News Posts matching #DDR4-3200

Return to Keyword Browsing

SMART Modular Launches 32GB Low-profile DDR4-3200 Mini-DIMMs for Industrial Applications

SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc., and a leader in specialty memory, storage and hybrid solutions including memory modules, Flash memory cards and other solid state storage products,today announced its lineup of DDR4-3200 32 GB Low Profile industrial Mini-DIMMs. SMART has several new 32 GB Mini-DIMMs which include ULP (Ultra Low Profile) and VLP (Very Low Profile) with registered and unbuffered ECC options to meet a wide range of use cases. SMART has been providing Mini-DIMM support for many years, offering customers long-term support as well as a solid roadmap of new higher-density, higher-speed options.

SMART's DDR4-3200 32 GB industrial Mini-DIMMs undergo stringent in-house environmental temperature screening to operate between -40 °C to +85 °C which makes SMART's DDR4 Mini-DIMMs an ideal solution for telecom and networking equipment being deployed under harsh operating conditions. Customized ruggedizing features can be added, such as conformal coating and anti-sulfur resistors to protect against toxic operating conditions or underfill for excessive vibration, all to allow reliable, long-term system operation.

GIGABYTE Rolls Out Designare DDR4-3200 High-Capacity 64GB (2x 32GB) Memory for Creators

The Designare brand of motherboards by GIGABYTE target content creators, and the company is extending the brand to memory, with the new Designare Memory series. It debuts with a high-capacity 64 GB dual-channel memory kit using two 32 GB modules. The rationale behind these densities is that creators may need them to deal with large data-sets. These are not off-spec "double height" modules, but are common dual-rank modules that stick to JEDEC compatibility spec, and pack XMP profiles that can run them at DDR4-3200 with 16-18-18-38 timings at 1.35 V.

GIGABYTE has tested these modules to work on all of its AMD X570, AMD B450, AMD TRX40, Intel X299, and Intel Z390 motherboards. For X570 and B450, however, the company states that only 3rd generation "Matisse" processors can handle this memory density. In its compatibility testing, GIGABYTE used 18-19-19-39 timings. Physically, the Designare modules have regular 32 mm height, a black PCB, and aluminium heatspreaders. GIGABYTE is backing the modules with lifetime warranty. The company didn't reveal pricing.

Zhaoxin KaiXian x86 Processor Now Commercially Available to the DIY Channel

Zhaoxin is a brand that makes multi-core 64-bit x86 processors primarily for use in Chinese state IT infrastructure. It's part of the Chinese Government's ambitious plan to make its IT hardware completely indigenous. Zhaoxin's x86-64 CPU cores are co-developed by licensee VIA, specifically its CenTaur subsidiary that's making NCORE AI-enabled x86 processors. The company's KaiXian KX-6780A processor is now commercially available in China to the DIY market in the form of motherboards with embedded processors.

The KaiXian KX-6780A features an 8-core/8-thread x86-64 CPU clocked up to 2.70 GHz, 8 MB of last-level cache, a dual-channel DDR4-3200 integrated memory controller, a PCI-Express gen 3.0 root-complex, and an iGPU possibly designed by VIA's S3 Graphics division, which supports basic display and DirectX 11.1 readiness. The CPU features modern ISA, with instruction sets that include AVX, AES-NI, SHA-NI, and VT-x comparable virtualization extensions. The chip has been fabricated on TSMC 16 nm FinFET process.

Intel "Panther Canyon" NUC Implements "Tiger Lake" SoC with Xe Graphics

Intel NUC 11 Extreme is the spiritual successor to the "Hades Canyon" and "Skull Canyon" NUC, and implements the company's next-generation 10 nm+ "Tiger Lake" processor. Codenamed "Panther Canyon," the NUC 11 Extreme represents a line of ultra-compact desktops with serious computing power, bringing together the company's highest-performance CPU cores and iGPUs. The "Tiger Lake-U" SoC powering the NUC 11 Extreme will reportedly be configured with a 28-Watt TDP, and will come in Core i3, Core i5, and Core i7 variants.

The "Tiger Lake-U" processor is expected to combine next-generation "Willow Cove" CPU cores with an iGPU based on Intel's new Xe graphics architecture, in what could be the first commercial outing for both. The NUC 11 Extreme "Panther Canyon" will also support up to 64 GB of dual-channel DDR4-3200 memory over SO-DIMMs, an M.2-2280 slot with PCI-Express 4.0 x4 and SATA 6 Gbps wiring, and option for Intel Optane M10 cache memory. On the connectivity front, and Intel AX-201 WLAN card provides 802.11ax Wi-Fi 6, and Bluetooth 5. A 2.5 GbE wired interface will also be available. These will also be among the first NUCs to feature front- and rear-Thunderbolt ports (possibly next-gen 80 Gbps given that the platform implements PCIe gen 4.0). The NUC 11 Extreme "Panther Canyon" is expected to launch some time in the second half of 2020.

G.SKILL Announces New Ultra Low-Latency DDR4 32GB-Module Kits

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce an all-new high-capacity, low-latency DDR4-3200 CL14-18-18-38 memory kit specification based on 32 GB modules across the Trident Z RGB, Trident Z Royal, and Trident Z Neo series. Available in 256 GB (32GBx8), 128 GB (32GBx4), and 64 GB (32GBx2) kit capacities for quad-channel and dual-channel platforms, these new DDR4 memory specifications are built with the latest high-density 16Gb components and provide the perfect mix of extreme performance and high memory capacity.

DDR4-3200 CL14 has always been the ultimate sweet spot for performance since the early days of DDR4 memory, and G.SKILL is now bringing the legendary high-performance efficiency to the latest 32 GB high-capacity DDR4 modules. Designed for the latest HEDT platforms with quad-channel support, the DDR4-3200 CL14-18-18-38 specification with 256 GB (32GBx8) memory kit capacity can be seen validated in the screenshots below with the new Intel Core i9-10900X processor on the ASUS ROG RAMPAGE VI EXTREME ENCORE motherboard and the Intel Core i9-10940X processor on the MSI Creator X299 motherboard.

Thermaltake Rolls Out ToughRAM Z-ONE RGB DDR4-3200 16GB Kit

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear and Enthusiast Memory solutions, today announced the release of the Thermaltake TOUGHRAM Z-ONE RGB DDR4 Memory Kit 3,200 MHz, which is supported by Intel and AMD platforms. Featuring 10-layer PCB construction for enhanced performance and stability, the TOUGHRAM Z-ONE RGB is equipped with high-performance components including tightly-selected memory chips, 2oz copper inner layer for enhanced electrical conduction, and 10μ gold fingers for high resistance ensuring ultimate gaming performance.

Furthermore, the TOUGHRAM Z-ONE RGB memory can be controlled by our software to monitor the real-time temperatures, frequency and performance and create stunning lighting effects with over 25 lighting modes. Users can also sync with TT RGB PLUS to maximize unique settings for their RGB color theme. Synchronize TT RGB PLUS, TT AI Voice Control, Razer Chroma, and Amazon Alexa RGB with TOUGHRAM Z-ONE RGB, users can build their own ecosystem with 10 super-bright addressable LEDs for stunning 16.8M RGB illumination. The TOUGHRAM Z-ONE RGB also support motherboards that have 5 V addressable RGB headers - ASUS Aura Sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync and ASRock Polychrome.

G.SKILL Releases New DDR4 32GB Module Specs with Memory Kits Up to 256GB

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing new high-capacity, high-performance memory kit specifications based on 32 GB modules across several memory series, including Trident Z Royal DDR4-3200 CL16 256 GB (32 GB x8), Trident Z Royal DDR4-4000 CL18 128 GB (32 GB x4), Trident Z Neo DDR4-3600 CL18 128 GB (32 GB x4), and Trident Z Neo DDR4-3800 C18 64 GB (32 GB x2). Built with the latest high-density 16Gb components, these DDR4 memory kits are the perfect choice for pushing the performance limits of high memory capacity.

With the availability of higher density memory at the consumer level, G.SKILL memory is pushing the performance boundary to DDR4-3200 on current HEDT platforms with up to 8 modules of 32 GB for a total of 256 GB. As shown in the screenshot below, the Trident Z Royal DDR4-3200 CL16 256 GB (32GBx8) is validated on the latest X299-based ASUS ROG Rampage VI Extreme Encore motherboard and the Intel Core i9-9820X processor. Such extremely high-capacity memory kits are the ideal choice for powerful workstations or for systems running multiple virtual machines.

Intel 10th Generation Core "Comet Lake" Lineup Detailed

Intel's short-term reaction to AMD's 3rd generation Ryzen processor family is the 10th generation Core "Comet Lake." These processors are based on existing "Skylake" cores, but have core-counts increased at the top-end, and HyperThreading enabled across the entire lineup. The Core i3 series are now 4-core/8-thread; the Core i5 series a 6-core/12-thread, the Core i7 series are 8-core/16-thread, and the new Core i9 series are 10-core/20-thread. Besides core-counts, Intel has given its 14 nanometer node one last step of refinement to come up with the new 14 nm+++ nodelet. This enables Intel to significantly dial up clock speeds across the board. These processors come in the new LGA1159 package, and are not backwards-compatible with LGA1151 motherboards. These chips also appear to feature an on-package PCH, instead of chipset on the motherboard.

Leading the pack is the Core i9-10900KF, a 10-core/20-thread chip clocked at 4.60 GHz with 5.20 GHz Turbo Boost, 20 MB of shared L3 cache, native support for DDR4-3200, and a TDP of 105 W. Intel's new 10-core die appears to physically lack an iGPU, since none of the other Core i9 10-core models offer integrated graphics. For this reason, all three processor models have the "F" brand extension denoting lack of integrated graphics. The i9-10900KF is closely followed by the i9-10900F clocked at 4.40/5.20 GHz, the lack of an unlocked multiplier, and 95 W TDP rating. The most affordable 10-core part is the i9-10800F, clocked at 4.20 GHz with 5.00 GHz boost, and a TDP of just 65 W. Intel has set ambitious prices for these chips. The i9-10900KF is priced at $499, followed by the i9-10900F at $449, and the i9-10800F at $409.

ZADAK at Computex: Boutique Memory, Coolers, Gaming Desktops, and Case-Mods

ZADAK may have dropped the "511" from its name, but remains a sought-after boutique hardware brand for case-modders. At its Computex 2019 booth, the company showed off its latest memory modules, cooling products, and a few case-mods that put the two together. The centerpiece at the booth was the Spark line of premium DDR4 memory modules. Silver accents of brushed aluminium top a darker shade, crowned by a silicone addressable-RGB LED diffuser. Each module has five lighting zones - top, top sides, and corners, which the maker calls "Dynamic multi-zone RGB." Each module cycles between 8 lighting presets, although with a 3-pin ARGB connection, you can play with the lighting via software.

ZADAK Spark memory comes in single-module, dual-channel, and quad-channel kits of 8 GB and 16 GB modules, which are further differentiated in four speeds, DDR4-3000, DDR4-3200, DDR4-3600, and DDR4-4133. Up to 3200 MHz, these modules offer timings of 16-18-18-38@1.35V, which loosen to 17-19-19-39@1.35V for DDR4-3600, and 19-21-21-42@1.4V for DDR4-4133. ZADAK claims it tested each memory kit for advertised settings on both Intel Core and AMD Ryzen platforms. Prices start at USD $159.99 for a 2x 8 GB DDR4-3200 memory kit. Next up, is the ZADAK Spark AIO closed-loop liquid CPU cooler.

AMD Zen 2 CPUs to Support Official JEDEC 3200 MHz Memory Speeds

An AMD-based system's most important performance pairing lies in the CPU and system RAM, as a million articles written ever since the introduction of AMD's first generation Ryzen CPUs have shown (remember the races for Samsung B-die based memory?). There are even tools that allow you to eke out the most performance out of your AMD system via fine memory overclocking and timings adjustment, which just goes to show the importance the enthusiast community derives from such tiny details that maximize your AMD Zen-based CPU performance. Now, notorious leaker @momomo_us has seemingly confirmed that AMD has worked wonders on its memory controller, achieving a base JEDEC 3200 MHz specification - up from the previously officially supported DDR4-2666 speeds in the first-gen Ryzen (updated to DDR4-2933 speeds on the 12 nm update).
Return to Keyword Browsing