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China Forecast to Represent 22% of the Foundry Market in 2020, says IC Insights

IC Insights recently released its September Update to the 2020 McClean Report that presented the second of a two-part analysis on the global IC foundry industry and included a look at the pure-play foundry market by region.

China was responsible for essentially all of the total pure-play foundry market increase in 2018. In 2019, the U.S./China trade war slowed China's economic growth but its foundry marketshare still increased by two percentage points to 21%. Moreover, despite the Covid-19 shutdown of China's economy earlier this year, China's share of the pure-play foundry market is forecast to be 22% in 2020, 17 percentage points greater than it registered in 2010 (Figure 1).

Rambus Advances HBM2E Performance to 4.0 Gbps for AI/ML Training Applications

Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip provider making data faster and safer, today announced it has achieved a record 4 Gbps performance with the Rambus HBM2E memory interface solution consisting of a fully-integrated PHY and controller. Paired with the industry's fastest HBM2E DRAM from SK hynix operating at 3.6 Gbps, the solution can deliver 460 GB/s of bandwidth from a single HBM2E device. This performance meets the terabyte-scale bandwidth needs of accelerators targeting the most demanding AI/ML training and high-performance computing (HPC) applications.

"With this achievement by Rambus, designers of AI and HPC systems can now implement systems using the world's fastest HBM2E DRAM running at 3.6 Gbps from SK hynix," said Uksong Kang, vice president of product planning at SK hynix. "In July, we announced full-scale mass-production of HBM2E for state-of-the-art computing applications demanding the highest bandwidth available."

TSMC Details 3nm N3, 5nm N5, and 3DFabric Technology

TSMC on Monday kicked off a virtual tech symposium, where it announced its new 12 nm N12e node for IoT edge devices, announced the new 3DFabric Technology, and detailed progress on its upcoming 5 nm N5 and 3 nm N3 silicon fabrication nodes. The company maintains that the N5 (5 nm) node offers the benefits of a full node uplift over its current-gen N7 (7 nm), which recently clocked over 1 billion chips shipped. The N5 node incorporates EUV lithography more extensively than N6/N7+, and in comparison to N7 offers 30% better power at the same performance, 15% more performance at the same power, and an 80% increase in logic density. The company has commenced high-volume manufacturing on this node.

2021 will see the introduction and ramp-up of the N5P node, an enhancement of the 5 nm N5 node, offering a 10% improvement in power at the same performance, or 5% increase in performance at the same power. A nodelet of the N5 family of nodes, called N4, could see risk production in Q4 2021. The N4 node is advertised as "4 nm," although the company didn't get into its iso-power/iso-performance specifics over the N5 node. The next major node for TSMC will be the 3 nm N3 node, with massive 25%-30% improvement in power at the same performance, or 10%-15% improvement in performance at same power, compared to N5. It also offers a 70% logic density gain over N5. 3DFabric technology is a new umbrella term for TSMC's CoWoS (chip on wafer on substrate), CoW (chip on wafer), and WoW (wafer on wafer) 3-D packaging innovations, with which it plans to offer packaging innovations that compete with Intel's various new 3D chip packaging technologies on the anvil.

TSMC Ships its 1 Billionth 7nm Chip

In a bid to show off its volume production prowess and technological edge (but mostly to rub it in to rival fabs), TSMC on Thursday announced that it shipped its 1 billionth chip fabricated on its 7 nm process. If these dies were combined into one big rectangular wafer, they would cover 13 New York City blocks. TSMC's 7 nm process debuted with its N7 node, which went into volume production in April 2018, over two years ago. The fab has since mass-produced 7 nm chips for the likes of Qualcomm, Apple, and AMD, among dozens of other clients. The company now looks to monetize refinements of N7, namely the N7e and N7P (DUV refinements), while executing its crucial EUV-based N7+ node, leading up to future nodelets such as N6. Much of TSMC's growth will be propelled by 5G modems, application processors, and its pivotal role in the growth of companies such as AMD.

MediaTek Introduces Dimensity 800U 5G SoC

MediaTek today announced its newest 5G SoC, the Dimensity 800U, as the latest addition in MediaTek's Dimensity series family. The 7 nm Dimensity 800U chipset is designed for multi-core high performance and leading 5G+5G Dual Sim Dual Standby (DSDS) technology. With Dimensity 800U MediaTek continues to accelerate the rollout of 5G technology and deliver premium experiences on mid-tier 5G smartphones.

"MediaTek has always focused on enhancing the user experience with our leading semiconductor technology, whether consumers are streaming, gaming or taking photos," said Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications Business Unit. "MediaTek's Dimensity 800U brings cutting-edge, next-gen technology to the Dimensity SoC series, bringing MediaTek's advanced 5G, imaging and multimedia technologies to high-performance 5G smartphones that deliver incredible 5G experiences."

Intel to Detail Xe Graphics on August 13

Intel is expected to reveal technical details of its upcoming Xe graphics architecture on August 13, according to a tweet by Intel Graphics that has since been deleted. Tom's Hardware believes the reveal is still on the cards. "You've waited. You've wondered. We'll deliver. In 20 days, expect more details on Xe graphics," the tweet read. Senior Fellow and Director of Graphics Architecture at Intel, David Blythe is expected to present a technical brief on the Xe graphics architecture at a Hot Chips 2020 virtual event on August 17.

These technical reveals are closely timed with the launch of "Tiger Lake," Intel's first commercial debut of Xe as an iGPU solution the chipmaker refers to as "Gen12" for consistency with older generations of integrated graphics. Xe is far from designed for just iGPU or small dGPUs, with the architecture being scalable all the way up to large scalar compute processors the size of beer mug coasters. Even as an iGPU, Xe is formidable, as it was recently shown playing AAA games by itself. Recent commentary from Intel at its Q2 2020 financial results provided strong hints of Xe dGPUs being de-coupled from Intel's foundry woes, and possibly headed for third-party foundries such as Samsung or TSMC.

Intel 7nm CPUs Delayed by a Year, Alder Lake in 2H-2021, Other Commentary from Intel Management

Intel's silicon fabrication woes refuse to torment the company's product roadmaps, with the company disclosing in its Q2-2020 financial results release that the company's first CPUs built on the 7 nanometer silicon fabrication node are delayed by a year due to a further 6-month delay from prior expectations. The company will focus on getting its 10 nm node up to scale in the meantime.

The company mentioned that the 10 nm "Tiger Lake" mobile processor and "Ice Lake-SP" enterprise processor remains on-track for 2020. The company's 12th Generation Core "Alder Lake-S" desktop processors won't arrive before the second half of 2021. In the meantime, Intel will launch its 11th Gen Core "Rocket Lake" processor on the 14 nm node, but with increased IPC from the new "Cypress Cove" CPU cores. Also in 2H-2021, the company will launch its "Sapphire Rapids" enterprise processors that come with next-gen connectivity and updated CPU cores.
Intel 7 nanometer delay

New AMD Radeon Pro 5600M Mobile GPU Brings Desktop-Class Graphics Performance and Enhanced Power Efficiency to 16-inch MacBook Pro

AMD today announced availability of the new AMD Radeon Pro 5600M mobile GPU for the 16-inch MacBook Pro. Designed to deliver desktop-class graphics performance in an efficient mobile form factor, this new GPU powers computationally heavy workloads, enabling pro users to maximize productivity while on-the-go.

The AMD Radeon Pro 5600M GPU is built upon industry-leading 7 nm process technology and advanced AMD RDNA architecture to power a diverse range of pro applications, including video editing, color grading, application development, game creation and more. With 40 compute units and 8 GB of ultra-fast, low-power High Bandwidth Memory (HBM2), the AMD Radeon Pro 5600M GPU delivers superfast performance and excellent power efficiency in a single GPU package.

Samsung Expands its Foundry Capacity with A New Production Line in Pyeongtaek

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced plans to boost its foundry capacity at the company's new production line in Pyeongtaek, Korea, to meet growing global demand for cutting-edge extreme ultraviolet (EUV) solutions.

The new foundry line, which will focus on EUV-based 5 nanometer (nm) and below process technology, has just commenced construction this month and is expected to be in full operation in the second half of 2021. It will play a pivotal role as Samsung aims to expand the use of state-of-the-art process technologies across a myriad of current and next generation applications, including 5G, high-performance computing (HPC) and artificial intelligence (AI).

Lenovo Announces ThinkPad Laptops Powered by AMD Ryzen PRO 4000

Today, Lenovo announced the new ThinkPad E14 and E15 with up to AMD Ryzen 7 4700U processors with Radeon Graphics bringing an improved design, higher performance and enhanced productivity features for SMB customers. Also, selected ThinkPad T, X and L series powered by AMD Ryzen PRO 4000 Series Mobile Processors announced in February are coming very soon. Delivering smarter IT innovations for better user experiences, the latest ThinkPad models meet today's increasing remote working needs.

Engineered for effortless productivity virtually anywhere, the new ThinkPad E14 and E15 offers a smart choice for SMB decision makers. An updated design with an improved screen to body ratio of 85%, the E series also offers the security and durability needed in a changing world. Innovative security features are provided on ThinkPad E series for the first time, including a touch fingerprint reader and an optional IR camera with Glance by Mirametrix technology. The touch fingerprint reader integrated into the power button offers one touch power and logon. The software-enabled Glance feature responds to users' presence, automatically locking the laptop when the user steps away, and also offers a Snap Window and Smart Pointer function for multi display setups.

TSMC Secures Orders from NVIDIA for 7nm and 5nm Chips

TSMC has reportedly secured orders from NVIDIA for chips based on its 7 nm and 5 nm silicon fabrication nodes, sources tell DigiTimes. If true, it could confirm rumors of NVIDIA splitting its next-generation GPU manufacturing between TSMC and Samsung. The Korean semiconductor giant is commencing 5 nm EUV mass production within Q2-2020, and NVIDIA is expected to be one of its customers. NVIDIA is expected to shed light on its next-gen graphics architecture at the GTC 2020 online event held later this month. With its "Turing" architecture approaching six quarters of market presence, it's likely that the decks are being cleared for a new architecture not just in HPC/AI compute product segment, but also GeForce and Quadro consumer graphics cards. Splitting manufacturing between TSMC and Samsung would help NVIDIA disperse any yield issue arriving from either foundry's EUV node, and give it greater bargaining power with both.

SMIC 7nm-class N+1 Foundry Node Going Live by Q4-2020

China's state-backed SMIC (Semiconductor Manufacturing International Corporation) has set an ambitious target of Q4-2020 for its 7 nanometer-class N+1 foundry node to go live, achieving "small scale production," according to a cnTechPost report. The company has a lot of weight on its shoulders as geopolitical hostility between the U.S. and China threatens to derail the country's plans to dominate 5G technology markets around the world. The SMIC N+1 node is designed to improve performance by 20%, reduce chip power consumption by 57%, reduce logic area by 63%, and reduce SoC area by 55%, in comparison to the SMIC's 14 nm FinFET node, Chinese press reports citing a statement from SMIC's co-CEO Dr. Liang Mengsong.

Dr. Liang confirmed that the N+1 7 nm node and its immediate successor will not use EUV lithography. N+1 will receive a refinement in the form of N+2, with modest chip power consumption improvement goals compared to N+1. This is similar to SMIC's 12 nm FinFET node being a refinement of its 14 nm FinFET node. Later down its lifecycle, once the company has got a handle of its EUV lithography equipment, N+2 could receive various photomasks, including a switch to EUV at scale.

TSMC N5P 5nm Node Offers 84-87% Transistor Density Gain Over Current 7nm Node

A WikiChip analysis of TSMC's next-generation 5 nanometer N5P silicon fabrication node estimates a massive 84-87% increase in transistor densities on offer compared to the company's first commercial 7 nm-class node, the N7 (7 nm DUV). The report estimates an 87% transistor-density increase, even though TSMC's own figure is slightly modest, at 84%. TSMC N5P node is expected to commence production later this year. Its precursor, TSMC N5, began risk production earlier this year, with production on the node commencing in April or May, unless derailed by the COVID-19 pandemic. The N5P node provides transistor densities of an estimated 171.3 million transistors per mm² die area, compared to 91.2 mTr/mm² of N7. Apple is expected to be the node's biggest customer in 2020, with the company building its A14-series SoC on it.

Xbox Series X Semi-custom SoC Features 320-bit Memory Interface, 10 GB or 20 GB Memory

Microsoft's upcoming Xbox Series X entertainment system is shaping up to be a technological monstrosity. Xbox group head at Microsoft, Phil Spencer, last revealed a picture of its semi-custom SoC back in January, by setting it as his Twitter display picture. Over the following weeks, many more technical details, such as the chip's 12 TFLOP/s combined compute power, would be let out. Spencer updated his display picture revealing a segment of the Xbox Series X mainboard with the SoC and memory chips surrounding it. The picture reveals the large SoC package in the center, surrounded on three sides by ten memory chips, possibly GDDR6, each with its own wiring to the SoC. This indicates that the SoC features a 320-bit wide memory interface.

As for the memory density, there's no way to tell. It could be 10 GB if those are 8 Gbit memory chips, or 20 GB if those are 16 Gbit. It boils down to which device the Xbox Series X the company wants to succeed. The Xbox One S features 8 GB of DDR3, while the spruced up Xbox One X features 12 GB of GDDR5. If the new Xbox Series X succeeds the latter, then it could very well feature 20 GB, more so given Microsoft's lofty design goals (4K UHD gaming with real-time ray-tracing). Microsoft leverages hUMA to use a common memory pool for both the CPU and GPU. Designed in collaboration with AMD on a TSMC 7 nm-class node (likely the N7P), the SoC features "Zen 2" CPU cores, and a GPU based on the RDNA2 graphics architecture.
Xbox Series X memory

Xbox Head Posts "Project Scarlett" (Xbox Series X) SoC Picture, Has that 7nm Tinge

Phil Spencer, head of the Xbox division at Microsoft, posted a picture of the semi-custom SoC at the heart of the company's upcoming "Project Scarlett" Xbox Series X game console as his Twitter avatar. The picture reveals a chip that looks visibly similar to that of "Project Scorpio" (Xbox One X). The picture was also taken from an angle that reveals the pinkish/auburn tinge of 7 nm AMD chips made at TSMC. You'll find the same tinge on chips such as "Navi 10" when viewed from an angle. The die unabashedly bears the "Project Scarlett" and "8K" markings.

Next-generation game consoles are marketing 4K 60 Hz and 8K gaming capability. They likely use a combination of dynamic resolution-scale and variable rate shading to achieve this. The "Project Scarlett" SoC is a semi-custom chip co-designed by Microsoft and AMD, and uses CPU cores based on the company's "Zen 2" microarchitecture, combined with a powerful GPU based on RDNA2, which features hardware-accelerated ray-tracing and variable-rate shading. Hardware enthusiasts on Twitter are abuzz with estimating the die-size of the SoC, with calculations pinning it around the 350 mm² mark ±10 mm², or roughly similar to that of "Project Scorpio," but one must factor in the switch to 7 nm from 16 nm significantly increasing transistor-density.

AMD to Outpace Apple as TSMC's Biggest 7nm Customer in 2020

AMD in the second half of 2020 could outpace Apple as the biggest foundry customer of TSMC for its 7 nm silicon fabrication nodes (DUV and EUV combined). There are two key factors contributing to this: AMD significantly increasing its orders for the year; and Apple transitioning to TSMC's 5 nm node for its A14 SoC, freeing up some 7 nm allocation, which AMD grabbed. AMD is currently tapping into 7 nm DUV for its "Zen 2" chiplet, "Navi 10," and "Navi 14" GPU dies. The company could continue to order 7 nm DUV until these products reach EOL; while also introducing the new "Renoir" APU die on the process. The foundry's new 7 nm+ (EUV) node will be utilized for "Zen 3" chiplets and "Navi 2#" GPU dies in 2020.

Currently, the top-5 customers for TSMC 7 nm are Apple, HiSilicon, Qualcomm, AMD, and MediaTek. Barring AMD, the others in the top-5 build mobile SoCs or 4G/5G modem chips on the node. AMD is expected to top the list as it scales up orders with TSMC. In the first half of 2020, TSMC's monthly output for 7 nm is expected to grow to 110,000 wafers per month (wpm). Apple's migration to 5 nm in 2H-2020, coupled with capacity-addition could take TSMC's 7 nm output to 140,000 wpm. AMD has reportedly booked the entire capacity-addition for 30,000 wpm, taking its allocation up to 21% in 2H-2020. Qualcomm is switching to Samsung for its next-generation SoCs and modems designed for 7 nm EUV. NVIDIA, too, is expected to built its next-gen 7 nm EUV GPUs on Samsung instead of TSMC. These moves by big players could free up significant foundry allocation at TSMC for AMD's volumes to grow in 2020.

ASRock Launches the Radeon RX 5500 XT Phantom Gaming D 8G OC Graphics Card

he leading global motherboard, graphics card and mini PC manufacturer, ASRock, launches the Radeon RX 5500 XT Phantom Gaming D 8G OC graphics card - as the latest member of the ASRock Phantom Gaming series graphics card product line, equipped with AMD 's 2nd generation 7nm Radeon RX 5500 XT GPU, 8 GB 128-bit GDDR6 video memory, and support PCI Express 4.0 bus standard, as well as the new dual fan design with Phantom Gaming appearance, brilliant Polychrome SYNC lighting effect synchronization, and the stylish metal backplane. The advanced specifications and rich functions bring gamers an outstanding 1080p gaming experience.

7nm Intel Xe GPUs Codenamed "Ponte Vecchio"

Intel's first Xe GPU built on the company's 7 nm silicon fabrication process will be codenamed "Ponte Vecchio," according to a VideoCardz report. These are not gaming GPUs, but rather compute accelerators designed for exascale computing, which leverage the company's CXL (Compute Express Link) interconnect that has bandwidth comparable to PCIe gen 4.0, but with scalability features slated to come out with future generations of PCIe. Intel is preparing its first enterprise compute platform featuring these accelerators codenamed "Project Aurora," in which the company will exert end-to-end control over not just the hardware stack, but also the software.

"Project Aurora" combines up to six "Ponte Vecchio" Xe accelerators with up to two Xeon multi-core processors based on the 7 nm "Sapphire Rapids" microarchitecture, and OneAPI, a unifying API that lets a single kind of machine code address both the CPU and GPU. With Intel owning the x86 machine architecture, it's likely that Xe GPUs will feature, among other things, the ability to process x86 instructions. The API will be able to push scalar workloads to the CPU, and and the GPU's scalar units, and vector workloads to the GPU's vector-optimized SIMD units. Intel's main pitch to the compute market could be significantly lowered software costs from API and machine-code unification between the CPU and GPU.
Image Courtesy: Jan Drewes

Intel CFO Talks About 7nm Rollout, Delay in 10nm, Increased Competition from AMD

Intel CFO George Davis in an interview with Barron's commented on the company's financial health, and some of the reasons behind its rather conservative gross margin guidance looking forward to at least 2023. Intel's current product stack is moving on to the company's 10 nm silicon fabrication process in a phased manner. The company is allocating 10 nm to mobile processors and enterprise processors, while brazening it out with 14 nm on the client-desktop and HEDT platforms until they can build 10 nm desktop parts. AMD has deployed its high-IPC "Zen 2" microarchitecture on TSMC's 7 nm DUV process, with plans to go EUV in the coming months.

"We're still keenly focused on gross margin. Everything from capital efficiency to the way we're designing our products. What we've said though, the delay in 10 nanometer means that we're going to be a little bit disadvantaged on unit cost for a period of time. We actually gave guidance for gross margin out in 2021 to help people understand. 2023 is the period that we were ultimately guiding [when] we're going to see very strong revenue growth and margin expansion. We've got to get through this period where we have the 10 nanometer being a little bit late [as] we're not optimized on a node that we're on. But [by] then we're moving to a two to two and a half year cadence on the next nodes. So we're pulling in the spending on 7 nanometer, which will start up in the second half of 2021 because we think it's the right thing to do competitively," he said.

TSMC Starts Shipping its 7nm+ Node Based on EUV Technology

TSMC today announced that its seven-nanometer plus (N7+), the industry's first commercially available Extreme Ultraviolet (EUV) lithography technology, is delivering customer products to market in high volume. The N7+ process with EUV technology is built on TSMC's successful 7 nm node and paves the way for 6 nm and more advanced technologies.

The N7+ volume production is one of the fastest on record. N7+, which began volume production in the second quarter of 2019, is matching yields similar to the original N7 process that has been in volume production for more than one year.

AMD Announces Availability of the Ryzen PRO 3000 Series Processors

Today, AMD announced the global availability of its new AMD Ryzen PRO 3000 Series desktop processor lineup, along with new AMD Ryzen PRO processors with Radeon Vega Graphics and AMD Athlon PRO processors with Radeon Vega Graphics. The AMD Ryzen PRO and Athlon PRO desktop processors combine powerful performance, built-in security features, and commercial-grade reliability to get the job done. Starting in Q4 2019, robust enterprise desktops from HP and Lenovo powered by AMD Ryzen PRO and Athlon PRO desktop processors are slated to be available.

"The launch of the Ryzen PRO 3000 Series processors for commercial and small business users is the latest demonstration of our commitment to technology leadership in 2019," said Saied Moshkelani, senior vice president and general manager, AMD Client Compute. "Designed specifically to efficiently data-crunch, design, compose, and create - AMD Ryzen PRO and Athlon PRO processors accelerate enhanced business productivity while offering protection safeguards with built-in security features, such as full system memory encryption and a dedicated, on-die security processor."

AMD Could Release Next Generation EPYC CPUs with Four-Way SMT

AMD has completed design phase of its "Zen 3" architecture and rumors are already appearing about its details. This time, Hardwareluxx has reported that AMD could bake a four-way simultaneous multithreading technology in its Zen 3 core to enable more performance and boost parallel processing power of its data center CPUs. Expected to arrive sometime in 2020, Zen 3 server CPUs, codenamed "MILAN", are expected to bring many architectural improvements and make use of TSMC's 7nm+ Extreme Ultra Violet lithography that brings as much as 20% increase in transistor density.

Perhaps the biggest change we could see is the addition of four-way SMT that should allow a CPU to have four virtual threads per core that will improve parallel processing power and enable data center users to run more virtual machines than ever before. Four-way SMT will theoretically boost performance by dividing micro-ops into four smaller groups so that each thread could execute part of the operation, thus making the execution time much shorter. This being only one application of four-way SMT, we can expect AMD to leverage this feature in a way that is most practical and brings the best performance possible.

BIOSTAR Launches the New X470MH Motherboard

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, is proud to announce a new addition to its AMD socket AM4 motherboards with the BIOSTAR X470MH. Built for office workers looking to smoothly cruise through their daily tasks without setbacks and for home users looking for a strong and stable platform to run their HTPC, the X470MH is equipped with the latest features the PC industry has to offer while maintaining an affordable price point. And for those looking to push the limit, the X470MH offers overclocking possibilities giving the user the added performance benefit for faster gaming and task management without risking to damage their investment.

The BIOSTAR X470MH, equipped with AMD's X470 chipset and AMD AM4 CPU socket, brings support for AMD's latest 3rd Gen Ryzen 7 nm processors. Built to make your daily computer needs a breeze, the X470MH is a Micro ATX motherboard featuring USB 3.1 Gen1 support (5 Gb/s) providing fast transfer speeds and support to a wide array of peripherals, PCI-e M.2 at 32 Gb/s for increased system responsiveness, as well as HDMI 4K resolution to sooth the eye while watching Netflix or Youtube, and a VGA port for a wider range of monitor compatibility. In addition, the Internet and network connectivity will not be a drag with the onboard Realtek GbE LAN. Overclockers are not left out either with enough room for 2x DDR4 RAM slots which support up to 32 GB and overclocks at 3200 MHz, making multitasking a pleasant experience.

AMD Designing Zen 4 for 2021, Zen 3 Completes Design Phase, out in 2020

AMD in its 2nd generation EPYC processor launch event announced that it has completed the design phase of its next-generation "Zen 3" CPU microarchitecture, and is currently working on its successor, the "Zen 4." AMD debuted its "Zen 2" microarchitecture with the client-segment 3rd generation Ryzen desktop processor family, it made its enterprise debut with the 2nd generation EPYC. This is the first x86 CPU microarchitecture designed for the 7 nanometer silicon fabrication process, and is being built on a 7 nm DUV (deep ultraviolet) node at TSMC. It brings about double-digit percentage IPC improvements over "Zen+."

The "Zen 3" microarchitecture is designed for the next big process technology change within 7 nm, EUV (extreme ultraviolet), which allows significant increases in transistor densities, and could facilitate big improvements in energy-efficiency that could be leveraged to increase clock-speeds and performance. It could also feature new ISA instruction-sets. With "Zen 3" passing design phase, AMD will work on prototyping and testing it. The first "Zen 3" products could debut in 2020. "Zen 4" is being designed for a different era.

AMD Reports Second Quarter 2019 Financial Results

AMD (NASDAQ:AMD) today announced revenue for the second quarter of 2019 of $1.53 billion, operating income of $59 million, net income of $35 million and diluted earnings per share of $0.03. On a non-GAAP basis, operating income was $111 million, net income was $92 million and diluted earnings per share was $0.08.

"I am pleased with our financial performance and execution in the quarter as we ramped production of three leadership 7nm product families," said Dr. Lisa Su, AMD president and CEO. "We have reached a significant inflection point for the company as our new Ryzen, Radeon and EPYC processors form the most competitive product portfolio in our history and are well positioned to drive significant growth in the second half of the year."
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