The global supply of semiconductor processors has been at risk lately. Starting from GPUs to CPUs, the demand for both has been much greater than the available supply. Manufacturing companies, such as TSMC, have been expanding capacities, however, they have not yet been able to satisfy the demand. We have seen the results of that demand in a form of the scarcity of the latest generation of graphics cards, covering NVIDIA's GeForce RTX 3000 series Ampere, and AMD' Radeon RX 6000 series Big Navi graphics cards. Consumers have had a difficult time sourcing them and they have seen artificial price increase that is much higher than their original MSRP.

However, it doesn't seem like the situation will improve. According to the latest reporting from Bloomberg, the next victim of global chip shortage is... you guessed it, your home internet router. The cited sources have noted that the waiting list to get a batch of ordered routers has doubled the waiting time, from the regular 30 weeks to 60-week waiting time. This represents a waiting list that is more than a year long. With the global COVID-19 pandemic still going strong, there is an increased need for better home router equipment, and delays can only hurt broadband providers that supply routers. Taiwan-based router manufacturer Zyxel Communications, notes that the company has seen massive demand for their equipment. Such a massive demand could lead to insufficient supply, which could increase prices of routers well above their MSRP and bring scarcity of them as well.

Intel has just launched its Ice Lake-SP lineup of Xeon Scalable processors, featuring the new Sunny Cove CPU core design. Built on the 10 nm node, these processors represent Intel's first 10 nm shipping product designed for enterprise. However, there is another 10 nm product going to be released for enterprise users. Intel is already preparing the Sapphire Rapids generation of Xeon processors and today we get to see more details about it. Thanks to the anonymous tip that VideoCardz received, we have a bit more details like core count, memory configurations, and connectivity options. And Sapphire Rapids is shaping up to be a very competitive platform. Do note that the slide is a bit older, however, it contains useful information.

The lineup will top at 56 cores with 112 threads, where this processor will carry a TDP of 350 Watts, notably higher than its predecessors. Perhaps one of the most interesting notes from the slide is the department of memory. The new platform will make a debut of DDR5 standard and bring higher capacities with higher speeds. Along with the new protocol, the chiplet design of Sapphire Rapids will bring HBM2E memory to CPUs, with up to 64 GBs of it per socket/processor. The PCIe 5.0 standard will also be present with 80 lanes, accompanying four Intel UPI 2.0 links. Intel is also supposed to extend the x86_64 configuration here with AMX/TMUL extensions for better INT8 and BFloat16 processing.

Alphacool introduces four new extremely large radiators. The first two radiators are for 180 or 200 mm fans and are a thickness of 86 mm. The 200 and 400 mm NexXxoS Monsta radiators offer a huge cooling surface. Both radiators have 7x standard G1/4" ports. 6 of the ports are for inlet/outlet and the 7th port is located at the end chamber and can only be used for filling, draining, or bleeding the radiator. The fin density has been reduced from 16 to 12 FPI to allow the use of lower static pressure fans and lower RPMs.

The new Nova 1080 UT60 radiator is a thicker version of the Nova 1080 XT45 radiator. The enormous cooling surface is comparable to three 360 mm UT60 radiators. This makes it easy to cool more than 1000 W of excess heat with extremely quiet to silent spinning fans. This is equivalent to a 64 core AMD Threadripper of the latest generation and at least two GeForce RTX 3090 graphics cards.

Dell's gaming subsidiary, Alienware, has launched a product designed to reintroduce products of a company that was abandoned in the laptop sector a long time ago. Alienware's last AMD-based gaming laptop made an appearance in 2007, and for 14 years there wasn't an Alienware laptop with an AMD processor inside it. For all those years, the heart of Alienware laptops was promised to Intel, however, that is no longer the case. Today, Alienware has introduced a Ryzen edition of the m15 R5 gaming laptop, powered by... you guessed it, AMD Ryzen 5000 series of mobile processors.

The new Alienware m15 R5 Ryzen Edition laptop is set to bring the balance to the force. Featuring AMD's flagship Ryzen 9 5900HX overclockable processor, the CPU is paired with NVIDIA's GeForce RTX 3070 graphics card. All of that is crammed inside a 15-inch body that offers QHD 240Hz or FHD 360Hz panels for the best possible gaming experience. For the cherry on top, the laptop offers Cherry MX keyboard switches with per-key RGB lighting. The new Ryzen edition Alienware laptop will be available for purchase in the U.S. with select configurations on April 20 starting at $1793.98. You can check out some pictures of the laptop below.More pictures follow.

AMD Ryzen 5000 series of processors feature the new Zen 3 core design, which uses many techniques to deliver the best possible performance. One of those techniques is called Predictive Store Forwarding (PSF). According to AMD, "PSF is a hardware-based micro-architectural optimization designed to improve the performance of code execution by predicting dependencies between loads and stores." That means that PSF is another "prediction" feature put in a microprocessor that could be exploited. Just like Spectre, the feature could be exploited and it could result in a vulnerability in the new processors. Speculative execution has been a part of much bigger problems in CPU microarchitecture design, showing that each design choice has its flaws.

AMD's CPU architects have discovered that the software that relies upon isolation aka "sandboxing", is highly at risk. PSF predictions can sometimes miss, and it is exactly these applications that are at risk. It is reported that a mispredicted dependency between load and store can lead to a vulnerability similar to Spectre v4. So what a solution to it would be? You could simply turn it off and be safe. Phoronix conducted a suite of tests on Linux and concluded that turning the feature off is taking between half a percent to one percent hit, which is very low. You can see more of that testing here, and read AMD's whitepaper describing PSF.

Razer, the maker of various gaming peripherals and gaming PCs/Laptops, has been a long-time user of Intel CPUs in their laptops devices. However, that might be changing just about now. According to some findings by @_rogame, there was a 3D Mark benchmark run that featured AMD Ryzen 5000 series "Cezanne" mobile processors. What is more interesting is the system it was running in. Called Razer PI411, this system is officially Razer's first AMD-powered laptop. While we don't have many details about it, we have some basic system configuration details. For starters, the laptop carries AMD's top-tier Ryzen 9 5900HX overclockable mobile processor. Carrying a configured TDP of 45 Watts (the maximum is 54 W), the system is likely not equipped with sufficient cooling for overclocking.

When it comes to the rest of the laptop, it features NVIDIA's GeForce RTX 3060 GPU, 16 GB of RAM, and 512 GB of storage. Being that this laptop was codenamed PI411, it could indicate a 14-inch model. However, we still don't know if it is ever going to hit consumer shelves. Being that Razer never carried an AMD CPU option, this could just be an engineering sample that the company was experimenting with, so we have to wait to find out more.

MonsterLabo, the maker of fanless PC cases designed for gaming with zero noise, has today tested its upcoming flagship offering in the case lineup. Called The Beast, the case is designed to handle high-end hardware with large TDPs and dissipate all that heat without any moving parts. Using only big heatsinks and heat pipes to transfer the heat to the big heatsink area. In a completely fanless configuration, the case can absorb and dissipate a CPU TDP of 150 Watts and a GPU TPD with 250 Watts. However, when equipped with two 140 mm fans running below 500 RPM, it can accommodate a 250 W CPU, and 320 W GPU. MonsterLabo has tested the fully fanless configuration, which was equipped with AMD Ryzen 7 3800XT processor, paired with NVIDIA's latest GeForce RTX 3080 Ampere graphics card.

There were no fans present in the system to help move the heat away, and the PC was being stress-tested using Microsoft's Flight Simulator. The company has posted a chart of CPU and GPU temperatures over time, where we see that the GPU has managed to hit about 75 degrees Celsius at one point. The CPU has remained a bit cooler, where the CPU package hit just above the 70-degree mark. Overall, the case is more than capable of cooling the hardware it was equipped with. By adding two slow-spinning fans, the temperatures would get even lower, however, that is no longer a fanless system. MonsterLabo's The Beast is expected to get shipped in Q3 of this year when reviewers will get their hands on it and test it for themselves. You can watch the videos in MonsterLabo's blog post here.

Gigabyte Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest BIOS of B560 AORUS motherboards. Enhanced by the 12+1 phases DrMOS power stage with 60 Amps for each and full coverage VRM thermal design, B560 AORUS motherboards can support Intel Core i9 11900K (F) series processors overclocking to all cores 5.1 GHz. The exclusive anti-interference design of memory circuit enables DDR4 speed raising up to XMP 4800 MHz, and overclocking performance boost to DDR4 5300 MHz. which demonstrates GIGABYTE's strong R&D strength and persistence in quality. Users can enjoy the performance boost of time-limited overclocking by simply updating to the latest BIOS to meet their special needs.1

Intel B series chipset motherboards have been always excluded from overclocking due to the product positioning. Although the memory XMP overclocking is unlocked on 500 series, the processor frequency can only reach up to 4.8 GHz by Turbo Boost. Thanks to the efforts of Gigabyte's R&D team, the processor can be overclocked to 5.1 GHz and maintain low temperature under the Prime95 no AVX burn-in test. This powerful performance benefits from the top-quality materials of GIGABYTE AORUS motherboards and product design capabilities, which include 12+1 phases/ 60Apms DrMOS power stage, 6 layers 2Oz ultra-cool PCB, full-covered VRM thermal design, and the latest Smart Fan 6 technology for temperature control. These features allow processors to have a stable and pure power supply under ultra-high frequency operation, providing the most solid backing for the CPU limited-time overclocking.

Intel Core i9-11900K processor, the flagship model from the 11th generation "Rocket Lake" CPU lineup, has been overclocked to more than 7 GHz by the "Rog-Fisher". Thanks to the report coming from VideoCardz, we have information that the top-end Rocket Lake processor is possibly a very good overclocker. Running at 7048 MHz, the CPU managed to achieve that frequency using "only" 1.873 V. There is no doubt that the system was being cooled by LN2, as such overclocks need it to remain stable, however, we don't have any data on that. The CPU was paired with the ASUS ROG Maximus XIII Apex motherboard, designed for extreme overclocking purposes.

It is important to note that the CPU didn't run any benchmarks, as it was just validated at that frequency by Valid x86. The sample was likely supplied by Intel, so it could be a cherry-picked model. For the official benchmark results of Rocket Lake processors, we have to wait until tomorrow (March 30th), when NDA lifts.

ASRock Rack, a division of ASRock dedicated to server/enterprise products, has today quietly launched a 1U short depth server, equipped with AMD's X570 motherboards, able to accommodate AMD Ryzen 5000 series of processors. The 1U2-X570/2T, as ASRock calls it, features an X570D4I-2T motherboard that is capable of housing any AMD Ryzen and Ryzen Pro 5000 series processor with TDP up to 105 Watts, paired with up to four SO-DIMMs of DDR4 ECC memory. Being a remote desktop/server type of build, the 1U case is not designed to be equipped with any powerful discrete graphics card. There is room for the motherboard, the power supply, and the HDDs located next to the motherboard.

Equipped with an 80-Plus Bronze 265 Watt PSU, the system can handle almost any CPU it is equipped with, two 3.5" drives and two 2.5" 7 mm drives. The motherboard also supports M.2 2280 SSD with PCIe 4.0 protocol support. When it comes to basic graphics output, ASRock Rack has installed an ASPEED AST2500 graphics controller to handle basic video output and display the command line, so you can operate with your server with ease. When it comes to networking, it is equipped with dual RJ45 10 GbE connectors, coming from an Intel X550-AT2 Ethernet controller. For more details, head over to the ASRock Rack 1U2-X570/2T product page.

The emergence of the COVID-19 pandemic in 1H20 seemed at first poised to devastate the IC design industry. However, as WFH and distance education became the norm, TrendForce finds that the demand for notebook computers and networking products also spiked in response, in turn driving manufacturers to massively ramp up their procurement activities for components. Fabless IC design companies that supply such components therefore benefitted greatly from manufacturers' procurement demand, and the IC design industry underwent tremendous growth in 2020. In particular, the top three IC design companies (Qualcomm, Broadcom, and Nvidia) all posted YoY increases in their revenues, with Nvidia registering the most impressive growth, at a staggering 52.2% increase YoY, the highest among the top 10 companies.

Hewlett Packard Enterprise, the company focused on making enterprise hardware and software, has today mistakenly listed some of Intel's upcoming 3rd generation Xeon Scalable processors. Called Ice Lake-SP, the latest server processor generation is expected to launch sometime in the coming days, with a possible launch date being the March 23rd "Intel Unleashed" webcast. The next generation of processors will finally bring a new vector of technologies Intel needs in server space. That means the support for PCIe 4.0 protocol for higher speed I/O and octa-channel DDR4 memory controller for much greater bandwidth. The CPU lineup will for the first time use Intel's advanced 10 nm node called 10 nm SuperFin.

Today, in the leaked HPE listing, we get to see some of the Xeon models Intel plans to launch. Starting from 32-core models, all the way to 40-core models, all SKUs above 28 cores are supposed to use dual die configuration to achieve high core counts. The limit of a single die is 28 cores. HPE listed a few models, with the highest-end one being the Intel Xeon Platinum XCC 8380 processor. It features 40 cores with 80 threads and a running frequency of 2.3 GHz. If you are wondering about TDP, it looks like the 10 nm SuperFin process is giving good results, as the CPU is rated only for 270 Watts of power.

AMD is slowly preparing to launch its next-generation client-oriented accelerated processing unit (APU), which is AMD's way of denoting a CPU+GPU combination. The future design is codenamed after Van Gogh, showing AMD's continuous use of historic names for their products. The APU is believed to be a design similar to the one found in the SoC of the latest PlayStation 5 and Xbox Series X/S consoles. That means that there are Zen 2 cores present along with the latest RDNA 2 graphics, side by side in the same processor. Today, one of AMD's engineers posted a boot log of the quad-core Van Gogh APU engineering sample, showing some very interesting information.

The boot log contains information about the memory type used in the APU. In the logs, we see a part that says "[drm] RAM width 256bits DDR5", which means that the APU has an interface for the DDR5 memory and it is 256-bit wide, which represents a quad-channel memory configuration. Such a wide memory bus is typically used for applications that need lots of bandwidth. Given that Van Gogh uses RDNA 2 graphics, the company needs a sufficient memory bandwidth to keep the GPU from starving for data. While we don't have much more information about it, we can expect to hear greater details soon.

As the industry is preparing for a shift to the new DDR standard, companies are trying to adopt the new technology and many companies are manufacturing the latest DDR5 memory modules. One of them is Shenzhen Longsys Electronics Co. Ltd, a Chinese manufacturer of memory chips, which has today demonstrated the power of DDR5 technology. Starting with this year, client platforms are expected to make a transition to the new standard, with the data center/server platform following. Using Intel's yet unreleased Alder Lake-S client platform, Longsys has been able to test its DDR5 DIMMs running at an amazing 6400 MHz speed and the company got some very interesting results.

Longsys has demoed a DDR5 module with 32 GB capacity, CAS Latency (CL) of 40 CL, operating voltage of 1.1 V, and memory modules clocked at 6400 MHz. With this being an impressive memory module, this is not the peak of DDR5. According to JEDEC specification, DDR5 will come with up to 8400 MHz speeds and capacities that are up to 128 GB per DIMM. Longsys has run some benchmarks, using an 8-core Alder Lake CPU, in AIDA64 and Ludashi. The company then proceeded to compare these results with DDR4-3200 MHz CL22 memory, which Longsys also manufactures. And the results? In AIDA64 tests, the new DDR5 module is faster anywhere from 12-36%, with the only regression seen in latency, where DDR5 is doubling it. In synthetic Ludashi Master Lu benchmark, the new DDR5 was spotted running 112% faster. Of course, these benchmarks, which you can check out here, are provided by the manufacturer, so you must take them with a grain of salt.

Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has completed its acquisition of the world-class CPU and technology design company, NUVIA for $1.4 billion before working capital and other adjustments.

"The world-class NUVIA team enhances our CPU roadmap, extending Qualcomm's leading technology position with the Windows, Android and Chrome ecosystems," said Cristiano Amon, President and CEO-Elect, Qualcomm Incorporated. "The broad support of this acquisition from across industries validates the opportunity we have to provide differentiated products with leading CPU performance and power efficiency, as on-demand computing increases in the 5G era."

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced AMD EPYC 7003 Series Processor-based server platforms featuring efficiency and performance enhancements in hardware, security, and memory density for the modern data center.

"Big data has become capital today. Large amounts of data and faster answers drive better decisions. TYAN's industry-leading server platforms powered by 3rd Gen AMD EPYC processors enable businesses to make more accurate decisions with higher precision," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "Moving the bar once more for workload performance, EPYC 7003 Series processors provide the performance needed in the heart of the enterprise to help IT professionals drive faster time to results," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. "Time is the new metric for efficiency and EPYC 7003 Series processors are the perfect choice for the most diverse workloads, helping provide more and better data to drive better business outcomes."

ARCTIC, one of the leading manufacturers of low-noise PC coolers and components, officially launches its MX-5 thermal paste today. The newly developed, high-performance paste comes with an ideal set of thermal properties, guaranteeing reliable heat dissipation over long periods of time. ARCTIC MX-5 is available now in variants ranging from 2 to 50 grams, with and without a spatula.

Like all thermal pastes from ARCTIC, MX-5 is completely metal-free. Because MX-5 is neither conductive nor capacitive, it is particularly safe to use: the possibility of short circuits, corrosion damage or discharges is eliminated.

Historically, system builders have been very good indicators of the market situation and demand for the latest processors available. Today, we have the report coming from Puget Systems, a system builder making PCs and laptops for any task needed. Having been present in the PC building business for 21 years, the company was able to notice some trends and look at the market like no one else could, simply by analyzing its orders. Today, we have the report that showcases just how much the CPU market has fluctuated and how dominant forces have shifted. The two main players, AMD and Intel, have been present for lots of years and we now get to see the latest trends in the consumer marketplace.

Back in 2015, Puget Systems quietly dropped AMD processors from their offerings, amid the very low demand the company saw for them. The sales of AMD processors accounted for a single-digit percentage of all of the total sales, and no one was interested in such systems. With the introduction of the Ryzen generation, Puget Systems re-introduced AMD processors back in their offerings. As the company analyzes its processor sales, it has concluded that, currently, AMD processors account for over 50% of the total CPU sales. That is quite a comeback for AMD, as the latest generation Ryzen 5000 series processors have taken the performance crown, and consumer demand is showing the need for new high-performance processors. You can take a look at the graph representing processor sales in the last five years below.

Demand for notebook computers is expected to remain strong throughout 2Q21 due to the persisting stay-at-home economy that arose in the wake of the pandemic, according to TrendForce's latest investigations. In response to the high demand for notebooks, PC OEMs are actively raising a consistent inventory of components, including client SSDs. Nonetheless, client SSDs are now in increasingly tight supply because the preexisting shortage of NAND Flash controllers is now exacerbated by the power outage at Samsung's Austin-based semiconductor plant. SSD manufacturers are therefore preparing to raise the prices of SSDs. Accordingly, TrendForce has also revised up its forecast of client SSD prices for 2Q21 from "mostly flat" to a 3-8% increase QoQ instead.

According to the official company website, Apple will no longer manufacture its iMac Pro computers based on Intel processors. Instead, the company will carry these models in its store, only while the supplies last. Apple will be replacing these models with next-generation iMac Pro devices that will be home to the custom Apple Silicon processors, combining Arm CPU cores with custom GPU design. Having a starting price of 4990 USD, the Apple iMac Pro was able to max out at 15000 USD. The most expensive part was exactly the Intel Xeon processor inside it, among the AMD GPU with HBM. Configuration pricing was also driven by storage/RAM options. However, even the most expensive iMac Pro with its 2017 hardware had no chance against the regular 2020 iMac, so the product was set to be discontinued sooner or later.

When the stock of the iMac Pro runs out, Apple will replace this model with its Apple Silicon equipped variant. According to the current rumor mill, Apple is set to hold a keynote on March 16th that will be an announcement for new iMac Pro devices with custom processors. What happens is only up to Apple, so we have to wait and see.

Some time ago, Intel has introduced the Performance Tuning Protection Plan (PTPP), which was used as a warranty for any damage that has occurred during overclocking. Customers of PTPP, mainly buyers of Intel Core processors having a "K" tag were able to get a replacement processor whenever they damaged their CPU by overclocking it. When it comes to the pricing of such a service, typical plans were spanning from $19.99 to $29.99, depending on the processor you had. However, there will no longer be such a program, as Intel is discontinuing its PTPP extended overclocking warranty. The company has updated its site to refer to End-Of-Life (EOL) page displaying a quote below.

Intel "Alder Lake" is the first processor generation coming from the company to feature the hybrid big.LITTLE type core arrangement and we are wondering how the configurations look like and just how powerful the next-generation processors are going to be. Today, a Geekbench submission has appeared that gave us a little more information about one out of twelve Alder Lake-S configurations. This time, we are getting an 8-core, 16-threaded design with all big cores and no smaller cores present. Such design with no little cores in place is exclusive to the Alder Lake-S desktop platform, and will not come to the Alder Lake-P processors designed for mobile platforms.

Based on the socket LGA1700, the processor was spotted running all of its eight cores at 2.99 GHz frequency. Please note that this is only an engineering sample and the clock speeds of the final product should be higher. It was paired with the latest DDR5 memory and NVIDIA GeForce RTX 2080 GPU. The OpenCL score this CPU ran has shown that it has provided the GPU with more than enough performance. Typically, the RTX 2080 GPU scores about 106101 points in Geekbench OpenCL tests. Paired with the Alder Lake-S CPU, the GPU has managed to score as much as 108068 points, showing the power of the new generation of cores. While there is still a lot of mystery surrounding the Alder Lake-S series, we have come to know that the big cores used are supposed to be very powerful.

Addressing the demands of the modern data center, Xilinx, Inc. (NASDAQ: XLNX) today announced a range of new data center products and solutions, including a new family of Alveo SmartNICs, smart world AI video analytics applications, an accelerated algorithmic trading reference design for sub-microsecond trading, and the Xilinx App Store.

Today's most demanding and complex applications, from networking and AI analytics to financial trading, require low-latency and real-time performance. Achieving this level of performance has been limited to expensive and lengthy hardware development. With these new products and solutions, Xilinx is eliminating the barriers for software developers to quickly create and deploy software-defined, hardware accelerated applications on Alveo accelerator cards.

GIGABYTE Technology, (TWSE: 2376), an industry leader in high-performance servers and workstations, today announced the G262-ZR0 for HPC, AI, and data analytics. Designed to support the highest-level of performance in GPU computing, the G262-ZR0 incorporates fast PCIe 4.0 throughput in addition to NVIDIA HGX technologies and NVIDIA NVLink to provide industry leading bandwidth performance.

When AMD and Sony collaborated on making the next generation console chip, AMD has internally codenamed it Flute, while Sony codenamed it Oberon or Ariel. This PlayStation 5 SoC die has today been pictured thanks to the Fritzchens Fritz and we get to see a closer look at the die internals. Featuring eight of AMD's Zen2 cores that can reach frequencies of up to 3.5 GHz, the CPU is paired with 36 CU GPU based on the RDNA 2 technology. The GPU is capable of running at speed of up to 2.23 GHz. The SoC has been made to accommodate all of that hardware, and bring IO to connect it all.

When tearing down the console, the heatsink and the SoC are connected by liquid metal, which is used to achieve the best possible heat transfer between two surfaces. Surrounding the die there is a small amount of material used to prevent liquid metal (a conductive material) from possibly spilling and shorting some components. Using a special short wave infrared light (SWIR) microscope, we can take a look at what is happening under the hood without destroying the chip. And really, there are a few distinct areas that are highlighted by the Twitter user @Locuza. As you can see, the die has special sectors with the CPU complex and a GPU matrix with plenty of workgroups and additional components for raytracing.