News Posts matching "DDR4"

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G.SKILL Announces DDR4-4266 64GB (8x8GB) and DDR4-4000 128GB (8x16GB) Memory Kits

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce two world-class extreme speed high capacity memory kits - DDR4-4266 64GB (8x8GB) and DDR4-4000 128GB (8x16GB) for the latest Intel Core X-series processors and X299 motherboards. Both kits are equipped with high performance Samsung B-die ICs and are validated on the ASUS PRIME X299-DELUXE II motherboard with the Intel Core i9-9920X and Core i7-9800X processors, respectively.

Dedicated to developing faster overclocking memory, G.SKILL is bringing 128GB capacity kits to the speed class of DDR4-4000, while maintaining an ultra-efficient CL19-19-19-39 CAS latency and 1.35V low voltage. It is the ultimate memory solution for building a super performance computer combining the highest capacity and extreme speed. This kit will join the G.SKILL Trident Z RGB family and has been validated on the ASUS PRIME X299-DELUXE II motherboard and with the latest Intel Core i7-9800X processor. The following screenshot shows the stress test result: (Note: Please refer to the "Specification" field of the CPU tab for the correct CPU model name.)

Intel Puts Out Additional "Cascade Lake" Performance Numbers

Intel late last week put out additional real-world HPC and AI compute performance numbers of its upcoming "Cascade Lake" 2x 48-core (96 cores in total) machine, compared to AMD's EPYC 7601 2x 32-core (64 cores in total) machine. You'll recall that on November 5th, the company put out Linpack, System Triad, and Deep Learning Inference numbers, which are all synthetic benchmarks. In a new set of slides, the company revealed a few real-world HPC/AI application performance numbers, including MIMD Lattice Computation (MILC), Weather Research and Forecasting (WRF), OpenFOAM, NAMD scalable molecular dynamics, and YaSK.

The Intel 96-core setup with 12-channel memory interface belts out up to 1.5X performance in MILC, up to 1.6X in WRF and OpenFOAM, up to 2.1X in NAMD, and up to 3.1X in YASK, compared to an AMD EPYC 7601 2P machine. The company also put out system configuration and disclaimer slides with the usual forward-looking CYA. "Cascake Lake" will be Intel's main competitor to AMD's EPYC "Rome" 64-core 4P-capable processor that comes out by the end of 2018. Intel's product is a multi-chip module of two 24~28 core dies, with a 2x 6-channel DDR4 memory interface.

SK Hynix Develops 10 nm-class 8 Gb DDR4 DRAM

SK Hynix Inc. announced that it has developed 1Ynm 8Gb (Gigabits) DDR4 (Double Data Rate 4) DRAM. The productivity of this product is increased by 20% and the power consumption reduced by more than 15%, compared to the previous generation, 1Xnm DRAM. It also supports a data transfer rate of up to 3,200Mbps, which is the fastest data processing speed in DDR4 interface. The Company adopted a '4-Phase Clocking' scheme, which doubles the clock signal to boost data transfer speed and stability.

SK Hynix also introduced its own 'Sense Amp. Control' technology to reduce power consumption and data errors. With this technology, the Company successfully enhanced the performance of the sense amplifier. SK Hynix improved the transistor structure to lower the possibility of data errors, a challenge that accompanies technology shrink. The Company also added a low-power power supply to the circuit to prevent unnecessary power consumption.

Micron Announces Mass Production of Industry's Highest-Capacity Monolithic Memory

Micron Technology, Inc., today announced that it has begun mass production of the industry's highest-capacity and first monolithic 12Gb low-power double data rate 4x (LPDDR4x) DRAM for mobile devices and applications. This latest generation of Micron's LPDDR4 memory brings key improvements in power consumption while maintaining the industry's fastest LPDDR4 clock speeds, thereby delivering advanced performance for next-generation mobile handsets and tablets. In addition, Micron's 12Gb LPDDR4x doubles memory capacity to offer the industry's highest-capacity monolithic LPDDR4 without increasing the footprint compared to the previous generation product.

The exponential increase in usage of compute and data-intensive mobile applications such as artificial intelligence (AI), augmented reality (AR) and 4K video has been accompanied with demands by mobile users to maximize battery life and performance and increase capacity. Next-generation mobile devices that integrate multiple high-resolution cameras and increasingly use AI for image optimization also require higher DRAM capacities to support these features.

As the industry transitions towards deployment of 5G mobile technology, the memory subsystem in mobile handsets will have to support these dramatically higher data rates and the associated processing of data in real-time. New applications built upon 5G technology will also be able to leverage the increased capabilities of the memory subsystem to enable new and immersive user experiences.

AMD Zen 2 "Rome" MCM Pictured Up Close

Here is the clearest picture of AMD "Rome," codename for the company's next-generation EPYC socket SP3r2 processor, which is a multi-chip module of 9 chiplets (up from four). While first-generation EPYC MCMs (and Ryzen Threadripper) were essentially "4P-on-a-stick," the new "Rome" MCM takes the concept further, by introducing a new centralized uncore component called the I/O die. Up to eight 7 nm "Zen 2" CPU dies surround this large 14 nm die, and connect to it via substrate, using InfinityFabric, without needing a silicon interposer. Each CPU chiplet features 8 cores, and hence we have 64 cores in total.

The CPU dies themselves are significantly smaller than current-generation "Zeppelin" dies, although looking at their size, we're not sure if they're packing disabled integrated memory controllers or PCIe roots anymore. While the transition to 7 nm can be expected to significantly reduce die size, groups of two dies appear to be making up the die-area of a single "Zeppelin." It's possible that the CPU chiplets in "Rome" physically lack an integrated northbridge and southbridge, and only feature a broad InfinityFabric interface. The I/O die handles memory, PCIe, and southbridge functions, featuring an 8-channel DDR4 memory interface that's as monolithic as Intel's implementations, a PCI-Express gen 4.0 root-complex, and other I/O.

AMD Unveils "Zen 2" CPU Architecture and 7 nm Vega Radeon Instinct MI60 at New Horizon

AMD today held its "New Horizon" event for investors, offering guidance and "color" on what the company's near-future could look like. At the event, the company formally launched its Radeon Instinct MI60 GPU-based compute accelerator; and disclosed a few interesting tidbits on its next-generation "Zen 2" mircroarchitecture. The Instinct MI60 is the world's first GPU built on the 7 nanometer silicon fabrication process, and among the first commercially available products built on 7 nm. "Rome" is on track to becoming the first 7 nm processor, and is based on the Zen 2 architecture.

The Radeon Instinct MI60 is based on a 7 nm rendition of the "Vega" architecture. It is not an optical shrink of "Vega 10," and could have more number-crunching machinery, and an HBM2 memory interface that's twice as wide that can hold double the memory. It also features on-die logic that gives it hardware virtualization, which could be a boon for cloud-computing providers.

Intel Announces Cascade Lake Advanced Performance and Xeon E-2100

Intel today announced two new members of its Intel Xeon processor portfolio: Cascade Lake advanced performance (expected to be released the first half of 2019) and the Intel Xeon E-2100 processor for entry-level servers (general availability today). These two new product families build upon Intel's foundation of 20 years of Intel Xeon platform leadership and give customers even more flexibility to pick the right solution for their needs.

"We remain highly focused on delivering a wide range of workload-optimized solutions that best meet our customers' system requirements. The addition of Cascade Lake advanced performance CPUs and Xeon E-2100 processors to our Intel Xeon processor lineup once again demonstrates our commitment to delivering performance-optimized solutions to a wide range of customers," said Lisa Spelman, Intel vice president and general manager of Intel Xeon products and data center marketing.

GIGABYTE Launches the Z390 Designare Motherboard

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, announced the release of the Z390 DESIGNARE motherboard with full support for the newest 8-core Intel Core i9-9900K processors. The newest addition to the GIGABYTE DESIGNARE series is a feature-packed motherboard that provides content creators the fastest and most efficient tools to showcase their creativity and craftsmanship. GIGABYTE DESIGNARE Series motherboards bring out the best in workstation graphics cards, maximize M.2 SSD and DDR4 RAM performance, and fully support powerful CPUs such as the newest 8-core Intel Core i9-9900K CPU. With built in USB Type-C Thunderbolt , and native USB 3.1 Gen 2 to provide 40Gb/s transmission speed, the board is designed with effective storage performance as a key feature. GIGABYTE Ultra-Durable Technology and exclusive software also bring additional value for digital content creators and design professionals.

"Today's content creators are seeking faster and more efficient performance from their PCs. GIGABYTE created the DESIGNARE series a few years back to fulfill these user demands," stated Jackson Hsu, Deputy Director of the GIGABYTE Channel Solutions Product Development Division. "Z390 DESIGNARE is the newest addition to this constantly evolving content creation focused series and is loaded with features that enable content creators to express their artistic creativity through their PCs with excellent performance and efficiency."

ADATA Launches XPG SX8200 Pro SSD, GAMMIX S5 SSD, and GAMMIX D30 DDR4 Memory

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash products, today announces a new line up of gaming hardware including the XPG SX8200 ProM.2 2280 SSD, GAMMIX S5 PCIe Gen3x4 M.2 2280 SSD, and GAMMIX D30 DDR4 memory module.

The SX8200 Pro M.2 2280 SSD is XPG's fastest SSD to date and is designed for avid PC enthusiasts, gamers, and overclockers. It features an ultra-fast PCIe Gen3x4 interface that offers sustained peak read/write speeds of 3500/3000MB/s, outpacing SATA 6Gb/s by a wide margin. Supporting NVMe 1.3, the SX8200 Pro delivers excellent random read/write performance of 390K/380K IOPS. With SLC caching, DRAM cache buffer, E2E Data Protection, and LDPC ECC, it maintains high speeds and data integrity, even during highly intensive applications such as gaming, rendering, and overclocking.

Silicon Power Launches New Gaming Solutions

Silicon Power (SP) introduced the XPOWER line of gaming DDR4 memory modules today. The XPOWER AirCool and Turbine DDR4 are designed and engineered to handle complex computing tasks with ease and ensure the most realistic picture quality, higher resolutions, and smoother 3D renders and transitions for gamers and modders. With the rising popularity of role-playing, first-person shooter, and massively multiplayer online games like PUBG and StarCraft, SP aims to give its customers the best memory upgrade user experience.

The high-quality RAMs feature speeds up to 4133 MHz at a low 1.4V power consumption. Designed to support the most dedicated gamers and modders, the XPOWER AirCool and Turbine DDR4 are the premier choices for a powerful and affordable memory upgrade. Both The XPOWER AirCool and Turbine DDR4 combine performance with compatibility and are both 100% tested for stability, durability, and compatibility in a range of rigs. As an added plus to kickstart a bold new direction for the memory storage company, SP has added a cool blue heat sink to the Turbine memory module to keep gamers safe from overheating complications.

Intel 9th Gen LGA1151 Processors Support Up to 128GB of Memory

Intel's 6-core "Coffee Lake" die was essentially a "Kaby Lake" die with two extra cores, and no physical changes to other components, such as iGPU or uncore. With its new 8-core "Coffee Lake" Refresh silicon, Intel has turned its attention to not just increasing the core-count, but also improving the processor's integrated memory controller, in addition to hardware fixes to certain security vulnerabilities. The 128-bit wide (dual-channel) integrated memory controller now supports up to 128 GB of memory. Intel's current DDR4-capable mainstream desktop processors only support up to 64 GB, as do rival AMD's Ryzen socket AM4 processors.

Support for up to 128 GB explains the emergence of off-spec memory standards such as ASUS' Double Capacity (DC) DIMMs. Samsung is ready with a JEDEC-compliant 32 GB dual-rank UDIMM memory module for client platforms. Introduction of 32 GB UDIMMs also comes amidst reports of DRAM pricing cool-off through 2019, which could make 32 GB dual-channel memory kits consisting of two 16 GB UDIMMs more affordable. The increase in maximum memory amount could also indicate Intel's seriousness to introduce 3D Xpoint-based Optane Persistent Memory modules as alternatives to DRAM-based main memory, with higher capacities compensating for worse latencies and data-rates compared to DRAM.

HyperX Ships 60 Million Memory Modules

As HyperX begins shipping Cloud Mix , its first Bluetooth-enabled gaming and lifestyle headset this month, the gaming division of Kingston Technology Company, Inc. today announced that since its inception in 2002, it has shipped over 60 million memory modules, billions of bytes of memory. Chosen by OEMs, PC builders, overclockers, and the gaming community, HyperX has steadily grown as the largest independent gaming memory module manufacturer and performance leader. With this major milestone and the growth in sales of headsets, keyboards and mice, HyperX is projected to exceed $550 million in total revenue for branded products in 2018.

Since HyperX launched 16 years ago, it has increasingly expanded its product line and market reach. The HyperX brand is not only recognized for delivering high quality memory products, but also as a peripherals leader, providing gaming headsets, keyboards, mice, and mousepads to gamers across the globe. The HyperX Engineering Labs and engineering team is committed to developing technology to bring new performance memory products to the PC, mini-PC and notebook markets. HyperX provides a variety of memory solutions, including Predator DIMMs for high performance PC builds, FURY DIMMs for gamers building affordable PCs, and Impact SODIMMs for notebook updates and system builds.

GIGABYTE Intros DDR4 Memory Modules with Chunkier Heatspreaders

GIGABYTE expanded its teething DDR4 memory lineup with a new 16 GB (2x 8 GB) dual-channel DDR4 memory kit, called simply "GIGABYTE Memory 2666MHz." These modules lack the Aorus branding featured on the company's very first DDR4 modules. You instead get 32 mm tall, 7 mm-thick modules with a restrained design, and plain GIGABYTE branding.

One area where the company refined its design is the heatspreaders, which are thicker, and have more mass to them, even if they lack finnage. GIGABYTE's module does what it says on the tin - DDR4-2666 with 16-16-16-35 timings, at 1.2 Volts. Out of the box, it packs both JEDEC and XMP SPD profiles. Memory controllers that support DDR4-2666 (such as Intel "Coffee Lake" and later), should run it at the advertised speeds without any user intervention. For older platforms, an XMP 2.0 profile helps achieve the advertised settings. The modules are backed by lifetime warranty.

ZADAK Shield 32 GB DIMMs are Double Height, DDR4-3600 with RGB Support

ZADAK announces the very first double capacity DDR4 featuring personalized AURA2 RGB lighting which was built ahead of many competitors, the SHIELD DC(Double Capacity) DDR4. Co-developed with ASUS ROG team, it amazingly supports small form factor motherboards of Intel Z390 including ROG MAXIMUS XI APEX, MAXIMUS XI GENE, and ROG STRIX Z390-I Gaming. With the whole new architecture, it achieves not only double capacity of 32GB for single slot, but also high frequency of 3600MHz with impressive stability. Such a widely praised high-end memory module in the PC world comes along once in a lifetime.

G.SKILL Also Announces DDR4-4800 16GB (2x8GB) and DDR4-4500 32GB (4x8GB) Kits For Intel Z390 Motherboards

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, demonstrates two extreme DDR4 RGB specifications on the latest Intel Z390 chipset, including DDR4-4800MHz CL19 16GB (2x8GB) and DDR4-4500MHz CL19 32GB (4x8GB). Both kits are built with high performance Samsung DDR4 B-die ICs and provide the fastest XMP speed of each capacity configuration.

G.SKILL Announces Double Capacity DDR4 with Trident Z RGB DC Series 32GBx2 Memory Kits

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce Trident Z RGB DC series DDR4 64GB (32GBx2) memory kits. Utilizing the latest Double Capacity DIMM technology closely developed with ASUS, the Trident Z RGB DC series DDR4 memory is able to provide double the maximum capacity of DDR4 UDIMM modules on select ASUS Z390 chipset motherboards.

MSI Shows Off A Plethora of Next Gen Z390 Motherboards and Features

In a recent live stream, MSI gave a sneak peek at their next generation of motherboards. The first one shown was a new red and black themed Gaming Plus model reminiscent of the early days in the MSI Gaming brand. It features a few quality of life improvements one of which is an enlarged PCIe latch making GPU removal a bit easier in cramped environments or when you happen to have a beefy air cooler. Keep out zones were also highlighted on the back of the motherboard giving users a visual cue to make sure other components, standoffs, screws etc do not come into contact with those particular regions. Furthermore, they also included an angled slot in the board's design for easier access to both the SATA ports and USB 3.0.

COLORFUL Announces New iGame D-RAM DDR4 Gaming Memory

Colorful Technology Company Limited, professional manufacturer of graphics cards, motherboards and high-performance storage solutions is proud to announce the launch of its latest product to be part of its illustrious iGame series of high-performance parts. The new iGame DDR4 memory features speeds up to DDR4-3200 and sports the new, custom heatspreader from COLORFUL which fits in the iGame series theme. The new iGame memory features RGB lighting and supports for ASUS AURA Sync controls so you can customize the lighting to your personal style.

COLORFUL has designed the iGame DDR4 memory to compliment the full line of COLORFUL iGame products. Its heatspreaders feature an aggressive, gamer styling featuring the new iGame logo. Across the top is the lighting module capable of RGB lighting to give users full control of what they want their memories to look. The heatspreaders also add great cooling to the product ensuring consistent and reliable performance even in under instense gaming load.

ASUS DDR4 "Double Capacity DIMM" Form-factor a Workaround to Low DRAM Chip Densities

32-gigabyte DDR4 UDIMMs are a reality. Samsung recently announced the development of a 32 GB DDR4 dual-rank UDIMM, using higher density DRAM chips. Those chips, however, are unlikely to be available anytime soon, compounded by Samsung's reported scumbaggery in the making. In the midst of all this, motherboard major ASUS designed its own non-JEDEC UDIMM standard, called "Double Capacity DIMM" or DC DIMM, with the likes of G.Skill and Zadak designing the first models. The utility of these modules is to max out the CPU memory controller's limit despite having fewer memory slots on the motherboard. Possible use-cases include LGA1151 mini-ITX motherboards with just one slot per memory channel (2 slots in all), or certain LGA2066 boards with just four slots (one slot per channel).

There is no word on the memory chip configuration modules, but it's highly likely they are dual-rank. The first DDR4 DC modules could be 32 GB, letting you max out the memory controller limit of 8th gen and 9th gen Core processors with just two modules. ASUS is heavily marketing this standard with its upcoming motherboards based on Intel's Z390 Express chipset, so it remains to be seen if other ASUS motherboards (or other motherboards in general) support the standard. Ironically, the Zadak-made module shown in ASUS marketing materials use DRAM chips made by Samsung.

AMD Announces "Zen" Based Athlon and 2nd Gen Ryzen PRO Desktop Processors

AMD today announced a reimagined family of AMD Athlon desktop processors with Radeon Vega graphics that have been optimized for everyday PC users: the AMD Athlon 200GE, Athlon 220GE, and Athlon 240GE processor. Combining the high-performance x86 "Zen" core and "Vega"] graphics architectures in a versatile System-on-Chip (SOC) design, the Athlon desktop processors offer responsive and reliable computing for a wide range of experiences, from day-to-day needs like web browsing and video streaming through more advanced workloads like high-definition PC gaming. Complementing this news, AMD announced the availability of the commercial-grade Athlon PRO 200GE desktop processor, along with three 2nd Gen Ryzen PRO desktop processor models for the commercial, enterprise, and the public sector: the Ryzen 7 PRO 2700X, Ryzen 7 PRO 2700, and Ryzen 5 PRO 2600 processors. With these new introductions, AMD now offers a top-to-bottom line-up of professional-grade computing solutions for experiences that range from premium content creation to advanced multitasking and office productivity.

"We are proud to expand our successful "Zen" core-based consumer and commercial product portfolios today with the addition of AMD Athlon, AMD Athlon PRO, and 2nd Gen AMD Ryzen PRO desktop processors. The new Athlon desktop processors, now incorporating the advanced "Zen" core and "Vega"3 graphics architectures, energize a legendary processor brand in AMD Athlon - a brand that consumers and PC enthusiasts alike trusted throughout nearly two decades of innovation," said Saeid Moshkelani, senior vice president and general manager, Client Compute, AMD. "Additionally, we are continuing to offer business PC users more processing power than we ever have before with the launch of 2nd Gen Ryzen PRO desktop processors into the commercial market."

Samsung Ready with 32GB DDR4 UDIMMs for Desktops, Paving the Way for 16GB Single-Rank

Samsung is ready with a 32 GB DDR4 UDIMM (unbuffered DIMMs) targeted at desktops. Dual-channel kits with these modules could let you max out the 64 GB memory limit of today's mainstream desktop processors, and 128 GB limits of Intel's Core X HEDT processors, with quad-channel kits. AMD's Ryzen Threadripper processors are advertised to support up to 2 TB of memory (including ECC support), so it should finally be possible to pack up to 256 GB of memory on Threadripper-powered machines.

The new M378A4G43MB1-CTD DDR4 UDIMM from Samsung is, unsurprisingly, a dual-rank module (x8 / x16 Organization or up to 2 ranks per DIMM and 2DPC configuration). It ticks at DDR4-2666 at a module voltage of 1.2 V. The module itself won't be much to look at, with a green PCB and bare-naked DRAM chips. It is is currently sampling to PC OEMs. It could also be possible for more popular memory manufacturers to get in touch with Samsung for the DRAM chips that make up this module. A single-rank variant of this module could finally make it possible for AMD Ryzen AM4 machines to have 32 GB of dual-channel memory at acceptably high memory clocks.

ASRock Intros X370 Pro BTC+ Motherboard

Cryptocurrency mining rig motherboards have, until now, mostly been based on the Intel platform because Intel chipsets put out more PCIe lanes than AMD ones, and because Intel's sub-$100 Pentium/Celeron chips don't have narrower PCIe connectivity from the CPU. ASRock apparently has a lot of unsold AMD X370 chipset inventory, and with the possible introduction of sub-$100 Ryzen chips that have 28 PCIe lanes from the CPU, a use-case has emerged for a mining motherboard based on this platform. We hence have the X370 Pro BTC+. The board features an AM4 socket, with out of the box support for "Pinnacle Ridge" processors. The socket is wired to just one DDR4 DIMM slot, but all eight PCI-Express 3.0 x16 slots.

The topmost x16 slot runs at electrical gen 3.0 x4, while the remaining seven slots are gen 3.0 x1, taking advantage of PCIe segmentation of the X370 platform. The board draws power from three 24-pin ATX, 8+4 pin EPS, and a number of Molex outputs, although most of these power connectors are optional. A point to note here is that the D-sub/HDMI display outputs only work if an A-series "Bristol Ridge" or Ryzen "Raven Ridge" APU is used (which have fewer PCIe lanes), so you're bound to take display output from one of the 8 graphics cards. A 1 GbE interface and two USB 3.0 ports make for the rest of it.

GIGABYTE Intros B450-I Aorus Pro WiFi Motherboard

GIGABYTE introduced an Aorus-branded, quasi-premium mini-ITX motherboard based on AMD B450 chipset, for socket AM4 processors, the B450-I Aorus Pro WiFi. The board draws power from a combination of 24-pin ATX and 8-pin EPS, conditioning it for the SoC with a lean 4+2 phase VRM. The AM4 SoC is wired to two DDR4 DIMM slots, supporting up to 32 GB of dual-channel DDR4 memory; and the board's lone PCI-Express 3.0 x16 slot.

Storage connectivity on the B450-I Aorus Pro WiFi includes an M.2-2280 slot with PCI-Express 3.0 x4 and SATA 6 Gbps wiring; and four SATA 6 Gbps ports. USB connectivity includes six USB 3.0 ports (four on the rear panel, two by headers); and two USB 3.1 gen 2 (both on the rear panel). With just 6-channel jacks, the onboard audio solution may look cheap, but is redeemed by Realtek ALC1220 CODEC. The Intel 9260 adapter is at the helm of wireless networking, with 802.11ac + Bluetooth 5.0, while GbE is handled by Intel i211AT. There's also some RGB LED fun to be had, with two 4-pin ARGB headers, and a small 8-pixel diffuser behind the PCB. GIGABYTE could price this board around $120.

MSI Announces the MEG X399 Creation Motherboard

MSI today announced the MEG X399 Creation, its flagship socket TR4 motherboard, with out of the box support for 2nd generation AMD Ryzen Threadripper 2000 processors. The company showed off this board at the 2018 Computex, held this June. Although built in the ATX form-factor, this board is recommended only for EATX-capable cases. The highlight of this board is its gargantuan 19-phase CPU VRM that's optimized for overclocking event the 32-core Threadripper 2990WX. The board draws power from a combination of 24-pin ATX, two 8-pin EPS, and an optional 4-pin Molex. Heat drawn from the CPU VRM MOSFETS is dissipated not just by a large heatsink that spans almost the entire width of the board, but also a secondary heatsink cooling the SoC phases, via a heat-pipe. The huge chipset heatsink cools not just the X399 chipset, but also three M.2-NVMe slots (two M.2-22110 and one M.2-2280). You get 4 more M.2-2280 slots over the new M.2-Xpander Aero, which is a PCI-Express 3.0 x16 riser card that converts the slot to four M.2-2280 slots with x4 wiring, ventilating them with a 100 mm fan. It ends up looking like a graphics card in doing so.

Expansion includes eight DDR4 DIMM slots supporting up to 2048 GB of DDR4 ECC memory; four PCI-Express 3.0 x16 slots (full-time x16/x8/x16/x4), and an x1. Storage connectivity includes 7 M.2-NVMe slots (3 onboard, 4 via the included M.2-Xpander Aero accessory); and eight SATA 6 Gbps ports. Connectivity includes MSI's highest-grade onboard audio solution combining an ALC1220 with a headphones amplifier, and audio-grade capacitors; and two 1 GbE interfaces driven by Intel i219-V controllers (10 GbE is a notable absentee); and 802.11ac + BT 5.0 WLAN. You get 10 USB 3.1 ports on the rear panel (including a type-C port), and four USB 3.1 ports via front-panel headers). RGB LED diffusers dot the rear I/O shroud, the chipset heatsink, and the reverse side of the PCB. The board is expected to be priced around $500.

Intel "Crimson Canyon" NUCs with Discrete GPUs Up for Pre-order

One of the first Intel NUC (next unit of computing) mini PCs to feature completely discrete GPUs (and not MCMs of CPUs and GPUs), the "Crimson Canyon" NUC8i3CYSM and NUC8i3CYSN, are up for pre-order. The former is priced at USD $529, while the latter goes for $574. The two combine Intel's 10 nm Core i3-8121U "Cannon Lake" SoC with AMD Radeon 540 discrete GPU. Unlike the "Hades Canyon" NUC, which features an MCM with a powerful AMD Radeon Vega M GPU die and a quad-core "Kaby Lake" CPU die; the "Crimson Canyon" features its processor and GPU on separate packages. The Radeon 540 packs 512 stream processors, 32 TMUs, and 16 ROPs; with 2 GB of GDDR5 memory.

All that's differentiating the NUC8i3CYSM from the NUC8i3CYSN is memory. You get 4 GB of LPDDR4 memory with the former, and 8 GB of it with the latter. Both units come with a 2.5-inch 1 TB HDD pre-installed. You also get an M.2-2280 slot with PCIe 3.0 x4 wiring, and support for Optane caching. Intel Wireless-AC 9560 WLAN card handles wireless networking, while an i219-V handles wired. Connectivity includes four USB 3.0 type-A ports, one of which has high current; an SDXC card reader, CIR, two HDMI 2.0 outputs, and 7.1-channel HD audio. The NUC has certainly grown in size over the years. This one measures 117 mm x 112 mm x 52 mm (WxDxH). An external 90W power-brick adds to the bulk.
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