News Posts matching "DDR4"

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AMD Announces 2nd Generation Ryzen Threadripper 2000, up to 32 Cores/64 Threads!

AMD announced its second-generation Ryzen Threadripper high-end desktop (HEDT) processor series, succeeding its lean and successful first-generation that disrupted much of Intel's Core X HEDT series, forcing Intel to open up new high-core-count (HCC) market segments beyond its traditional $1000 price-point. AMD's 16-core $999 1950X proved competitive with even Intel's 12-core and 14-core SKUs priced well above the $1200-mark; and now AMD looks to beat Intel at its game, with the introduction of new 24-core and 32-core SKUs at prices that are sure to spell trouble for Intel's Core X HCC lineup. The lineup is partially open to pre-orders, with two SKUs launching within August (including the 32-core one), and two others in October.

At the heart of AMD's second-generation Ryzen Threadripper is the new 12 nm "Pinnacle Ridge" die, which made its debut with the 2nd Generation Ryzen AM4 family. This die proved to introduce 3-5 percent IPC improvements in single-threaded tasks, and multi-threaded improvements with an improved Precision Boost II algorithm, which boosted frequencies of each of 8 cores on-die. The Threadripper is still a multi-chip module, with 2 to 4 of these dies, depending on the SKU. There are four of these - the 12-core/24-thread Threadripper 2920X, the 16-core/32-thread Threadripper 2950X; the 24-core/48-thread Threadripper 2970WX, and the flagship 32-core/64-thread Threadripper 2990WX.

ASUS Launches AMD B450 Series Motherboards

ASUS today announced that the ROG Strix, Prime and TUF Gaming series motherboards built on the AMD B450 chipset and supporting the latest AMD Ryzen processors are now available. AMD's Ryzen platform offers an incredible desktop compute experience with multithreaded horsepower plus accessible overclocking and gaming prowess. Earlier this year AMD launched the second-generation Ryzen family with the updated X470 chipset designed to further enhance the performance of higher-end gaming and content creation rigs. Now, AMD is launching the B450 chipset for a new generation of affordable motherboards.

The B450 is streamlined for straightforward builds and smaller form factors, and ASUS has a complete collection available now. ROG Strix B450-I and B450-F Gaming elevate the platform with signature features for serious gamers, TUF B450-Plus and B450M-Plus Gaming focus on essentials and durability, and Prime B450-Plus, B450M-A and B450M-K put a more professional face on the platform.

Ryzen DRAM Calculator 1.3.1 by 1usmus Released

User 1usmus is the programmer of Ryzen DRAM Calculator, a must-have tool for any PC enthusiast with AMD Ryzen-powered machines. The tool simplifies the process of finding the right memory clock, timing, and voltage combination by adjusting other settings to match the setting you key in. For example, if you're looking for a memory clock of DDR4-3200 and CAS latency of 14T, the tool will put out "safe" and "stable" combinations of other timings and voltages. You can also make the app read Intel XMP and other fast SPD profiles from your modules, and translate them to Ryzen-friendly settings that run stable. In short, this is the app that clears that last bit of hesitation you had to embrace Ryzen. Get it from the link below.
DOWNLOAD: Ryzen DRAM Calculator by 1usmus v1.3.1

The change-log follows.

Crucial Ballistix Sport AT Gaming Memory Now Available

Ballistix, a leading global brand of gaming memory, today announced the immediate availability of Ballistix Sport AT memory in support of ASUS' TUF Gaming Alliance. Developed as a collaboration between ASUS, Ballistix, and other trusted industry partners, TUF Gaming Alliance ensures easier building, the best compatibility, and complementary aesthetics from components to cases.

"Our TUF Gaming Alliance relationship with Ballistix, the memory brand of choice for so many gamers, offers customers and partners an exciting new product for PC builds," said Sharon Pan, Division Director of the ASUS Motherboard Channel PM Department. "On the heels of all the positive feedback at Computex 2018, we're looking forward to a successful collaboration with Ballistix as we continue to create products that excel in both performance and aesthetics."

Sapphire Intros FS-FP5V SFF Motherboard Based on Ryzen Embedded

Sapphire introduced the FS-FP5V, a mini-ITX (147.3 mm x 139.7 mm) SFF motherboard designed for AIO desktops, digital signage boxes, and compact desktops. At the heart of this board is an AMD Ryzen Embedded V1000 series FP5 SoC based on the 14 nm "Raven Ridge" silicon. Since this SoC also integrates a southbridge, the board is practically chipset-less. The Ryzen Embedded V1000 chip is configured with a 4-core/8-thread "Zen" CPU clocked at 2.00 GHz with 3.35 GHz boost, and 4 MB L3 cache. The iGPU is a Radeon Vega 11, which may look overkill, but is required to pull the four DisplayPort 1.4 outputs of this board (handy for digital-signage applications).

The Ryzen Embedded V1000 is wired to two DDR4 SO-DIMM slots, supporting up to 32 GB of dual-channel DDR4-2933 memory. Storage connectivity includes an M.2-2280 slot with PCI-Express 3.0 x4 wiring, an M.2 E-key slot with x1 wiring for WLAN cards; and a SATA 6 Gbps port. Networking options include two 1 GbE interfaces. USB connectivity includes two USB 3.1 gen 1 ports at the rear-panel, and two USB 3.1 gen 1 ports (direct ports) at the front side of the board, one each of type-A and type-C. Stereo HD audio makes for the rest of it. The board draws power from either 2-pin DC (external) or 4-pin ATX.

ASUS Intros TUF B360M-Plus Gaming S Motherboard

ASUS expanded its mid-range TUF Gaming motherboard lineup with a new micro-ATX socket LGA1151 motherboard, the TUF B360M-Plus Gaming S. Built with the characteristic black+yellow color scheme and the polygonal shape, this board takes in 8th generation Core processors. It draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, conditioning it for the CPU with a 4+3 phase VRM. The CPU is wired to four DDR4 DIMM slots, and a reinforced PCI-Express 3.0 x16 slot. Two other PCI-Express 3.0 x1 slots, and three M.2 PCIe slots make for the rest of the expansion.

Storage connectivity includes two M.2-2280 slots with PCIe gen 3.0 x4 wiring, one of which also has SATA 6 Gbps wiring; and six SATA 6 Gbps ports. The third M.2 slot is 30 mm long, has PCIe 3.0 x1 wiring, and is meant for CNVi WLAN cards. Networking is handled by an Intel i219-V controller driving a GbE interface. The onboard audio solution combines an entry-level Realtek ALC887 codec with 6-channel output, audio-grade capacitors, and ground-layer isolation. USB connectivity includes two USB 3.1 gen 2 (both type-A), four USB 3.1 gen 1 (three type-A, one type-C), two USB 3.1 gen 1 front-panel ports by header; and a number of USB 2.0 ports. The board features an RGB LED ornament at the top-right corner, and a 4-pin RGB LED header, controlled by Aura Sync RGB software. The board is expected to be priced around USD $120.

GIGABYTE Lights Up DRAM Market With AORUS RGB Memory

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, announced its first XMP supported DRAM, the AORUS RGB Memory. With DDR4 XMP 3200 16GB(8GB*2)memory modules and exclusive 2* RGB Infused Demo Modules, AORUS RGB Memory delivers outstanding value to anyone seeking a combination of high-end performance and glowing aesthetics. GIGABYTE RGB Fusion or RGB Fusion Link software allows users to easily control over 5 new lighting effects available only for DDR so they can enjoy the most impressive RGB lighting effects memory kits have to offer.

GIGABYTE introduced its AORUS RGB Memory at Computex 2018, garnering much praise among the media and receiving Best Product awards from U.S. based Tom's Hardware as well as U.K. based TechRadar. AORUS RGB Memory Modules feature aluminum heatsinks with anodized hairline surface for a sleek, metallic look. A standout feature of AORUS RGB Memory is the addition of 2 brand exclusive RGB Infused Demo Modules for pure RGB illumination and lighting effects. This feature makes it completely unnecessary for the user to purchase a completely different set of memory modules with RGB functionality to fill out the DIMM slots of the memory configuration, without affecting their budget. Users can now add RGB Infused Demo Modules to their boards to enjoy a full memory configuration packed with RGB brilliance.

TEAMGROUP Releases 3600 MHz DDR4 SO-DIMM for Gaming Laptops

With the rapid growth of the global eSports economy, the gaming laptop market is getting hotter and hotter. TEAMGROUP's gaming brand, T-FORCE releases VULCAN DDR4 3600 MHz memory module exclusively for gaming laptop. The clock frequency is as high as the maximum performance of DDR4 3600 MHz. The capacity of the memory module is up to 32 GB (16 GBx2), which allows gamers to possess high speed performance and master the key to winning every gaming battle.

Apacer's PANTHER RAGE DDR4 RGB Will Glow Away the Competition

For enthusiastic gamers and modders, powerful gear is a must. And after winning over the professional gaming crowd, Apacer is bringing some colorful bling to DRAM. Since its last incarnation, PANTHER RAGE DDR4 has evolved from single-light LED to splashy RGB, with its bold new color in Gold. Apacer is going to show that the new gear is definitely worth the wait.

By implementing the newly developed hardware architecture to enhance the RGB controller, PANTHER RAGE DDR4 RGB has improved the performance by 200%. It also seamlessly integrates with the latest ASUS Aura Sync software which is popular among gamers, and allows users to select various patterns based on their preference. On top of that, it is compatible with the latest platform by Intel and AMD.

Wishful Thinking, Disingenious Marketing: Intel's Optane Being Marketed as DRAM Memory

Intel's Optane products, based on the joint venture with Micron, have been hailed as the next step in memory technology - delivering, according to Intel's own pre-launch slides, a mid-tier, al-dente point between DRAM's performance and NAND's density and pricing. Intel even demoed their most avant-garde product in recent times (arguably, of course) - the 3D XPoint DIMM SSD. Essentially, a new storage contraption that would occupy vacant DIMM channels, delivering yet another tier of storage up for grabs for speed and space-hungry applications - accelerating workloads that would otherwise become constrained by the SATA or even NVMe protocol towards NAND drives.

Of course, that product was a way off; and that product still hasn't come to light. The marriage of Optane's density and speed with a users' DRAM subsystem is just wishful thinking at best, and the dreams of pairing DRAM and 3D Xpoint in the same memory subsystem and extracting the best of both worlds remains, well... A figment of the imagination. But not according to some retailers' websites, though. Apparently, the usage of Intel's Optane products as DRAM memory has already surfaced for some vendors - Dell and HP included. How strange, then, that this didn't come out with adequate pomp and circumstance.

Ballistix Shows Off TUF Gaming Alliance Sport Memory

Ballistix announced its ASUS TUF Gaming Allinace co-branded Sport DDR4 memory module, and we got a chance to go hands on. These modules are essentially the company Sport series mid-range sticks with a ruggedized heat-spreader, and style elements from the TUF Gaming Alliance - black with sharp golden-yellow lines. The module comes in 8 GB (single-rank) and 16 GB (dual-rank) densities, which each come in two speed variants - DDR4-2666 and DDR4-3000, making up dual-channel kits of 16 GB and 32 GB, respectively.

Team Group Announces T-FORCE XCALIBUR DDR4 Memory

Ever since from the release moment, TEAMGROUP T-FORCE gaming memory module series has been creating global gaming trends and won multiple major international design awards. Today, the long expected latest RGB memory module - T-FORCE XCALIBUR is released. The king's sword will dominate the industry by the outstanding unique design and extremely high-speed experience. Along with the gorgeous special edition and the simple general version with two ultra-high frequency DDR4 3600MHz and DDR4 4000MHz, T-FORCE XCALIBUR will fully satisfy global gamers who love building their own PC, meanwhile, it will also show the solid strength and the charm of T-FORCE product series in leading the global gaming market.

The unstoppable T-FORCE gaming product series has gained global consumers' interest in gaming ever since its release. In 2018, once again, T-FORCE releases the all new luminous memory module - T-FORCE XCALIBUR. TEAMGROUP design team continues the design concept of the ultra-wide-angle force flow effect, using the full color and dazzling RGB LED lighting with the full range, 120° ultra-wide angle luminous area at the top that emits colorful bright light. Moreover, they add unique totem element on the light guide for special edition with innovative ideas. The initial letters of T-FORCE, TF are designed as hilts of the king's sword on the heat spreader to bring an extraordinary visual experience to the gamers. The two ultra-high frequencies, DDR4 3600MHz and DDR4 4000MHz support the total capacity of 16GB(2x8GB) . With selected Samsung IC chips and strict testing standard, it offers excellent quality, optimal performance, stability and compatibility. It allows gamer to win every battle as if he/she is holding the king's sword in the gaming world, and also setting a new benchmark for RGB luminous memory modules.

Samsung Begins Mass Producing Industry's First 16Gb, 64GB DDR4 RDIMM

Samsung Electronics, announced today that it is the first in the industry to begin volume production of modules containing a 16 gigabit (Gb) monolithic 64 gigabyte (GB) DDR4 memory solution. The new registered dual in-line memory module (RDIMM), which is designed primarily for use in enterprise and cloud server applications, will be shown at the HPE Discover Las Vegas conference and exhibition June 19-21 at the Venetian-Palazzo Resort Center in Booth #170.

"Large data centers are increasingly embracing Big Data, high-speed mobility, IoT, deep learning, AI and cloud-native technologies, with Samsung and other leaders like HPE and AMD delivering integrated solutions that are faster, denser, more scalable, and more power-conserving," said Sewon Chun, senior vice president of memory marketing at Samsung Electronics. "At Samsung, we are taking the industry to new horizons with our 16Gb, 64GB RDIMMs and other leading-edge memory and storage solutions in helping to fully enable the real-time needs of leading enterprise OEMs (original equipment manufacturers) worldwide," he added.

Intel's 28-core HEDT Processor a Panic Reaction to 32-core Threadripper

At Computex 2018, we witnessed two major HEDT (high-end desktop) processor announcements. Intel unveiled a client-segment implementation of its "Skylake XCC" (extreme core count) silicon, which requires a new motherboard, while AMD announced a doubling in core-counts of its Ryzen Threadripper family, with the introduction of new 24-core and 32-core models, which are multi-chip modules of its new 12 nm "Zen+" die, and compatible with existing X399 chipset motherboards. With frantic increases in core counts, the practicality of these chips to even the most hardcore enthusiast or productivity professional diminishes. The Computex 2018 demos reek of a pissing-contest between the x86 processor giants, with AMD having an upper hand.

The HEDT segment is intended to occupy the space between client desktops and serious scalar workstations. Intel is frantically putting together a new HEDT platform positioned above its current LGA2066 (X299) platform, built around its Purley enterprise platform, and a variant of the LGA3647 socket (this chip + your X299 motherboard is no bueno). This socket is needed to wire out the 28-core Skylake XCC (extreme core count) silicon, which has a six-channel DDR4 memory interface. The company put up a live demo at the teaser of this unnamed processor, where it was running at 5.00 GHz, which led many to believe that the processor runs at that speed out of the box, at least at its maximum Turbo Boost state, if not nominal clock. Intel admitted to "Tom's Hardware," that it "forgot" to mention to the crowds that the chip was overclocked.

Team Group Reveals T-Force Xcalibur RGB Memory

Team Group showcased their long-expected T-Force Xcalibur RGB memory at their Computex booth this year. Staying true to its name, the Xcalibur RGB memory modules feature a unique design with totem elements combined with a heat spreader that resembles a sword's handle. Height of the modules is 88 mm. Team Group will be initially launching the T-Force Xcalibur RGB memory in 16 GB (2 x 8 GB) kits available in 3600 MHz and 4000 MHz configurations. Xcalibur RGB memory modules employ Samsung IC chips, which have been carefully selected and tested to provide the best performance, stability, and compatibility.

ADATA Unveils XPG Gammix D50 Line of Performance-segment DDR4 Memory

ADATA this Computex showed off its new XPG Gammix D50 line of performance-segment DDR4 memory modules. The Gammix D50 is positioned a notch below the enthusiast-segment Gammign D80 series. It lacks the "hybrid air+liquid" cooling heatspreaders from its pricier sibling, but still gives you chunky aluminium heatspreaders crowned by an acrylic diffuser, which interestingly, lacks any underlying LEDs. The Gammix D50 will come in a variety of speeds ranging from DDR4-2666 all the way to DDR4-4500, and in 8 GB single-rank and 16 GB dual-rank densities. The top-dog DDR4-4500 SKU sustains its clocks with timings of 19-19-18-39. It comes in both dual-channel (16 GB) and quad-channel (32 GB) kits.

Colorful Readies its First DDR4 Memory Modules, and They're Colorful

Colorful is on a diversification drive, and its latest expansion in PC hardware is memory. The company showed off its first DDR4 memory modules under the iGame brand, and they're, well, colorful. The common theme is a die cast metal heatspreader with a silicone diffuser on top for either RGB or fixed color illumination. The modules come in both 8 GB and 16 GB densities, making up dual-channel kits. Among the first is a 16 GB DDR4-3600 module, which will be ready for the overseas market by the end of the year.

GALAX Hall of Fame Extreme Series Limited Edition DDR4 Memory Pictured

GALAX unveiled its Hall of Fame (HOF) Extreme series limited edition DDR4 memory with a staggering speed rating of DDR4-5000. Featuring a gold-plated heatspreader, this 16 GB (8 GB x2) dual-channel kit ticks at DDR4-5000 with timings of 21-36-36-46, and at 1.50V. If that's a little too much to handle, there's also an identical-looking kit with DDR4-4700 speeds, with tighter timings of 19-26-26-46, at 1.50V.

There's also chrome/silver colored kit clocked at DDR4-4500, with 19-19-19-39 timings and 1.40V DRAM voltage, though it lacks the limited edition tag. Getting into the mid-range of this series, we find the HOF Extreme DDR4-3600 kit, with a similar design, but matte-white heatspreaders, 17-18-18-38 timings, and safer voltages of 1.35V. The gateway to this series is the HOF Extreme DDR4-3200, with 16-18-18-38 timings, at 1.35V, and a matte-black heatspreader.

Antec Enters the PC Memory Market with AntecMemory Brand

While Corsair began as a memory maker and branched out into cases and power-supplies, Antec is taking the opposite route, starting out as a case and PSU maker. The company set up the new AntecMemory brand, complete with a new logo. Its first product is the mid-range "5-series," with the possibility of the entry-level 3-series, and high-end 7-series, for sheer driving computing pleasure. The 5-series DDR4 module features either an all-white or black+white heatspreader, with an RGB LED diffuser at a corner. For now, it only comes in 8 GB single-module kits. The module ticks at DDR4-3000, with timings of 16-18-18-36, at 1.35V. There's also an ASUS TUF Gaming Alliance co-branded kit, complete with the urban camo pattern.

Gigabyte Enters the Memory Market With AORUS RGB DDR4 DRAM

In a bid to further extend their AORUS brand to other PC-critic components, Gigabyte is putting the finishing touches to another line of own-branded PC components - DDR4 memory modules. The new DDR4 modules, marketed under the company's gaming AORUS brand, feature a brushed aluminum heatspreader with AORUS' characteristic logo. Some artistic cutouts give the modules an aggressive look, and the top of the heatspreader houses an RGB diffuser that allows the modules to light up evenly. Gigabyte's tease is only that - a tease - and the company has said the final product will likely see the aluminum toned a few shades darker.

GeIL Announces Super Luce RGB SYNC Series TUF Gaming Alliance Gaming Memory

Golden Emperor International Ltd. - one of the world's leading PC components & peripheral manufacturers is announcing their Super Luce RGB SYNC Series TUF Gaming Alliance gaming memory featuring military camouflage design with RGB LED illumination. In collaboration with ASUS TUF Gaming motherboards, GeIL Super Luce RGB SYNC Series TUF Gaming Alliance gaming memory is a wise choice for mainstream gamers. The memory kit not only has an aesthetic RGB and heat spreader design but features a wide compatibility, unparalleled reliability and cost-efficiency.

INNOVENTIONS Launches Memory Testers for DDR4

INNOVENTIONS, Inc., the leading manufacturer of portable computer memory testers, is now shipping the RAMCHECK LX DDR4 and the RAMCHECK LX DDR4 Pro for testing and identifying industry standard DDR4 ECC and non-ECC SDRAM modules.

"DDR4 memory is now the standard for servers and PCs," said Dr. David Y. Feinstein, President of INNOVENTIONS. "With these new RAMCHECK LX memory testers, data centers, memory dealers and repair techs have a great tool to test and identify DDR4 DIMMs quickly and reliably. Considering the price of these big server DIMMs, the RAMCHECK LX pays for itself pretty quickly."

Samsung Announces 10 nm-Class DDR4 SO-DIMMs for Gaming Notebooks

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has started mass producing the industry's first 32-gigabyte (GB) double data rate 4 (DDR4) memory for gaming laptops in the widely used format of small outline dual in-line memory modules (SoDIMMs). The new SoDIMMs are based on 10-nanometer (nm)-class process technology that will allow users to enjoy enriched PC-grade computer games on the go, with significantly more capacity, higher speeds and lower energy consumption.

Using the new memory solution, PC manufacturers can build faster top-of-the-line gaming-oriented laptops with longer battery life at capacities exceeding conventional mobile workstations, while maintaining existing PC configurations. "Samsung's 32GB DDR4 DRAM modules will deliver gaming experiences on laptops more powerful and immersive than ever before," said Sewon Chun, senior vice president of memory marketing at Samsung Electronics. "We will continue to provide the most advanced DRAM portfolios with enhanced speed and capacity for all key market segments including premium laptops and desktops."

Patriot Viper Launches Brand New RGB DDR4 Series Memory Kits

PATRIOT, a global leader in performance memory, SSDs, gaming peripherals and flash storage solutions today announced the immediate availability of its new VIPER RGB Series Performance DDR4 Memory Kits. PATRIOT's VIPER RGB Series memory modules are designed for users who are obsessed with maximizing hardware performance without compromising stability. The VIPER RGB series are fully optimized for the latest Intel and AMD platforms and matched with a stunning heat shield design. VIPER RGB series offers RGB illumination control through a software application without additional cables to maintain an aesthetic look and stunning visuals.

The new heat spreader design is made from high-quality aluminum and designed to offer excellent thermal dissipation to maintain greater stability under heavy loads. In addition, VIPER RGB series memory is built with a customized PCB to guarantee good signal integrity for stable gaming while also offering increased overclocking potential. The memory ICs featured in VIPER RGB Series undergo a proprietary sorting process to retain strict quality standards and reliability on the latest Intel and AMD platform motherboards.
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