V-Color brought an interesting innovation to Computex 2025—DDR5 memory modules with LCD matrix displays. The company showed off its upcoming XFinity Manta DDR5 modules that come with small integrated displays (around 1-inch diagonal), which put out real-time stats such as module voltage, temperature, clock speed, timings, module density, etc. Among the speed and density options we've seen are 24 GB DDR5-7800 CL38 @1.4 V, and 24 GB DDR5-8000 CL38 @ 1.35 V. There's also a 32 GB DDR5-6400 CL32 @ 1.4 V module, a 48 GB DDR5-6000 CL28 @ 1.4 V module, and a 48 GB DDR5-7200 CL36 @ 1.4 V. The 32 GB and 48 GB modules are likely dual-rank.

We also spotted a 64 GB (2x 32 GB) DDR5-8000 CL44 @ 1.4 V dual-channel kit. Given its high speed, it is either using high-density DRAM chips in a single-rank configuration, or a CKD. Another example of high density is an XPrism 32 GB DDR5-9600 CL48 1.4 V module, and an XSky ROG co-branded series 24 GB DDR5-8800 CL42 1.45 V module. Next up are things we weren't expecting—OC R-DIMMs with RGB!

Biwin, a global leader in storage and memory solutions, announces its participation in Computex 2025, held in the Taipei Nangang Exhibition Center from May 20th to 23rd. In Hall 1, Booth #J1028, Biwin will showcase its latest products setting new benchmarks for speed, reliability, and performance in the consumer storage market. Visitors to the booth will see cutting-edge custom PC builds equipped with Biwin storage products and hands-on live product demos. With the theme "Built to Win," Biwin's booth will feature a wide array of innovative storage products designed for work, play and mobility-- with top-of-the-range Biwin Black Opal SSDs and DRAM modules sure to satisfy even the most competitive gamers, modders and overclockers.

FEATURED PRODUCTS FROM BIWIN AT COMPUTEX 2025
Black Opal X570 PRO & X570
Biwin Black Opal X570 PRO and X570 harness the power of PCIe Gen5x4 to deliver groundbreaking speeds, setting a new benchmark for high-performance storage. The X570 PRO delivers read speeds up to 14000 MB/s and write speeds up to 13000 MB/s. With a 6 nm controller and 8-channel architecture, it maximizes data throughput while maintaining exceptional power efficiency. Featuring up to 4 GB DRAM cache, it reaches 2000K IOPS random read speeds for faster high-load scenarios. While the X570 delivers impressive read speeds up to 14500 MB/s in an efficient, DRAM-less design. By leveraging Host Memory Buffer (HMB) and dynamic SLC cache, it enables faster application launches, quicker game loading, and smoother file transfers.

Slimbook, a Linux hardware manufacturer based in Europe (Spain) unveiled Kymera Black, a highly configurable desktop computer designed for gamers, content creators and hardware enthusiasts. This latest model focuses on flexibility, performance and durability. Kymera Black comes with options for AMD or Intel processors, capable of housing up to the latest AMD Ryzen 9 or Intel Ultra 9 CPUs. It can support up to 192 GB of DDR5 RAM running at 6000 MHz, as well as a wide variety of storage options up to 4 TB NVMe 5.0 SSDs (NVMe 5.0 optional depending on motherboard) and 80 TB of HDD capacity. For networking, it can feature up to Wi-Fi 7 (depending on motherboard) and 2.5G Ethernet connectivity, and up to 1200 W Platinum power supply units.

This desktop PC features a matte black metal chassis with modular components, removable panels, and washable dust filters. The case uses a combination of tempered glass and metal side panels with an optional 8-inch front display to monitor system temperature, fan speed, and component performance in real time. In terms of software, the Kymera Black offers a wide selection of pre-installed Linux distributions. These include the Ubuntu-based Slimbook OS with GNOME or KDE Plasma, as well as Kubuntu, Xubuntu, Ubuntu MATE, KDE neon, Debian, elementary OS, Pop!_OS, Linux Mint, Fedora, openSUSE, Manjaro, EndeavourOS, and Lliurex.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to unveil DDR5 memory with an ultra-high kit capacity of 256 GB (64 GB x4), overclocked to DDR5-6000 CL32. Built with high-performance SK hynix DDR5 ICs, this overclock memory speed and timing pushes the boundaries of memory overclocking by fully loading 4 modules of high-capacity DDR5 64 GB U-DIMM modules on a single system; marking a new milestone for high-performance computing, content creation, AI applications, and advanced workstation workloads.

Overclocked, Ultra-Capacity 256 GB (64 GB x4) at DDR5-6000 CL32 In content creation and recent advancements in AI, the need for higher DRAM capacity is essential. Whether calculating large language models or working with complex or high-resolution video content, high-speed memory of high-density 64 GB modules would help to provide a smoother and more efficient workflow. Loaded with AMD EXPO memory overclock profiles, see the DDR5-6000 CL32 256 GB (64 GB x4) kit being stress-tested in the screenshots below on the ASUS ROG CROSSHAIR X870E HERO motherboard with the AMD Ryzen 7 9800X3D desktop processor, as well as on the MSI MPG X870E CARBON WIFI motherboard with the AMD Ryzen 9 9900X desktop processor.

G.Skill International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing a new high-capacity, low-latency DDR5 specification of DDR5-6000 CL26 with a total of 96 GB (48 GB x2) kit capacity, intended for the AMD AM5 platform. Designed for PC enthusiasts, gamers, professionals, and AI applications who are looking for high performance, this new memory kit enables low-latency performance at high kit capacities on the latest AMD computing platforms.

High-Capacity & Low-Latency Performance DDR5 Memory for AMD AM5
G.Skill continues to push the limits of DDR5 memory with the new DDR5-6000 CL26 at a high kit capacity of 96 GB (48 GB x2). Featuring a very low latency timing of CL26-36-36-96, this memory kit is engineered to provide efficiency and responsiveness for high-performance computing tasks, such as content creation, 3D modeling, or AI applications, on the latest AMD AM5 platforms. See below for a Memtest validation screenshots on the ASUS ROG CROSSHAIR X870E HERO motherboard with the AMD Ryzen 9 9950X3D desktop processor, as well as on the MSI MPG X870E CARBON WIFI motherboard with the AMD Ryzen 9 9900X desktop processor.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the release of three new DDR5 memory specifications with AMD EXPO OC profiles for AMD platforms, including an extreme speed with low-latency at DDR5-8000 CL36-48-48 48 GB (24 GB x2), large-capacity & low-latency DDR5-6000 CL28-36-36 192 GB (48 GB x4), and a new DDR5-6000 CL26-39-39 with 48 GB (24 GB x2) kit capacity. Designed for PC enthusiasts, gamers, content creators, and AI applications, these cutting-edge DDR5 memory kits push the boundaries of speed, latency, and capacity on AMD AM5 platforms.

Pushing the Limits with Extreme DDR5-8000 CL36 24 GB x2
For users seeking top-tier performance, the new DDR5-8000 CL36-48-48 24 GB x2 memory kit with AMD EXPO OC profile is engineered for ultra-high memory speed at low CL36 latency timings. This extreme-speed and low-latency combination is ideal for exceptional system responsiveness and multitasking performance. See below for the Memtest validation screenshot showcasing its stability on the ASUS ROG Crosshair X870E Hero motherboard and AMD Ryzen 9 9900X desktop processor.

Biwin, a world-renowned innovator in cutting-edge memory and storage solutions, proudly introduces the Biwin Black Opal OC Lab Gold Edition DW100 RGB DDR5 192 GB Memory Kit (48 GB x 4), available in DDR5-6400 CL30-39-39-108 1.4 V and DDR5-6000 CL28-36-36-102 1.4 V specifications. Breaking the capacity limits of traditional consumer memory, this ultra-large 192 GB kit offers the performance boost needed for AI computing, large-scale data processing, and next-gen computing.

Push Memory Performance with Revolutionary 192 GB Memory Kit
Biwin Black Opal DW100, delivering an ultra-high-capacity 192 GB (48 GB x4) configuration, redefines what's possible with desktop memory and exceptional memory bandwidth, stability, and efficiency. This breakthrough enables users to take full advantage of DDR5's enhanced data throughput to power fast, out-of-the-box speeds for AI computing, large language models (LLMs), generative AI, and edge computing, and other data-rich workloads.

TechInsights has identified CXMT's new 16 nm DRAM chips in Gloway DDR-6000 UDIMM modules, confirming advancement in the Chinese memory industry. The CXMT 16 Gb DDR5 chip measures 67 square millimeters with a density of 0.239 Gb per square millimeter. The G4 DRAM cells are 20 percent smaller than CXMT's previous G3 generation. This follows the company's progression from 23 nm (G1) and 18 nm (G2) nodes. Despite this advancement, CXMT remains approximately three years behind Samsung, SK Hynix, and Micron in manufacturing capabilities. The Hefei-based company achieved this production milestone under US sanctions restricting access to certain manufacturing equipment and materials, setting it back years in gaining production of advanced memory nodes.

TechInsights found these chips in commercially available memory modules, confirming CXMT's entry into DDR5 production. DDR5 technology is projected to be the primary DRAM standard through 2027. The three major DRAM manufacturers have been producing DDR5 through multiple generations, with DDR5 now reaching 10,000 MT/s speeds. This represents CXMT's first DDR5 DRAM product to reach the consumer market. The chips meet basic compatibility requirements for current DDR5 specifications, meaning that the Chinese memory manufacturing has achieved "1z" memory manufacturing on its soil. This marks the second major news for the Chinese semiconductor industry, right after TechInsights also confirmed that YMTC has started shipping 292-layer NAND Flash. With domestic demand for memory and storage projected to remain strong, we wonder if the supply will exceed demand and allow some left-over chips for worldwide usage.

You've seen Splave on top of overclocking leaderboards, get ready to see him on PC hardware store shelves. The professional overclocker now has a line of high-end PC memory kits and power supplies in partnership with G.Skill and Enermax. The new Enermax Revolution DFX Pro 1350 W Splave Edition (the show demo was a different model as proof of concept) has a few features custom designed by him. The first one is a button that flushes all capacitors to make sure there's no residual power left in it when the AC input is switched off. Overclockers tend to need this between resets, and even waste a few seconds waiting on their PSUs to drain, or getting their motherboards to do that job (not recommended). The PSU has individually sleeved cables that are designed to not get in the way, and make them easier to manage; and the fan is configured to turn backwards for 20 seconds, blowing air out, each time the PSU is sent an ACPI shutdown command.

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, is thrilled to release new low CAS latency memory kits featuring AMD EXPO overclock profile for the new AMD Ryzen 9000 series processors and performance X870 chipset motherboards. These new specifications include DDR5-6000 CL26 2x16GB/2x32GB kits and 2x 24 GB/2x 48 GB memory kits under the Trident Z5 Royal Neo, Trident Z5 Neo RGB, and Ripjaws M5 RGB Neo series.

Aiming to provide high-performance overclock DDR5 memory for PC enthusiasts, G.SKILL is releasing a new low CAS Latency memory kit at DDR5-6000 CL26-36-36-96 with kit capacity configuration of 32 GB (2x16GB), as well as the world's first 64 GB (2x32GB) kit capacity for this low latency specification. Featuring the AMD EXPO memory overclocking profile, these new specifications are built for selected X870 series motherboards and AMD Ryzen 9000 series processors. The screenshot below demonstrates DDR5-6000 CL26 2x32GB kit's stability under the Memtest memory stress test on the ASUS ROG Crosshair X870E Hero motherboard and AMD Ryzen 9 9900X desktop processor.

Lexar late last week introduced the ARES DDR5-6000 CL26 memory kit. The kit is optimized for AMD Ryzen platforms, such as the recently launched Ryzen 7 9800X3D. It comes with an AMD EXPO profile for DDR5-6000 and tight timings, including a CAS latency of 26, or 55 ns. It also includes an Intel XMP 3.0 profile that enables the same timings. Typical DDR5-6000 kits tend to come with a CL of 30. Under the hood, the kit uses SK Hynix A-die DRAM chips, and a 10-layer PCB. The module features thermal pads for not just the DRAM chips, but also the PMIC. These transfer heat to a 1.8 mm-thick aluminium heatspreader that's crowned by a silicone diffuser for the module's lighting setup that consists of eight ARGB LEDs, with 13 lighting presets. The module comes in two color options—silver and black. The company didn't reveal pricing or availability information.

AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.

COLORFIRE has introduced the new Aries series memory modules. The new Aries memory will be sold in kits, with the main specifications being DDR4 3600 8 GB x2 and 16 GB x2, all with a timing of CL16. It also includes DDR5 variants, offering DDR5-6000 16 GB x2 and 6400 16 GB x2 at different frequencies. The Aries memory, positioned above the previously released Scorpio series, features optimized timing and the addition of DDR5 standards. By incorporating zodiac elements into the memory design, COLORFIRE is continuing to experiment with its product offerings.

COLORFIRE, a brand by Chinese hardware maker COLORFUL, is tailored to cater to younger users and a range of different styles. The products align with diverse elements like cute, anime, and trendy lifestyle themes. COLORFIRE has successfully captivated users with its "Cyber Rua Cat" theme, launching the highly popular MEOW series, which includes VGA, motherboards, memory, SSDs, and a full range of peripherals such as speakers and headphones.

We've known for the past couple of weeks that AMD is working on the Ryzen 5 7600X3D—a 6-core/12-thread processor based on the older "Zen 4" microarchitecture, but featuring 3D V-cache that enables significant gaming performance uplifts. The company finally launched the chip, but here's the bummer—it's only available in the US, and is a MicroCenter exclusive, where's it's going for $299.99. Here's the second bummer—you can't buy the processor on its own, but in a 3-part bundle that includes it, an ASUS TUF Gaming B650-Plus Wi-Fi motherboard, and an unspecified brand of 32 GB (2x 16 GB) DDR5-6000 memory kit. When you add up the prices of the three parts when purchased separately, you arrive at $630, but MicroCenter is selling the bundle for an impressive $450—a $180 discount.

The AMD Ryzen 5 7600X3D comes with a maximum boost frequency of 4.70 GHz, which is a steep 600 MHz fall from that of the regular Ryzen 5 7600X, and 400 MHz less than that of the 65 W Ryzen 5 7600 (non-X). Much like the 7600, the 7600X3D comes with a 65 W TDP. Where it loses on clock speeds, it makes up for with its large cache—1 MB of L2 cache per core, and 96 MB of L3 cache (or 102 MB of L2+L3 "total cache."). The bundle could offer good value for those building PCs from scratch, or coming in from the older Socket AM4 platform. The TUF Gaming B650-Plus Wi-Fi is a fairly feature-packed mid-range ATX motherboard.

MSI is excited to announce the launch of the latest AMD Ryzen 9000 Series processors, set to debut on the AM5 platform. Powered by advanced 4 nm CPU process technology, the Ryzen 9000 Series promises to revolutionize the computing landscape with unmatched performance, efficiency, and versatility for gamers and content creators. At launch, August 8th, AMD Ryzen 7 9700X, and Ryzen 5 9600X are available while the Ryzen 9 9950X and 9900X will launch on August 15th. These processors will feature up to 16 cores and 32 threads, with a theoretical maximum boost clock speed of 5.7 GHz, 64 MB of L3 cache, and a maximum TDP of 170 W.

AMD Ryzen 9000 Series will also support PCIe 5.0 for the GPU and M.2 while enhancing DDR5 memory speed. Notably, the AMD Ryzen 7 9700X offers approximately 12% better overall performance than the first-gen AMD 3D V-cache CPU. All these processors are compatible with the AM5 socket, and existing AMD 600 Series motherboards and Ryzen 9000 Series processors can seamlessly integrate by updating to the latest BIOS, available on MSI's product support page.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce an ultra-low latency specification of DDR5-6000 CL28-36-36-96 in 32 GB (2x16GB) and 64 GB (2x32GB) kit capacities, and DDR5-6000 CL28-38-38-96 in 48 GB (2x24GB) and 96 GB (2x48GB) kit capacities under the new Trident Z5 Royal Neo series, designed for compatible AMD AM5 platforms. Including AMD EXPO technology for an easy memory overclock experience in BIOS, this overclock performance memory kit with low timing is the ideal DDR5 memory solution for enthusiasts and overclockers.

Optimization with Memory Timing
For enthusiasts and overclockers, memory timing or latency is a key factor in squeezing performance out of a memory kit. Since memory timing is the delay between specific actions, a lower latency is desired; and performance may be improved by finding the best mix of memory speed and latency. Compared to a standard DDR5 memory speed and latency of DDR5-4800 CL40, this new DDR5-6000 CL28 memory specification aims to deliver a more optimized combination on compatible AMD AM5 platforms.