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TEAMGROUP Announces T-FORCE CARDEA Ceramic C440 M.2 PCIe 4.0 SSD

T-FORCE, the gaming brand of TEAMGROUP, today announces the new CARDEA Ceramic C440 Solid State Drive with latest and ultra-fast M.2 PCIe Gen4x4 interface. It is the first of its kind in the industry to be made with ceramic composite cooling materials, and obtained Taiwan Utility Model Patent (No. M595313). The snow-white ceramic has a unique texture, and the special aerospace ceramic can achieve excellent heat dissipation effect. Not only bringing a new color into the gaming world, it also unleashes an ultimate performance with read/write speed of 5,000/4,400 MB/s.

With NVMe 1.3 specification, T-FORCE CARDEA Ceramic C440 Solid State Drive creates a higher standard for M.2 solid state drive by using the latest, ultra-fast M.2 PCIe Gen4 x4 interface to achieve a sequential read/write speed of 5,000/4,400 MB/s. The use of aerospace ceramic composite cooling materials not only provides excellent heat dissipation, but also reduces heat by 18% when the case is equipped with a fan. At the same time, it is also lightweight and thin, anti-electromagnetic interference, high temperature resistant, extreme temperature shock resistant. Besides, it is made with environmentally friendly materials, which is RoHS compliant. The combination of CARDEA Ceramic C440's snow-white heat spreader and the golden T-FORCE displays a trendy style. It will be even more eye-catching if it is matched with a white motherboard and case. The thickness is only about 1 mm which perfectly showcase the aesthetics of thinness of T-FORCE CARDEA Ceramic.

Intel Announces "Copper Lake" 4P-8P Xeons, New Optane Memory, PCIe 4.0 SSDs, and FPGAs for AI

Intel today introduced its 3rd Gen Intel Xeon Scalable processors and additions to its hardware and software AI portfolio, enabling customers to accelerate the development and use of AI and analytics workloads running in data center, network and intelligent-edge environments. As the industry's first mainstream server processor with built-in bfloat16 support, Intel's new 3rd Gen Xeon Scalable processors makes artificial intelligence (AI) inference and training more widely deployable on general-purpose CPUs for applications that include image classification, recommendation engines, speech recognition and language modeling.

"The ability to rapidly deploy AI and data analytics is essential for today's businesses. We remain committed to enhancing built-in AI acceleration and software optimizations within the processor that powers the world's data center and edge solutions, as well as delivering an unmatched silicon foundation to unleash insight from data," said Lisa Spelman, Intel corporate vice president and general manager, Xeon and Memory Group.

Semiconductor Fabs to Log Record Spending of Nearly $68 Billion in 2021, SEMI Reports

2021 is poised to mark a banner year for global fab equipment spending with 24 percent growth to a record US$67.7 billion, 10 percent higher than the previously forecast US$65.7 billion, and all product segments promising solid growth rates, according to the second-quarter 2020 update of the SEMI World Fab Forecast report. Memory fabs will lead worldwide semiconductor segments with US$30 billion in equipment spending, while leading-edge logic and foundry is expected to rank second with US$29 billion in investments.

The 3D NAND memory subsegment will help power the spending spree with a 30 percent jump in investments this year before tacking on 17 percent growth in 2021. DRAM fab investments will surge 50 percent next year after declining 11 percent in 2020, and fab spending on logic and foundry, mainly leading edge, will trace a similar but more muted trajectory, rising 16 percent 2021 after an 11 percent drop this year.

Lexar Announces New Professional NM700 M.2 2280 PCIe Gen3x4 NVMe SSD

Lexar, a leading global brand of flash memory solutions, today announced the new Lexar Professional NM700 M.2 2280 PCIe Gen3 x4 NVMe SSD to its family line of SSD products. As the need for faster performance and uninterrupted application experiences increases, Lexar has developed a solution to keep videographers, photographers, and designers in the driver's seat with speeds of up 3500 MB/s read, and 2000 MB/s write. The NM700 is supported by PCIe Gen3 x4 NVMe and built with 3D NAND flash for higher capacity and more efficiency without unnecessary slowdowns.

"The Lexar Professional NM700 allows our high-intensive users to experience improved performance with speeds that will keep them in front of any task. This new SSD solidifies our commitment to improving our SSD portfolio and meets the demands of our customers' needs," said Joel Boquiren, Director of Global Marketing.
Lexar NM700

ADATA Launches Swordfish and Falcon NVMe SSDs for Creators

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories, today announces the launch of two new PCIe Gen 3 x4 M.2 2280 solid state drives (SSD), the ADATA FALCON and SWORDFISH. Both SSDs were designed with creators in mind and are built with 3D NAND Flash memory and support the PCIe Gen 3 x4 interface for excellent performance and reliability.

The ADATA FALCON SSD is made to help creators up their creative power. Using the PCIe Gen 3 x4 interface and equipped with 3D NAND Flash memory, the FALCON delivers read/write speed of up to 3100/1500 MB per second for uninterrupted productivity and creativity. With 3D NAND Flash, the FALCON features higher efficiency and increased reliability compared to 2D NAND SSDs. It comes in diverse capacities, ranging from 256 GB to 2 TB and features data protection and correction technologies to expand the lifespan of SSD. What's more, the FALCON sports intelligent SLC caching, host memory buffer, and random read/write of 180/180K IOPS to give creators seamless performance for creating. The FALCON also comes with a stylish aluminium alloy heatsink for heat dissipation.

Micron Delivers Client NVMe Performance and Value SSDs With Industry-Leading Capacity Sizes and QLC NAND

Micron Technology, Inc., today announced new client solid-state drives (SSDs) that bring NVMe performance to client computing applications, freeing laptops, workstations and other portables from legacy architectures that can rob devices of battery power, performance and productivity. The Micron 2300 SSD combines the power and density needed to drive compute-heavy applications in a compact form factor with the reduced power consumption modern mobile users demand. For the first time, Micron brings together NVMe performance and low-cost quad-level-cell (QLC) NAND in the Micron 2210 QLC SSD. It combines fast NVMe throughput and Micron's leadership in QLC technology to offer flash capabilities at hard disk drive-like price points while reducing power consumption by 15 times when compared to hard drives.
Micron 2300 NVMe SSD

ADATA Announces the Falcon M.2 NVMe PCIe Gen 3 SSDs

ADATA today announced the Falcon line of SSDs in the M.2-2280 form-factor, with NVMe 1.3 protocol support, leveraging PCI-Express 3.0 x4 host interface. The drives are characterized by an aluminium heatspreader on top of the NAND flash chips and controller, which isn't just an adhesive metal peal, but a 1 mm-thick metal plate. The Falcon comes in capacities of 256 GB, 512 GB, 1 TB, and 2 TB; and uses 3D NAND flash memory (likely QLC).

The ADATA Falcon offers sequential speeds of up to 3,100 MB/s reads, with up to 1,500 MB/s writes; and up to 180,000 IOPS 4K random access. The 2 TB variant offers 1,200 TBW endurance, the 1 TB variant offers 600 TBW, the 512 GB variant 300 TBW, and the 256 GB variant 150 TBW. ADATA is backing the drives with a 5-year warranty. The company didn't reveal pricing.
ADATA Falcon

Intel Ready with 144-layer 3D NAND On its Own, Talks 4-layer 3DXP, "Alder Stream" and "Keystone Harbor"

Intel's memory and storage products division now has a completely independent NAND flash technology development team post its split with Micron Technology, with which it was part of the IMFlash Technologies joint-venture. Intel is close to gaining a technological lead over Micron with a new 144-layer 3D NAND flash chip which will ship roughly around the time Micron begins pushing out its 128-layer 3D NAND chips. SK Hynix will begin shipping its 128-layer 3D NAND flash chips later this year. KIOXIA will put out 112-layer chips before the turn of the year. YMTC is developing its portfolio at a breakneck pace.

The 144-layer 3D NAND flash chip by Intel can handle up to four bits per cell (QLC), and can be configured to function as TLC or SLC, at lower densities. Intel will launch its first SSD based on this 144-layer QLC NAND flash chip, codenamed "Keystone Harbor," later this year. Development is underway at Intel for PLC (5 bits per cell) technology, which should drive up densities by 25 percent. Intel is also close to launching its second generation 3D X-point memory technology.

ADATA Launches Ultimate SU720 SSD With Up To 1 TB Capacity

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash products, today announces the launch of the ADATA Ultimate SU720 SATA 6 Gb/s solid state drive (SSD). An ideal offering for those looking to make the switch to SSDs, the SU720 offers great performance and reliability at an amazing value. Equipped with 3D NAND memory and intelligent SLC caching, the SU720 reaches read/write speeds of up to 520/450 MB per second.

SK hynix to Commence Mass-Production of 128-layer NAND Flash in Q2

SK hynix, in its Q1-2020 financial results commentary, confirmed that the company will commence mass-production of its next-generation 128-layer 3D NAND flash memory within Q2-2020 (before July). This would mark the company's transition from 96-layer 3D NAND flash, which formed the bulk of the company's NAND flash output through 2019. SK hynix is developing 128-layer 3D NAND flash chips in both TLC and QLC offerings. The company also mentioned that in Q2, it could diversify its portfolio of PCIe (NVMe) SSDs covering more markets and form-factors.

Crucial Unveils the P5 High-Performance M.2 NVMe SSDs

Crucial is expanding its P-series M.2 NVMe SSD lineup with the introduction of the P5. Available in capacities of 250 GB, 500 GB, 1 TB, and 2 TB, and built in the M.2-2280 form-factor, the drives are still based on PCI-Express gen 3.0 x4 host interface with NVMe 1.3. The P5 implements a DRAM-cache cushioned controller, and 3D TLC NAND flash memory.

Performance on offer includes sequential read speeds of up to 3,400 MB/s, and sequential write speeds of up to 3,000 MB/s (up to 1,400 MB/s writes for the 250 GB model), while Crucial rates endurance (TBW) at 150 TBW for the 250 GB model, 300 TBW for the 500 GB model, 600 TBW for 1 TB, and 1.2 PBW for the 2 TB model. The performance numbers are a class above the P2 or P1 mid-range drives. The drives are backed by 5-year warranties. The company didn't reveal pricing.
Crucial P5 Crucial P5 Crucial P5 Crucial P5
Many Thanks to TheLostSwede for the tip.

Samsung Developing 160-layer 3D NAND Flash Memory

Samsung Electronics is reportedly developing its 7th generation V-NAND memory with ultra-high 3D stacking technology. The first model will feature at least 160 layers, subsequent models will feature more. In early signs of the company not wanting to yield the technological initiative to China's YMTC, the first 160-layer V-NAND by Samsung is slated to come out roughly around the time YMTC's 128-layer 3D NAND flash hits mass production, towards the end of 2020.

At the heart of the ultra-high 3D stack is Samsung's proprietary Double Stack technology. The double-stack technology creates electron holes at two separate times for current to go through circuits. The current-generation single-stack chips creates these holes once throughout the stack per cycle. The 160-layer NAND flash is expected to herald a 67% increase in densities per package over the 96-layer chips in the market. Densities could also be increased by other means such as switching to newer semiconductor fabrication nodes, and PLC (5 bits per cell), which is currently being developed by KIOXIA.

Silicon Power Releases Its Thinnest Portable SSD Yet: The PC60

Portable SSDs should be just that: portable. If you're looking for a reliable way to offload lots of footage from your DSLR or drone and more while on-the-go to keep it in safe hands, look no further than our new PC60. It strikes the right balance between size, performance, and design.

At just 80 mm square, the PC60 is one of our most portable-friendly portable SSDs yet. It fits snugly in the palm of a hand and comfortably slides into a pocket, unnoticed, thanks to its slim 11 mm profile. It's also surprisingly lightweight. The shock-resistant structure, which can withstand minor drops and bumps, and the convenient keyhole design, which allows it to easily attach to keychains or bags, both complement its intent to be an on-the-go back-up storage solution.

YMTC Launches 128-layer 3D NAND Flash Memory Chip

Mainland Chinese semiconductor firm Yangtze Memory Technologies Co (YMTC) formally launched a product that could serve as a technological milestone for the company, a 128-layer 3D QLC NAND flash memory chip. Carrying the product naming series "X2-6070," the chip implements YMTC's XTracking 2.0 memory stacking architecture. This is a particularly big development for the company considering the chip's immediate predecessor is a 64-layer chip based on XTracking 1.0, which entered mass-production as recently as in September 2019, a time when most foreign firms such as Samsung, SK Hynix, and Micron, had moved on to 96-layer mass-production, having announced their 128-layer designs around June 2019. YMTC hence appears to have pole-vaulted 96-layer.

"With the launch of Xtacking 2.0, YMTC is now capable of building a new business ecosystem where our partners can play to their strengths and we can achieve mutually beneficial results," said Grace Gong SVP of sales and marketing at YMTC. "This product will first be applied to consumer-grade solid-state drives and will eventually be extended into enterprise-class servers and data centers in order to meet the diverse data storage needs of the 5G and AI era," Gong added. YMTC, part of the state-owned conglomerate Tsinghua Unigroup, is one of the dozens of beneficiaries of the Chinese government's initiative of localizing cutting-edge electronics technology, and reducing reliance on foreign hardware.

KINGMAX Announces PX4480 M.2 NVMe PCIe Gen 4 x4 SSD Series

KINGMAX Semiconductor Inc., a global leading provider of memory products, is proud to announce today the launch of its M.2 2280 PCIe 4.0x4 (Gen 4 x4) SSD PX3480 solid-state drive. As SSD plays a leading role in the current era, an ultra-slim, ultra-fast M.2 specification SSD has attracted customers' attention. KINGMAX's latest Gen 4 x4 SSD PX4480 is suitable for the AMD Ryzen 3000 series processor with X570 chipset. The new SSD not only offers wide-ranging capacity choices of up to 500 GB /1 TB / 2 TB but also has read speeds up to 5000 MB/s, surpassing other SSD products available on the market. It is recommended to the video editors, graphic designers, gaming enthusiasts and anyone who are trying to process data or media contents faster.

The M.2 2280 SSD is ultra-slim. Moreover, the M.2 interface has become a must-have for new motherboards or laptops that offers users an even faster SSD experience. KINGMAX's latest M.2 PCIe Gen 4 x4 SSD PX4480 adopts a PCIe Gen 4.0 high-speed interface and meets NVMe 1.3 specifications. It can deliver stunning read/write speeds. It features incredibly high R/W speeds of up to 5,000 MB/s (read) and 4,400 MB/s (write), 8 to 9 times faster than the transmission connector of the SATA III interface, and has an increase of 50% in data R/W speeds compared with the PCIe 3.0 series SSD. Users can fully experience the higher speeds of PCIe SSDs when turning on devices, loading games, and transferring or saving data.
Kingmax PX4480 SSD

Greenliant Ships Industrial Temperature 2TB NVMe and SATA M.2 ArmourDrive SSDs

Greenliant has started volume production of its industrial temperature (-40°C to +85°C) 2 Terabyte NVMe and SATA M.2 ArmourDrive solid state drive (SSD) modules. Built in the 2280 form factor, and offered with hardware encryption and on-board DRAM, these high-performance SSDs save space, improve security and increase capacity for a wide variety of applications, including video conferencing, in-flight entertainment and data logging.

"Customers rely on our wide and deep selection of quality solid state storage products, and Greenliant is pleased to be one of the first companies to offer I-temp 2 Terabyte M.2 SSDs for industrial applications that require higher capacities," said Arthur Kroyan, vice president of business development and marketing, Greenliant. "With on-board DRAM and advanced security features, these products deliver consistent sustained performance and strong user data protection, which can be important advantages for certain embedded systems."

Micron Samples the Industry's First uMCP Product With LPDDR5 to Increase Performance and Battery Life in 5G Smartphones

Micron Technology, Inc., today announced it began sampling the industry's first universal flash storage (UFS) multichip package (uMCP) with low-power DDR5 (LPDDR5) DRAM. The uMCP provides high-density and low-power storage designed to fit on slim and compact midrange smartphone designs.

Micron's new uMCP5 packaging builds on the company's innovation and leadership in multichip form factors. Micron uMCPs combine low-power DRAM with NAND and an onboard controller, using 40% less space compared to a two-chip solution. This optimized configuration saves power, reduces memory footprint and enables smaller and more agile smartphone designs.
RAM Production

Driven by Strong Demand from Data Center Clients, 4Q19 NAND Flash Revenue Grows 8.5%, Says TrendForce

According to the DRAMeXchange research division of TrendForce, 4Q19 NAND flash bit shipment increased by nearly 10% QoQ thanks to demand growth from data center clients. On the supply side, contract prices made a successful rebound due to shortages caused by the power outage at Kioxia's Yokkaichi production base in June. In sum, 4Q19 NAND flash revenue reached $12.5 billion, an 8.5% increase QoQ.

The stronger-than-expected 4Q19 performance from the demand side helped improve supplier inventory back to normal levels. In response, NAND suppliers were able to reduce their allocations to the wafer market and instead focus on shipping products with comparatively higher margins.

Quick Look: Hawk Security S-Drive

Continuing our quick look series, this time we cover a product that came to us after our article on portable encrypted storage was published. That very article came about from two companies asking us if we would be interested in checking out their products, and when a startup company formed by Russians who specialize in data protection and embedded security asks you the same, you answer yes! Hawk Security was set up in 2018, and is actually based out of Hong Kong now, and offers data encryption solutions with military-grade encryption standards. They sent out their S-Drive, a portable solution with a 3D NAND-based memory and certification galore, with performance and privacy as the selling point.

The Hawk Security S-Drive ships in a thick cardboard box with a two-piece packaging, with aptly named security seals on the sides. The inner box slides out to reveal a premium unboxing experience with thick foam cut to shape, which in turn houses the user manual, the drive, and the connecting cable itself. The manual is handy for not only knowing the locking and unlocking procedures for this encrypted drive, but also the default password for using it the first time. The cable terminates in a standard USB 3.1 Gen 1 Type A connector on one end, but a 10-pin USB 3.1 Gen 1 Micro Type B super-speed connector on the other to help make the most of connection speeds. This means backwards compatibility with USB 2.0 ports is restricted to USB ports/hubs that provide enough power only, so keep that in mind. Read past the break for more on the drive.

Intel Builds 10 million QLC 3D NAND Solid-State Drives

Last week, Intel's memory and storage group produced Intel QLC 3D NAND solid-state drive (SSD) number 10 million based upon the QLC NAND die built in Dalian, China. Production began in late 2018, and this milestone establishes QLC (quadruple-level cell memory) as a mainstream technology for high-capacity drives.

"Many have talked about QLC technology, but Intel has shipped it, and at scale," said Dave Lundell, director of Client SSD Strategic Planning and Product Marketing at Intel. "We have seen strong demand for the cost-effective capacity of our standalone QLC SSD (Intel SSD 660p) and the performance of our Intel Optane Technology + QLC solution (Intel Optane Memory H10)."

Transcend Announces JetFlash 910 High-Endurance USB Flash Drive

Transcend Information Inc. (Transcend ), a leading manufacturer of storage and multimedia products, is proud to present the market-redefining JetFlash 910, a USB flash drive that packs incredible performance and endurance into a compact USB form factor. The flash drive utilizes the latest 3D NAND technology for up to 420 MB/s and 400 MB/s read and write speeds and an excellent endurance level of 3,000 P/E cycles - the equivalent of MLC NAND flash. With capacities up to 256 GB, the JetFlash 910 is ideal for storing a trove of 4K videos and high-resolution images, transferring them in a flash. Housed in lightweight aluminium with a sandblasted finish for extra durability and a sleek look, the JetFlash 910 takes the USB storage experience to a brand new level.

At 10 times the lifespan of a regular TLC flash drive, the JetFlash 910 offers superior and persistent protection of key data, making it great everyday carry for work and life. Having a high endurance rating also makes the JetFlash 910 well-suited for write-intensive applications, such as dashcams or surveillance systems. The aluminium metallic housing makes the USB flash drive less prone to wear, while gracing it with an extra touch of sleekness.

BIOSTAR Rolls Out M700 Series M.2 NVMe SSDs

BIOSTAR today rolled out the M700 line of SSDs in the M.2-2280 form-factor with PCI-Express 3.0 x4 interface, taking advantage of the NVMe 1.3 protocol. The drive combines a Silicon Motion SM2263XT DRAM-less controller with 3D NAND flash, and comes in 256 GB and 512 GB capacities. The 256 GB model offers sequential transfer speeds of up to 1,850 MB/s reads with up to 950 MB/s writes, while the 512 GB model offers up to 2,000 MB/s reads, with up to 1,600 MB/s writes. The controller features native AES 256-bit encryption. The company didn't reveal pricing.

ADATA Launches IM2P33E8 PCIe Gen3x4 M.2 2280 SSD

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories is pleased to announce the launch of the ADATA IM2P33E8 PCIe Gen3 x4 M.2 2280 SSD. Designed with 5G networking, cloud computing, AI, and IoT in mind, the SSD sports excellent performance, large storage capacities, wide-temperature resistance (-40°C-85°C), and security features. These capabilities combine to offer an ideal solution for applications such as data centers, surveillance, and transportation.

The IM2P33E8 PCIe Gen3 x4 M.2 2280 SSD is NVMe 1.3-compliant and delivers read/write speeds of up to 3500/3200 GB per second, making it up to six times faster than standard SATA III SSDs. It is equipped with 3D NAND Flash memory and comes with storage capacities ranging from 256 GB to 2 TB. It is available in normal-temperature (0°C to 70°C) and wide-temperature (-40°C to 85°C) variants. For enhanced security, integrity, and durability the IM2P33E8 features E2E (End-to-End) Data Protection and RAID Engine. What's more, the IM2P33E8 utilizes AES and TCG Opal encryption to keep confidential data away from prying eyes.

WD Introduces Storage Optimized for Public Safety, AI and Smart City Deployments

Western Digital Corp., today addressed head-on the need to optimize storage for video and AI analytics at the network edge. The increased use of smart cameras and ever-rising video resolutions are driving the requirement for on-camera storage. Western Digital introduced the WD Purple SC QD101 Ultra Endurance microSD card designed specifically for equipment makers, resellers and installers in the mainstream security camera market. In addition, the company announced a compelling new addition to the hard disk drive portfolio, WD Purple 14 TB HDD for surveillance, which is compatible with wide range of security systems.

According to IHS Markit Technology, global professional video surveillance camera shipments are expected to grow from 140 million to 224 million between 2018 and 2023, and those with onboard storage are expected to grow by an average of approximately 17 percent per year. 4K-compliant cameras are expected to grow from 3.6 percent of all network cameras shipped in 2018 to over 24 percent by 2023, and the up to 5.7X increase in bits generated by 4K vs.1080p video illustrates a fast-growing demand for more storage.

Micron Tapes Out 128-layer 3D NAND Flash Memory

Micron Technology has taped out its 4th generation 3D NAND flash memory with 128 layers. This paves the way for mass production and product implementations in 2020. The 4th gen 3D NAND by Micron continues to use a CMOS-under-array design, but with Replacement Gate (RG) Technology instead of Floating Gate, which Micron and the erstwhile IMFlash Technology had been using for years. Micron is currently mass-producing 96-layer 3D NAND flash, and TLC remains the prominent data-storage physical layer despite the advent of QLC (4 bits per cell).

Micron comments that this 4th gen 128-layer 3D NAND will be a stopgap restricted to a select few applications, and may not see the kind of adoption as its current 96-layer chips. The company appears to be more focused on its evolution, possibly the 5th generation 3D NAND, which are expected to bring tangible cost-per-bit gains for the company, as it transitions to a newer silicon fabrication node, and implements even newer technologies besides RG. "We achieved our first yielding dies using replacement gate or "RG" for short. This milestone further reduces the risk for our RG transition. As a reminder, our first RG node will be 128 layers and will be used for a select set of products. We don't expect RG to deliver meaningful cost reductions until FY2021 when our second-generation RG node is broadly deployed. Consequently, we are expecting minimal cost reductions in NAND in FY2020. Our RG production deployment approach will optimize the ROI of our NAND capital investments," said Sanjay Mehrotra, CEO and president of Micron.
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