Intel is officially stepping back from its Deep Link suite of technologies. The confirmation came through a company representative on GitHub, confirming that active development has ceased. This follows a period when Intel quietly stopped highlighting Deep Link in newer offerings, such as its "Battlemage" GPUs. While the features might still work for those currently using Deep Link, don't expect any future updates or official assistance from Intel's support channels. If you cast your mind back to late 2020, you might recall Intel launching Deep Link. The core idea was to get Intel CPUs and their dedicated Arc GPUs working more effectively in tandem. To tap into this, you needed a specific setup: an 11th, 12th, or 13th Generation Intel CPU alongside an Arc Alchemist GPU. The package featured key tools: Dynamic Power Share for optimizing power between the CPU and GPU, Stream Assist to offload streaming to integrated graphics, Hyper Encode for faster video encoding, and Hyper Compute to accelerate AI tasks using OpenVINO.

These were designed to give a leg up to applications like OBS, DaVinci Resolve, and Handbrake. However, the writing may have been on the wall for Deep Link. Intel's "Meteor Lake" chips, which arrived in late 2023, weren't on the compatibility list, hinting that development had already wound down. Getting these features to perform reliably wasn't always straightforward, with users, like the one on GitHub who raised the initial question, reporting difficulties even with supported hardware. A user tried running Core Ultra 200S with Battlemage in OBS, facing issues not by the software, but by Intel's drivers. The general thinking is that Intel might have viewed Deep Link as a bit of a niche feature, possibly concluding that the continued effort and investment, especially with the need for validation with each software vendor, wasn't paying off. As for what's next, Intel hasn't announced a direct successor to these specific integrated features.

Intel has revised the recommended retail prices for two of its Core Ultra 7 200S series desktop processors, making the most significant adjustment to its "Arrow Lake‑S" lineup since it launched six months ago. As of right now, the Core Ultra 7 265K carries an MSRP of $299 instead of $399, and the unlocked 265KF model is now $284, down from $384. Intel notes these are suggested prices only—actual costs will vary by retailer, region, taxes, and other factors. These price changes come alongside Intel's Spring Bundle promotion, where buyers receive blockbuster game keys and professional software licenses with qualifying purchases of Core Ultra Series 2 and 14th Gen processors. Intel emphasizes that the new MSRPs are separate from these bundles, so combining both savings opportunities is still possible. Interestingly, Intel has left the pricing for its top‑end Core Ultra 9 285/285K ($549/$589) and its mainstream Core Ultra 5 245/245K/245KF ($270/$309/$294) unchanged.

This suggests the company is focusing on mid‑range SKUs to win back market share rather than adjusting the entire Arrow Lake‑S family. This move also reflects market pressure—early stability issues with the 14th Gen chips and strong performance from AMD's Ryzen 9000X3D series have made Intel's task tougher. A glance at retailer listings shows not everyone has updated prices yet; in some cases, the Core Ultra 7 265K can already be found for under $299. Whether these cuts will drive more gamers, creators, and professionals to Arrow Lake‑S remains to be seen, but Intel is clearly betting on a winning combination of price, recently boosted performance, and bundled extras.

Die shots of Intel's "Arrow Lake" desktop processors have appeared online, confirming the chiplet design we have known about since the launch. The images annotated by the YouTube channel HighYield show a four‑tile arrangement mounted on a base die made with Intel's 22 nm FinFET process. The compute tile sits at the top left, built on TSMC's N3B node and covering 117.24 mm². To its right are the SoC tile on TSMC's N6 node measuring 86.65 mm², and the GPU tile, which houses four Xe cores alongside an Arc Alchemist render slice. The I/O tile, at 24.48 mm² on the same N6 node, completes the group at the bottom left. Intel has redesigned its hybrid core layout for Arrow Lake, moving away from separate P‑core and E‑core clusters. Four of the eight high‑performance P‑cores line the die's outer edges, with the remaining four in the center. In between these lie the four efficiency E‑core clusters, each sharing 3 MB of L2 cache. A unified 36 MB L3 cache ring bus connects to every core, allowing E‑cores to tap into that larger cache pool for the first time. Intel aims to spread heat more evenly and boost background task performance.

The I/O tile integrates Thunderbolt 4 controllers, PCIe buffers and PHYs. The SoC tile carries display engines, media accelerators and DDR5 memory controllers. All tiles are bonded to the base die via Intel's Foveros Omni stacking technology. Arrow Lake also reflects a shift in Intel's manufacturing strategy. Plans to use Intel's 20A node were dropped in favor of TSMC processes, making this the first desktop CPU from Intel that relies almost entirely on external foundries. On the software side, Intel has begun offering its IPO profiles in select prebuilt systems. These presets optimize CPU and memory settings for a hassle‑free performance boost that remains within warranty limits. Meanwhile, the native 200S Boost overclocking option is rolling out via BIOS updates. Early tests suggest that 200S Boost alone yields modest gains unless paired with very high-speed DDR5 modules, while IPO profiles deliver more consistent improvements with mainstream memory configurations.

MSI proudly announces full support for Intel 200S Boost technology for the latest Z890 motherboard lineup, empowering gamers, creators, and enthusiasts to unlock next-level performance with a single click. Intel 200S Boost is a cutting edge memory enhancement technology that allows users to safely elevate DDR5 memory performance when paired with Intel Core Ultra 200S Series Desktop "K-SKU" processors and "Z890 series motherboards". To fully optimize this feature, MSI has forged strong partnerships with leading memory brands. Together, we've rigorously tested and validated a wide range of DDR5 modules to meet Intel 200S Boost standards, delivering exceptional performance, stability, and compatibility. Learn more about Intel 200S Boost.

Once a compatible processor and supported memory kit are installed, users can instantly activate 200S Boost via MSI Click BIOS X, no manual tuning or technical expertise required. This one click feature enables real performance improvements in gaming, content creation, and everyday multitasking. To support this breakthrough, MSI has released the latest BIOS for all Z890 series motherboards, ensuring full compatibility with Intel 200S Boost. Users are encouraged to visit MSI's official website and product pages for the latest BIOS updates.