News Posts matching #DDR4

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GIGABYTE Updates the Brix Lineup with 10th Generation Comet Lake CPUs

GIGABYTE has updated its Brix lineup of Mini-PCs with Intel's latest and greatest 10th generation Comet Lake mobile CPUs. Measuring 46.8 x 119.5 x 119.5 mm, the Brix mini PC is a small form factor machine with its 0,6-liter size. If anyone thinks that power is proportional to the size of a PC, the GIGABYTE Brix is here to prove them wrong. Available in four variants that differ only in CPU that is soldered inside, you can get anything from a dual-core Intel Core i3-10110U, all the way up to six-core Core i7-10710U CPU powerhouse. These CPUs are 15 W TDP models, so even though the Brix is small, its cooling solution should be able to handle the heat.

The Brix Mini-PC comes with a mounting bracket for 75 x 75 mm and 100 x 100 mm VESA mounts, meaning that you can place it behind a monitor. Storage options are limited to one 2.5-inch drive that can be up to 9.5 mm thick. For RAM, the Brix is using two SO-DIMM slots that can support up to 64 GB of DDR4 2666 MHz RAM. When it comes to connectivity options, GIGABYTE has equipped the Brix with Intel Dual Band Wireless-AC 3168 wireless adapter providing Bluetooth 4.2 and WiFi 802.11ac connectivity. The IO options are somewhat decent as Brix has three USB 3.2 Gen 2 ports at the front, along with a USB Gen 2 Type-C connector and 3.5 mm headphone jack. On the back, there are two HDMI 2.0a ports for video output, two additional USC 3.2 Gen 2 ports, power input, and of course an RJ45 Ethernet connector.

GeIL Announces Availability of EVO SPEAR Phantom Gaming Edition Memory in the Americas

Golden Emperor International Ltd. - one of the world's leading PC components and peripheral manufacturers, is pleased to announce the EVO SPEAR Phantom Gaming Edition DDR4 Memory, GeIL and ASRock's co-branded DRAM, is now available at Newegg.com and select retailers in the Americas.

GeIL memory has joined forces with leading motherboard brand, ASRock, and its top-of-the-line Phantom Gaming Alliance. Through this partnership, GeIL and ASRock dedicated to building a strong foundation for compatibility and reliability between DRAM and motherboard. The EVO SPEAR Phantom Gaming Edition Memory is tested under the strict criteria and validation of the ASRock Phantom Gaming series motherboards. As an excellent result of the cooperation, exceptional stability has benefited. It's available in frequencies from 2400 MHz to 3200 MHz, capacity for 4 GB to 32 GB kit, and runs as low as 1.2 V and at max 1.35 V.

Zhaoxin KaiXian x86 Processor Now Commercially Available to the DIY Channel

Zhaoxin is a brand that makes multi-core 64-bit x86 processors primarily for use in Chinese state IT infrastructure. It's part of the Chinese Government's ambitious plan to make its IT hardware completely indigenous. Zhaoxin's x86-64 CPU cores are co-developed by licensee VIA, specifically its CenTaur subsidiary that's making NCORE AI-enabled x86 processors. The company's KaiXian KX-6780A processor is now commercially available in China to the DIY market in the form of motherboards with embedded processors.

The KaiXian KX-6780A features an 8-core/8-thread x86-64 CPU clocked up to 2.70 GHz, 8 MB of last-level cache, a dual-channel DDR4-3200 integrated memory controller, a PCI-Express gen 3.0 root-complex, and an iGPU possibly designed by VIA's S3 Graphics division, which supports basic display and DirectX 11.1 readiness. The CPU features modern ISA, with instruction sets that include AVX, AES-NI, SHA-NI, and VT-x comparable virtualization extensions. The chip has been fabricated on TSMC 16 nm FinFET process.

BIOSTAR Introduces RACING B450 GT3 Micro-ATX Motherboard

The RACING B450GT3 motherboard is built for gamers that require high-performance on a micro-ATX form factor. Fitted with the B450 chipset that supports AMD's Ryzen 3000 Series processors. The RACING B450GT3 motherboard is packed with loads of functions and features that are found in most high-end gaming AM4 motherboards and is designed with BIOSTAR's signature premium black Racing themed PCB style.

The RACING B450GT3 supports 4-DIMM DDR4-1866/2133/2400/2666/2933/3200 (OC) with up to 64G maximum capacity, 1x USB 3.2 Gen2 Type-C port (10 Gb/s), 1x USB 3.2 Gen2 Type-A port (10 Gb/s), 1x M.2 (32 Gb/s) and 6x SATA3 connectors. Gamers will also appreciate the Hi-Fi 7.1ch HD Audio for truly immersive sound quality that is enabled with the Realtek ALC1150 7.1-Channel Audio, Dual BIOS for auto-recovery, and Iron Slot Protection for a much more stable and durable port composition.

Razer at CES 2020: Kishi Mobile Controller, Tomahawk Gaming Desktop, and an Epic Sim

Razer had an interesting outing at CES 2020. There were no new PC gaming peripherals, other than Star Wars "storm trooper" co-branded Kraken, Goliathus, and Atheris; but three interesting exhibits. To begin with, Razer Kishi is an adjustable, split game controller for smartphones. The controller's two ends (meant for your left and right hands, wrap around the two ends of your smartphone. You get two analog thumbsticks, a D-pad, four action buttons, and four triggers. The Razer Gamepad app lets you map the controller to your smartphone over Bluetooth, and provides custom button mapping. The company also showed off Arctech line of smartphone sleeves that are designed to dissipate heat.

Having made its mark as a leading gaming notebook vendor, Razer is turning its attention to pre-built gaming desktops, and we saw one of its first creations, the Tomahawk SFF. Much like Apple, Razer has a serious focus on form as much as function, and that's evident with the aluminium CNC precision-milled chassis with tempered glass side-panels, and a size that's fit both for desks and the living room.

Plextor at CES 2020: M9P Plus AIC SSD and its M.2 Twin

Plextor showed off its very recently announced M9P line of premium PCI-Express NVMe SSDs at CES 2020. The M9P Plus comes in both half-height add-in card (AIC) form-factor, and a more conventional M.2-2280 form-factor. In both, it leverages PCI-Express 3.0 x4 along with the NVMe 1.3 protocol. At the heart of these drives is the Marvell 88SS1092 "Eldora Plus" controller that has 8 flash channels. This controller is paired with Kioxia 96-layer 3D TLC NAND flash (BiCS 4), and a DDR4 DRAM cache.

With capacities of 256 GB, 512 GB, and 1 TB, the M9P offers sequential reads of up to 3,400 MB/s, with up to 2,200 MB/s writes (up to 1,700 MB/s writes for the 256 GB variant). Endurance (TBW) for the three models are proportionately rated at 160 TB, 320 TB, and 640 TB. The 256 GB variant of the M.2-2280 model is priced at $51, the 512 GB variant at $81, and the 1 TB variant at $135. The AIC equivalents are priced at roughly $15 premiums over these prices, and in addition to the convenience of AIC (easier to swap in a test bench), they feature some RGB LED embellishments.

STEIGER DYNAMICS launches FORGE Living Room Gaming PC

At the Consumer Electronics Show 2020, Living Room PC manufacturer STEIGER DYNAMICS launches the liquid cooled FORGE compact Gaming PC. Measuring only 6.7 x 18.5 x 10.8 inches (17 x 47 x 27.4 cm (WxHxD), 22 L volume), FORGE feels equally home on desks, TV cabinets and other areas with limited space. FORGE can be placed vertically or horizontally while providing equal cooling performance and quietness levels.

Based on a modified Phanteks Evolve Shift chassis, FORGE features a high-quality, vibration-optimized, sand-blasted aluminium design with side mesh or windows. FORGE is available in Satin Black and Anthracite Grey color options. 120 and 140 mm CPU liquid cooling options and 140 mm case fans allow for maximum air flow and ultra-quiet operation at idle and low loads. This gives FORGE the capability to handle latest generation overclocked Intel CPUs up to 10 cores/20 threads and the AMD Ryzen 9 3950X with 16 cores/32 threads as well full-size NVIDIA graphics cards up to the GeForce RTX 2080 Ti.

Thermaltake Aims to Become a Major Enthusiast Memory Player, ToughRAM RGB Tip of its Spear

Thermaltake aspires to be a major enthusiast-segment PC memory vendor, and brought several new models of its ToughRAM RGB memory modules to the 2020 International CES. These modules are characterized by chunky aluminium heatspreaders, and an RGB LED diffuser crowning the modules. There are also some chrome accents that make to the distinct "TT" company logo. There's also the standard ToughRAM that replaces the RGB diffuser with a block of silvery aluminium. At CES we spotted new high-frequency variants, with the ToughRAM series now spanning DDR4-4400, DDR4-4266, DDR4-4000, DDR4-3600, and DDR4-3200 in standard ToughRAM and its RGB variants.

The ToughRAM RGB White Edition comes in DDR4-4400, DDR4-4266, and DDR4-4000 speeds, and in 8 GB module densities making up 16 GB dual-channel kits. Common to both lines are high-bin DRAM chips, 10-layer PCBs with 2 oz copper layers, 10 µ-thick gold electroplated contacts, and the ToughRAM software application that provides temperature, frequency, and timing monitoring; alongside the TT RGB Plus software that lets you play with colors on the ToughRAM RGB models. We also spotted the liquid-cooled WaterRAM from last year.

SK hynix Displays its Semiconductor Technologies Leading the 4th Industrial Revolution

SK hynix Inc. presents its innovative semiconductor technologies leading the 4th Industrial Revolution at CES 2020, the world's largest trade show for IT and consumer electronics in Las Vegas, USA, from January 7-10, 2020. In line with its "Memory Centric World" theme, SK hynix depicts a futuristic city which effectively utilizes enormous amounts of data. The Company also showcases its semiconductor solutions across six crucial business fields - artificial intelligence (AI), augmented reality (AR) / virtual reality (VR), automotive, Internet of Things (IoT), big data and 5G.

Headlining at CES 2020 are SK hynix's memory solutions including HBM2E, DDR5 for servers, and SSD, which are already highly regarded and widely used in 4th industrial fields such as 5G and AI for their stability, speed, power consumption and density excellence. Other cutting-edge products set to make headlines in January are the Company's highly durable LPDDR4X and eMMC 5.1, which are optimized for automobiles. What's more, SK hynix is displaying its LPDDR5 and UFS that enhance the performance of 5G smartphones as well as CIS (CMOS Image Sensor) which is essential in establishing effective environments for AR/VR and IoT.

Micron Start Sampling DDR5 RDIMMs

Micron has today announced that it started sampling RDIMMs based on DDR5 technology to its industry partners. Designed for server operations, these DDR5 modules come in RDIMM form-factor and feature Error-Correcting Code (ECC) technology for removing any error that occurs inside electronic circuits. The new DDR5 standard offers a massive performance uplift compared to the previous generation of DDR4 memory. For starters, DDR5 will double the MT/s transfer rate to 6400 MT/s, double the speed of the original 3200 MT/s speed for DDR4 that was established by JEDEC. The bandwidth of the new DDR memory is supposed to be 32 GB/s, which is 25% faster than the original 25.6 GB/s bandwidth of DDR4.

With DDR5, the SDRAM prefetch buffer data size is being doubled to 16 data words per memory access, making for a 16n prefetching throughput. Another improvement is that the highest possible density for DDR5 chips is now being up to 64 Gb per chip. Additionally, DDR5 is supposed to bring the power needed for chip operation down to 1.1 volts, which is around 8% lower than what DDR4 achieved. There are also features like MIR (Mirror Pin) which provides better DIMM signaling, and more options for PRECHARGE and REFRESH commands that can now operate on a per bank basis, so specific banks can be refreshed in bank group. It is also worth pointing out that DDR5 chips are manufactured using 1znm memory manufacturing process.

COLORFUL Introduces ProMaster Line for Creators and Professionals

Colorful Technology Company Limited, professional manufacturer of graphics cards, motherboards and high-performance storage solutions is thrilled to introduce a new line-up of pre-built PCs to empower creators, artists, and multimedia professionals with the introduction of the new ProMaster line from COLORFUL. The ProMaster H1 PC is designed to bring creators and professionals a ready-made solution so they can focus on what matters: to start creating.

Based on NVIDIA RTX Studio, COLORFUL ProMaster H1 features the latest GeForce RTX SUPER GPUs from NVIDIA, bolstered by COLORFUL engineering for maximum performance and dependability and is complimented by an 8-core 9th-generation Intel Core i7 9700F processor. Easily multitask and handle large files with memory options up to 64 GB DDR4 memory and storage combos of up to 1 TB NVMe SSDs an a 2 TB HDD. The premium built body features soft, dampening fabric on the side panels for a premium look. The ProMaster also comes with Intel Optane technology for a more responsive feel and comes with D5 Fusion software out of the box.

Intel's Frost Canyon NUC 10 Mini PC is now Available

Intel's latest NUC (Next Unit of Computing) series of Mini PCs, based on the 10th generation of Intel "Core" processors, is now available for purchase. Dubbed Frost Canyon, this NUC series is featuring Intel's 10th generation Comet Lake CPUs at its base. All of the available configurations are based around the Intel Core i7-10710U processor, Intel i219-V Gigabit Lan, Bluetooth 5.0 and Intel WiFi 6 AX200 networking module. Configurations are varying by the amount of pre-installed RAM and storage and the option of whatever you want OS pre-installed or not.

The NUC 10 supports up to 64 GB of DDR4 memory, while the storage options include space for one 2.5 inch SSD/HDD in smaller variants or two 2.5 inch SSD/HDD drives in taller variants, with one NVMe M.2 SSD slot available in both versions. Pricing starts at $679 for the base models, while higher-end configurations cost upward of $1,295. Additionally, it is worth pointing out that all CPUs inside the new NUC are configured to run at 25 W of TPD, regardless of the model. This will result in higher performance compared to 15 W versions of processors found in most laptop solutions.

G.SKILL Announces New Ultra Low-Latency DDR4 32GB-Module Kits

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce an all-new high-capacity, low-latency DDR4-3200 CL14-18-18-38 memory kit specification based on 32 GB modules across the Trident Z RGB, Trident Z Royal, and Trident Z Neo series. Available in 256 GB (32GBx8), 128 GB (32GBx4), and 64 GB (32GBx2) kit capacities for quad-channel and dual-channel platforms, these new DDR4 memory specifications are built with the latest high-density 16Gb components and provide the perfect mix of extreme performance and high memory capacity.

DDR4-3200 CL14 has always been the ultimate sweet spot for performance since the early days of DDR4 memory, and G.SKILL is now bringing the legendary high-performance efficiency to the latest 32 GB high-capacity DDR4 modules. Designed for the latest HEDT platforms with quad-channel support, the DDR4-3200 CL14-18-18-38 specification with 256 GB (32GBx8) memory kit capacity can be seen validated in the screenshots below with the new Intel Core i9-10900X processor on the ASUS ROG RAMPAGE VI EXTREME ENCORE motherboard and the Intel Core i9-10940X processor on the MSI Creator X299 motherboard.

ADATA Launches High-Capacity XPG Hunter DDR4 Modules

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the launch of the XPG Hunter DDR4 memory module. Geared toward PC enthusiasts and gamers, the XPG Hunter delivers all the benefits of DDR4 with remarkable performance and efficiency. It supports XMP 2.0 for easy overclocking and offers great stability, making it ideal for performance seekers - gaming to competitive benchmarking. It comes in U-DIMM and SO-DIMM variants to meet the needs of desktop and notebook users alike.

The XPG Hunter modules are made with high-quality chips selected through a strict filtering process. They are equipped with the finest PCBs and pass rigid reliability and compatibility tests to ensure longevity and rugged durability, which are vital for overclocking, gaming, and extreme benchmarking. The modules deliver high-speed performance of up to 3200 MHz and comes with capacities of 4 GB, 8 GB, 16 GB, or 32 GB to meet the needs of diverse users and budgets.

ADATA XPG Announces Tested Compatibility with Ryzen 9 3950X and 3rd Gen Threadripper

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories is pleased to announce that ADATA and XPG DDR4 memory modules are compatible with latest 3rd Gen AMD Ryzen and Ryzen Threadripper HEDT (High-end Desktop) platforms. Whether for creators that demand high-capacity modules or gamers and overclockers seeking high-performance modules, ADATA and XPG offer memory products that meet their specific needs.

ADATA and XPG have always strove to ensure high compatibility of their memory modules through the use of high-quality, rigorously tested IC chips and PCB boards. With the recent launch of AMD's most powerful desktop processors- Ryzen 9 3950X processor with X570 platform and AMD HEDT Ryzen Threadripper 3960X/3970X processor with TRX40 platform, ADATA's and XPG's commitment to high compatibility remains a key consideration, in addition to robust performance and sufficient capacity.

ChangXin Becomes China's First Domestic DRAM Supplier

ChangXin Memory Technologies, a Chinese startup founded in 2016 that was formerly known as "Innotron Memory", now claims that it has become China's first and only domestic DRAM supplier. Following the announcement that it started production of domestic DRAM chips, ChangXin is now reportedly shipping its first DRAM wafers. With an output of around 20000 wafers per month, the company is currently building LPDDR4, DDR4 8Gbit chips using the "10-nanometer class" node, which is supposed to be 18 or 19 nm size in reality.

The company expects to double its wafer output to 40000 wafers per month sometime around Q2 of 2020 when additional expansion facilities will start production. ChangXin plans to soon open two more manufacturing facilities to start manufacturing even more wafers, in addition to its Fab 1. So far ChangXin has laid-out plans to start manufacturing DRAM technology based on stack capacitor, which is different from the usual trench capacitor technology few companies are pursuing.

Thermaltake Rolls Out ToughRAM Z-ONE RGB DDR4-3200 16GB Kit

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear and Enthusiast Memory solutions, today announced the release of the Thermaltake TOUGHRAM Z-ONE RGB DDR4 Memory Kit 3,200 MHz, which is supported by Intel and AMD platforms. Featuring 10-layer PCB construction for enhanced performance and stability, the TOUGHRAM Z-ONE RGB is equipped with high-performance components including tightly-selected memory chips, 2oz copper inner layer for enhanced electrical conduction, and 10μ gold fingers for high resistance ensuring ultimate gaming performance.

Furthermore, the TOUGHRAM Z-ONE RGB memory can be controlled by our software to monitor the real-time temperatures, frequency and performance and create stunning lighting effects with over 25 lighting modes. Users can also sync with TT RGB PLUS to maximize unique settings for their RGB color theme. Synchronize TT RGB PLUS, TT AI Voice Control, Razer Chroma, and Amazon Alexa RGB with TOUGHRAM Z-ONE RGB, users can build their own ecosystem with 10 super-bright addressable LEDs for stunning 16.8M RGB illumination. The TOUGHRAM Z-ONE RGB also support motherboards that have 5 V addressable RGB headers - ASUS Aura Sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync and ASRock Polychrome.

Team Group Releases T-Force Xtreem ARGB DDR4 Memory with Mirror Finish

Today TEAMGROUP's gaming brand T-FORCE announces the release of the world's first mirror design T-FORCE XTREEM ARGB Gaming Memory, leading the industry with full mirror reflection, light penetration and ARGB three major core technologies. Up to DDR4 4800MHZ of frequency offers a smooth user experience. The mirror design enhances the detail of the texture and it has an incomparable dominance in both visual beauty and gaming performance.

With creative thinking, T-FORCE XTREEM ARGB Gaming Memory is the first in the industry to feature full-screen light guiding technology. After researching optical principles and characteristics of light, special designed LED lighting method and Addressable RGB LED (Addressable RGB: A single LED capable of emitting colours independently and controlling speed) are used to allow players to change the RGB lighting freely. The product's full mirror screen is a combination of special spluttering process and full-screen light guiding technology, which is capable of directly penetrating and reflecting surrounding products. The optical beauty of gaming memory can be re-interpreted innovatively. The highest frequency of T-FORCE XTREEM ARGB is up to DDR4 4800 MHz. Its IC chips are selected through a rigorous testing process. Each of them is tested for complete compatibility and stability. This gaming memory with a magic mirror is specially designed for gamers and PC DIY enthusiasts.

ASRock Announces Brand new Mars Series of Mini PCs

The leading global motherboard & graphics card manufacturer, ASRock, a pleasure to launch brand new compact Mini PC - Mars Series. Supports up to Intel Core i5 Quad-Core processor, 32 GB DDR4-2666 MHz, PCIe NVMe M.2 SSD, 2.5-inch hard drive, and wireless connectivity; all implies into 0.7-liter chassis with 26 mm height.

ASRock Mars offers abundant USB devices connectivity, features a total of 7 USB ports, including one Type-C port; In addition, the native SD card reader and dual display outputs to provide more productive and convenience.

G.SKILL Announces New High-Performance, Ultra-Capacity DDR4 Memory Kits for HEDT Platforms

G.SKILL, the world's leading manufacturer of extreme performance memory and gaming peripherals, is pleased to announce the release of new high-performance and high-capacity quad-channel memory kits for the latest Intel X299 and AMD TRX40 high-end desktop (HEDT) platforms, including the high-capacity DDR4-3600 CL16-19-19-39 256 GB (32 GB x8), DDR4-4000 CL18-22-22-42 256 GB (32 GB x8), and the high-speed, low-latency DDR4-4000 CL15-16-16-36 64 GB (8 GB x8) specifications. By bringing ultra-high 32 GB memory module capacity into the realm of HEDT computing, powerful workstations are now truly able to achieve a complete combination of high core count processor with high-speed, high-capacity memory for heavy workloads or for running more virtual machines than ever.

MSI Unveils Comet Lake Powered Cubi 5 10M Mini-PC

MSI updated its Cubi line of NUC-like mini-PCs with the new Cubi 5 10M, powered by 10th generation Core "Comet Lake" mobile processors. Measuring 124 mm x 124 mm X 53.7 mm (WxDxH), and weighing 550 g (excluding the power-brick), the Cubi 5 10M is powered by a Core i7 "Comet Lake-U" SoC (either i7-10510U quad-core or i7-10710U six-core), with its integrated UHD Graphics putting out pixels. Two DDR4 SO-DIMM slots let you drop in up to 64 GB of dual-channel memory, while your storage options are an M.2-2280 slot with both PCI-Express 3.0 x4 and SATA 6 Gbps wiring, and a 2.5-inch drive bay with SATA 6 Gbps. Connectivity includes USB 3.2 gen 1 type-C and type-A ports along the front panel, next to the audio jacks; additional type-A gen 1 ports at the rear; DisplayPort and HDMI making up the display outputs; a gigabit Ethernet interface driven by an Intel i219-V controller, and Intel AX201 WLAN card that provides 802.11ax and Bluetooth 5.0. The company didn't reveal pricing.

Thermaltake Releases TOUGHRAM RGB White Edition DDR4 Memory Kits

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear and Enthusiast Memory solutions, today announced the release of the Thermaltake TOUGHRAM RGB DDR4 Memory Series which now comes in a white edition along with new frequencies of 3,200 MHz and 3,600 MHz 2x 8 GB. TOUGHRAM is supported by Intel and AMD platforms and features 10-layer PCB construction, 2oz copper inner layers and 10μ gold fingers, the TOUGHRAM RGB white edition is not only visually appealing, but is also high in performance. The TOUGHRAM RGB White Edition is built with premium fine coating that reveals true elegance from inside out.

The TOUGHRAM RGB DDR4 Memory Series 3,200 MHz and 3,600 MHz white edition is now available for pre-order at the TT Premium website. Please refer to the Thermaltake website or contact your local Thermaltake sales or PR representative for more information on pricing for the Thermaltake TOUGHRAM RGB DDR4 3,200 MHz and 3,600 MHz white edition memory kits.

MSI TRX40 PRO Series Motherboards Pictured

Ahead of their launch, low-resolution pictures of two nearly identical MSI TRX40 PRO series motherboards surfaced on the web, the TRX40 PRO 10G, and the TRX40 PRO WiFi. The former is characterized by a 10 GbE wired Ethernet connection through an included add-on card, while the latter features 802.11ax Wi-Fi 6 WLAN. The two appear otherwise identical, with a couple of M.2 slots on the board, four additional M.2 slots on a cooled add-on card, four PCI-Express x16 slots, eight DDR4 DIMM slots, and other storage connectivity that includes four SATA 6 Gb/s ports, and U.2 port. From the looks of it, the new for the 3rd generation Ryzen Threadripper looks identical to TR4, which bodes well for people wanting to use their TR4-compatible CPU coolers or water-blocks on the new platform.

BIOSTAR Ready for AMD New Firmware and Ryzen 9 3950X

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, is proud to announce it's full support for the newly launched AMD Ryzen 9 3950X processor. The 3950X, a 16-core, 32-thread desktop CPU running at a 4.7GHz boosted clock, has been highly anticipated and BIOSTAR has been well prepared for it. Supported by BIOSTAR X570, X470, B450, X370, B350, and A320 chipset with AM4 socket motherboards, the monster CPU from AMD brings the latest in PC tech with support for dual-channel DDR4 memory at 3200+MHz and PCIe 4.0, a perfect match for the feature-loaded GEN4 RACING X570 and X470 motherboards from BIOSTAR.

By updating the supported motherboards with the latest AGESA 1.0.0.4 Patch B BIOS, the users can unlock support for the new AMD CPU and its benefits, as well as improved system boot time as tested by our engineers. By updating the supported motherboards with the latest AGESA 1.0.0.4 Patch B BIOS, users can unlock support for the new AMD CPU and its benefits, as well as improved system boot time as tested by our engineers.

Thermaltake Releases High-Frequency TOUGHRAM RGB DDR4 Memory Kits

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear and Enthusiast Memory solutions, today announced the release of the Thermaltake TOUGHRAM RGB DDR4 Memory Series which comes in new frequencies of 4,000 MHz, 4,266 MHz and 4,400 MHz 2x8 GB modules, supported by Intel and AMD platforms. Featuring 10-layer PCB construction, 2oz copper inner layers and 10μ gold fingers, the TOUGHRAM RGB enhances overclocking performance and betters gaming experiences. The high-frequency memory kits are constructed with higher standard chips, which have been tested to achieve higher and more stable overclocks. Our latest module 4,400 MHz and 4,000 MHz was tested with Intel's Core i7 platform, ASUS ROG MAXIMUS XI GENE and MAXIMUS XI HERO motherboards and remained stable under load.

Thermaltake CEO Kenny Lin is excited to launch the newest addition to the TOUGRAM RGB Series. "We are glad to embrace the new era of high-frequency memory. With the rapid rise of esports, higher frequency ram is essential for faster and smoother performance. Level up your gameplay with the next level TOUGHRAM RGB DDR4 16 GB Memory Kit in 4,000 MHz, 4,266 MHz, 4,400 MHz." stated Thermaltake CEO Kenny Lin.
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