Eurocom is shipping the NVIDIA GeForce GTX 880M in single and SLI (Dual) configuration in the line of fully configurable, VGA upgradeable, high performance gaming laptops.

The addition of the NVIDIA GeForce GTX 880M, the highest performance mobile solution from NVIDIA, gives Eurocom customers an even greater choice of GPUs to power their gaming laptop with a graphics card to fit every performance level.

Razer, the world leader in entertainment devices and software, today announced it has enhanced its award-winning Razer Blade Pro laptop with next-generation graphics capabilities and a suite of new applications designed for professionals and gamers.

At the heart of the Blade Pro is a full-HD, 17-inch LED main display working in-tandem with the award-winning Razer Switchblade User Interface (SBUI), the latter of which provides users with one-click access to program tools, macros, key binds and other customizable functions, as well as full Internet capabilities independent of the main display. Features of the Razer SBUI include 10 dynamic adaptive tactile keys, a cell phone-grade LCD display that doubles as a track pad, and associated proprietary software.

G.SKILL International Co. Ltd., the leading high performance memory designer and manufacturer, is excited to announce the release of a high performance, high capacity DDR3L SO-DIMM 16GB (2x8GB) memory kit at 2133MHz! Requiring only 1.35V of low operating voltage with a timing of 11-11-11-31, this Ripjaws SO-DIMM memory kit will provide a much needed performance boost to your small form factor PC or high performance laptop.

The following is a test screenshot completed on the GIGABYTE BRIX Pro (GB-BXi7-4770R), showing fast processing and stable performance. Dubbed the F3-2133C11D-16GRSL, this Ripjaws DDR3L SO-DIMM memory kit is best used with the latest Intel i5 and i7 Haswell processors. Let the overclocking begin!

BIOSTAR has announced the J1800NH motherboard with the on-board Intel Dual-Core Celeron J1800 processor in a mini ITX form factor size of 17x17cm for flexible use.

The J1800NH boards come with the Intel Celeron J1800 Dual-Core processor already installed and it supports one DDR3L 1333/1066 MHz memory slot for a maximum of 8 GB of memory. It features an integrated graphics chip with enough performance for most home and office applications. The J1800NH board is ready for building a universal multimedia system due to its HDMI and analog VGA-out, and high definition audio with the Realtek ALC662 6-Channel HD Audio chip.

Axiomtek, one of the world's leading designers and manufacturers of innovative, high performance and reliable PC-based industrial computer products, announced the arrival of the PICO880, the most advanced, high-performance and extremely compact single board computer in the marketplace. Created with the most advanced 4th Generation Intel Core technology, the PICO880 is designed to support the needs of systems integrators who require a compact, high-performance, versatile and reliable single board computer.

The PICO880 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F). Designed with expandability in mind, the tiny embedded board has a full-size PCI Express Mini Card slots with mSATA support. The PICO880 also provides two flexible board-to-board connectors that integrate audio, four USB 3.0, four USB 2.0, one PCIe x1, one DisplayPort, two UARTs, LED, and power on/off interfaces. It is a perfect fit for vehicle PCs, small media entertainment systems, industrial automation systems, medical imaging, gaming and small electronic devices customers.

Intel is ready with an NUC form-factor system based on its Atom "Bay Trail" SoC. Called the NUC DN2820FYKH, the system runs a Celeron N2820 SoC, which integrates a dual-core 64-bit x86 CPU clocked at 2.40 GHz, and a TDP of under 7.5W. Its board features a single DDR3L SO-DIMM slot, a single SATA 3 Gb/s port, a single USB 3.0 SuperSpeed port, two USB 2.0 ports, HDMI display output, and stereo audio. Network connectivity includes gigabit Ethernet, 802.11 b/g/n WLAN, IrDA, and Bluetooth 4.0. The unit measures 116.6 x 112 x 55 mm, and features a VESA wall-mount, letting you latch it onto your monitor. Intel plans to sell it for US $139.

ASUS today announced Transformer Book Duet (TD300), the world's first quad-mode, dual-OS laptop and tablet convertible that allows users to switch between Windows and Android in either laptop or tablet modes with just a single push of the Instant Switch button or a virtual key on the tablet. With a powerful Intel Core i7 processor at its heart, Transformer Book Duet runs up to twice as fast as existing tablets based on ARM processors. ASUS SonicMaster technology and dual speakers ensure that Transformer Book Duet delivers incredible audio for immersive entertainment.

Quad-mode, dual-OS laptop and tablet with Instant Switch
ASUS Transformer Book Duet (TD300) is an extremely capable device that is able to function as an Android or Windows 8.1 tablet or notebook. Users can simply switch operating systems with a single push of the Instant Switch button or a virtual key on the tablet.

CMTL, Computer Memory Test Labs, the industry's leading independent memory compatibility and functionality testing lab announced today that G.Skill's 4 GB and 8 GB 1866MHz DDR3L (low voltage, 1.35v) SO-DIMMs have received Advanced Tested certification on the Intel NUC D53427RKE platform with i5 Ivy Bridge processor.

CMTL's President, John Deters stated, "Having high speed G.Skill SO-DIMMs Advanced Tested on the D53427RKE platform is great news for the Intel NUC customer base. The Intel NUC form factor platform is really catching on in the industry based on the number of test requests we are receiving. The NUC D53427RKE with G.Skill's 1866 MHz speed SO-DIMM provides a high performance system solution in a small compact form factor."

G.SKILL International Co. Ltd., the leading high performance memory designer and manufacturer, is expanding its Ripjaws SO-DIMM series DDR3L memory up to a staggering 2133 MHz. Meticulously designed to operate at a low voltage of 1.35V, this 4GBx2 memory kit will give your system a much needed performance boost!

1.35V Low Voltage for 4th Gen Intel Core i5 and i7 laptops
1.35V DDR3L SO-DIMM memory is the required and recommended standard for most new Intel Haswell laptop systems. The G.SKILL DDR3L 2133 MHz 1.35V kit is the perfect memory solution to boost your new laptop's performance while extending battery life.

Silicon Power, the world's leading provider of memory storage solutions, today unveils the latest memory module solution, DDR3L-1333 and DDR3L-1600 Low-Voltage Series. Running at 1.35 volts at 1333 MHz and 1600 MHz, the Low-Voltage series is able to decrease hardware power consumption effectively without compromising the benefit of the performance. Apart from saving power from long-term operations, it also reduces the unnecessary heat waste, allowing advanced gamers, video and photo professionals and DIY enthusiasts to create an eco-friendly working stations.

Silicon Power Low-Voltage DDR3L series comes in selections from UDIMM to SO-DIMM at 1333 MHz and 1600 MHz, providing desktop and notebook users to save energy up to 20% from the benefits of low energy consumption. Moreover, this series is compatible with the latest Intel Haswell platform, ideal for those who are looking for a greener and power-saving alternative while enjoying the ultimate system performance.

MSI, the leading brand of embedded computers recently released a new Mini-ITX embedded board that focuses on advanced POS application. Powered by the 4th Gen Intel Core processor, MS-98D3 brings the POS system to a new level with the capability of multiple processing covering front-end retailing to back-end management at the same time, while keeps the system active and prompt at both ends.

The fast growth of information technology and network communication has made POS no longer in the stereotype of a stand-alone cash register in a store or restaurant, processing simple ordering and checkout works. With increasing POS system connected to network, wireless, or cellular communication to form a networked or even cloud-based POS system, high-end POS host is required by the market. The MS-98D3 is an embedded board designed in response to this demand.

Other World Computing, the world's leading destination for cutting-edge and easy-to-install Mac and PC upgrades and accessories, announced the immediate availability of the OWC Memory Upgrade Kits from 8GB to 32GB for 2013 iMac 27" models that became available today. OWC's kits offer memory configurations not offered by the factory as well as savings of more than $240 compared to same-size factory options. Like all OWC Memory Upgrade Kits, a 'how-to' install video and OWC Lifetime warranty are included.

What it does: upgrading the memory of this iMac gives you more options and better performance. It's a low-cost improvement that gives Apple's latest OSX-including the upcoming Mavericks release-the space it needs for maximum performance. For hundreds less than what Apple charges, users can select an OWC upgrade to unlock the machine's true potential. Installation takes just a few minutes, and OWCs iMac Memory Upgrade Guide makes it easy to select the right memory for any Apple iMac model.

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, today announced the arrival of its 8 GB DDR3L-1600 Low Voltage 1.35V RDIMM memory module. Aimed at improving high performance data mining and big data analytics, the DDR3 Low Voltage RDIMM allows enterprises to address the challenges of server memory density, performance, and power consumption.

Strong demand for data center services continues to grow as more organizations are taking advantage of the huge and highly available computing and storage resources of cloud and virtualization systems. However, the success of implementing these technologies rests on the ability to quickly load applications and easily process information.

Crucial, a leading global brand of memory and server memory, today announced the 64 GB Crucial DDR3L Load-Reduced DIMMs (LRDIMMs) for servers, which enable more DIMMs per channel for up to twice the installed memory capacity per server. Additionally, these modules offer up to a 35 percent increase in memory bandwidth per server compared to standard DIMMs, and eliminate the channel ranking limitation of standard DDR3 registered DIMMs. The Crucial DDR3L LRDIMMs is designed for IT professionals that manage high-end server environments with demanding workloads.

The 64 GB Crucial DDR3L LRDIMMs operates using 1.35V, unlike the 1.5V common in DDR3 RDIMMs, making the new module more energy-efficient and cost-effective, especially in large deployments. Since Crucial LRDIMMs transmit power in a more efficient manner to the CPU (via the data path buffer), they use less voltage, which allows for additional power savings. These new memory modules are also compatible with OEM servers and warranties, allowing users to upgrade their existing server infrastructures without having to purchase an entirely new system. Crucial LRDIMMs fully support the latest Intel Xeon processor E5 family.

Razer, the world leader in high-performance gaming hardware, software and systems, announced that it is taking pre-orders for its new 14-inch Blade gaming laptop.

Powered by a 4th gen Intel Core i7 quad core processor with Hyper-Threading (Base 2.2 GHz/Turbo 3.2 GHz) and the latest NVIDIA GeForce GTX 765M GPU, the Blade is the thinnest and lightest 14-inch gaming laptop in history. Measuring in at just 0.66-inches thin, the Razer Blade packs more power-per-cubic-inch than any other laptop in the world. The Razer Blade utilizes solid-state storage technology with boot speeds of up to four-times faster than a traditional 5400-RPM notebook hard drive. The Razer Blade has a rigid all-aluminum chassis, with a stunning 14-inch LED-backlit HD+ display and features a custom-designed track pad and backlit gaming grade keyboard.

Transcend Information, Inc., a worldwide leader in storage and multimedia products, today announced the arrival of its 32GB DDR3 Load-Reduced DIMM (LRDIMM) memory module. An important component of today's powerful servers, LRDIMMs use a specially designed buffer to minimize the load on the server memory bus, allowing administrators to maximize memory capacity, increase performance, and reduce the power consumption of their systems.

In standard RDIMM technology, the data bus connects directly to the multiple ranks of DRAM chips on the module, which increases electrical load and limits system speed as more modules are added. In contrast, Transcend's DDR3 Low Voltage LRDIMMs feature a full memory buffer chip on the module, which acts as a go-between for all signals sent from the host to the DRAM chips, reducing the electrical load on all interfaces. Compared to standard RDIMMs or UDIMMs, a system using Transcend LRDIMMs can support more modules per channel and higher maximum memory capacity without sacrificing speed.

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, and TE Connectivity (TE), a world leader in connectivity, announced today the availability of a Single-Sided SODIMM and a low-profile single-sided, double data rate 3 (DDR3) SODIMM connector solution to take advantage of the burgeoning market for Ultrabook devices, convertibles, tablets and other thin and light devices. Aimed at providing a reduced-height memory solution for the ultrathin computing market, the new Single-Sided SODIMM, developed by Micron, has components on either the front or back side of the module, but not both. When paired with the single-sided DDR3 SODIMM connector from TE, the total z-height of the overall solution from the motherboard is just 3mm, a 35 percent savings compared to 4.6 mm for a standard SODIMM solution.

Micron's Single-Sided SODIMM is available in a 4 GB, single-rank, x8 configuration. In addition to a reduced height, this new module is built using 30nm DDR3L-RS components that consume less power in standby compared to standard DDR3. Additionally, Single-Sided SODIMMs are pin-to-pin compatible with current DDR3 modules, making them backward compatible with existing DDR3 SODIMM connectors.

Intel's next-generation Atom processor platform, codenamed "Bay Trail" doesn't arrive before 2014, but that's not enough to stop the company from talking at great lengths about it. A new presentation intended for Intel's pals in the PC industry was leaked on German tech-forum 3DCenter.org, and reveals quite a bit more about the platform than the Bay Trail-T we already know about.

The first two slides (below) detail key scoring points of the platform over its predecessor, the "Cedar Trail." These include a true single-chip SoC (with complete integration of the chipset into the processor die), being built on the 22 nm Tri-gate transistor fab process, up to four x86-64 cores with out-of-order execution capabilities, 7th generation Intel graphics that features DirectX 11 and supports resolutions as high as 2560 x 1600 pixels, a native USB 3.0 controller, and support for DDR3L memory, that allows device makers to do away with DIMM/SO-DIMM modules to conserve board foot-print, using smaller, space-optimized DRAM chips on the main PCB.

To address the significant increase in data over the next 10-15 years, and the demand for more energy-efficient network infrastructure and servers, ARM has announced the ARM CoreLink CCN-504 cache coherent network. This advanced system intellectual property (IP) can deliver up to one terabit of usable system bandwidth per second. It will enable SoC designers to provide high-performance, cache coherent interconnect for 'many-core' enterprise solutions built using the ARM Cortex-A15 MPCore processor and next-generation 64-bit processors.

LSI, a leading designer of intelligent semiconductors that accelerate storage, mobile networking and client computing, and Calxeda, an innovative supplier of disruptive SoC technology for the server market, are lead licensees for the CoreLink CCN-504 launch.

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today announced high-volume availability of 30-nanometer (nm) reduced-power DDR3L-RS SDRAM for ultrathin computing devices and tablets. The 2-gigabit (Gb) and 4 Gb solutions reduce power consumption in standby to provide longer battery life, while maintaining the high performance and cost effectiveness of PC DRAM.

"Micron has been one of the leaders in the development and commercialization of DDR3L-RS and the introduction of its 30 nm product is confirmation of this," said Mike Howard, senior principal analyst, DRAM and Memory at IHS iSuppli. "DDR3L-RS is an excellent option for customers who have tight power budgets and need high performance at a competitive price. We expect many of the next-generation ultrathin platforms to take advantage of DDR3L-RS."

SK Hynix announced that it has introduced DDR3L-RS (Reduced Standby) DRAM for mobile solutions using its 20nm class technology. This product significantly reduces the standby power consumption.

By using cutting-edge 20nm class technology and efficiently managing standby current, this DDR3L-RS product reduces 70% of standby power compared to existing DDR3L DRAM while it maintains DDR3L performance. DDR3L DRAM which has recently gone mainstream works at 1.35V, while DDR3 DRAM does at 1.5V.

You could soon have NVIDIA Tegra 3 processors running entry-level PCs. COM (computer-on-module) and IPC (industrial PC) designer Kontron developed an NVIDIA Tegra 3 system board in the slim mini-ITX form-factor (170 mm x 170 mm), which is compatible with most ITX/ATX cases. The board has most common PC peripheral interfaces, and is fit to drive an entry-level PC. The KTT30/mITX from Kontron features an NVIDIA Tegra 3 SoC, with 4+1 ARM Cortex-A9 cores clocked at 900 MHz and GeForce ULP graphics. The GPU is fit to drive 1080p displays with H264 MPEG-4 encoding/decoding acceleration. Display outputs include HDMI 1.4a (up to 1920x1080 pixels), and LVDS 24-bit (up to 2048x1536 pixel @ 18bpp).

The Kontron KTT30/mITX packs 2 GB of DDR3L memory. For storage, it has an mSATA 3 Gb/s port, two SD card slots, and a bootable eMMC slot. Two mPCIe slots and a SIM card slot (for 3G HSDPA) handle on-board expansion. System interfaces include two RS232 (serial/COM), three USB 2.0. Apart from 3G HSDPA, the board supports gigabit Ethernet. For audio, there's 2-channel analog and multi-channel digital (S/PDIF) audio outputs. The board draws power from a 2-pin DC input. The board should be able to run most distributions of Linux for ARM (including Android and Chrome OS), and technically should also be able to run the upcoming Microsoft Windows 8 RT operating system.

The Panasonic Toughbook CF-19 has transformed the way professionals work in field utilities, emergency services, defence, transport maintenance and a huge range of field services by providing access to data and applications, wherever and whenever they need it. This latest device will mark a decade for the product line of market-leading rugged convertible notebooks, enabling customers to benefit from the latest design and technology enhancements whilst continuing to use the wide range of peripherals built around the range, such as docking stations and car mounts.

The new Toughbook CF-19 includes the 3rd generation Intel Core i5 Processor & Chipset. The high performance Intel Core i5-3320 vPro (2.60 GHz, up to 3.30 GHz with Intel Turbo Boost Technology) standard voltage processor with Intel HD 4000 graphics, ensures the device is capable of handling the most intensive applications. To ensure reliability in the most challenging environments, the CF-19 remains unique in the market with its fan less design; instead using Panasonic energy optimisation and optimised heat pipes to cool the full performance, standard voltage CPU.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today launched a new line of DDR3L ECC SO-DIMM server memory modules, boasting low voltage, large densities, and rapid processing capability. They are designed and engineered especially for cloud computing solutions, and can greatly minimize the power consumption of a wide range of network systems.

A new kind of server is becoming increasingly needed for website hosting and mission critical applications. Micro-servers are a new type of server suited for the special workloads of data centers. Starting in the second half of 2009, many large data centers and information service suppliers have begun to use micro-servers. Micro-servers are taking an increasingly important role in small site dedicated hosting, lightweight web serving, and simple content delivery. Many semiconductor manufacturers have announced plans to enter the micro-server market, and are expected to release new low-power processors for use with high density servers.

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, is proud to announce its launch of 16 GB DDR3-1600 Registered DIMM (RDIMM) and 8GB DDR3L-1333 Low Voltage RDIMM modules. Fully compatible with the latest generation of Intel Xeon and Core i7 processors, the cost-effective DDR3 memory modules provide increased memory density and higher performance, while significantly reducing power consumption.

As Transcend's highest density DDR3 module, the 16GB DDR3-1600 RDIMM is constructed with top quality 4 Gb DDR3 1 Gbx4 35nm DRAM chips that deliver stable performance and durability. A single 16 GB memory module can lower power consumption by a staggering 75% compared with using four 4 GB modules, thereby saving energy and costs. The 16GB DDR3 module is rated at 1600 MHz with low latency of 11-11-11-28 and an operating voltage of a mere 1.5V. Offering memory bandwidth up to 12.8 GB/s and the flexibility to expand maximum capacity to 96 GB (per processor), the 16GB DDR3-1600 RDIMM module allows administrators to create a robust infrastructure that runs memory-intensive applications such as virtualization and cloud computing with ease.