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Samsung Develops 512 GB DDR5 Memory Modules Running at 7.2 Gbps

At this year's Hot chips 33 conference, Samsung has presented its works on the upcoming DDR5 memory standard. The company has managed to achieve a lot of new developments, as the newer standard pairs with new technologies to deliver higher speeds and better capacity. The Korean company designed its DDR5 modules as 8-high (8H) stacked TSV (through silicon via) dies. In the previous DDR4 implementations, Samsung used 4-high (4H) stacked TSV dies, which are actually thicker than the latest 8-high implementations. To achieve the new thin design, Samsung has used thin wafer handling techniques, which resulted in a 40% reduction in gab between stacked dies. The new 8H DDR5 modules are only 1.0 mm thick, compared to the 1.2 mm of the older 4H modules.

When it comes to performance, Samsung expects the new DDR5 modules to deliver big. Running at 7.2 Gbps speeds, the Samsung-made RDIMM/LRDIMM modules can reach up to 512 GB in capacity. This is, of course, limited to the server/enterprise market. Regular consumers/PC users can expect to have UDIMMs with up to 64 GB of capacity. The aforementioned 7.2 Gbps speed is achieved at the specified 1.1 Volts of power, meaning that Samsung's implementation is very efficient. According to some estimations made by the company, the DDR5 crossover for the mainstream market is not expected before 2023/2024, meaning that there is still a lot of time for memory makers to refine their DDR5 products.

Lexar Announces Hades RGB Line of Premium DDR4 Gaming Memory

Lexar, a leading global brand of flash memory solutions, is proud to announce the new HADES product line of Gaming DRAM products. This is our introduction into the gaming DRAM category as Lexar expands its product portfolio. The new Lexar HADES RGB DDR4 3600/3200 Desktop Memory is for gamers looking for next-level performance and an enhanced gaming experience with customizable RGB lighting. The Lexar HADES OC DDR4 3600/3200 Desktop Memory is the perfect upgrade for gamers and content creators who want optimized performance and a next-level gaming experience or for intensive workloads.

The HADES RGB DDR4 overclocked memory allows you to level-up your gaming experience without slow-downs. And with its RGB lighting effects, the HADES RGB DDR4 memory enhances your gameplay with vibrant colors of RGB lighting effects. The RGB customization creates a lively atmosphere rendering your gameplay more realistic, and adds a touch of style to your gaming setups. It also features Lexar RGB Sync, a powerful lighting control software which allows you to customize and synchronize your lighting effects by setting color, intensity, and speed while allowing you to save your lighting effects for later use. The Lexar HADES RGB DDR4 3600/3200 is also compatible with ASUS Aura Sync, GIGABYTE RGB Fusion 2.0, MSI Mystic Light, ASRock Polychrome SYNC.

Penetration Rate of Ice Lake CPUs in Server Market Expected to Surpass 30% by Year's End as x86 Architecture Remains Dominant, Says TrendForce

While the server industry transitions to the latest generation of processors based on the x86 platform, the Intel Ice Lake and AMD Milan CPUs entered mass production earlier this year and were shipped to certain customers, such as North American CSPs and telecommunication companies, at a low volume in 1Q21, according to TrendForce's latest investigations. These processors are expected to begin seeing widespread adoption in the server market in 3Q21. TrendForce believes that Ice Lake represents a step-up in computing performance from the previous generation due to its higher scalability and support for more memory channels. On the other hand, the new normal that emerged in the post-pandemic era is expected to drive clients in the server sector to partially migrate to the Ice Lake platform, whose share in the server market is expected to surpass 30% in 4Q21.

Kingston FURY Released, New Lineup Takes Systems to the Next Level

Kingston FURY, a division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today it has begun shipping its high-performance memory: Kingston FURY Renegade, Kingston FURY Beast, and Kingston FURY Impact. Enthusiasts and gamers can give their systems the upgrade they need and want with modules in DDR4 RGB, DDR4 non-RGB, and DDR3.

Perfect for the gamer who wants cutting-edge performance, Kingston FURY Renegade DDR4 RGB1 allows you to crank up your frame rate, keep your streams broadcasting smoothly, and plow through your highlight reel editing. Offering speeds up to 4600 MHz2 paired with quick CL15-CL19 latencies. The dynamic RGB lighting utilizes Kingston FURY's patented Infrared Sync Technology to provide smooth, synchronized lighting effects. With its own aggressive, stylish black heat spreader and matching black PCB Kingston FURY Renegade DDR4 also provides ultra-fast speeds up to 5333 MHz2, paired with quick CL13-CL20 timings. Both are Intel XMP certified with profiles that are optimized for Intel's latest chipsets - just select the hand-tuned profile in your BIOS and you're ready to strike fear in the hearts of your foes. Available in single module capacities of 8 GB - 32 GB and kits of 2, 4, and 8 with capacities up to 256 GB.

Team Group Steps into the New DDR5 Era, Launches Team Elite DDR5 DIMM

At the end of 2020, TEAMGROUP reached a cooperation agreement with top DRAM wafer manufacturers and started working on DDR5 technology. Since then, TEAMGROUP has dedicated to the research and development of DDR5 modules, collaborating with various major motherboard manufacturers to ensure that each R&D stage undergoes comprehensive testing and to deliver products of the highest quality that the industry has ever seen. TEAMGROUP is leading the industry today as we announce our official launch of the world's first DDR5 memory module for desktops, the TEAMGROUP ELITE U-DIMM DDR5, which is estimated to be available on major EC platforms for consumers worldwide by the end of June and the beginning of July.

The initial launch of TEAMGROUP ELITE DDR5 memory module will support 16GBx2 of capacity at a frequency of 4800 MHz, with a voltage of 1.1 V CL40-40-40-77, which complies with the standard specifications defined by the JEDEC association. Compared to the maximum 3200 MHz standard frequency in the DDR4 generation, the DDR5 is able to increase the speed to up to 50%. The low 1.1 V voltage is also more energy efficient than its previous generation; to ensure minimum noise interference for the memory module, the power management is transferred from the motherboard onto the memory with an additional power management IC (PMIC) for more effective system load control. The most incredible feature of ELITE DDR5 is doubling the 16 banks of DDR4 to those of 32 in DDR5 to improve the IC structure, providing double access availability. An on-die ECC (error correction code) included in the DRAM IC is also available for self-recovery of the DRAM unit, ensuring that DRAM systems with DDR5 can obtain higher levels of stability.

CORSAIR Teases DDR5-6400 Memory Coming Later This Year

The fifth iteration of DDR technology, called DDR5, is set to arrive later this year. Many makers of DDR4 technology are announcing their plans to switch to the new standard, and CORSAIR is no exception. Known as the maker of high-quality products, CORSAIR has today posted a blog post teasing company's upcoming DDR5 products, and what they will be bringing to the table. For starters, the company has posted data about DDR5 modules that run at 6400 MHz speed, which is assumed to be the speed of the CORSAIR DDR5 modules when they arrive. At such speed, the memory can achieve a bandwidth of 51 GB/s, which is almost double the 26 GB/s that DDR4-3200 MHz memory achieves.

Another point CORSAIR wrote about is the capacity of a single DIMM. With DDR4, the company has made DIMMs that are only up to 32 GB in capacity. However, with DDR5, CORSAIR plans to quadruple that and build a single DDR5 DIMM that has up to 128 GB of memory on it. Another big point was the power required to run the new technology. The DDR4 standard required 1.2 Volts for operation, while the JEDEC specification says that DDR5 needs just 1.1 Volts to run. This will result in a cooler operation of memory modules.

SMART Modular Announces New Memory Solutions for Data Center Networking Applications

SMART Modular Technologies, a subsidiary of SMART Global Holdings, Inc., (Nasdaq: SGH), has expanded its support for data center networking applications with the introduction of DuraMemory high-density, very low profile DIMMs and Mini-DIMMs for hyperscale network switching. These products are ideal for maximizing network bandwidth and reliability, which is critical to data center networking requirements.

Network memory dictates the amount of data stored or transferred in switching and routing equipment. Low density as well as poor quality memory can disrupt the performance of a network by acting as a bottleneck to data transfer. The rating and attributes of memory can also greatly affect data center network's overall efficiency.

ASRock Rack Puts AMD Ryzen 5000 Series Processor in 1U Short Depth Server

ASRock Rack, a division of ASRock dedicated to server/enterprise products, has today quietly launched a 1U short depth server, equipped with AMD's X570 motherboards, able to accommodate AMD Ryzen 5000 series of processors. The 1U2-X570/2T, as ASRock calls it, features an X570D4I-2T motherboard that is capable of housing any AMD Ryzen and Ryzen Pro 5000 series processor with TDP up to 105 Watts, paired with up to four SO-DIMMs of DDR4 ECC memory. Being a remote desktop/server type of build, the 1U case is not designed to be equipped with any powerful discrete graphics card. There is room for the motherboard, the power supply, and the HDDs located next to the motherboard.

Equipped with an 80-Plus Bronze 265 Watt PSU, the system can handle almost any CPU it is equipped with, two 3.5" drives and two 2.5" 7 mm drives. The motherboard also supports M.2 2280 SSD with PCIe 4.0 protocol support. When it comes to basic graphics output, ASRock Rack has installed an ASPEED AST2500 graphics controller to handle basic video output and display the command line, so you can operate with your server with ease. When it comes to networking, it is equipped with dual RJ45 10 GbE connectors, coming from an Intel X550-AT2 Ethernet controller. For more details, head over to the ASRock Rack 1U2-X570/2T product page.

Team T-FORCE Gaming Launches the Next-Gen with Overclockable DDR5 Memory

TEAMGROUP has worked vigorously on the development of next-generation DDR5 memory. After completing validation tests for standard DDR5 U-DIMM and SO-DIMM products with the collaboration of major motherboard manufacturers, TEAMGROUP is announcing an exciting breakthrough today: its T-FORCE brand has successfully created DDR5 overclocking memory. Samples were immediately sent to ASUS, ASRock, MSI, and GIGABYTE for collaborative testing of its overclocking capability. Consumers can expect TEAMGROUP's products to be fully compatible with motherboards from the four major manufacturers when the DDR5 generation arrives.

The DDR5 overclocking memory has greater room for voltage adjustment, due to its upgraded power management IC. This PMIC can support high frequency overclocking with voltage over 2.6 V. In previous generations, voltage conversion was controlled by the motherboard. With DDR5, components were moved to the memory, enabling the module to handle the voltage conversion, which not only reduces voltage wear but also reduces noise generation. This allows significantly increased room for overclocking compared to the past, and more powerful computing processing.

Longsys Launches DDR5 Memory and Publishes Test Data

Longsys Electronics launches the Longsys DDR5 memory module (ES1). The company has done so in order to keep up with the development of storage technologies, to meet expectations from industry professionals and users regarding future product technology development, and to provide more possibilities for the future of storage industry applications. Moreover, Longsys' FORESEE, a technical storage brand, and Lexar, a storage brand for high-end consumer goods, will also provide strong support in their main areas of application.

The newly-launched DDR5 involves the prototypes of two new architecture products: the 1-Rank x8, and the 2-Rank x8 standard PC Unbuffered DIMM 288PIN On-die-ECC. Compared with DDR4, DDR5 boasts significantly improved function and performance.

DDR5-6400 RAM Benchmarked on Intel Alder Lake Platform, Shows Major Improvement Over DDR4

As the industry is preparing for a shift to the new DDR standard, companies are trying to adopt the new technology and many companies are manufacturing the latest DDR5 memory modules. One of them is Shenzhen Longsys Electronics Co. Ltd, a Chinese manufacturer of memory chips, which has today demonstrated the power of DDR5 technology. Starting with this year, client platforms are expected to make a transition to the new standard, with the data center/server platform following. Using Intel's yet unreleased Alder Lake-S client platform, Longsys has been able to test its DDR5 DIMMs running at an amazing 6400 MHz speed and the company got some very interesting results.

Longsys has demoed a DDR5 module with 32 GB capacity, CAS Latency (CL) of 40 CL, operating voltage of 1.1 V, and memory modules clocked at 6400 MHz. With this being an impressive memory module, this is not the peak of DDR5. According to JEDEC specification, DDR5 will come with up to 8400 MHz speeds and capacities that are up to 128 GB per DIMM. Longsys has run some benchmarks, using an 8-core Alder Lake CPU, in AIDA64 and Ludashi. The company then proceeded to compare these results with DDR4-3200 MHz CL22 memory, which Longsys also manufactures. And the results? In AIDA64 tests, the new DDR5 module is faster anywhere from 12-36%, with the only regression seen in latency, where DDR5 is doubling it. In synthetic Ludashi Master Lu benchmark, the new DDR5 was spotted running 112% faster. Of course, these benchmarks, which you can check out here, are provided by the manufacturer, so you must take them with a grain of salt.

TYAN Now Offers AMD EPYC 7003 Processor Powered Systems

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced AMD EPYC 7003 Series Processor-based server platforms featuring efficiency and performance enhancements in hardware, security, and memory density for the modern data center.

"Big data has become capital today. Large amounts of data and faster answers drive better decisions. TYAN's industry-leading server platforms powered by 3rd Gen AMD EPYC processors enable businesses to make more accurate decisions with higher precision," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "Moving the bar once more for workload performance, EPYC 7003 Series processors provide the performance needed in the heart of the enterprise to help IT professionals drive faster time to results," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. "Time is the new metric for efficiency and EPYC 7003 Series processors are the perfect choice for the most diverse workloads, helping provide more and better data to drive better business outcomes."

Team Group Develops Next-Gen DDR5 SO-DIMM

Leading global memory brand TEAMGROUP continues to make its mark on the next generation of DDR5 memory. At the end of last year, the company announced that it had entered the validation phase with the collaboration of major motherboard manufacturers. In early 2021, it has made another breakthrough. Paying attention to the needs of not only desktop but also notebook and mini PC users, TEAMGROUP has successfully created DDR5 SO-DIMM and is expected to be the first to take Intel and AMD's new platform validation tests.

Specifications of the DDR5 SO-DIMM at the early stage of development resemble those of the U-DIMM version. A single module has a capacity of 16 GB and a frequency of 4800 MHz, and both versions run at the lowered voltage of 1.1 V. For notebooks that need to stay mobile for a long period of time, this can noticeably reduce power consumption and extend standby time. DDR5 SO-DIMM also supports on-die ECC, a feature that self-corrects single-bit errors, greatly improving system stability. Users can look forward to the convenience and peace of mind that DDR5 will bring to notebooks, mini PCs, NAS, and more.

ASRock Rack Brings AMD EPYC CPUs to "Deep" Mini-ITX Form Factor

ASRock Rack, a branch of ASRock focused on making server products, has today launched a new motherboard that can accommodate up to 64 core AMD EPYC CPU. Built on the new, proprietary form factor called "Deep Mini-ITX", the ROMED4ID-2T motherboard is just a bit bigger than the standard ITX board. The standard ITX boards are 170 x 170 mm, while this Deep Mini-ITX form extends the board by a bit. It measures 170 x 208.28 mm, or 6.7" x 8.2" for all of the American readers. ASRock specifies that the board supports AMD's second-generation EPYC "Rome" 7002 series processors. Of course, the socket for these CPUs is socket SP3 (LGA4094) with 4094 pins.

The motherboard comes with 4 DDR4 DIMM slots, of any type. Supported DIMM types are R-DIMM, LR-DIMM, and NV-DIMM. If you want the best capacity, LR-DIMM use enables you to use up to 256 GB of memory. When it comes to expansion, you can hook-up any PCIe 4.0 device to the PCIe 4.0 x16 slot. There is also an M.2 2280 key present, so you can fit in one of those high-speed PCIe 4.0 x4 M.2 SSDs. For connection to the outside world, the board uses an Intel X550-AT2 controller that controls two RJ45 10 GbE connectors. There are also two Slimline (PCIe 4.0 x8 or 8 SATA 6 Gb/s), and four Slimline (PCIe 4.0 x8) storage U.2 ports.

New World Record: Crucial Ballistix Max Memory Overclocked to 7004 MHz

Overclocking is always fun and almost everyone can do it, however, when it comes to extreme overclocking, there are only a handful of persons doing it. Today, a Chinese extreme overclocker "baby-j" has managed to establish a new world record frequency with his Crucial Ballistix Max DDR4-4000 (BLM16G40C18U4B.M8FB1) memory kit. Using liquid nitrogen (LN2) cooling for the DIMMs, the overclocker managed to push the memory kit to an amazing 7004.2 MHz, making it the world's highest frequency hit on DDR4 memory. What is more amazing is the fact that the platform used for the new record-setting overclock, is based on AMD's B550 motherboards running with AMD Ryzen 5 PRO 4650G processor, which seems to have a very good memory controller. The timings were a bit relaxed with them running at 22-26-26-46-127-1 (tCAS-tRC-tRP-tRAS-tCS-tCR) settings.

SK hynix Launches World's First DDR5 DRAM

SK hynix Inc. announced to launch world's first DDR5 DRAM. It is a high-speed and high-density product optimized for Big Data, Artificial Intelligence (AI), and machine learning (ML) as a next generation standard of DRAM. Since SK hynix announced the development of World's First 16 Gigabit (Gb) DDR5 DRAM on November 2018, the Company has provided its major partners including Intel with sample products, and has completed various tests and verification of its functions and compatibility. This will allow SK hynix to provide its customers with the products once the DDR5 market becomes active.

In the meantime, SK hynix has conducted joint-operation of on-site lab, system-level test, and simulation with System-on-Chip) (SoC) manufacturers to verify the functions of DDR5. Also, the Company validated compatibility of its DDR5 and the major components on DRAM module including register clock driver) (RCD), which affect DRAM performance, and power management integrated circuit) (PMIC). Through these verifications, SK hynix has been collaborating closely with its global partners.

HyperX Increases DRAM Density With New Impact SODIMM DDR4 Lineup

HyperX has launched their Impact lineup of DDR4 DRAM, which boasts of high memory densities per stick for space-constrained setups such as laptops or SFF PCs. The new Impact SODIMMs are available in capacities up to 32 GB per stick, which should make possible for users to install up to 64 GB of DDR4 RAM in their system. All Impact SODIMM operate at 1.2 V, thus enabling relatively low power consumption.

Available operating frequencies stand at 2400 MHz (15-15-15); 2666 MHz (16-18-18); 2933 MHz (17-19-19); and 3200 MHz (20-22-22) - timings are slightly loose, but that's to be expected at these densities and, most importantly in space and/or cooling-constrained environments, voltage. HyperX Impact SODIMMs are available in single modules, dual channel kits, and quad channel kits. MSRP starts at $77 for a 16 GB module running at 2400 MHz, and apparently tops out at $358.99 for 2x 32 GB modules at 3200 MHz.

Kingston Technology Top DRAM Module Supplier in 2019

Kingston Technology Europe Co LLP, an affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has been ranked the top third-party DRAM module supplier in the world, according to the latest rankings by revenue from analyst firm TrendForce (formerly DRAMeXchange). Kingston retains its number 1 position with an estimated 80.33% market share on $12.9B (USD) revenue, according to TrendForce. The rankings for 2019 mark the 17th consecutive year that TrendForce has placed Kingston in the top spot.

TrendForce states DRAM prices were lower in 2019 due to an ample supply combined with weaker demand from both the server and client sides, thus resulting in less revenue for many module makers. Kingston was one of the few manufacturers to go against this trend and see market share grow, according to the analysts. Kingston has maintained its competitive advantage by working closely with its partners and customers to remain flexible while adapting to their ever-changing needs as well as market conditions. The following chart with results provided by TrendForce shows the top 10 DRAM module suppliers:

Transcend Releases DDR4 3200 MHz Industrial Modules

Transcend, a leading brand of industrial-grade memory products and storage solutions, recently announced the release of a new series of industrial-grade DDR4-3200 memory modules. Aiming at 5G networking and intelligent computing at the edge, DDR4-3200 memory modules feature high transmission bandwidth at 3200MT/s, low latency, and low power consumption, running at 1.2 V. The line-up includes Unbuffered Long-DIMM, Unbuffered SO-DIMM, ECC Long-DIMM, ECC SO-DIMM, and Registered Long-DIMM, addressing the varied, and often strict, form factor requirements of vertical markets. Fully complied with JEDEC specification, DDR4-3200 memory modules are optimized for Intel, AMD, and ARM processors. The DDR4-3200 DIMMs are ready to power up embedded telecommunication, in-vehicle, gaming, and smart healthcare applications in the approaching AIoT decade.

JEDEC Publishes New DDR5 Standard for Advancing Next-Generation High Performance Computing Systems

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the widely-anticipated JESD79-5 DDR5 SDRAM standard. The standard addresses demand requirements being driven by intensive cloud and enterprise data center applications, providing developers with twice the performance and much improved power efficiency. JESD79-5 DDR5 is now available for download from the JEDEC website.

DDR5 was designed to meet increasing needs for efficient performance in a wide range of applications including client systems and high-performance servers. DDR5 incorporates memory technology that leverages and extends industry know-how and experience developing previous DDR memories. The standard is architected to enable scaling memory performance without degrading channel efficiency at higher speeds, which has been achieved by doubling the burst-length to BL16 and bank-count to 32 from 16. This revolutionary architecture provides better channel efficiency and higher application level performance that will enable the continued evolution of next-generation computing systems. In addition, the DDR5 DIMM has two 40-bit fully independent sub-channels on the same module for efficiency and improved reliability.

New features, such as DFE (Decision Feedback Equalization), enable IO speed scalability for higher bandwidth and improved performance. DDR5 supports double the bandwidth as compared to its predecessor, DDR4, and is expected to be launched at 4.8 Gbps (50% higher than DDR4's end of life speed of 3.2 Gbps).

Patriot Viper Gaming Announces 32GB VIPER STEEL SODIMMs and UDIMMs

VIPER GAMING by PATRIOT, a trademarked brand of PATRIOT and a global leader in performance memory, solid-state drives, and flash storage solutions, is excited to announce the launch of their new 32 GB memory modules into the VIPER STEEL SERIES DDR4 PERFORMANCE MEMORY. The new 32 GB modules are available in both UDIMM and SODIMM. The frequencies from 3000 MHz to 3600 MHz are available for UDIMM and the frequencies from 2400 MHz to 3000 MHz for SODIMM. The new modules are built from rigorously tested memory chips and components on a ten-layer PCB for optimum performance in gaming desktops and laptops.

The VIPER STEEL provides extra gaming performance and stability for the most demanding desktop and laptop environments across the latest Intel and AMD platforms. The VIPER STEEL modules bring Intel XMP 2.0 performance to the next level by offering hardcore gamers and enthusiasts the possibility to upgrade their gaming systems with more DRAM memory capacity and further extending their potential.

BIOSTAR Announces Racing Z490GTA and Z490GTN Motherboards

BIOSTAR, a leading manufacturer of motherboards and graphics cards, today announced the new RACING Z490GTA and the RACING Z490GTN motherboards which powers the new 10th Gen Intel Core processors. Geared Towards power efficiency and flawless performance, the BIOSTAR RACING Z490GTA and the RACING Z490GTN motherboards have been built to last, with its stylish RACING DNA carried down from their premium flagship motherboard the RACING Z490GTA EVO.

Much similar to their elder sibling, BIOSTAR's RACING Z490GTA and the RACING Z490GTN motherboards are built around the new LGA 1200 socket designed to support the high power requirements of the new 10th generation of Intel Core processors with their new microarchitecture Z490 chipset, and BIOSTAR has taken extra steps to ensure that their products are designed and tuned to perfection to run these processors on blazing fast boost speeds with some radical new features such as the Super Hyper PWM system that delivers stable power with 100% fixed voltage and offers excellent precision, performance and reliability.

GeIL Announces DDR4 3200 MHz SO-DIMM 64 GB Kit

GeIL has today announced a new line of memory for Intel 10th Gen and AMD Ryzen 4000 series mobile processors. The new 64 GB kit offered as 2x 32 GB DDR4-3200 modules is simply called "SO-DIMM". This new kit features high-density chips and a standard operating voltage of 1.2 V which helps maximize system performance. The new series of modules will also feature lower speed kits in DDR4 2933 MHz 64 GB and DDR4 2666 MHz 64 GB. The 3200 MHz kit comes with a latency of 22-22-22-52 while the 2933 Mhz features 21-21-21-48 and the 2666 MHz 19-19-19-43 which are all similar to other vendors offerings. These new kits should offer gamers and content creators a robust memory upgrade path for mobile devices, pricing and availability were not announced.

Deepcool Announces the GAMMAXX 400 EX Tower Cooler

Deepcool today announced a refresh of their previously-released GAMMAXX X 400 tower cooler. The new version will see improved cooling performance, due in no small part to the new dual-fan support. DIMM clearance has also been revisited, so as to prevent the new GAMMAXX 400 EX from interfering with your DIMM slot installation. The number of fins has been increased to 56, which means an extra 20% heat dissipation are that can be served by the increased airflow from the dual-fan configuration. A 4x 6 mm sintered copper heat pipe design (sintered as in, produced via pressure or temperatures that don't liquefy the copper) with Direct Touch technology should accelerate heat transfer form the CPU heatsink through to the cooling fins.

This is kind of a weighty design, coming in at 930 g for a cooling solution. Dimensions stand at 129 mm width, 103 mm thickness, and 157.5 mm height. It's expected the GAMMAXX 400 EX will be available around the $39 mark. For that pricing, it includes 2x TF120 high performance fans.

DDR5 Arrives at 4800 MT/s Speeds, First SoCs this Year

Cadence, a fabless semiconductor company focusing on the development of IP solutions and IC design and verification tools, today posted an update regarding their development efforts for the 5th generation of DDR memory which is giving us some insights into the development of a new standard. The new DDR5 standard is supposed to bring better speeds and lower voltages while being more power-efficient. In the Cadence's blog called Breakfast Bytes, one of Cadence's memory experts talked about developments of the new standards and how they are developing the IP for the upcoming SoC solutions. Even though JEDEC, a company developing memory standards, hasn't officially published DDR5 standard specifications, Cadence is working closely with them to ensure that they stay on track and be the first on the market to deliver IP for the new standard.

Marc Greenberg, a Cadence expert for memory solutions was sharing his thoughts in the blog about the DDR5 and how it is progressing. Firstly, he notes that DDR5 is going to feature 4800 MT/s speeds at first. The initial speeds will improve throughout the 12 months when the data transfer rate will increase in the same fashion we have seen with previous generation DDR standards. Mr. Greenberg also shared that the goals of DDR5 are to have larger memory dies while managing latency challenges, same speed DRAM core as DDR4 with a higher speed I/O. He also noted that the goal of the new standard is not the bandwidth, but rather capacity - there should be 24Gb of memory per die initially, while later it should go up to 32Gb. That will allow for 256 GB DIMMs, where each byte can be accessed under 100 ns, making for a very responsive system. Mr. Greenberg also added that this is the year of DDR5, as Cadence is receiving a lot of orders for their 7 nm IP which should go in production systems this year.
Cadence DDR5
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