News Posts matching #3D

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VR as a Coping Mechanism for Loss: Meet Nayeon

VR has been hailed as the next coming of truly ingenious, engrossing, enveloping experiences, and to some extent, it already does offer those. There are still limitations to the technology and the level of realism it can impart (there is a whole slew of senses we need to trigger for truly enveloping experiences, of course), but I feel we sometimes get somewhat limited in the way we look at VR. Of course, we can all imagine video games built in VR - and when we do, we likely imagine them as they were presented to us in Steven Spielberg's Ready Player One.

Then there are other use-cases, such as real-estate experiences that place you right inside your future home and allow you to see the changes you'd make. Architecture design, engineering, game world design, even strolls through museums, your mind a subatomic particle able to instantly travel to foreign countries and explore their marvels. All for this, mind you, without ever leaving the comfort of our home, without the required expenses and no wasted time with travelling or passport checks - all, however, simulated. But what if VR could go even further? What if VR could be used as a coping mechanism? What if you could meet your dead parents, siblings... Or children? This is the story I bring to you today: of how VR was used to reunite a mother with her deceased seven-year-old girl. This is the story of Ji-sung and her daughter Nayeon.

SK Hynix Licenses DBI Ultra 3D Interconnect Technology

Xperi Corporation today announced that it entered into a new patent and technology license agreement with SK hynix, one of the world's largest semiconductor manufacturers. The agreement includes access to Xperi's broad portfolio of semiconductor intellectual property (IP) and a technology transfer of Invensas DBI Ultra 3D interconnect technology focused on next-generation memory.

"We are delighted to announce the extension of our long-standing relationship with SK hynix, a world-renowned technology leader and manufacturer of memory solutions," said Craig Mitchell, President of Invensas, a wholly owned subsidiary of Xperi Corporation. "As the industry increasingly looks beyond conventional node scaling and turns toward hybrid bonding, Invensas stands as a pioneering leader that continues to deliver improved performance, power, and functionality, while also reducing the cost of semiconductors. We are proud to partner with SK hynix to further develop and commercialize our DBI Ultra technology and look forward to a wide range of memory solutions that leverage the benefits of this revolutionary technology platform."

Kioxia Corporation Unveils 5th-Generation BiCS FLASH

Kioxia Corporation, the world leader in memory solutions, today announced that it has successfully developed its fifth-generation BiCS FLASH three-dimensional (3D) flash memory with a 112-layer vertically stacked structure. Kioxia plans to start shipping samples of the new device, which has a 512 gigabit (64 gigabytes) capacity with 3-bit-per-cell (triple-level cell, TLC) technology, for specific applications in the first quarter of calendar year 2020. The new device aims to fulfill ever-growing bit demands for a wide variety of applications, including traditional mobile devices, consumer and enterprise SSDs, emerging applications enabled by the new 5G networks, artificial intelligence and autonomous vehicles.

Going forward, Kioxia will apply its new fifth-generation process technology to larger capacity devices, such as 1 terabit (128 gigabytes) TLC and 1.33 terabit 4-bit-per-cell (quadruple-level cell, QLC) devices.

Intel to Detail Xe Graphics Card Architecture at GDC

This year's Game Developers Conference (GDC) that will take place in March is forming to become a very interesting one. According to the GDC schedule platform, Intel is having a presentation about its upcoming Xe graphics card architecture. Saying that "Intel's brand new Xe Architecture, has been teased for a while, and is scheduled for release later this year! This update brings a significant compute, geometry and throughput improvements over today's widely used Gen9 and Gen11 graphics.", Intel is giving us a slight hint of what is to come.

Presented by Intel's senior developer relations engineer, Antonie Cohade, the talk will include an in-depth look of the Xe hardware architecture and its implementations. Said to introduce "powerful new features", the talk about Xe graphics should include a mention of the latest trend in the world of 3D graphics, ray tracing, and show us what are the capabilities of the new GPU architecture.

Kioxia Develops New 3D Semicircular Flash Memory Cell Structure "Twin BiCS FLASH"

Kioxia Corporation today announced the development of the world's first three-dimensional (3D) semicircular split-gate flash memory cell structure "Twin BiCS FLASH" using specially designed semicircular Floating Gate (FG) cells. Twin BiCS FLASH achieves superior program slope and a larger program/erase window at a much smaller cell size compared to conventional circular Charge Trap (CT) cells. These attributes make this new cell design a promising candidate to surpass four bits per cell (QLC) for significantly higher memory density and fewer stacking layers. This technology was announced at the IEEE International Electron Devices Meeting (IEDM) held in San Francisco, CA on December 11th.

3D flash memory technology has achieved high bit density with low cost per bit by increasing the number of cell stacked layers as well as by implementing multilayer stack deposition and high aspect ratio etching. In recent years, as the number of cell layers exceeds 100, managing the trade-offs among etch profile control, size uniformity and productivity is becoming increasingly challenging. To overcome this problem, Kioxia developed a new semicircular cell design by splitting the gate electrode in the conventional circular cell to reduce cell size compared to the conventional circular cell, enabling higher-density memory at a lower number of cell layers.

Intel RealSense Lidar Camera Technology Redefines Computer Vision

Today, Intel announced the Intel RealSense lidar camera L515, the world's smallest and most power-efficient, high-resolution lidar that captures millions of depth points per second. Designed with proprietary technology that creates entirely new ways to incorporate lidar into smart devices to perceive the world in 3D, the L515 provides high-quality performance and millimeter accuracy to products that require vision capabilities.

"Intel RealSense technology is used to develop products that enrich people's lives by enabling machines and devices to perceive the world in 3D. With the L515 depth camera, we are excited to bring high-resolution lidar performance to markets previously inaccessible to this technology."
-Sagi BenMoshe, corporate vice president, Intel RealSense Group

Crucial Intros 2 TB Version of its BX500 Series SATA SSD

Crucial has started shipping a 2 TB version of its famous, budget/minded BX500 Series of SATA SSDs. As pricing on NAND density has come down, it makes sense that budget solutions start to increase their capacities as well, since there is no longer a premium on new, advanced technologies. The Crucial BX500 2 TB model features the same 3D TLC NAND as the other capacities in Crucial's portfolio: 96-layer 3D TLC NAND flash memory mated to an SMI SM2258XT DRAM-less controller.

Since it maintains the communication protocol (SATA), and the hardware is virtually unchanged except for higher densities, don't expect improved performance: the 2 TB drive is still rated for up to 540 MB/s reads and up to 500 MB/s writes. Pricing is set at $214 (or €241) for the 2 TB model, which means price per GB stands at roughly $0.10.

Micron Brings 3D XPoint Technology to Market With the World's Fastest SSD

Micron Technology, Inc., today announced a breakthrough in nonvolatile memory technology with the introduction of the world's fastest SSD, the Micron X100 SSD. The Micron X100 SSD is the first solution in a family of products from Micron targeting storage- and memory-intensive applications for the data center. These solutions will leverage the strengths of 3D XPoint technology and usher in a new tier in the memory-to-storage hierarchy with higher capacity and persistence than DRAM, along with higher endurance and performance than NAND.

"Micron's innovative X100 product brings the disruptive potential of 3D XPoint technology to the data center, driving breakthrough performance improvements for applications and enabling entirely new use cases," said Micron Executive Vice President and Chief Business Officer Sumit Sadana. "Micron is the only vertically-integrated provider of DRAM, NAND and 3D XPoint solutions in the world, and this product continues the evolution of our portfolio towards higher value solutions that accelerate artificial intelligence capabilities, drive faster data analytics and create new insights for our customers."

Samsung Launches Sixth Generation 3D V-NAND SSDs

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing 250-gigabyte (GB) SATA solid state drive (SSD) that integrates the company's sixth-generation (1xx-layer) 256-gigabit (Gb) three-bit V-NAND for global PC OEMs. By launching a new generation of V-NAND in just 13 months, Samsung has reduced the mass production cycle by four months while securing the industry's highest performance, power efficiency and manufacturing productivity.

"By bringing cutting-edge 3D memory technology to volume production, we are able to introduce timely memory lineups that significantly raise the bar for speed and power efficiency," said Kye Hyun Kyung, executive vice president of Solution Product & Development at Samsung Electronics. "With faster development cycles for next-generation V-NAND products, we plan to rapidly expand the markets for our high-speed, high-capacity 512 Gb V-NAND-based solutions."

Epic Games Supports Blender Foundation with $1.2 million Epic MegaGrant

Epic Games, as part of the company's $100 million Epic MegaGrants program, is awarding the Blender Foundation $1.2 million in cash to further the success of Blender, the free and open source 3D creation suite that supports the full range of tools empowering artists to create 3D graphics, animation, special effects or games.

The Epic MegaGrants initiative is designed to assist game developers, enterprise professionals, media and entertainment creators, students, educators, and tool developers doing outstanding work with Unreal Engine or enhancing open-source capabilities for the 3D graphics community.

AMD Files a Patent for Cooling of 3D Stacked Memory

Scaling and manufacturing of ever shrinking semiconductor devices is becoming more challenging as smaller nodes are introduced. As we have approached 7 nanometers, economies of scale are becoming more influential than scales of manufacturing. For example, the development of the 7 nm node development cost more than 3 billion USD, while smaller nodes are expected to see that price cross the 5 billion USD mark. So given that we are approaching the limit where we can't squeeze more transistors in two-dimensional space without huge economical impact, we have to utilize another dimension in order to keep performance improvements coming.

AMD has filed a patent for cooling a 3D stacked memory with thermo-electric coolers - TECs, also known as Peltier devices. Being that TECs are made out of P-type and N-type semiconductors, they can easily be integrated into existing silicon manufacturing methods and controlled like a regular device. The process AMD has patented basically describes how to insert the TEC between memory and logic devices, where it draws heat from either logic or memory with each side being able to dissipate the heat. That effect is possible due to nature of TEC, where the direction of heat flow is changed inverting the voltage.

Kingston Introduces Next-Gen KC2000 NVMe PCIe SSD

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced KC2000, its next generation M.2 NVMe PCIe SSD for enterprise and power users. Kingston's KC2000 NVMe PCIe SSD delivers powerful performance using the latest Gen 3.0 x 4 controller and 96-layer 3D TLC NAND. Offering superior read and write speeds up to 3,200 and 2,200MB/s, respectively, KC2000 delivers outstanding performance and endurance, and improves workflow in desktop, workstations and high-performance computing (HPC) systems.

KC2000 is a self-encrypting drive that supports end-to-end data protection using 256-bit AES Hardware-based encryption and allows the usage of independent software vendors with TCG Opal 2.0 security management solutions such as Symantec , McAfee , WinMagic and others. KC2000 also has built-in Microsoft eDrive support, a security storage specification for use with BitLocker.

HTC Vive Pro Eye: Hands On with Hardware and Software

The Vive Cosmos was not the only major announcement coming out of HTC's Vive business unit at CES this year. While that has massive mainstream appeal, the company was quick to let us know that it was still to early to comment further than what has already been covered in the aforelinked news post. Instead, they invited us to their suite to take a closer look at the Vive Pro Eye- one of the few things that really stood out for us at the trade show.

The Vive Pro Eye is, as the name would suggest, a new SKU with integrated eye tracking in the Vive Pro HMD. Working together with Tobii, the Vive Pro Eye allows for a more natural control mechanism within VR via eye controls, which in turn means a revamped menu navigation system is possible. This allows for increased accessibility to end users with disability, more optimization on VR performance, and detailed analysis of VR experiences for both the client and the businesses alike. Read past the break for a breakdown of our experience with the Vive Pro Eye, and the various demos on hand to showcase the feature.

Sennheiser's AMBEO Soundbar will be available from May

Immersive 5.1.4 sound and deep bass that has to be heard to be believed: Sennheiser's new AMBEO Soundbar will be available from May. Created by the audio specialist to be one of the world's best soundbars, the AMBEO Soundbar places the listener inside the sound experience with incredible realism, delivering 3D sound that blurs the line between playback and reality from a single all-in-one device. Visitors to CES can experience the AMBEO Soundbar at the Sennheiser booth.

Sennheiser's soundbar has been developed under the audio specialist's AMBEO trademark. The AMBEO 3D audio technology program is dedicated to creating immersive audio solutions that deliver the ultimate in audio capture and reproduction to transform the way users experience content. Bringing this transformation to the living room, the AMBEO Soundbar is another milestone in the program. "We are thrilled to be introducing the AMBEO Soundbar as Sennheiser's first foray into the home entertainment speaker category. We have developed it with the ambition to create one of the best soundbars on the market - an elegant all-in-one solution for all those seeking an immersive 3D, audiophile-grade home entertainment experience," said Stephane Hareau, Global Head of Products - Consumer at Sennheiser.

Distributed GPU Rendering on the Blockchain is The New Normal, and It's Much Cheaper Than AWS

Otoy, based in Los Angeles, announced a few months ago the launch of RNDR, a cloud rendering platform that is based on the same blockchain used on the Ethereum platform. The idea is simple: it leverages a distributed network of idle GPUs to render graphics more quickly and efficiently.

The solution takes advantage of the unused power of our GPUs, and allows those who need to render images at full speed to do so through this platform. RNDR distributes the revenue through its own blockchain in a decentralized fashion, and in a recent survey of 1,200 of its contributors Otoy said it has the world's largest cloud rendering platform. One that has even been praised by Hollywood director and producer J.J. Abrams, founder of Brave and Basic Attention Token Brendan Eich, and famed talent agent Ari Emanuel.

Samsung Electronics Brings Next Wave of High-Performance Storage with Mass Production of Fifth-Generation V-NAND

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing its fifth-generation V-NAND memory chips with the fastest data transfers now available. In the industry's first use of the 'Toggle DDR 4.0' interface, the speed for transmitting data between storage and memory over Samsung's new 256-gigabit (Gb) V-NAND has reached 1.4-gigabits per second (Gbps), a 40-percent increase from its 64-layer predecessor.

The energy efficiency of Samsung's new V-NAND remains comparable to that of the 64-layer chip, primarily because the operating voltage has been reduced from 1.8 volts to 1.2 volts. The new V-NAND also has the fastest data write speed to date at 500-microseconds (μs), which represents about a 30-percent improvement over the write speed of the previous generation, while the response time to read-signals has been significantly reduced to 50μs.

Memblaze Launches New PBlaze5 Series NVMe SSDs

Beijing Memblaze Technology Co., Ltd. newly released high-performance PBlaze5 910/916 and low-power 510/516 series NVMe SSD. They adopt the 64-layer enterprise-level 3D-NAND and support NVMe standard protocol with a user capacity up to 15.36TB.

The PBlaze5 910/916 series NVMe SSD features 6GB/s sequential read bandwidth, 1 million IOPS read performance and 89/11microsecond read/write latency. With the high performance shared by PBlaze series products, PBlaze5 910/916 series boasts advanced features like High-speed TRIM and Multiple-namespace, with higher QoS and more flexible.

Corsair Launches MP300 Budget M.2 NVMe 3D TLC NAND SSD Series

Corsair today launched a new series of SSDs under their brand. The MP300 carry a more budget affiliation, offering a high-speed NVMe solution (which Corsair says is up to three times faster than SATA) for relatively low prices. Like other budget NVMe solutions, the Corsair MP300 runs on a PCIe 2x bus, instead of the higher performance 4x (which carries higher cost for the controllers, hence, the price savings).

With that bus, Corsair is quoting up to 1600 MB/s read speeds, and up to 1040 MB/s writes, which are still more than enough for mainstream workloads. The usage of 3D TLC NAND also helps in the cost savings, naturally - and doesn't carry the same performance and longevity issues as it may have had in its inception. Corsair is selling these drives at 120, 240, 480 and 960 GB capacities, at €59.99, €94.99, €154.99, and €314.99 respectively.

Marvell Launches New 88SS1084 and 88SS1100 NVMe SSD Controllers

Marvell, a leader in storage, networking and connectivity semiconductor solutions, today announced its latest NVM Express (NVMe ) solid-state drive (SSD) controller family for mainstream and high-performance PC client and edge computing SSDs. The Gen 3x4 PCIe SSD controllers, the 4-channel 88SS1084 and 8-channel 88SS1100, bring leading performance, endurance and reliability to the industry and will help broaden the adoption of NVMe SSDs across emerging client and edge computing applications. The controllers integrate Marvell's fourth generation of NANDEdge technology, offering the advanced error correction capabilities to address the increasing demands required to enable future SSD solutions with emerging 96-layer triple level-cell (TLC) and quad level-cell(QLC) NAND architectures.

As gaming, video-on-demand, CAD, imaging, photography and video surveillance proliferate and scale, NVMe SSDs can meet the increasing storage performance and capacity requirements that these end use applications seek. The new Marvell client NVMe SSD controller family can provide up to 3.6GB/s of bandwidth and up to 700,000 input output per second (IOPS). The 88SS1084 and 88SS1100 devices can save system power consumption by supporting lower voltage NAND devices and LPDDR4 DRAM components. These features enable PCs and edge computing devices to process and store increasingly data-intensive workloads more quickly and reliably.

Kingston Adds 2 TB Model to UV500 Series SSD Lineup

Kingston's UV500 family of SSDs debuted last April with capacities ranging from 120 GB all the way up to 960 GB. However, Kingston has decided to add a 2 TB model to the existing lineup due to increasing demands for higher capacity drives. Like its siblings, the 2 TB model also employs the Marvell 88SS1074 controller and 3D TLC NAND. It will also carry the same features like support for 256-bit AES hardware-based encryption and TCG Opal 2.0. While the 120 GB, 240 GB, and 480 GB models are available in 2.5-inch, M.2, and mSATA formats, the 2 TB model only comes in the 2.5-inch form factor. In terms of performance, the 2 TB variant delivers sequential read and write speeds up to 520 MB/s and 500MB/s, respectively. It also offers 4 KB random read performance up to 79,000 IOPS and 4 KB write performance up to 50,000 IOPS. Backed by a 5-year warranty, the UV500 2 TB SSD is priced at $695.50 according to Kingston's website.

3D Headphone Startup Shut Its Doors After Raising $3.2 Million in Crowdfunding

In the business world, companies fail all the time, and startups are no exception either. Ossic is the latest startup to make the headlines after announcing over the weekend that the company is shutting its door. The audio startup had successfully raised $3.2 million through Indiegogo and Kickstarter campaigns to produce their high-end "3D sound" Ossic X headphones. The headphones, which costed between $199 to $299, incorporated special head-tracking technology to deliver surround sound in VR environments. Apparently, they were also capable of determining the shape of the user's ears and customize the sound profile to match the user.

Ossic had received over 22,000 pre-orders over the company's life. Unfortunately, the company only managed to produce 250 pairs of their Ossic X headphones and delivered around a dozen of them to Kickstarters. As the well has run dry, Ossic has no other alternative but to cease operations. Kickstarter backers are extremely angry - and with right as they will not receive their headphones or refunds. A Facebook group with over 2,500 members threaten to pursue a class action lawsuit against the company.

Western Digital Introduces New Black 3D NVMe SSD

PC gaming is increasingly immersive, with richer and more intense visual content than ever before, and gamers are faced with making technology choices to maximize their experience. To push leading-edge performance, lower power consumption and extended durability for PC gaming systems, Western Digital Corporation today introduced a high-performance Western Digital Black 3D NVMe SSD featuring the company's own SSD architecture and controller. The drive accelerates data for PC applications to enable users to quickly, access, engage and capture today's high-resolution video, audio and gaming content.

With growing demand for rich content, PCs must have the capability to run intensive applications and enable the 4K/Ultra HD graphics and video content experiences. To move this immense amount of data quickly and seamlessly, Western Digital developed a new breed of SSDs to help remove the traditional storage bottleneck. This M.2 drive features a new NVMe architecture and controller, which optimally integrates with Western Digital 3D NAND. Western Digital's new vertically integrated SSD platform was engineered from the ground up, specifically architected to help maximize performance for NVMe SSDs, with advanced power management, durability and endurance for the growing range of applications benefiting from NVMe technology.

Nimbus Data Launches Their 100TB ExaDrive DC100 SSD

Nimbus Data, a pioneer in flash memory solutions, today announced the ExaDrive DC100, the largest capacity (100 terabytes) solid state drive (SSD) ever produced. Featuring more than 3x the capacity of the closest competitor, the ExaDrive DC100 also draws 85% less power per terabyte (TB). These innovations reduce total cost of ownership per terabyte by 42% compared to competing enterprise SSDs, helping accelerate flash memory adoption in both cloud infrastructure and edge computing.

"As flash memory prices decline, capacity, energy efficiency, and density will become the critical drivers of cost reduction and competitive advantage," stated Thomas Isakovich, CEO and founder of Nimbus Data. "The ExaDrive DC100 meets these challenges for both data center and edge applications, offering unmatched capacity in an ultra-low power design."

Western Digital Announces the PC SN720 and PC SN520 NVMe SSDs

Addressing the needs of a growing landscape of Internet of Things (IoT) and Fast Data applications at the edge, Western Digital Corporation today announced two new NVMe SSDs - Western Digital PC SN720 and Western Digital PC SN520 - powered by a new NVMe storage architecture, scalable for a range of emerging implementations, from IoT and edge computing to mobile computing systems.

The new Western Digital NVMe client architecture and product portfolio will enable manufacturers of IoT devices, computing devices such as thin and light, 2-in-1 and embedded PCs and monitoring systems to enable the capture and transformation of the massive quantities of data in real-time at the edge of smart city, smart home and personal data environments. Cisco GCI estimates that nearly 850 zettabytes (ZB) will be generated by all people, machines and things by 2021. With the advent of high-bandwidth technologies like 5G, augmented reality and facial recognition, new applications can benefit from the exceptional performance, power efficiency and capacity of NVMe and Western Digital 3D NAND to deliver an optimal user experience.

SK Hynix Ramps Up Enterprise SSDs with Its 72-Layer 512Gb 3D NAND Flash

SK Hynix Inc. today announced that the Company recently completed developing an enterprise SATA Solid State Drive (or 'eSSD'). With its 72-Layer 512Gb (Gigabits) 3D NAND Flash chips, the Company is paving the way for its full-fledged entrance to the high value-added eSSD market. SK Hynix combined the 72-Layer 512Gb 3D NAND Flash with its in-house firmware and controller to provide the maximum density of 4TB (Terabytes). SK Hynix makes the most of its 72-Layer 512Gb 3D NAND chips to double the biggest density of the SSD of the same size with 256Gb NAND chips.

A single 4TB SSD could contain 200 UHD (Ultra-HD) movies, each of which is generally as large as approximately 20GB (Gigabytes). The new eSSD supports sequential read and write speed of up to 560MB/s (Megabytes per second) and 515MB/s, respectively, and it can perform 98,000 random read IOPS (Input/Output operations per second) and 32,000 random write IOPS. SK Hynix also improved the read latency, which is of the utmost importance in eSSD performance. The Company is sampling the product to server and data center clients in the United States.
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