ASUS today announced the TUF Gaming GT302 ARGB chassis, a case that makes it easy to build a high-performance PC with great cooling. Prepped and ready for great out-of-the-box cooling, equipped for wide compatibility with high-performance parts, and thoughtfully constructed inside and out for an easy PC DIY experience, the GT302 ARGB resets expectations for a mainstream case.

Great cooling - right out of the box
Most PC builders go big on cooling to ensure an excellent balance of performance and quiet operation. From the moment it is pulled out of the packaging, the TUF Gaming GT302 ARGB gives users a superb foundation for high-end cooling. This starts with a front panel designed first and foremost to maximize airflow efficiency. It is constructed of a wide-open, high-porosity square-type mesh that leaves ample room for fresh air to enter a PC. Four pre-installed 140 mm ARGB case fans move cool air through the chassis. These fans are exceptionally thick, measuring 28 mm in depth. These fans deliver up to 3 mmH2O static pressure and 115 CFM airflow for excellent cooling with quiet operation.

For those of you that have been waiting patiently for the first DisplayPort 2.1 monitors to start arriving, we have good news as Gigabyte has revealed details of its first display equipped with DP 2.1. The monitor in question is the AORUS FO32U2P which also sports a 4K QD-OLED panel with a 240 Hz refresh rate. The 31.5-inch QD-OLED panel does follow the standard feature set with a 10-bit panel, 250 cd/m² brightness, 1.5 million to one contrast ratio, 0.03 ms GTG response time and a DisplayHDR True Black 400 certification. Gigabyte has gone for an anti-reflective coating as well, which might not appeal to everyone.

As for the inputs, the DP2.1 ports support the full UHBR20 spec, which is 80 Gbps of total bandwidth over four 20 Gbps DisplayPort lanes, which means Gigabyte hasn't skimped on anything here. Yes, you read that correctly as well, the monitor has two DP 2.1 inputs, one full size and one mini DP input and there's also a USB Type-C input that supports DP-Alt mode, in addition to 65 W USB Power Delivery and USB data, although it's not clear if this port also supports DP 2.1. Furthermore, there are two HDMI 2.1 ports, one upstreams and two downstreams USB 3.2 ports, as well as a headphone and microphone jack. Gigabyte has also equipped the AORUS FO32U2P with a pair of 5 W speakers and a stand that offers tilt, swivel, pivot and height adjustments. The maximum power usage is said to be 78 W, but this shouldn't include the USB PD part. Other features include KVM support, daisy-chaining via a DP output, picture in picture and picture by picture support and various gaming features such as crosshairs, night vision, black equalizer etc. Gigabyte has as yet to announce official pricing on a release date.

Update Mar 5th: We've received additional details on the DisplayPorts of the AORUS FO32U2P from Gigabyte and only the DP inputs supports DP 2.1, whereas the USB Type-C input and the DP daisy-chain ports are limited to DP 1.4. The MSRP of the AORUS FO32U2P will be US$1399.99 with the AORUS FO32U2 which is a DP 1.4 version will have an MSRP of US$1199.99.

erial leaker @yuuki_ans on X/Twitter has released details on Intel's upcoming Barlow Rridge Thunderbolt 5 controller which will be known as the JHL9580 or JHL9540 depending on the SKU. The good news is that Intel has finally moved to PCIe 4.0 for the bus interface, which was expected due to the increased bandwidth on offer by Thunderbolt 5 over Thunderbolt 3 and 4. Barlow Ridge will use a PCIe 4.0 x4 interface to connect to the host and it appears that the earlier leak that suggested native Thunderbolt support in Arrow Lake-S might be incorrect, as there are diagrams showing Barlow Ridge connected to Arrow Lake-S CPUs.

Besides the faster bus, Thunderbolt 5 brings asymmetrical data transmission support which means that for display applications there will be a 120/40 Gbps mode, whereas for data only applications Thunderbolt 5 will deliver a symmetrical 80 Gbps mode. We should point out that this only appears to apply to the JHL9580 SKU, which also supports 40 Gbps USB4 speeds, whereas the JHL9540 for some reason remains a Thunderbolt 4 controller. That said, both of the Barlow Ridge SKUs get support for 20 Gbps USB 3.2 Gen 2x2, something that was lacking in previous Thunderbolt implementations. There will also be support for DisplayPort 2.1 via DP Alt Mode with full UHBR20 support when used with a DP80 certified cable. Actual data transfers are limited to the 64 Gbps PCIe 4.0 interface to the host system, just like USB4, but this does at least give Thunderbolt 5 extra head room for display data even in symmetrical mode. The Barlow Ridge controllers appear to be connected directly to the Arrow Lake-S CPUs via the PCIe 4.0 x4 interface, much in the same way USB4 host controllers connect to AMD's Ryzen 7000-series CPUS.

Thunderbolt 5 is almost upon us. The new specification offers 80 Gbps bi-directional transfers, with up to 120 Gbps per-direction through lane asymmetry. The new Thunderbolt 5 + 8K60 Display Docking Station from j5create (model: JTD5172) takes advantage of Thunderbolt 5 to wire out next-gen connectivity. It plugs into one Thunderbolt 5 upstream port, putting out three downstream Thunderbolt 5. Each of the three double up as USB. You also have four type-A USB 3.2 ports, two each of 10 Gbps and 5 Gbps. When connected to a 2-pin power brick, the dock puts out a high-powered USB-PD 3.1 port with 140 W delivery. An SD/microSD 4.0 card reader, stereo audio through 4-pole 3.5 mm jack, and a 2.5 GbE wired networking interface make for the rest of it.

VIA Labs, Inc. (VLI), a leading supplier of USB4, USB 3.2, and USB Power Delivery Controllers, today announced that the VL832 USB4 Endpoint Device Controller achieved USB4 certification from the USB Implementor's Forum (USB-IF). VIA Lab's VL832 supports USB 40 Gbps operation and is now listed on the USB-IF Integrator's List under TID: 10033.

VIA Lab VL832's USB-IF Certification represents a key milestone in the USB4 ecosystem. The certified USB4 device controller with an integrated USB 3.2 USB 10 Gbps Hub, USB 2.0 Hub, and DisplayPort output, provides essential connectivity for peripheral devices such as multi-function adapters and docking stations. In USB4 40 Gbps mode, VL832 supports full DisplayPort HBR3 bandwidth (32.4 Gbps), and the USB 20 Gbps hub can enable multiple USB 10 Gbps devices to operate at full performance on supported host platforms. Both metrics are double what was previously possible using DisplayPort Alternate Mode, which is limited to 2-lanes of DisplayPort when supporting USB 3.2 functionality.

ASRock, the leading global motherboard, graphics card, and mini PC manufacturer, today announced the ASRock Radeon RX 7900 XT Phantom Gaming White 20 GB OC. This graphics card is powered by the AMD Radeon RX 7900 XT GPU and built on 5 nm process. The new design pattern, featuring a white color scheme, is for enthusiasts seeking a white-themed PC. ASRock Radeon RX 7900 XT Phantom Gaming White 20 GB OC Graphics card has 84 compute units and boasts 5376 stream processors with a Boost Clock of up to 2450 MHz and a Game Clock of up to 2075 MHz. With 20 GB of GDDR6 high-speed memory clocked at 20 Gbps Effective and 80 MB of Infinity Cache, delivering 4K gaming at the highest settings.

ASRock Radeon RX 7900 XT Phantom Gaming White 20 GB OC graphics cards use the triple-fan Phantom Gaming 3X cooling system with the customized 100/100/100 mm Striped Ring Fans, Air Deflecting Fin, and Ultra-fit Heatpipe to provide superior cooling performance. ARGB LEDs that support Polychrome SYNC allow users to customize lighting effects, while the metal frame and backplate prevent the PCB from bending. The Super Alloy Graphics Card components provide stability for long-term operation. With its great performance and rich features, it can fully satisfy the needs of gamers.

QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today launched the new QXG-10G2SF-X710 10GbE network expansion card. Equipped with the advanced Intel Ethernet Controller X710-BM2, this PCIe Gen 3 card (compatible with PCIe Gen 2) can be installed into a QNAP NAS or Windows /Linux PC, instantly augmenting connectivity with two high-speed 10GbE ports.

Featuring a low-noise fanless design, the QXG-10G2SF-X710 comes with two 10GbE SFP+ (10G/1G) network ports. Users can utilize SMB Multichannel or Port Trunking to combine bandwidth, providing up to 20 Gbps of data transfer potential, thereby accelerating large file sharing and intensive data transmission. The QXG-10G2SF-X710 also supports SR-IOV that enhances network resource allocation for VMware virtualization applications, reducing network bandwidth consumption and significantly lowering CPU usage for virtual machine servers (hypervisors).

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator has launched the QXG-10G2T 10 GbE network expansion card. The QXG-10G2T is a cutting-edge, dual-port, 5-speed 10 GbE (RJ45) network expansion card, presenting an energy-efficient and cost-effective solution for various networking needs. This card is ideal for a professional photographers, videographers, or part of a collaborative team that requires simultaneous data access with lower latency.

Andy Chuang, QNAP Product Manager said, "We are excited to bring the QXG-10G2T to the market. This expansion card is a testament to QNAP's commitment to providing innovative and efficient solutions for modern networking challenges. With its versatile features and support for multiple speeds, the QXG-10G2T offers a seamless experience for both NAS and PC users, enhancing their workflow efficiency."

Simply NUC, Inc, a leading mini computer solutions company, today announced a new Simply NUC designed and branded mini PC product family called Moonstone. Equipped with the latest AMD Ryzen 7000 processors in a compact 4x4 design with an innovative cooling solution, Moonstone delivers top-tier computing performance for a wide range of usages. Supporting up to 64 GB of DDR5-4800 high-speed RAM and up to 16 TB of storage, Moonstone will increase your computing output while keeping a minimal footprint on both your desk and energy bill.

"Perfect for working or gaming, we saw an opportunity to set the new standard of innovation-driven mini PC performance," said Aaron Rowsell, Simply NUC co-CEO, "Moonstone is the highest performing 4x4 ever launched."

Back in October of last year, pictures from an ASUS event in China appeared online, showing off a pair of mATX motherboards that had most of its peripheral and power connectors on the reverse side of the motherboard. Now it appears that ASUS has decided to launch such a product, in the shape of the unforgettably named TUF Gaming B760M-BTF WiFi D4. The BTF part in the model name stands Back To (the) Future, although ASUS is most likely not allowed to use that term due to copyright restrictions, so it had to make do with BTF. Regardless of naming, the interesting part here is that all of the power connectors, the four SATA ports, the USB-C and USB 3.0 headers, as well as multiple other headers and one of three M.2 slots, are on the reverse side of the motherboard. This is all done to allow for cleaner cable management.

Other noteworthy features on the board include a single PCIe 5.0 x16 slot, one PCIe 4.0 x4 and one x1 slot, three USB-C ports, of which one is capable of 20 Gbps speeds and 2.5 Gbps Ethernet. As this is a mid-range board, we presume ASUS wants to test the waters so to speak, to make sure there's a market for such a product. However, one major hurdle is the small fact that there aren't any suitable chassis in the market and the product page even mentions that "This motherboard is compatible with specific case models", without going into any details. Presumably, ASUS will offer a suitable chassis, or have some partner(s) lined up that will provide a suitable chassis. Gigabyte announced something similar in May last year, but decided to team up with system integrators, something ASUS might be planning on as well.

Yes, you read that correctly, ASUS didn't launch just one, but two W790 based LGA-4677 motherboards today, namely the Pro WS W790-Sage SE and the Pro WS W790-Ace. The main difference here is that the Sage supports up to seven PCIe 5.0 x16 slots—one is a x8 slot electrically—and is designed for the Xeon W-3400 series, whereas the Ace supports five PCIe 5.0 x16 slots and is in turn designed for the Xeon W-2400 series. One downside of these boards is that they might not fit in a standard ATX case, as the Sage follows the SSI-EEB form factor and the Ace the SSI-CEB form factor, both of which are a fair bit wider than an ATX motherboard and with different mounting holes.

The Pro WS W790-ACE also sports eight DDR5 DIMM slots that operate in quad-channel and supports up to 2 TB of RAM if ECC R-DIMMs are used. Furthermore, ASUS has kitted out the Ace with a pair of PCIe 4.0 M.2 slots, one 2280 and one 22110 slot, four SATA ports, three slim SAS ports, a Marvell 10 Gbps and an Intel 2.5 Gbps Ethernet interface, a single USB 3.2 Gen 2x2 20 Gbps USB Type-C port around the back and an internal header for a second, case mounted port. Finally the board has four USB 3.2 Gen 2 10 Gbps Type-A ports around the back and a header for a further two., as well as eight USB 2.0 ports around the back and audio courtesy of a Realtek S1220A based solution with optical S/PDIF out.

MSI Radeon RX 7900 XTX Gaming Trio Classic, the company's first Radeon 7000 series RDNA3 graphics card, is finally listed online. American retailer Newegg put it up for sale at $1,100, a $100 premium over the $1000 AMD baseline price for the RX 7900 XTX. This is a "sold and shipped by Newegg" listing. MSI showed this card off last month, at the 2023 International CES. It pairs a custom-design PCB with a previous-generation Tri Frozr 2.0 cooling solution—the same one it used with its RX 6950 XT Gaming series. The PCB, however, is an MSI in-house design, with a meaty VRM that draws power from three 8-pin PCIe power connectors, and should hence feature a higher power-limit than the reference-design board, which has been known to scoop out a far greater overclocking headroom on other cards with a similar power setup (such as the ASUS TUF Gaming RX 7900 XTX).

The MSI RX 7900 XTX Gaming Trio Classic comes with clock speeds of 2.30 GHz game, and 2.50 GHz boost, which surprisingly are AMD's reference clocks. Perhaps MSI is saving factory-overclocks for the RX 7900 XTX Gaming X Trio Classic, which it will price even higher. Maxing out the 5 nm "Navi 31" GPU, the RX 7900 XTX offers 6,144 stream processors across 96 RDNA3 compute units, with 96 Ray Accelerators, 384 TMUs, 192 ROPs, and a 384-bit wide GDDR6 memory interface, running 24 GB of memory at 20 Gbps (960 GB/s memory bandwidth).

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today unveiled the latest Intel B760 series motherboards. With enhanced XMP and hardware design of memory, the full B760 DDR5 lineup can achieve superb Z790-like memory performance of DDR5-7600. Featuring up to 16+1+1 phases of 60 amps digital power VRM design with full-coverage heatsink, GIGABYTE's B760 lineup provides premium power and thermal design for the high-frequency operation of Intel 13th gen processors. Meanwhile, the innovative PCIe and M.2 EZ-Latch technology are implemented to simplify the upgrade of graphics cards and M.2 SSDs, and to avoid accidental damage to the surrounding components. Moreover, the features of 2.5 GbE LAN, Wi-Fi 6E, USB 3.2 Gen 2x2 Type C with 20 Gbps, and up to 3 sets of PCIe 4.0 x4 M.2 slots with armor on select models offer superb connectivity. Further with the latest GIGABYTE PerfDrive technology and GCC software platform, GIGABYTE delivers the outstanding B760 platform with the optimal hardware, software, and firmware which covers from DDR4 to DDR5 with full form factor options of ATX, Micro ATX, and Mini ITX.

In the Intel product plan, the "Z" chipset is the only platform to support CPU and memory overclocking. However, the B chipset with limited DDR frequency tuning offers more budget friendly options, especially those only require memory overclocking. In order to provide solid power for high-performance operation of CPU and XMP overclocking, GIGABYTE B760 AORUS motherboards are geared up to 16+1+1 power phases with 60 amps DrMOS design, while the well-received B760 AORUS ELITE features 12+1+1 power phases, and the leading power design of 14+1+1 phases on B760M AORUS PRO. These power designs allow GIGABYTE B760 AORUS motherboards of all configuration to deliver the most stable power, as well as to provide sufficient power when the CPU runs full loading. Meanwhile, enhanced by full-coverage heatsink, 5 W/mK thermal pad, and 2x copper PCB, B760 AORUS MASTER/ PRO/ ELITE/ GAMING X lineup covers from ATX to micro ATX models boast superb thermal design to improve the stability and keep the power supply area which is most likely to generate heat staying cool.

ECS Industrial Computer Co., Ltd., also known as ECS IPC, is the subsidiary of leading motherboard and computer manufacturer Elitegroup Computer Systems (ECS). ECS IPC has joined hands with Intel to announce a new generation of Intel Raptor Lake Z790 series for LEET Z790H7-A motherboard and the other product of the latest LEET B660 gaming PC to satisfy gamers' passionate gaming experience and enhance the passionate gaming soul.

The Z790H7-A motherboard provides excellent performance for gamers and professionals. It is compatible with Intel 12th and 13th generation Core processors (Raptor Lake-S & Alder Lake-S) as well as supports Windows 11 64-bit. With the Intel Z790 chipset as the strong backing for development, the Z790 chipset has further improved the overclocking function, which can support the performance requirements of one-click overclocking, and the Z790 chipset also supports the powerful performance of DDR5 memory and PCIe 5 transfer. DDR5 provides 50% higher bandwidth than DDR4 and also PCIe 5.0 increases the data rate from 16GT/s to 32GT/s, which is twice faster than PCIe 4.0.

AMD in its technical presentation confirmed the reference clock speeds of the Radeon RX 7900 XTX and RX 7900 XT RDNA3 graphics cards. The company also made its first reference to a GeForce RTX 40-series "Ada" product, the RTX 4080 (16 GB), which is going to launch later today. The RX 7900 XTX maxes out the "Navi 31" silicon, featuring all 96 RDNA3 compute units or 6,144 stream processors; while the RX 7900 XT is configured with 84 compute units, or 5,376 stream processors. The two cards also differ with memory configuration. While the RX 7900 XTX gets 24 GB of 20 Gbps GDDR6 across a 384-bit memory interface (960 GB/s); the RX 7900 XT gets 20 GB of 20 Gbps GDDR6 across 320-bit (800 GB/s).

The RX 7900 XTX comes with a Game Clocks frequency of 2300 MHz, and 2500 MHz boost clocks, whereas the RX 7900 XT comes with 2000 MHz Game Clocks, and 2400 MHz boost clocks. The Game Clocks frequency is more relevant between the two. AMD achieves 20 GB memory on the RX 7900 XT by using ten 16 Gbit GDDR6 memory chips across a 320-bit wide memory bus created by disabling one of the six 64-bit MCDs, which also subtracts 16 MB from the GPU's 96 MB Infinity Cache memory, leaving the RX 7900 XT with 80 MB of it. The slide describing the specs of the two cards compares them to the GeForce RTX 4080, which is what the two could compete more against, especially given their pricing. The RX 7900 XTX is 16% cheaper than the RTX 4080, and the RX 7900 XT is 25% cheaper.

AMD, in its technical presentation for the new Radeon RX 7900 series "Navi 31" GPU, gave us an elaborate explanation on why it had to take the chiplets route for high-end GPUs, devices that are far more complex than CPUs. The company also enlightened us on what sets chiplet-based packages apart from classic multi-chip modules (MCMs). An MCM is a package that consists of multiple independent devices sharing a fiberglass substrate.

An example of an MCM would be a mobile Intel Core processor, in which the CPU die and the PCH die share a substrate. Here, the CPU and the PCH are independent pieces of silicon that can otherwise exist on their own packages (as they do on the desktop platform), but have been paired together on a single substrate to minimize PCB footprint, which is precious on a mobile platform. A chiplet-based device is one where a substrate is made up of multiple dies that cannot otherwise independently exist on their own packages without an impact on inter-die bandwidth or latency. They are essentially what should have been components on a monolithic die, but disintegrated into separate dies built on different semiconductor foundry nodes, with a purely cost-driven motive.

Leading global motherboard manufacturer, ASRock, proudly announces its new ASRock Z790 PG SONIC, an officially licensed motherboard featuring SEGA's Sonic the Hedgehog. A 16-bit spinning ring emblazons the rear IO cover, while on the rear side you'll even catch a glimpse of Sonic mid-run. The ASRock motherboard is co-launched to celebrate the release of SEGA's new Sonic Frontiers game.

"Designed to bring back epic memories of catching rings in Green Hill Zone, the motherboard echoes Sonic's lightning speed with its fast blue and silver shards and Sonic silhouette, besides the motherboard outlook is designed around the Sonic the Hedgehog theme, the ASRock Z790 PG SONIC also features a SONIC-inspired UEFI BIOS interface", Said Chris Lee, Vice President of ASRock motherboard & gaming monitor business unit.

USB Implementers Forum (USB-IF), the support organization for the advancement and adoption of USB technology, today announced the publication of the USB4 Version 2.0 specification, a major update to enable USB 80 Gbps performance over the USB Type-C cable and connector. The updated USB4 specification doubles the maximum aggregate bandwidth of USB to the benefit of higher-performance displays, storage, and USB-based hubs and docks. The USB Type-C and USB Power Delivery (USB PD) specifications have also been updated to support this higher level of data performance.

"For engineers, USB4 is defined by its multi-protocol tunneling that architecturally differentiates it from its predecessors - USB 3.2 and USB 2.0," said Brad Saunders, USB-IF Board Chair and CEO. "This updated technical specification extends USB4 speed and data protocol performance, enabling manufacturers to develop products that can deliver USB 80 Gbps in addition to existing USB 40 Gbps and USB 20 Gbps to end users."

The Video Electronics Standards Association (VESA) announced today that it has released DisplayPort 2.1, the latest version of the DisplayPort specification, which is backward compatible with and supersedes the previous version of DisplayPort (DisplayPort 2.0). VESA has been working closely with member companies to ensure that products supporting DisplayPort 2.0 would actually meet the newer, more demanding DisplayPort 2.1 spec. Due to this effort, all previously certified DisplayPort 2.0 products including UHBR (Ultra-high Bit Rate) capable products - whether GPUs, docking station chips, monitor scalar chips, PHY repeater chips such as re-timers, or DP40/DP80 cables (including both passive and active, and using full-size DisplayPort, Mini DisplayPort or USB Type-C connectors) - have already been certified to the stricter DisplayPort 2.1 spec.

Achieving a robust, end-to-end user visual experience remains the utmost priority for VESA's DisplayPort specification, whether across a native DisplayPort cable, via DisplayPort Alt Mode (DisplayPort over the USB Type-C connector), or tunneled through the USB4 link. As such, DisplayPort 2.1 has tightened its alignment with the USB Type-C specification as well as the USB4 PHY specification to facilitate a common PHY servicing both DisplayPort and USB4. In addition, DisplayPort 2.1 has added a new DisplayPort bandwidth management feature to enable DisplayPort tunneling to coexist with other I/O data traffic more efficiently over the USB4 link. This increased efficiency is on top of mandated support for VESA's visually lossless Display Stream Compression (DSC) codec and VESA's Panel Replay capability. DSC bitstream support can reduce DisplayPort transport bandwidth in excess of 67 percent without visual artifacts, while VESA's Panel Replay capability can reduce DisplayPort tunneling packet transport bandwidth in excess of 99 percent when Panel Replay operation is taking place.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the latest AMD B650 motherboards based on the success of the X670 series. The comprehensive lineup includes AORUS, AERO, and GAMING series to provide more reasonable options with notable features for users. GIGABYTE select B650 motherboards adopt PCIe 5.0 / 4.0 x16 graphics interface and PCIe 5.0 / 4.0 M.2 slots with EZ-Latch technology, making it easier than ever for users to upgrade graphics cards and M.2 SSDs, avoiding accidental damage to the surrounding components. Further, up to 16+2+2 phase Twin Digital power, 105 Amps Smart Power Stage, and up to 12-layer PCB provide increased stability, optimal compatibility, and performance for AMD Ryzen 7000 series processors. With the advanced thermal design, VRM temperature is reduced, stabilizing the power and performance of the PCIe 5.0 slot and PCIe 4.0 M.2 SSD and avoiding performance drop due to thermal throttling. Meanwhile, the enhanced shielding design of SMD slots strengthens the reliability of signals and slot structure. In addition, select models take advantage of Active OC Tuner technology to deliver optimized performance with a more flexible and user-friendly experience.

Unfortunately there's no pricing attached to this leak, unlike the earlier pricing details for MSI's B650 motherboards from B&H, but Videocardz has managed to get the specs for ASRocks upcoming B650 and B650E motherboards. Once again we're looking at a collection of seven models, four B650E and three B650 models in total. Something interesting to note that Videocardz is pointing out, is that only the cheapest board in the lineup has a six layer PCB, with most models using an eight layer PCB and the Mini-ITX board is going up to 10 layers. In other words it seems like most entry level boards are now using high-end PCBs, due to the transition to PCIe 5.0.

The base model is the B650 PG Lightning, which is a pretty feature stripped motherboard, yet all PCIe slots are said to be PCIe 4.0 and it has a pre-installed I/O shield. It comes with 2.5 Gbps Ethernet, but WiFi is optional. At least there's a rear mounted 20 Gbps USB-C port here and the board has a total of three M.2 slots, of which one is PCIe 5.0. On the same kind of level sits B650 Pro RS, which is a step down in the sense that one of the M.2 slots PCIe 3.0 x2 and it has fewer PCIe slot, but it appears to have slightly fancier cooling for the VRMs and it gains a DisplayPort output around the back.

US retailer B&H has kindly provided the first B650 motherboard pricing and it's something of a mixed bag. The company has listed no less than seven different models from MSI, ranging in price from US$199.99 to US$329.99. It doesn't appear as if any of these boards are based on the B650E chipset, but based on information TPU were given at Computex, we know that some higher-end B650 boards will cost around the same as some lower-end B650E boards.

As B&H has only listed key features of the boards, it's hard to tell what features some of the boards offer, but the base model is the mATX Pro B650M-A WiFi, which at the very least has one PCIe 4.0 x16 slot, one PCIe 4.0 x4 slot, one PCIe 3.0 x1 slot and two M.2 slots. The board obviously also has WiFi 6E and somewhat surprisingly has 2.5 Gbps Ethernet. On the other hand, it only has a front header for a USB-C port and none around the back. This type of board was supposed to start at or below the US$150 mark and we'll hopefully see a transition to there in due time.

The USB Implementers Forum (USB-IF) has announced a few changes to the various logos that are tied to the USB standard. This is said to be done to simplify the plethora of logos that are currently being used and to make it easier for consumers to know what they're buying. At the same time, the old SuperSpeed USB logo is being retired and the branding will not appear on new products at all. Instead, the logos that were developed for the USB4 standard and USB PD 3.1, will be adapted across the board. The new changes will come into effect this quarter and could appear on new products before the end of the year.

The new logos that will replace the SuperSpeed logo are pretty straightforward, with a 5 and 10 Gbps logo being added to the 20 and 40 Gbps logos that we've already seen. These logos will be used for packaging, on cable connectors and even on some devices. The new 5 and 10 Gbps logos can also be combined with the 60 W and 240 W charging logos when used with USB-C cables. All of this should make it easier as a consumer to know what kind of cable you're buying, but keep in mind that these logos only apply to certified products and not all USB cables are certified. Still, it's an improvement overall and should make life easier when shopping for cables, assuming the new logos are being used properly.

It was only yesterday that the USB Promoters Group announced the USB4 Version 2.0 spec with support for speeds of up to 80 Gbps, something TechPowerUp mentioned at the end of our USB4 article back in June. Now details of a 120 Gbps asymmetric mode has popped up, courtesy of Angstronomics and we've managed to confirm that it is indeed something that is coming from one of our own sources. We were in fact told back in June that the 80 Gbps mode was meant to be asymmetric, but this was not mentioned in the recent press release.

The 120 Gbps mode will use three of the four data pairs for upstream data and the fourth 40 Gbps data pair will be for downstream data from and to the host controller.Asymmetric data transfers are nothing new over USB Type-C cables, as the DP Alt Mode is already taking advantage of this. This is possible because USB4 Version 2.0 will move to PAM3 (Pulse-Amplitude Modulation) data encoding from today's 64/66- or 128/132-bit encoding. The next generation of Thunderbolt is also expected to use PAM3 encoding to reach the rumoured 80 Gbps speeds that were posted somewhat by mistake by an Intel executive last year.

BizLink, a global leader in interconnect solutions, is proud to announce the release of the world's first VESA certified DP80 Enhanced full-size DP cable after the launch of DP80 mDP cable in March 2022. DP80 as the highest standard for cable configuration defines a new standard for display connectivity with emphasis on higher link rate. Certified with the latest version of DP technology, BizLink's DP80 Enhanced full-size DP cable provides a maximum throughput data rate up to 80 Gbps, covering new data rates per lane: UHBR10 (10 Gbps), UHBR13.5 (13.5 Gbps), and UHBR20 (20 Gbps).

In an era consisting of trends such as remote work and extended reality, to deal with the growing needs for high-performance displays and "stay connected" at the most elevated implementation levels becomes crucial. Satisfying user experience and reliable connectivity requires higher data rate conversion. The DP80-marked cable supports UHBR20 at their highest transfer rate, enabling ultimate connections of advanced and latest display applications and systems. With a satisfactory data rate value up to 80 Gbps, the DP80 standard unleashes new capabilities for bringing superior connection to achieve a given level of video quality as image capture and display technology advance.