those marked "Taiwan." We've reached out to NVIDIA for comment.

Update July 3rd: NVIDIA got back to us
NVIDIA
The answer is really simple and these markings are not new. Other Turing GPUs have had these markings in the past. The chip is made at TSMC, but packaged in various locations. This one was done in Korea, hence why his says "Korea".

On an unrelated note: We already use both TSMC and Samsung, and qualify each of them for every process node. We can't comment in any further detail on future plans, but both remain terrific partners.

AMD Ryzen 3000 "Matisse" I/O Controller Die 12nm, Not 14nm

AMD Ryzen 3000 "Matisse" processors are multi-chip modules of two kinds of dies - one or two 7 nm 8-core "Zen 2" CPU chiplets, and an I/O controller die that packs the processor's dual-channel DDR4 memory controller, PCI-Express gen 4.0 root-complex, and an integrated southbridge that puts out some SoC I/O, such as two SATA 6 Gbps ports, four USB 3.1 Gen 2 ports, LPCIO (ISA), and SPI (for the UEFI BIOS ROM chip). It was earlier reported that while the Zen 2 CPU core chiplets are built on 7 nm process, the I/O controller is 14 nm. We have confirmation now that the I/O controller die is built on the more advanced 12 nm process, likely GlobalFoundries 12LP. This is the same process on which AMD builds its "Pinnacle Ridge" and "Polaris 30" chips. The 7 nm "Zen 2" CPU chiplets are made at TSMC.

AMD also provided a fascinating technical insight to the making of the "Matisse" MCM, particularly getting three highly complex dies under the IHS of a mainstream-desktop processor package, and perfectly aligning the three for pin-compatibility with older generations of Ryzen AM4 processors that use monolithic dies, such as "Pinnacle Ridge" and "Raven Ridge." AMD innovated new copper-pillar 50µ bumps for the 8-core CPU chiplets, while leaving the I/O controller die with normal 75µ solder bumps. Unlike with its GPUs that need high-density wiring between the GPU die and HBM stacks, AMD could make do without a silicon interposer or TSVs (through-silicon-vias) to connect the three dies on "Matisse." The fiberglass substrate is now "fattened" up to 12 layers, to facilitate the inter-die wiring, as well as making sure every connection reaches the correct pin on the µPGA.

AMD Ryzen 3 3200G and Ryzen 5 3400G Detailed: New Slide Leak

At the bottom end of AMD's rather tall new Ryzen 3000 desktop processor product-stack are the Ryzen 3 3200G and Ryzen 5 3400G APUs. Unlike the rest of the Ryzen 3000 series, these two are based on the monolithic 12 nm "Picasso" silicon, which is essentially "Raven Ridge" redesigned for 12 nm with the "Zen+" microarchitecture. For the quad-core CPU, this means an improved Precision Boost algorithm that scales better across multiple cores, and faster on-die caches. For the iGPU based on the "Vega" architecture, this is a minor speed-bump.

The 3200G is configured with a 4-core/4-thread CPU and 8 out of 11 NGCUs of the iGPU enabled, yielding 512 stream processors. The maximum CPU clock speeds have been dialed up by 300 MHz over that of the 2200G, to now attain 4.00 GHz boost frequency, while the iGPU engine frequency is increased by 150 MHz, to 1250 MHz. The 3400G maxes out the silicon with a 4-core/8-thread CPU, and all 11 NGCUs enabled on the iGPU (704 stream processors). The CPU spools up to 4.20 GHz, and the iGPU up to 1400 MHz. AMD is including a bigger Wraith Spire cooling solution with the 3400G. Prices remain unchanged over the previous generation, with the 3200G being priced at USD $99, and the 3400G at $149, when the processors likely go on sale this July.

AMD Ryzen "Picasso" APU Clock Speeds Revealed

AMD is giving finishing touches to its Ryzen 3000 "Picasso" family of APUs, and Thai PC enthusiast TUM_APISAK has details on their CPU clock speeds. The Ryzen 3 3200G comes with 3.60 GHz nominal clock-speed and 4.00 GHz maximum Precision Boost frequency; while the Ryzen 5(?) 3400G ships with 3.70 GHz clock speeds along with 4.20 GHz max Precision Boost. The "Picasso" silicon is an optical shrink of the 14 nm "Raven Ridge" silicon to the 12 nm FinFET process at GlobalFoundries, the same one on which AMD builds "Pinnacle Ridge" and "Polaris 30."

Besides the shrink to 12 nm, "Picasso" features upgraded "Zen+" CPU cores that have improved Precision Boost algorithm and faster on-die caches, which contribute to a roughly 3% increase in IPC on "Pinnacle Ridge," but significantly improved multi-threaded performance compared to 1st generation Ryzen. Clock speeds of both the CPU cores and the integrated "Vega" iGPU are expected to increase. Both the 3200G and 3400G see a 100 MHz increase in nominal clock-speed, and 300 MHz increase in boost clocks, over the chips they succeed, the 2200G and 2400G, respectively. The iGPU is rumored to receive a similar 100-200 MHz increase in engine clock.

Lenovo Launches New ThinkPad Laptops Based on New AMD Ryzen PRO processors

Lenovo has released a trio of new Windows 10 laptops based on new, 2nd generation AMD Ryzen PRO processors, in their famous ThinkPad form factor. There are two models that are part of the T series of ThinkPads, while one is part of X series. For reminding, the T series is the flagship line that offers the best balance between ruggedness, features, processing power, and portability in a 14 or 15-inch unit, while the X series focuses on portability.

The new ThinkPads use the second generation of AMD Ryzen PRO processors, which are 12nm improvements of the previous 14nm Ryzen Family. They carry the 3000 name branding but are similar to the 2000 series of desktop CPUs.

Return to Keyword Browsing