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AMD Posts November Investor Presentation

AMD later this month is preparing to address investors as part of a yet-unknown event. The company typically hosts Financial Analyst Day events around Q1-Q2, and goes to the investors with substantial material on the current state of the organization, the products on offer, what's on the horizon, and how it could impact the company's financials. An alleged presentation related to the November 2021 event was leaked to the web. The presentation provides a guided tour of the entire product portfolio of the company, spanning server processors, compute accelerators, consumer graphics, some client processors, and the semi-custom business.

The presentation outlines that the company has so far successfully executed its roadmaps for the client-CPU, server-CPU, graphics, and compute-accelerator segments. In the client CPU segment, it shows a successful execution up to 2021 with the "Zen 3" microarchitecture. In the server space, it mentions successful execution for its EPYC processors up to "Zen 3" with its "Milan" processors, and confirms that its next-generation "Zen 4" microarchitecture, and its sister-architecture, the "Zen 4c," will be built on the 5 nm silicon fabrication node (likely TSMC N5). The presentation also details the recently announced "Milan-X" processor for existing SP3 platforms, which debuts the 3D Vertical Cache technology, bringing up to 96 MB of L3 cache per CCD, and up to 768 MB of L3 cache (804 MB L1+L2+L3 cache) per socket.
Update 10:54 UTC: The presentation can now be found on the AMD Investor Relations website.

AMD Processors Accelerating Performance of Top Supercomputers Worldwide

During this year's Supercomputing Conference 2021 (SC21), AMD is showcasing its expanded presence and growing preference in the high performance computing (HPC) industry with the exceptional innovation and adoption of AMD data center processors and accelerators. Customers across the industry continue to expand their use of AMD EPYC processors and AMD Instinct accelerators to power cutting-edge research needed to address some of the world's biggest challenges in climate, life sciences, medicine, and more.

Growing preference for AMD is showcased in the latest Top500 list. AMD now powers 73 supercomputers, compared to 21 in the November 2020 list, a more than 3x year-over-year increase. Additionally, AMD powers four out of the top ten most powerful supercomputers in the world, as well as the most powerful supercomputer in EMEA. Finally, AMD EPYC 7003 series processors, which launched eight months ago, are utilized by 17 of the 75 AMD powered supercomputers in the list, demonstrating the rapid adoption of the latest generation of EPYC processors.

TOP500 Update Shows No Exascale Yet, Japanese Fugaku Supercomputer Still at the Top

The 58th annual edition of the TOP500 saw little change in the Top10. The Microsoft Azure system called Voyager-EUS2 was the only machine to shake up the top spots, claiming No. 10. Based on an AMD EPYC processor with 48 cores and 2.45GHz working together with an NVIDIA A100 GPU and 80 GB of memory, Voyager-EUS2 also utilizes a Mellanox HDR Infiniband for data transfer.

While there were no other changes to the positions of the systems in the Top10, Perlmutter at NERSC improved its performance to 70.9 Pflop/s. Housed at the Lawrence Berkeley National Laboratory, Perlmutter's increased performance couldn't move it from its previously held No. 5 spot.

AMD EPYC Processors Hit by 22 Security Vulnerabilities, Patch is Already Out

AMD EPYC class of enterprise processors has gotten infected by as many as 22 different security vulnerabilities. These vulnerabilities range anywhere from medium to high severity, affecting all three generations of AMD EPYC processors. This includes AMD Naples, Rome, and Milan generations, where almost all three are concerned with the whole 22 exploits. There are a few exceptions, and you can find that on AMD's website. However, not all seems to be bad. AMD says that "During security reviews in collaboration with Google, Microsoft, and Oracle, potential vulnerabilities in the AMD Platform Security Processor (PSP), AMD System Management Unit (SMU), AMD Secure Encrypted Virtualization (SEV) and other platform components were discovered and have been mitigated in AMD EPYC AGESA PI packages."

AMD has already shipped new mitigations in the form of AGESA updates, and users should not fear if they keep their firmware up to date. If you or your organization is running on AMD EPYC processors, you should update the firmware to avoid any exploits from happening. The latest updates in question are NaplesPI-SP3_1.0.0.G, RomePI-SP3_1.0.0.C, and MilanPI-SP3_1.0.0.4 AGESA versions, which fix all of 22 security holes.

IBM Cloud Selects 3rd Gen AMD EPYC Processors for New Bare Metal Offering for Compute-Intensive Workloads

AMD announced today that IBM Cloud has chosen 3rd Gen AMD EPYC processors to expand its bare metal service offerings designed to power customers' demanding workloads and solutions. The new servers, featuring 128 cores, up to 4 TB of memory and 10 NVMe drives per server, give users full access to high-end, dual-socket performance with AMD EPYC 7763 processors; a first for IBM Cloud in a dual-socket platform.

"Our customers have a high demand for computing processing power and the new 3rd Gen AMD EPYC processors provide the high levels of performance and scalability we were looking for," said Suresh Gopalakrishnan, vice president, IBM Cloud. "Our collaboration with AMD has helped us deliver our highest core counts and bandwidth ever available for IBM Cloud customers, to offer top market performance for today and tomorrow's demanding workloads."

"IBM Cloud customers regularly running compute-intensive workloads can see an immediate benefit to speed and scalability by upgrading to 3rd Gen AMD EPYC processors, while helping to deliver a secure experience for end-users," said Lynn Comp, corporate vice president, Cloud Business Group, AMD. "Our continued collaboration with IBM Cloud is further validation of the strong standing AMD holds in the market as we deliver topline solutions that promote a seamless experience for cloud partners and their customers."

AMD Accelerated Data Center Event Live Blog

AMD held its Accelerated Data Center Keynote address by CEO Dr Lisa Su today. The company made some big announcements for the enterprise space in this first major series of announcements by AMD after Intel's launch of its Alder Lake 12th Gen Core processors that set the tone for what's to come from Intel in the enterprise space (Xeon "Sapphire Rapids"). First up is the EPYC "Milan-X" line of server processors leveraging 3D Infinity Cache memory, a tripling in L3 cache amount, which the company claims significantly improves performance of memory-intensive applications. This should also give you an idea if any upcoming Ryzen desktop processor based on the refreshed chiplet could live up to its claim of "up to 15% gaming performance boost." The next-generation Instinct MI200 series GPU compute accelerators are equally important as they bring the CDNA2 compute architecture to market, establishing competition to NVIDIA's A-series Tensor Core processors, and Intel's upcoming "Ponte Vecchio" Xe-HPC accelerators.

AMD Could Use Infinity Cache Branding for Chiplet 3D Vertical Cache

AMD in its Computex 2021 presentation showed off its upcoming "Zen 3" CCD (CPU complex dies) featuring 64 MB of "3D vertical cache" memory on top of the 32 MB L3 cache. The die-on-die stacked contraption, AMD claims, provides an up to 15% gaming performance uplift, as well as significant improvements for enterprise applications that can benefit from the 96 MB of total last-level cache per chiplet. Ahead of the its debut later today in the company's rumored EPYC "Milan-X" enterprise processor reveal, we're learning that AMD could brand 3D Vertical Cache as "3D Infinity Cache."

This came to light when Greymon55, a reliable source with AMD and NVIDIA leaks, used the term "3D IFC," and affirmed it to be "3D Infinity Cache." AMD realized that its GPUs and CPUs have a lot of untapped performance potential with use of large on-die caches that can make up for much of the hardware's memory-management optimization. The RDNA2 family of gaming GPUs feature up to 128 MB of on-die Infinite Cache memory operating at bandwidths as high as 16 Tbps, allowing AMD to stick to narrower 256-bit wide GDDR6 memory interfaces even on its highest-end RX 6900 XT graphics cards. For CCDs, this could mean added cushioning for data transfers between the CPU cores and the centralized memory controllers located in the sIOD (server I/O die) or cIOD (client I/O die in case of Ryzen parts).

AMD EPYC Processors Expand Performance and Security Innovation Across Microsoft Azure Virtual Machines Portfolio

Today, AMD announced its continued momentum and collaboration with Microsoft Azure, who is offering the 3rd Gen AMD EPYC processor in the latest generation of Dasv5 and Easv5 Azure Virtual Machines (VMs). Azure is also introducing new confidential VMs, DCasv5 and ECasv5, which use the latest advanced security features available in 3rd Gen EPYC processors, including Secure Encrypted Virtualization-Secure Nested Paging (SEV-SNP).

The new Azure confidential VMs, DCasv5 and ECasv5, the first EPYC processor-based confidential VMs at Azure and the first confidential VMs to use SEV-SNP, will enable customers to have the data in their security focused applications encrypted in use, in transit and at rest. The updated Dasv5 VMs, optimized for general purpose workloads, and the Easv5 VMs, optimized for memory-based workloads, deliver better price-performance for most general purpose and memory intensive workloads compared to prior EPYC processor-based Microsoft Azure VMs.

AMD Promotes Server SoC Architect Kevin Lepak to Corporate Fellow

AMD today announced the appointment of Senior Fellow and Server SoC (system on chip) Architect Kevin Lepak to AMD Corporate Fellow, in recognition of his critical role in the design of next-generation AMD EPYC processors. Lepak achieved an excellent record of overseeing the execution and delivery of leadership data center processors for AMD, including 2nd and 3rd Gen AMD EPYC CPUs and next generation AMD Instinct accelerators. As AMD Corporate Fellow, Lepak expands on his leadership in chip design to play a larger role in evolving AMD's processor and systems vision.

"Kevin's technical contributions made undeniable positive impact on AMD over many years," said Mark Papermaster, chief technology officer and executive vice president of Technology and Engineering at AMD. "He played an instrumental role in solidifying the company's leadership in the data center and continues to work closely with customers to design future generations of high-performance AMD products. With his aptitude for innovation, execution and collaboration, Kevin epitomizes our high-performance culture."

AMD to Host Accelerated Data Center Premiere Virtual Event on November 8, 2021

AMD will host its Accelerated Data Center Premiere on November 8, 2021 at 11 a.m. ET, showcasing the company's upcoming innovations with AMD EPYC processors and AMD Instinct accelerators. The virtual event is slated to feature presentations from AMD President and CEO Dr. Lisa Su, Senior Vice President and General Manager, Data Center and Embedded Solutions Business Group Forrest Norrod, and Senior Vice President and General Manager, Server Business Unit Dan McNamara. The event will be accessible to the public at this page starting at 11 a.m. ET. A replay will be available and can be accessed after the conclusion of the livestream event.

Editor's Note: We expect AMD to announce several SKUs in its MI200-series "Aldebaran" compute accelerator family, along with a new line of EPYC "Milan-X" enterprise processors that leverage the new "Zen 3+" chiplet that comes with 64 MB 3D Vertical Cache memory on top of the 32 MB L3 cache.

GIGABYTE Announces a Unique Server Solution to RAID Drawbacks with GRAID SupremeRAID

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced a new server, GIGABYTE R282-Z9G, that gets around hardware and software RAID limitations that bottleneck RAID when used with NVMe SSDs. Continuing in the success of the R282 series, the new SKU was designed to house an all-in-one server solution that specifically targets high performance NVMe (Gen4) SSDs for RAID by incorporating the GRAID SupremeRAID solution into the R282-Z9G. This is the first GIGABYTE server to incorporate a GRAID Technology solution and has proven to be highly successful with Kioxia CM6-R SSDs.

More and more companies are using flash storage and doing so on a larger scale; however, there may be pitfalls when using RAID, such as limitations in computing performance or consuming a large amount of CPU resources. To solve these problems and to do so with a large amount of drives, the GRAID SupremeRAID works by installing a virtual NVMe controller on the OS while integrating a PCIe device for high performance. With this GIGABYTE solution over 100 GB/s of throughput is possible for workloads in HPC, 4K/8K video editing, high-frequency trading, online transaction processing, or database processing.

AMD Announces Ambitious Goal to Increase Energy Efficiency of Processors Running AI Training and High Performance Computing Applications 30x by 2025

AMD today announced a goal to deliver a 30x increase in energy efficiency for AMD EPYC CPUs and AMD Instinct accelerators in Artificial Intelligence (AI) training and High Performance Computing (HPC) applications running on accelerated compute nodes by 2025.1 Accomplishing this ambitious goal will require AMD to increase the energy efficiency of a compute node at a rate that is more than 2.5x faster than the aggregate industry-wide improvement made during the last five years.

Accelerated compute nodes are the most powerful and advanced computing systems in the world used for scientific research and large-scale supercomputer simulations. They provide the computing capability used by scientists to achieve breakthroughs across many fields including material sciences, climate predictions, genomics, drug discovery and alternative energy. Accelerated nodes are also integral for training AI neural networks that are currently used for activities including speech recognition, language translation and expert recommendation systems, with similar promising uses over the coming decade. The 30x goal would save billions of kilowatt hours of electricity in 2025, reducing the power required for these systems to complete a single calculation by 97% over five years.

AMD Zen 4 AM5 & SP5 CPU Coolers Spotted

Chinese cooler manufacturer Cool Server have recently listed several upcoming coolers for the AMD Zen 4 AM5 & SP5 sockets. The manufacturer has listed 5 AM5 coolers, and 4 SP5 coolers all targeted towards the enterprise sector. The lineup includes several passive coolers which rely on case airflow while the others feature high-performance fans which can get quite noisy. The AM5 socket will be introduced with the next-generation Zen 4 Ryzen processors while the SP5 (LGA6096) socket has been prepared for the Zen 4 EPYC processors. The complete list of coolers can be found below.

Intel Xeon "Sapphire Rapids" Processor With 20 Cores Tested

Intel is slowly preparing to launch its 4th generation of Xeon Scalable processors, with it being the first arrival of the 10 nm designs to the server market. Codenamed Sapphire Rapids, these processors are expected to bring much-needed IPC and platform improvements so Intel can keep up with AMD's EPYC processors. Today, we are getting some first performance results as well as some information about a specific 20 core, 40 threaded Intel Xeon Sapphire Rapids SKU. In a leaked Geekbench 4 submission, the latest Xeon processor was tested and we get to see even more details about the processor.

Featuring 20 cores and 40 threads, the CPU has a base clock speed of 1.5 GHz. It features as much as 40 MB of L2 cache and 75 MB of L3 cache spread across the die. The system was tested on an Intel reference platform called VulcanCity, with this configuration carrying 32 GB of DDR5 memory. The reported results of the benchmarks that this processor went through are not very impressive. These numbers are easily beaten by AMD Ryzen 9 5950X, however, this is only an engineering sample with low clock speed and it could be possible that Geekbench is not optimized to run on this processor. You can check out some of the performance numbers below, and see the submitted results here.

AMD MI200 "Aldebaran" Memory Size of 128GB Per Package Confirmed

The 128 GB per package memory size of AMD's upcoming Instinct MI200 HPC accelerator was confirmed, in a document released by Pawsey SuperComputing Centre, a Perth, Australia-based supercomputing firm that's popular with mineral prospecting companies located there. The company is currently working on Setonix, a 50-petaFLOP supercomputer being put together by HP Enterprise, which combines over 750 next-generation "Aldebaran" GPUs (referenced only as "AMD MI-Next GPUs"); and over 200,000 AMD EPYC "Milan" processor cores (the actual processor package count would be lower, and depend on the various core configs the builder is using).

The Pawsey document mentions 128 GB as the per-GPU memory. This corresponds with the rumored per-package memory of "Aldebaran." Recently imagined by Locuza_, an enthusiast who specializes in annotation of logic silicon dies, "Aldebaran" is a multi-chip module of two logic dies and eight HBM2E stacks. Each of the two logic dies, or chiplets, has 8,192 CDNA2 stream processors that add up to 16,384 on the package; and each of the two dies is wired to four HBM2E stacks over a 4096-bit memory bus. These are 128 Gbit (16 GB) stacks, so we have 64 GB memory per logic die, and 128 GB on the package. Find other drool worthy specs of the Pawsey Setonix in the screengrab below.

AMD Leads High Performance Computing Towards Exascale and Beyond

At this year's International Supercomputing 2021 digital event, AMD (NASDAQ: AMD) is showcasing momentum for its AMD EPYC processors and AMD Instinct accelerators across the High Performance Computing (HPC) industry. The company also outlined updates to the ROCm open software platform and introduced the AMD Instinct Education and Research (AIER) initiative. The latest Top500 list showcased the continued growth of AMD EPYC processors for HPC systems. AMD EPYC processors power nearly 5x more systems compared to the June 2020 list, and more than double the number of systems compared to November 2020. As well, AMD EPYC processors power half of the 58 new entries on the June 2021 list.

"High performance computing is critical to addressing the world's biggest and most important challenges," said Forrest Norrod, senior vice president and general manager, data center and embedded systems group, AMD. "With our AMD EPYC processor family and Instinct accelerators, AMD continues to be the partner of choice for HPC. We are committed to enabling the performance and capabilities needed to advance scientific discoveries, break the exascale barrier, and continue driving innovation."

Google Selects 3rd Gen AMD EPYC Processors to Launch First Tau VM Instance

AMD and Google Cloud today announced T2D, the first instance in the new family of Tau Virtual Machines (VMs) powered by 3rd Gen AMD EPYC processors. According to Google Cloud, the T2D instance offers 56% higher absolute performance and more than 40% higher price performance for scale-out workloads. The Tau VM family provides customers with a leading combination of performance, price, and easy integration. The T2D instances, using the leadership performance of 3rd Gen AMD EPYC processors, excels at workloads including web servers, containerized micro-services, data logging-processing, large scale Java applications and more.

"At Google Cloud, our customers' compute needs are evolving," said Thomas Kurian, CEO of Google Cloud. "By collaborating with AMD, Google Cloud customers can now leverage amazing performance for scale-out applications, with great price-performance, all without compromising x86 compatibility." "We designed 3rd Gen AMD EPYC processors to meet the growing demand from cloud and enterprise customers for high-performance, cost-effective solutions with optimal TCO," said AMD President and CEO Dr. Lisa Su. "We work closely with Google Cloud and are proud they selected AMD to exclusively power the new Tau VM T2D instance which provides customers with powerful new options to run their most demanding scale-out workloads."

AMD "Milan-X" Processor Could Use Stacked Dies with X3D Packaging Technology

AMD is in a constant process of processor development, and there are always new technologies on the horizon. Back in March of 2020, the company has revealed that it is working on new X3D packaging technology, that integrated both 2.5D and 3D approaches to packing semiconductor dies together as tightly as possible. Today, we are finally getting some more information about the X3D technology, as we have the first codename of the processor that is featuring this advanced packaging technology. According to David Schor, we have learned that AMD is working on a CPU that uses X3D tech with stacked dies, and it is called Milan-X.

The Milan-X CPU is AMD's upcoming product designed for data center usage. The rumors suggest that the CPU is designed for heavy bandwidth and presumably a lot of computing power. According to ExecutableFix, the CPU uses a Genesis-IO die to power the connectivity, which is an IO die from EPYC Zen 3 processors. While this solution is in the works, we don't know the exact launch date of the processor. However, we could hear more about it in AMD's virtual keynote at Computex 2021. For now, take this rumor with a grain of salt.
AMD X3D Packaging Technology

Two New Security Vulnerabilities to Affect AMD EPYC Processors

AMD processors have been very good at the field of security, on par with its main competitor, Intel. However, from time to time, researchers find new ways of exploiting a security layer and making it vulnerable to all kinds of attacks. Today, we have information that two new research papers are being published at this year's 15th IEEE Workshop on Offensive Technologies (WOOT'21) happening on May 27th. Both papers are impacting AMD processor security, specifically, they show how AMD's Secure Encrypted Virtualization (SEV) is compromised. Researchers from the Technical University of Munich and the University of Lübeck are going to present their papers on CVE-2020-12967 and CVE-2021-26311, respectfully.

While we do not know exact details of these vulnerabilities until papers are presented, we know exactly which processors are affected. As SEV is an enterprise feature, AMD's EPYC lineup is the main target of these two new exploits. AMD says that affected processors are all of the EPYC embedded CPUs and the first, second, and third generation of regular EPYC processors. For third-generation EPYC CPUs, AMD has provided mitigation in SEV-SNP, which can be enabled. For prior generations, the solution is to follow best security practices and try to avoid an exploit.
AMD EPYC Processor

AMD Embedded Roadmap Lists Zen 4 EPYC CPU with 64+ Cores

The AMD embedded roadmap for 2020 - 2023 was recently leaked and reveals some interesting information about AMD's upcoming Zen 4 based EPYC server processes. The current generation 7003 series of Zen 3 EPYC processors offer up to 64 cores and 128 threads with a TDP range of 120 W - 280 W. The next-generation EPYC 7004 "Genoa" Zen 4 processors will push the maximum core count to 96 cores and 192 threads with a maximum TDP of 320 W. The Zen 4 based EPYC processors will move to a 12 chiplet design up from the current 8 chiplet design which allows for the core increase that will increase the physical size of the processors and require a new SP5 socket. The new EPYC 7004 series processors will also support the latest features such as 12 channel DDR5-5200 ECC memory and PCIe Gen5.

AMD and GlobalFoundries Wafer Supply Agreement Now Non-Exclusive, Paves Way for 7nm sIOD

AMD in a filing with the U.S. Securities and Exchange Commission (SEC), revealed that its wafer supply agreement with GlobalFoundries has been amended. Under the new terms, AMD places orders for wafers from GlobalFoundries up to 2024, with purchase targets set for each year leading up to 2024. Beyond meeting these targets, AMD is free from all other exclusivity commitments. The agreement was previously amended in January 2019, setting annual purchase targets for 2019, 2020, and 2021, while beginning a de-coupling between AMD and GlobalFoundries. This enabled the company to source 7 nm (or smaller) chips, such as CCDs and GPUs, from other foundries, such as TSMC, while keeping GlobalFoundries exclusive for 12 nm (or larger) nodes.

The updated wafer supply agreement unlocks many possibilities for AMD. For starters, it can finally build a next-generation sIOD (server I/O die) on a more efficient node than GlobalFoundries 12LP, such as TSMC 7 nm. This transition to 7 nm will be needed as the next-gen "Genoa" EPYC processor could feature future I/O standards such as DDR5 memory and PCI-Express Gen 5, and the switching fabric for these could be too power-hungry on 12 nm. The "Zen 4" CPU core complex dies (CCDs) of "Genoa" are expected to be built on TSMC 5 nm.

AMD Clocks Highest Quarterly Growth in Server CPU Sales Against Intel in 15 Years

AMD has registered the steepest single-quarter growth in server CPU sales in 15 years, for Q1-2021, according to Mercury Research data accessed by Tom's Hardware. "While we don't often discuss average selling prices, we note that this quarter saw unusually strong price moves for AMD -- as AMD shipped fewer low-end parts and more high-end parts, as well as shipping many more server parts, the company's average selling price increased significantly," said Dean McCarron of Mercury Research. Unfortunately, the growth in its EPYC server CPU sales also coincides with a drop in notebook CPU sales. It's also interesting to note here that AMD's Q1-2021 performance with server CPUs also coincides with a 20% drop in revenue for its Data Center Group, the business unit responsible for sales of its Xeon server processors.

TSMC Employs AMD EPYC CPUs for Mission-Critical Manufacturing

Taiwan Semiconductor Manufacturing Company, the maker of various kinds of silicon products, is the manufacturer of AMD's EPYC processors. However, have you ever questioned what CPUs are actually behind TSMC? The answer to that question is quite simple. Today, we have come to know that TSMC is using AMD EPYC processors to power their manufacturing infrastructure and tape out thousands of wafers per month. AMD has published TSMC's case study, which pointed out that the total cost of ownership has been the main challenge of the Taiwanese company. By using AMD EPYC 7702P and 7F72 CPUs, TSMC addresses the need for both reliable and high-performing server infrastructure to power the manufacturing efforts. For research and development purposes, TSMC chose the 7F72 with 24 cores and a high clock speed of 3.2 GHz, which is ideal for the company needs and purposes.

For more details about TSMC's choices and solutions, read the case study here.

AMD Reports First Quarter 2021 Financial Results

AMD (NASDAQ:AMD) today announced revenue for the first quarter of 2021 of $3.45 billion, operating income of $662 million, net income of $555 million and diluted earnings per share of $0.45. On a non-GAAP* basis, operating income was $762 million, net income was $642 million and diluted earnings per share was $0.52.

"Our business continued to accelerate in the first quarter driven by the best product portfolio in our history, strong execution and robust market demand," said Dr. Lisa Su, AMD president and CEO. "We had outstanding year-over-year revenue growth across all of our businesses and data center revenue more than doubled. Our increased full-year guidance highlights the strong growth we expect across our business based on increasing adoption of our high-performance computing products and expanding customer relationships."

TYAN Now Offers AMD EPYC 7003 Processor Powered Systems

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced AMD EPYC 7003 Series Processor-based server platforms featuring efficiency and performance enhancements in hardware, security, and memory density for the modern data center.

"Big data has become capital today. Large amounts of data and faster answers drive better decisions. TYAN's industry-leading server platforms powered by 3rd Gen AMD EPYC processors enable businesses to make more accurate decisions with higher precision," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "Moving the bar once more for workload performance, EPYC 7003 Series processors provide the performance needed in the heart of the enterprise to help IT professionals drive faster time to results," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. "Time is the new metric for efficiency and EPYC 7003 Series processors are the perfect choice for the most diverse workloads, helping provide more and better data to drive better business outcomes."
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