GELID Solutions Launches GP-Ultimate 120x20 Thermal Pad
Tech innovator GELID Solutions unveils the ultimate performance GP-Ultimate 120x20 thermal pad. The GP-Ultimate 120x20 is a product of GELID Solutions GAMER product line. The GP-Ultimate 120x20 is designed to provide perfect thermal interface to transfer heat to heatsinks when installed on PCB with height differences and uneven surfaces such as DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs and other high-temperature SMD components.
Thanks to its enhanced multilayer matrix, advanced material composition, and the ultimate 15 W/mK thermal conductivity, the GP-Ultimate 120x20 offers the best performance in class. It is non-electrical conductive, non-corrosive, non-curing, non-toxic and supports extended operating temperature range -60° to 220°C. The GP-Ultimate 120x20 features seamless application and has the thermal pad dimensions of 120x20mm with 0.5 mm, 1 mm, 1.5 mm and 2 mm thickness to best fit enlarged PCB surfaces of RAM Memory modules, GPU and CPU VRM circuits, M.2 Type SSD and other densely packed electronic devices.
Thanks to its enhanced multilayer matrix, advanced material composition, and the ultimate 15 W/mK thermal conductivity, the GP-Ultimate 120x20 offers the best performance in class. It is non-electrical conductive, non-corrosive, non-curing, non-toxic and supports extended operating temperature range -60° to 220°C. The GP-Ultimate 120x20 features seamless application and has the thermal pad dimensions of 120x20mm with 0.5 mm, 1 mm, 1.5 mm and 2 mm thickness to best fit enlarged PCB surfaces of RAM Memory modules, GPU and CPU VRM circuits, M.2 Type SSD and other densely packed electronic devices.