News Posts matching "DDR4"

Return to Keyword Browsing

Samsung Begins Mass-production of 30.72-terabyte PM1643 SSD

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry's largest capacity Serial Attached SCSI (SAS) solid state drive (SSD) - the PM1643 - for use in next-generation enterprise storage systems. Leveraging Samsung's latest V-NAND technology with 64-layer, 3-bit 512-gigabit (Gb) chips, the 30.72 terabyte (TB) drive delivers twice the capacity and performance of the previous 15.36 TB high-capacity lineup introduced in March 2016.

This breakthrough was made possible by combining 32 of the new 1TB NAND flash packages, each comprised of 16 stacked layers of 512 Gb V-NAND chips. These super-dense 1 TB packages allow for approximately 5,700 5-gigabyte (GB), full HD movie files to be stored within a mere 2.5-inch storage device.

Intel Intros Core i3-8130U Dual-core Low-power Processor

Intel today introduced the Core i3-8130U dual-core (2-core/4-thread) ultra low-power processor for thin and light notebooks, and 2-in-1 convertibles. Based on the 14 nm "Kaby Lake-U" silicon, the chip features a TDP of just 15W, making it ideal for all-day power devices. It is clocked at 2.40 GHz, with 3.40 GHz Turbo Boost frequency, and packs 4 MB of L3 cache. In its TDP-down mode, the CPU idles at 800 MHz, lowering the TDP to 10W. Its dual-channel DDR4 memory controller supports up to 32 GB of DDR4-2400 or LPDDR3-2133 memory. On the display side of things are the UHD Graphics 620 iGPU with clock speed ranging between 300 MHz and 1.00 GHz, 24 execution units, and hardware-acceleration for H.265/HEVC with 10bpc color.

AAEON Announces the BOXER-6640 IPC

AAEON, an award-winning developer of embedded systems, is pleased to announce the release of the BOXER-6640, an embedded controller with a 6th or 7th Generation Intel Core Desktop Processor and support for DDR4 memory.

The BOXER-6640 is purpose built for factory automation and machine vision applications. With two LAN ports, four USB3.0 ports, and three USB2.0 ports, it can be connected to a range of cameras and sensors, and its 8-bit DIO enables it to control connected systems based on digital inputs. As it also has a VGA port and two further combined HDMI and DP ports for dual display output, this controller can easily serve as the hub of an effective HMI solution.

G.SKILL Releases World's Fastest DDR4-4700MHz Trident Z RGB Memory Kit

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the world's fastest Trident Z RGB memory kit at an extreme speed of DDR4-4700MHz CL19-19-19-39 1.45V 16GB (2x8GB). Not only is this kit the first retail DDR4 memory kit to reach DDR4-4700MHz, it's also the first RGB-enabled kit to reach this extremely high level of frequency speed. This ultimate memory kit is achieved with highly-screened, high-performance Samsung DDR4 B-die ICs and validated on the MSI Z370I GAMING PRO CARBON AC motherboard and Intel Core i7-8700K processor.

Ever since the first release announcement of the G.SKILL Trident Z RGB series at the end of 2016, DDR4-4266MHz had reigned as the highest frequency speed for an RGB memory kit. Over the past year, the G.SKILL R&D team has been dedicated to break through this technology bottleneck and aimed to provide an even higher speed RGB memory to PC enthusiasts. Today, all the hard work is finally paying off. G.SKILL successfully developed the world's fastest RGB memory kit at a blistering DDR4-4700MHz, while maintaining ultra-low timings at CL19-19-19-39.

Samsung Launches 800GB Z-SSD for HPC and AI Systems

Samsung Electronics, the world leader in advanced memory technology, today announced that it has launched an 800-gigabyte (GB) solid state storage drive-the SZ985 Z-SSD, for the most advanced enterprise applications including supercomputing for AI analysis. Developed in 2017, the new 800 GB Z-SSD provides the most efficient storage solution for high-speed cache data and log data processing, as well as other enterprise storage applications that are being designed to meet rapidly growing demand within the AI, big data and IoT markets.

"With our leading-edge 800 GB Z-SSD, we expect to contribute significantly to market introductions of next-generation supercomputing systems in the near future, enabling improved IT investment efficiency and exceptional performance," said Jinman Han, senior vice president, Memory Product Planning & Application Engineering at Samsung Electronics. "We will continue to develop next-generation Z-SSDs with higher density and greater product competitiveness, in order to lead the industry in accelerating growth of the premium SSD market."

SK Hynix Announces Availability of 16 Gb DDR4 Chips, up to 256 GB DIMMs

Sk Hynix has added to its product catalog single-die 16 Gb DDR4 memory chips, which should enable a two-fold increase in maximum memory capacity per single DIMM. This allows SK Hynix to sell same-capacity chips with fewer memory semiconductor dies, due to the increase in storage density, and to increase maximum memory capacity at the same memory die populations as before. The benefits are lower power consumption (due to the reduced number of memory dies to power), and the possibility of putting together either dual-ranked 64 GB modules, quad-ranked 128 GB LRDIMMs and octal-ranked 256 GB LRDIMMs. That last part is the most important: theoretically, the maximum amount of memory on top Intel or AMD server platforms could double, which could enable up to 4 TB RAM in EPYC systems, for example. And as memory-hungry as big data applications have become, there's ever need for higher memory capacity.

SK Hynix's 16 Gb DDR4 chips are organized as 1Gx16 and 2Gx8 and supplied in FBGA96 and FBGA78 packages, respectively. Current 16 Gb density speeds stand at DDR4-2133 CL15 or DDR4-2400 CL17 modes at 1.2 V. SK Hynix plans increase the available frequencies in the third quarter of this year, adding DDR4-2666 CL19 to the lineup.

AMD Ryzen 5 2400G Smokes Core i5-8400 at iGPU Performance

AMD is pinning a lot of hopes on its upcoming Ryzen 2000G "Raven Ridge" desktop APU family, which combine a quad-core "Zen" CPU with a larger-than-expected integrated GPU based on the latest "Vega" architecture. While Intel's iGPU design focus for its "Coffee Lake-S" processors continues to be hardware-accelerated 4K video playback, and non-gaming tasks; AMD promises a more wholesome solution. The integrated Radeon Vega 11 graphics of the Ryzen 5 2400G features 11 "Vega" NGCUs (next-generation compute units), which translates to 704 stream processors, 44 TMUs (@ 4 TMUs per NGCU), 8 or 16 ROPs, and a bandwidth-rich pathway to the APU's dual-channel DDR4-2933 capable IMC, thanks to AMD's new Infinity Fabric interconnect.

In its pre-launch press-deck for the Ryzen 3 2200G and Ryzen 5 2400G, AMD did the obvious - comparing a similarly priced Intel Core i5-8400 six-core processor (MSRP: $189) with its faster Ryzen 5 2400G (MSRP: $169.99) at gaming, highlighting its products key promise - enabling 1080p gaming with many of the newer AAA titles. In AMD's testing, the Radeon Vega 11 iGPU keeps frame-rates well above 30 fps at 1080p. In key popular titles such as "Battlefield 1," the frame-rates cross 50 fps, titles like "Overwatch" and "Rocket League" are almost that fast. "Skyrim" approaches 96 fps, while "The Witcher 3" stays barely above 30 fps. The i5-8400 with its UHD 620 graphics barely touches the 30 fps mark in any of the games, at 1080p. Even taking into account AMD's marketing hyperbole, the Radeon Vega 11 seems capable of running most eSports titles at resolutions above 1600 x 900, which should particularly interest iCafes and gamers on a shoestring budget.

BIOSTAR Introduces H110MDE Motherboard

BIOSTAR presents another entry-level micro-ATX form factor motherboard - the BIOSTAR H110MDE. This motherboard sports the entry-level Intel H110 chipset that supports the Socket LGA 1151 7th and 6th generation Intel Core processors. The BIOSTAR H110MDE is the perfect solution for desktop users on a tight budget by opting for Kaby Lake and Skylake processors. The compact micro-ATX form factor ensures high compatibility with most desktop cases in the market today. It also comes bundled with a free BullGuard Antivirus Software, another instant saving for builders.

The BIOSTAR H110MDE features the entry-level Intel H110 chipset for the 7th and 6th generation Intel Core processors offering builders instant savings by opting for the previous generation Intel processors. Still, the H110MDE offers the essential features and performance you need for daily computing with its dual DIMM slots supporting up to 32GB of 2400MHz DDR4 memory and a single PCI-E 3.0 x16 slot that supports high-end graphics card and NVMe solid-state drives if desired. As for connectivity, the H110MDE packs a Realtek RTL8111G offering up to 100 MB/s Ethernet connectivity along with two USB 3.1 Gen1 ports and a USB 3.1 Gen1 header offering high-speed data transfers for portable storage drives.

AMD Reveals Specs of Ryzen 2000G "Raven Ridge" APUs

AMD today revealed specifications of its first desktop socket AM4 APUs based on the "Zen" CPU micro-architecture, the Ryzen 2000G "Raven Ridge" series. The chips combine a quad-core "Zen" CPU with an integrated graphics core based on the "Vega" graphics architecture, with up to 11 NGCUs, amounting to 704 stream processors. The company is initially launching two SKUs, the Ryzen 3 2200G, and the Ryzen 5 2400G. Besides clock speeds, the two are differentiated with the Ryzen 5 featuring CPU SMT, and more iGPU stream processsors. The Ryzen 5 2400G is priced at USD $169, while the Ryzen 3 2200G goes for $99. Both parts will be available on the 12th of February, 2018.

The Ryzen 5 2400 features an 4-core/8-thread CPU clocked at 3.60 GHz, with a boost frequency of 3.90 GHz; 2 MB of L2 cache (512 KB per core), and 4 MB of shared L3 cache; and Radeon Vega 11 graphics (with the 11 denoting NGCU count), featuring 704 stream processors. The iGPU engine clock is set at 1250 MHz. The dual-channel DDR4 integrated memory controller supports up to 64 GB of dual-channel DDR4-2933 MHz memory. The Ryzen 3 2200G is a slightly cut down part. Lacking SMT, its 4-core/4-thread CPU ticks at 3.50 GHz, with 3.70 GHz boost. Its CPU cache hierarchy is unchanged; the iGPU features only 8 out of 11 NGCUs, which translate to 512 stream processors. The iGPU engine clock is set at 1100 MHz. Both parts feature unlocked CPU base-clock multipliers; and have their TDP rated at 65W, and include AMD Wraith Stealth cooling solutions.

ASRock Intros a Pair of Celeron "Gemini Lake" ITX Motherboards

ASRock introduced a pair of mini-ITX desktop motherboards implementing Intel's new Celeron "Gemini Lake" SoCs. The ASRock J4105-ITX and J4105B-ITX, as their names suggest, are powered by Celeron J4105 "Gemini Lake" SoCs, which combine a quad-core "Goldmont Plus" CPU ticking at 2.50 GHz, with new Intel UHD 600 Graphics. The integrated graphics features hardware-acceleration of 10bpc HEVC video encoding and decoding in addition to new DRM standards, which should enable Netflix 4K, and other on-demand video services at 4K UHD resolution. The J4105-ITX and J4105B-ITX are similar, but for the latter featuring legacy connectivity such as LPT and RS232 COM ports, replacing 8-channel HD audio with 6-channel, and a DVI port. While the former has a PCIe x1 slot, the latter has an x16 slot with x2 wiring.

The board draws power from a 24-pin ATX connector. The SoC is cooled by a fan-less heatsink, and is wired to DDR4 SO-DIMM slots, supporting up to 8 GB of dual-channel DDR4-2400 memory. The 22 mm M.2 slot that has x1 wiring, is recommended only for a WLAN card. Storage connectivity includes four SATA 6 Gbps ports on the J4105-ITX, and two ports on the J4105B-ITX. Both boards come with gigabit Ethernet. Display outputs include DVI, HDMI, and D-Sub on the J4105-ITX; while the J4105B-ITX features D-Sub and HDMI. Both boards are expected to be priced around $170, given that the SoC itself costs $107.

Biostar Announces B250MDC Motherboard

BIOSTAR introduces the B250MDC motherboard offering a well-balanced set of features without the premium price point making it ideal for casual users on a budget. The BIOSTAR B250MDC motherboard is the perfect solution for an entry-level desktop computer for daily multitasking use, office application and home entertainment. The B250MDC features a compact micro-ATX form factor that fits in most budget cases. The B250MDC also uses the Intel B250 chipset, perfect for a daily driver with its high-efficiency performance.

The BIOSTAR B250MDC features the Intel B250 chipset offering everything essential for desktop users without compromise. The B250MDC features a single PCIe 3.0x16 slot that can fully utilize high-end graphics cards and NVMe solid-state drives; dual DDR4 DIMM slots supporting up to 43GB of 2400MHz memory; four speedy USB 3.1 Gen1 ports and a DVI-D output port for basic setups without discrete graphics. Users will also enjoy the board's 7.1 channel High-Definition Audio.

QNAP Launches TS-x28A Series Home NAS

QNAP Systems, Inc. today launched the all-new TS-x28A series NAS for entry-level home users, including the TS-128A and TS-228A models. The TS-x28A series provides complete multimedia storage, sharing and streaming functions, and complete file and data protection capabilities (including snapshots) to meet increasing data protection needs for home users. The launch of the TS-x28A series also marks the milestone of all QNAP NAS on the market being able to benefit from snapshot protection. Users can now enjoy more features, stronger protection, and more cost-effective NAS.

The TS-x28A series features a Realtek RTD1295 quad-core 1.40 GHz processor with 1 GB RAM, providing abundant performance for home multimedia/data storage needs. The TS-x28A series also comes with QTS 4.3.4, the latest version of QNAP's award-winning operating system. QTS 4.3.4 introduces enhanced snapshot features with lowered hardware resource requirements, allowing NAS with 1 GB RAM to benefit from snapshot protection. Users of the TS-x28A series will enjoy these advanced data protection capabilities alongside other amazing applications for multimedia, sharing, backup and data storage at an attractive price point.

QNAP Introduces TVS-x73e 4/6/8-bay NAS, Featuring AMD Inside

QNAP Systems, Inc. today announced the release of the high-performance TVS-x73e series - an SMB NAS lineup featuring an AMD RX-421BD quad-core APU, up to 64GB DDR4 RAM, two M.2 SATA 6Gb/s SSD slots (for SSD cache acceleration with Qtier auto-tiering), the unique USB QuickAccess port, dual 4K HDMI output, and hardware-assisted 4K video transcoding acceleration. Designed for versatile business needs, the secure and scalable TVS-x73e series provides a pair of PCIe slots for flexibly installing 10GbE NICs, QM2 cards or USB 3.1 10 Gbps cards, presenting small and medium businesses with the perfect NAS solution to build a private cloud for applications including high-speed data transfer, backup/recovery, virtualization, media playback and graphics display.

"The TVS-x73e NAS series is powered by an AMD quad-core APU with up to 3.4 GHz clock speed and also provides dual PCIe slots that add more value to maximize NAS potential for a wider range of applications, making the TVS-x73e ideal for organizations and professionals who ask for performance and expandability," said Jason Hsu, Product Manager of QNAP.

More Pictures of GIGABYTE Aorus X470 Gaming 7, Because Moar

We headed to the GIGABYTE Aorus booth at the 2018 International CES to check out the only motherboard based on AMD's upcoming 400-series chipset visible in the entire show, the Aorus X470 Gaming 7. We snapped a lot of pictures. The first thing that caught our attention is the board's updated styling, which resembles the one GIGABYTE introduced with its Intel Z370-series motherboards. The second thing of course, was two 32 Gb/s M.2 slots, confirming that AMD has indeed addressed 300-series chipset's greatest shortcoming - lack of PCIe gen 3.0 general purpose lanes. Since the AM4 SoC puts out 4 gen 3.0 general purpose lanes of its own, which wired to one 32 Gb/s M.2 slot on 300-series motherboards, the new 400-series boards will have at least two of these slots, one wired to the AM4 SoC, and another to the chipset.

The Aorus X470 Gaming 7 could become the company's flagship socket AM4 product based on AMD X470 chipset. It's been designed as such. Built in the ATX form-factor, the board draws power from a combination of 24-pin ATX, 8-pin EPS, and 4-pin ATX power connectors. A 12-phase VRM supplies power to the AM4 SoC. It's interesting to note that GIGABYTE chose some very high-current chokes for the chip's main voltage domains. The VRM heatsinks, too, are elaborate aluminium fin-stack types, with the two heatsinks spreading heat over a heat pipe. Is this a telltale sign that certain Ryzen 2 parts could have >95W TDP? The CPU socket is wired to four DDR4 DIMM slots, two PCI-Express 3.0 x16 slots (x8/x8 when both are populated), and one of the two M.2 slots (we're guessing the top M.2-22110 slot). Both it, and the bottom M.2-2280 slots have included heatsinks. Other expansion slots include an x16 (electrical x4) slot wired to the chipset, and two x1 slots, which are all gen 3.0.

Apacer Announces BLADE FIRE DDR4-3200MHz 64GB Memory

Apacer is pleased to announce its groundbreaking achievement in DDR history, BLADE FIRE DDR4 with heartbeat LED, perfectly for gaming, overclocking, and M.O.D enthusiasts. It is astonishing to see speed at 3200MHz with LED pulsing at 77 beats per minute yet it is still consuming low voltage at 1.35V. It is compatible with Intel & AMD platforms, providing unprecedented performance and energy-saving efficiency. Backed by the world's best technology in industrial memory module and storage, BLADE FIRE DDR4 makes users on fire in the gaming/ overclocking star-war.

The world-class BLADE FIRE DDR4 is an advanced generation of BLADE DDR4 which was published in Feb 2015, featured a sensational armory design on heat spreader as well as LED lights heartbeat effect. The meticulously screened ICs allow the optimized stability and compatibility while playing in the heavy workload games. BLADE FIRE DDR4 is available in 4GB, 8GB and 16GB capacities in dual-module package and comes equipped with total capacity of 32GB(16GBx2). The fastest memory kit available is clocked at 3200MHz, and BLADE FIRE DDR4 kits are ranged in four different clock speeds from 2800MHz 1.2V to 3200MHz 1.35V with 16-18-18-38. The XMP 2.0 support for simple overclocking setup delivers instant top-level performance for motherboards with Intel's 100 & 200 Series. Not only low latency for outstanding DDR4 performance but also lower power consumption with less heat and higher reliability provides users the fastest speeds and the highest stability when it comes to gaming and overclocking.

HyperX Unveils World's First Infrared Synchronized DDR4 RGB Memory

HyperX, the gaming division of Kingston Technology Company, Inc., today announced the industry's first memory modules featuring synchronized RGB lighting with IR (infrared) technology - the HyperX Predator DDR4 RGB. HyperX has designed IR communication channels onto each memory module, allowing multiple modules to sync LED lighting and produce an exceptional color and pattern display. Powered directly from the motherboard, this patent-pending technology provides an enhanced visual experience of RGB memory for gaming, overclocking PCs and DIY system builds. A video demo of the HyperX IR technology is here.

"As a leader in performance and overclocked memory for 15 years, HyperX is excited to bring this unique RGB memory innovation to CES 2018 and the market," said Kristy Ernt, business manager, HyperX. "Synchronizing HyperX Predator DDR4 RGB memory using IR technology creates a new way to experience RGB lighting on a PC and enables gamers and overclockers to further personalize their gaming experience."

MSI Brings Award-Winning Innovations to CES 2018

MSI, a world leader in gaming hardware, launches three brand-new gaming products at CES 2018, and will display two other CES Innovation Award Honorees. The CES 2018 Innovation Award Honorees include the Trident 3 Arctic, the new Z370 GODLIKE GAMING motherboard, new GTX 1080TI Lightning Graphics Card, Infinite X gaming desktop and new Optix MPG27CQ gaming monitor. The Trident 3 Arctic was also awarded a "Best of Innovation at Gaming" award. With these products, MSI affirms its position at the head of the high-end gaming market, bringing gamers all over the world the latest and greatest technologies.

"MSI has been dedicated to the field of gaming and is highly acclaimed by gamers and eSports teams worldwide," said Eric Kuo, MSI Vice President of Global Sales & Marketing. "We are honored to receive award recognition for these products and are excited to share them with gamers everywhere."

ASRock Announces X399M Taichi Motherboard for Ryzen Threadripper

ASRock today unveiled the industry's first micro-ATX form-factor motherboard for AMD Ryzen Threadripper processors, the X399M Taichi. The board supports a full-featured Threadripper HEDT build. Drawing power from a combination of 24-pin ATX and 8-pin EPS power connectors, it uses an 8-phase VRM to power the CPU. MOSFETs of this VRM vent heat onto both a smaller primary heatsink, and a larger secondary heatsink, via a heat-pipe. The TR4 socket is wired to four DDR4 DIMM slots, supporting quad-channel DDR4 memory; and three PCI-Express 3.0 x16 slots (from which at least two run at full x16 bandwidth at all times).

Storage connectivity on the ASRock X399M Taichi includes three 32 Gb/s M.2 slots, one 32 Gb/s U.2 port, and eight SATA 6 Gb/s ports. Networking connectivity includes 802.11ac + Bluetooth 4.x WLAN, and two 1 GbE interfaces. USB connectivity includes eight USB 3.0 and two USB 3.1 (including a type-C) ports on the rear panel, and four USB 3.0 ports via headers. ASRock deployed its highest-grade onboard audio solution, which takes advantage of a 120 dBA SNR CODEC, audio-grade capacitors, and ground-layer isolation. The company will showcase this board at the 2018 International CES.

MSI Announces B350I Pro AC Motherboard

MSI, one of the world leading motherboard developers, is pleased to introduce the new Mini-ITX B350I PRO AC motherboard, ready for AMD SocketAM4 and the latest RYZEN processors. Building a small form factor PC, whether it's for professional, multimedia or gaming use, has never been more interesting on the AM4 platform with this comprehensive, feature packed solution.

A strong 9-phase PWM design (6+2+1), unseen on any AM4 Mini-ITX motherboard, the use of Military Class components and inclusion of DDR4 Boost, ensures a perfectly stable system under any condition with top performance. It also features DisplayPort, a HDMI output and 2x pin headers for RGB strips.The new B350I PRO AC even comes with Mystic Light, allowing anyone to change the system LED colors while applying lighting effects.

G.SKILL Releases New Sniper X DDR4 Memory Series

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is releasing the new Sniper X series DDR4 memory that features 3 different camouflage designs and available in speeds up to DDR4-3600MHz. This new family of high performance memory kits is perfect for memory upgrades or for building PC gaming rigs and custom system builds.

Unique Camouflage Design
Sniper X is designed with a militaristic camouflage top bar to compliment any gaming system with offerings in three distinct patterns: Classic Camo, Urban Camo, and Digital Camo. Classic Camo is inspired by the classic jungle green camouflage design, while Urban Camo is styled to blend into a concrete jungle combat setting with multiple shades of gray. And developed to match the ASUS TUF Gaming series motherboard, the Digital Camo features yellow stylistic highlights for a modern warfare look. All three variations are paired with minimalistic aluminum heat spreaders that further optimizes cooling performance under heavy computing load, so you won't miss out on the next firefight!

VIA Making a Comeback to x86 CPU Market with Zhaoxin R&D Monies

The only other active x86 architecture licensee than AMD, VIA Technologies, is planning a comeback to the x86 processor market, bolstered by R&D investment by Shanghai Zhaoxin Semiconductor. VIA and Zhaoxin have been co-developing the ZX family of x86 processors for rollout in 2018, and at least on paper, the chips appear to have the chops to take on Intel's "Gemini Lake" SoCs. The new VIA-Zhaoxin combine CPU family begins with the KX-5000 "Wudaoku" SoCs launched late-2017. These are full-fledged SoCs, which completely integrate the chipset (including the southrbidge).

The KX-5000 chips feature 4 or 8 CPU cores without SMT, 2.00-2.20 GHz nominal CPU clock, 2.40 GHz boost clock, a dual-channel DDR4 IMC, a PCI-Express gen 3.0 root complex, an integrated graphics core, and platform I/O that includes SATA 6 Gbps, and USB 3.1 gen 2. This chip debuted on only one product from a major OEM, the Lenovo M6200 desktop model launched in China. 2018 could see a broader launch of VIA-Zhaoxin chips, with the KX-6000. While the older chips were built on the 28 nm process, the KX-6000 series will be built on the newer 16 nm process, feature 4 or 8 CPU cores clocked at speeds of up to 3.00 GHz, while retaining the feature-set of the KX-5000 series. These chips could realistically be touted as low-cost alternatives to Intel "Gemini Lake" SoCs, although Zhaoxin is making bold claims about its performance nearing that of AMD Ryzen processors.

G.Skill Releases World's Fastest 64GB (4x16GB) SO-DIMM Kit at DDR4-3466 CL17

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing the world's fastest performance 64GB DDR4 SO-DIMM memory running at DDR4-3466MHz CL17-17-17-37 at 1.35V with a 4x16GB kit configuration. Constructed with rigorously hand-selected Samsung B-die DDR4 IC components, this new Ripjaws DDR4 SO-DIMM memory kit elevates the computing power of small-form-factor (SFF) PCs to a whole new realm of memory performance, allowing you to design a miniature powerhouse system for virtually any tasks ranging from content creation to gaming.

The Perfect Trio: High Capacity, High Frequency, Low Timings
The need of faster and larger capacity memory kits continue to rise as modern day workloads increases in both capacity and weight. To tackle this need, G.SKILL is expanding the delivery of maximum memory performance across all memory capacities; and by using 16GB SO-DIMM modules, high-end machines and workstation PCs can now be built in the size of a SFF system that can fit into a shoebox. Shown in the following screenshot is the high capacity 64GB SO-DIMM memory kit running at DDR4-3466MHz CL17-17-17-37 and being tested for over 6 hours on the ASRock X299E-ITX/ac mini-ITX motherboard with the Intel Core i9-7900X processor.

ADATA Introduces XPG Z1 DDR4 4600MHz Overclocking Memory Modules

ADATA Technology Co., Ltd., a leading manufacturer of high-performance DRAM computer memory modules and NAND Flash products is excited to declare that the 2015 Taiwan Excellence Gold Award winner, XPG Z1 DDR4 overclocking memory, is designed to be the ultimate upgrade for overclockers, enthusiasts, and gamers.

At CES 2018, ADATA will unleash the new XPGZ1 DDR4 16GB 4600MHz CL 19-26-26-46 1.5V (AX4U460038G19-DRZ), a new force designed for Intel Z370/X299 chipset motherboards. The XPGZ1 DDR4 4600MHz Kits features timings of CL 19-26-26-46 16GB at 1.5V and is built to achieve both stability and high performance. XPG Z1 DDR4 4600MHz Kits are ready for action with the MSI Z370I GAMING PRO CARBON AC at CES 2018 and will be available in Q1, 2018. MSRP for dual pack (8GB x 2) will be $579.

Samsung Now Mass Producing Industry's First 2nd-Generation 10nm Class DRAM

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry's first 2nd-generation of 10-nanometer class (1y-nm), 8-gigabit (Gb) DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8 Gb DDR4 features the highest performance and energy efficiency for an 8 Gb DRAM chip, as well as the smallest dimensions.

"By developing innovative technologies in DRAM circuit design and process, we have broken through what has been a major barrier for DRAM scalability," said Gyoyoung Jin, president of Memory Business at Samsung Electronics. "Through a rapid ramp-up of the 2nd-generation 10 nm-class DRAM, we will expand our overall 10 nm-class DRAM production more aggressively, in order to accommodate strong market demand and continue to strengthen our business competitiveness."

Corsair Launches the World's Fastest DDR4 SODIMM 32GB Memory Kit

CORSAIR, a world leader in PC components high-performance gaming hardware and enthusiast memory, today announced the launch of the new CORSAIR VENGEANCE SODIMM DDR4 4,000MHz 32GB (4x8GB) kit, the world's fastest DDR4 SODIMM DDR4 memory kit.

While PC enthusiasts might be more familiar with SODIMM memory from laptops or all-in-one PCs, CORSAIR VENGEANCE SODIMM DDR4 4x8GB 4,000MHz is designed to power the latest small-form-factor systems running Intel's high-end-desktop X299 motherboard platform. Motherboards such as the ASRock X299E-ITX are able to fit all the power and performance of Intel's high-end motherboard chipset into a tiny Mini-ITX form factor but have, until now, been limited on memory frequency and bandwidth. With CORSAIR VENGEANCE SODIMM DDR4 4x8GB 4,000MHz, PC builders and enthusiasts can now pack 32GB of high-frequency quad-channel 4,000MHz DDR4 alongside Intel's Core i9 processors, for up to 36 threads of processing power and massive memory bandwidth, in Mini-ITX small-form-factor PCs.
Return to Keyword Browsing