Announced back in January, at CES 2012, the IdeaPad S206 11.6-inch laptop is moving closer to its release date so its maker, Lenovo, has made a nice little video for it to entice potential buyers. The S206 features a 20.7 mm thick metallic casing, an AccuType keyboard, an AMD dual-core APU, a 0.3-megapixel webcam, 802.11 b/g/n WiFi, the Quick Start 'instant on' function, and a battery allowing for up to 4 hours of operation.

While it's certainly dedicated to the ultrabook 'cause', ASUS is not ignoring AMD's own slim mobile PC offering and is in fact prepping a new ultra thin machine powered by the E-450 APU (dual Bobcat cores @ 1.65 GHz, Radeon HD 6320 graphics).

Named U82U, ASUS' new ultra thin has a 14-inch display, 2 GB of RAM (up to 8 GB are supported), a 500 GB hard drive, two USB 3.0 ports, a HDMI output, and an 8-cell battery. ASUS has yet to reveal the machine's release date or price tag.

AMD today announced a collaboration with Green Hills Software, the largest independent vendor of embedded software, that brings its industry-leading INTEGRITY real-time operating system (RTOS) to the AMD Embedded G-Series Accelerated Processing Unit (APU) platform. The combination of INTEGRITY RTOS with the AMD Embedded G-Series APU creates a high performance, reliable and secure embedded computing solution or use across a range of applications including industrial control systems, consumer, networking, military/aerospace and medical.

The INTEGRITY RTOS offers support for multi-core x86 CPUs in the AMD Embedded G-Series APU with its v10.0.2 SMP release. The AMD Embedded G-Series APU offers an advanced, low-power, multi-core x86 CPU and a discrete-class DirectX 11-capable GPU on a single chip. This specific family of APUs was created expressly for the requirements of embedded systems, many of which require the precise, deterministic timing of an RTOS.

FinalWire today released the latest version of AIDA64, version 2.30. This release is set around enhancing the desktop gadget, improving the UPS and smart-battery monitoring capabilities, and adding support for newly-released hardware, such as the latest GPUs from AMD and NVIDIA; and the latest Intel SSDs. AIDA64 is proprietary software, and is available through FinalWire's online store.DOWNLOAD: FinalWire AIDA64 2.30 EXE (installer), ZIP Package

The condensed change-log follows.

Sapphire released the new Pure Platinum A55V motherboard to the market. The board offers a value socket FM1 platform based on AMD A55 FCH chipset, in the ATX form-factor. The motherboard supports AMD A4, A6, A8, and Athlon II "Llano" APU/CPUs in the FM1 package. This model is not exactly designed to be "no-frills", as it does pack an interesting mix of features that could help it grab a comfy price-point in the market.

The FM1 socket is powered by a 6-phase VRM, which uses a simple whine-free choke + DPAK MOSFET design, but throws in a heatsink to cool the MOSFETs. The socket is wired to four DDR3 DIMM slots, supporting up to 16 GB of dual-channel DDR3 memory, with speeds of over DDR3-1600 MHz with overclocking. The APU is also wired to a PCI-Express 2.0 x16 slot, and two PCI-Express 2.0 x1 slots. Apart from these, you get three legacy PCI slots, wired to the FCH.

Later this year, AMD will unveil its second-generation accelerated processing units (APUs) in the FM2 package, based on its brand-new "Piledriver" CPU and "Graphics CoreNext" GPU architectures. Among these, the part that is designed keeping overclockers in mind is the A10-5800K, which features an unlocked base clock multiplier, four x86-64 cores, 3.80 GHz (nominal) and 4.20 GHz Turbo Core clock speed, and AMD Radeon HD 7660D graphics. Find out more about the lineup here.

INPAI got its hands on an A10-5800K APU, and supporting socket FM2 motherboard, and wasted no time in comparing it to the current-generation A8-3850. INPAI put the two chips through SuperPi 1M, to measure single-thread performance, and 3DMark 06, to measure embedded-GPU performance. In SuperPi, A10-5800K crunched SuperPi 1M in 23.775 s, the A8-3850 did the same in 26.039 s. With 3DMark 06, the A10-5800K scored 9396 points, while the A8-3850 scored 6223. The inference that can be drawn out of this little test is that Trinity has significantly faster graphics, not so much CPU (taking into account A10-5800K cores were clocked over 30% higher than those of the A8-3850).

GLOBALFOUNDRIES today announced that its Fab 1 in Dresden, Germany has shipped a quarter of a million semiconductor wafers based on 32nm High-k Metal Gate (HKMG) technology. The milestone represents a significant lead over other foundries in HKMG manufacturing and carries on a long tradition of rapidly ramping leading-edge technologies to volume production.

On a unit basis, cumulative 32nm shipments for the first five quarters of wafer production are more than double that achieved during the same period of the 45nm technology ramp, demonstrating that the overall 32nm ramp has significantly outpaced the 45nm ramp, despite the integration of a number of new and complex elements in both design and process technologies.

AMD is close to launching a new value accelerated processing unit (APU) in the FM1 package, the A4-3420. This model has been available in OEM/tray package to system manufacturers since January, but now AMD is releasing it to the retail channel, in the PIB (processor in a box) package. This chip has two x86-64 cores clocked at 2.80 GHz, and Radeon HD 6410D graphics with 160 stream processors, with its engine clocked at 600 MHz. The L2 cache size is 512 KB per core. It packs an integrated memory controller supporting dual-channel DDR3-1600 MHz memory, and a PCI-Express 2.0 root hub for discrete graphics. Its rated TDP is 65W. Expect a US $65 price.

Manli, a brand owned by PC Partner, showed off its latest mini-PC, the Elite. Driven by AMD E-450 "Brazos" APU, the Elite is a barebone, that requires you to add the memory (a single DDR3-SODIMM slot is available), and storage (a 2.5-inch drive with SATA 6 Gb/s connection available). Pre-configured models with 2 GB memory and 320 GB HDD are available in select markets. Connectivity includes two USB 2.0 ports, two USB 3.0 ports, a DisplayPort and HDMI connector for display, an eSATA port, Gigabit Ethernet, a multi-format card reader, audio jacks and built in 802.11b/g/n WLAN.

AMD's upcoming A10 and A8 "Trinity" APUs will be built in the new FM2 package for desktop PCs, requiring new motherboards. These APUs will be launched towards the end of Q2, and into Q3 (June-July). A ComputerBase.de report suggests that sources in the motherboard industry it spoke to, at CeBIT, say that socket FM2 motherboards will arrive in June. Further, these motherboards will be based on the new AMD A85 FCH chipset. Not much is known about the A85, except that with the USB-IF certification, it could incorporate native USB 3.0 controllers.

AMD today announced it has invested in Nuvixa, Inc., a developer of gesture-based video communication and presentation solutions, through AMD Ventures (formerly the AMD Fusion Fund program). Leveraging depth-sensing camera technologies, the Nuvixa StagePresence immersive video presentation tool extracts a presenter from virtually any background environment, and embeds their live video persona within any compatible digital desktop or slide content. Image processing enhancements only available via OpenCL and AMD accelerated processing units (APUs) create immersive performance and quality improvements that deliver close to double the frame rate1 and a more immersive experience to online audiences.

ASUS is readying five new Eee PC netbooks for launch at CeBIT, these include the Eee PC X101CH, Eee PC 1011CX, two variants of the Eee PC 1015BX, and the Eee PC 1025C. The X101CH and 1011CX are driven by Intel Atom N2600 processor, the 1025C by Atom N2800, while the 1015BX has two variants, driven by AMD Vision C50 or C60 APUs. All of these are 10.1-inchers. Also common between these models are 1 GB RAM, 320 GB storage, and Windows 7 Starter Edition operating system. The five Eee PCs also feature ASUS Express Gate, a lean web-oriented operating system. In related news, ASUS is also working on 11.6-inch Eee PC 1225B/C, which feature larger screens, with 1366x768 pixels resolution.

Cyclos Semiconductor, the inventor and only supplier of resonant clock mesh technology for commercial IC designs, today announced at the International Solid State Circuits Conference (ISSCC) in San Francisco, CA that AMD has successfully implemented Cyclos' low-power semiconductor intellectual property (IP) in the AMD x86 core destined for inclusion in Opteron server processors and client Accelerated Processing Units (APUs). The adoption of the Cyclos resonant clock mesh IP to reduce power consumption demonstrates the commitment AMD has made to provide its customers with not only class-leading APU performance but also with the lowest possible power consumption.

AMD's 4+ GHz x86-64 core code-named "Piledriver" employs resonant clocking to reduce clock distribution power up to 24% while maintaining the low clock-skew target required by high-performance processors. Fabricated in a 32nm CMOS process, Piledriver represents the first volume production-enabled implementation of resonant clock mesh technology. "We were able to seamlessly integrate the Cyclos IP into our existing clock mesh design process so there was no risk to our development schedule," said Samuel Naffziger, Corporate Fellow at AMD. "Silicon results met our power reduction expectations, we incurred no increase in silicon area, and we were able to use our standard manufacturing process, so the investment and risk in adopting resonant clock mesh technology was well worth it as all of our customers are clamoring for more energy efficient processor designs."

Building on the success of its first Mini PC, hailed as the smallest PC in the world, SAPPHIRE Technology - a world leading manufacturer and supplier of PC graphics cards, mainboards and multimedia solutions has just introduced a new model - the SAPPHIRE EDGE-HD3 based on industry leading APU technology from AMD.

The SAPPHIRE EDGE-HD3 shares the same slim, stylish outline as the earlier models but delivers increased graphical capability and higher core performance as a result of incorporating the latest E450 APU technology from AMD. At less than half a litre in volume, it is slimmer and smaller than most wireless access points - in fact around the size of a paperback book! Its stylish design and simple pedestal mount make it equally at home next to a TV or a business monitor whilst occupying the minimum of desk or shelf space.

HP today announced the powerful new HP t610 Flexible Series Thin Client and HP t510 Thin Client with industry-leading performance and security, enabling businesses to protect their data more effectively while improving employees' user experience.

The HP t510 and HP t610 come standard with dual-core CPUs and offer graphics cores that offload computing from the server to the chipset, enabling users to easily stream multimedia and work with high-definition (HD) graphics. The HP t510 and HP t610 also enable the use of multiple monitors and remote connections.

In the second quarter of this year, AMD will launch its next-generation accelerated processing unit, codenamed "Trinity", starting with quad-core A10 and A8 parts in the quarter, followed by dual-core A6 and A4 parts in the third-quarter of 2012 (more here). DonanimHaber scored a specifications-sheet that details all the models AMD has in store for this year, also giving us an insight to what constitute each of these model numbers.

An interesting revelation here is that AMD does not have triple-core APUs anywhere in its lineup. The A10 lineup consists of quad-core APUs that come with Radeon HD 7660D graphics, while the A8 lineup also consists of quad-core APUs, but with slower Radeon HD 7560D graphics. The A6 lineup consists of dual-core APUs with Radeon HD 7540D graphics, while the A4 lineup has dual-core APUs with Radeon HD 7480D graphics.

AMD is pushing on with a desktop product lineup that's leveraging its Piledriver CPU and Graphics CoreNext GPU architectures in 2012. Apparently, the company will have a faster product development cycle to catch up with Intel's "Tick-Tock", as revealed in a roadmap slide scored by DonanimHaber. The current product lineup will remain unchanged in the first quarter of 2012. Then in the second quarter, AMD will launch a few more socket AM3+ FX-8000, FX-6000, and FX-4000 series eight, six, and four-core processors; along with the much talked about "Trinity" accelerated processing unit.

The fastest "Trinity" APUs will get a new brand identifier, the A10-5000 series. These APUs will pack next-generation "Piledriver" modular cores and Radeon HD 7600D series graphics. Around this time, AMD will also launch the Brazos 2.0 low-power APU for netbooks, nettops, and embedded computing devices. Brazos 2.0 will get the E2-1000 series branding. The big change is reserved for the third quarter of 2012, when AMD launches the successor of its less-than-lucky AMD FX "Bulldozer" processor family.

While Intel and AMD are making efforts to come up with low-power x86 processor platforms to compete with the plethora of ARM processor vendors, manufacturers of the target devices of these low-power x86 processors - tablets, netbooks, and smartphones; note that the architecture simply isn't competitive due to its prices. ARM processors are manufactured by a variety of companies, in a variety of different SoC configurations, and as such the tough competition among these companies ensure ARM processor platforms are comparatively cheaper to low-power x86 ones.

Intel recently debuted its 32 nm "Medfield" Atom processors, with power consumption as low as 11W for the platform. In the second half of 2012, it will launch another line of processors with under 10W power consumption, for high-end smartphones. AMD, on the other hand, will unveil "Hondo", which combines its x86 architecture with Radeon graphics IP, and a power consumption target of less than 5W. In 2013, it plans to launch the "Temash" APU, with power consumption under 2W, and built on the 28 nm process.

In a significant development, AMD reportedly disclosed at the Financial Analyst Day event that it has begun manufacturing its "Trinity" accelerated processing units (APUs) at IBM's foundries. With the creation of Global Foundries, AMD went fabless, relying on Global Foundries (its former manufacturing division) and the likes of TSMC to manufacture its products. Till date, Global Foundries has handled manufacture of most of AMD's CPU products, and socket FM1 APUs, while BGA APUs and chipset have been manufactured at TSMC.

What makes AMD's partnership with IBM for manufacturing a significant development is the fact that IBM can handle high-volume production, and has a proven track-record with semiconductor manufacturing process R&D, it also holds a wide range of silicon fabrication IP, rivaled only by Intel. Chips manufactured at IBM will only add to the volumes created by Global Foundries, Big Blue won't completely replace it as AMD's foundry partner. The ability to ship in greater volumes plays a significant role in scoring design wins, apart from pure performance of the product. For example, Lenovo would want to be absolutely sure you can ship in large quantities before designing a major product around your chip.

In a footnote of a slide detailing AMD's Trinity A6 APU for Ultrathin notebooks at the company's Financial Analyst Day event, the new chip's 3DMark performance was revealed. The company was talking about the 17W ULV (ultra-low voltage) variant of the "Trinity" APU in the slide, that's designed for compact notebooks. The 3DMark Vantage performance of the APU was measured to be 2,355 points, in the same test, an Intel Core i5-2537M ULV 17W "Sandy Bridge" processor scored 1,158 points. The AMD chip, hence, emerged with a 103% graphics performance lead.

The slide notes that with an assumed performance increase of 30% by the upcoming "Ivy Bridge" architecture, its 3DMark performance is projected to be 1,505 points. The 17W Trinity chip would still end up with a 56% performance lead. Moving on, AMD even revealed the performance of the high-performance A10 "Trinity" APU with 25W TDP, designed for slightly thicker notebooks. This chip scored 3,600 points in 3DMark, which would effectively make it 136% faster than Ivy Bridge at graphics.

At its annual Financial Analyst Day, AMD (NYSE: AMD) detailed a new "ambidextrous" strategy that builds on the company's long history of x86 and graphics innovation while embracing other technologies and intellectual property to deliver differentiated products.

AMD is adopting an SoC-centric roadmap designed to speed time-to-market, drive sustained execution, and enable the development of more tailored customer solutions. SoC design methodology is advantageous because it is a modular approach to processor design, leveraging best practice tools and microprocessor design flows with the ability to easily re-use IP and design blocks across a range of products.

Acer has recently rolled out a new Revo series nettop/mini PC, a model called Revo RL70 which measures 209.89 (W) x 209.89 (D) x 35.35 (H) mm and makes use of AMD's E-450 APU boasting two Bobcat cores @ 1.65 GHz and Radeon HD 6320 graphics.

Acer's compact system also has 2 GB of RAM, a 500 GB hard drive, Gigabit Ethernet, 802.11 b/g/n WiFi, a multi-in-one card reader, six USB 2.0 ports, plus D-Sub and HDMI outputs. The Revo RL70(-UR10P) runs Windows 7 Home Premium 64-bit and is selling for $329.99.

Today at its annual Financial Analyst Day, AMD has presented an updated roadmap detailing the hardware it plans to bring to the table during 2012 and 2013. For this year, the Sunnyvale-based company is preparing a processor quarter which includes the Trinity, Brazos 2.0 and Hondo APUs (accelerated processing units) and the Vishera CPU.

Set to be the main weapon in AMD's x86 arsenal, the Trinity APU (aka the 2nd gen A Series) is made on 32 nm process technology, and features DirectX 11 graphics, two/four Piledriver cores (Piledrive is said to deliver 25% better performance than the Stars cores found in Llano APUs), and a TDP that can go as low as 17 W on mobile parts. Trinity is expected to debut in Q2 and already has close to 100 design wins (more than Llano had before its release).

Overclocker "Christian Ney" of the HWBOT community claims to have cracked the 6 GHz clock speed mark with an AMD A8-3870K APU, with all four of its cores enabled. The feat consisted of a clock speed of 6067.7 MHz achieved using a base clock of 258.2 MHz and multiplier of 47.0x. The memory was clocked at 3505 MHz, just 95 MHz short of a world-record. The chip was put through a scorching core voltage of 2V. Supporting components included GIGABYTE A75-UD4H motherboard, and GeIL EVO Corsa DDR3 memory. The setup was cooled sub-zero. CPU-Z Validator rejected this submission, probably because like us, it finds 2V vCore and 258.2 MHz base clock unreal for Llano, since it uses a common 100 MHz clock domain for BClk and PCIe.

Last year, ARCTIC revealed the underlying potential of all-in-one home entertainment centers. Our first notable MC001 entertainment center was successfully launched and remarkably praised by numerous media in USA (CPU, TechPowerUp, TomsHardware, Europe (KitGuru, Madshrimps, ProHardver, PC Tuning, HW Legend, InformaticaEasy, 59 Hardware, Cowcotland) and Canada (Overclockers Online) etc.

This year, ARCTIC continues with its spirit of innovation by creating a new generation of powerful home entertainment centers - the MC101 Series which will keep you entertained - always. We design our innovative technologies around you so that you can enjoy more with less effort. In addition to its cost-effective, multi-functional, and high level of accessibility, our MC101 Series deliver fast, compact and feather-light home entertainment solutions that are humbly perfect.