AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to showcase an incredibly high-speed overclock of G.SKILL DDR5 memory at DDR5-9000 CL44-56-56 with 48 GB (24 GB x2) kit capacity, featuring AMD EXPO overclock profile and demonstrating the memory overclock capability of the ASUS ROG CROSSHAIR X870E HERO motherboard and the AMD Ryzen 7 8700G processor.

A New High-Speed Frontier with 24 GB x2 Continuing to explore the overclock limits of DDR5 memory speed in conjunction with the new ASUS NitroPath DRAM technology that provides enhanced DDR5 memory overclock performance, G.SKILL demonstrates an amazing DDR5-9000 CL44-56-56 with two 24 GB capacity modules. Refer to the screenshot below to see this G.SKILL memory kit reaching the astounding overclocked memory speed on the ASUS ROG CROSSHAIR X870E HERO motherboard with an AMD Ryzen 7 8700G processor

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to unveil the shiny new X870E VALKYRIE flagship motherboard designed to run the latest "Zen 5" architecture based AMD Ryzen 9000 series processors. Built on BIOSTAR's top-of-the-line VALKYRIE platform, the X870E VALKYRIE delivers exceptional features and functionality, catering to gamers, content creators, and PC enthusiasts alike.

Meticulously crafted to cater to the modern-day professional, the X870E VALKYRIE motherboard offers unparalleled power and stability across the most demanding applications. Whether you're designing immersive 3D worlds, rendering high-definition animations, editing ultra-high-resolution videos, or pushing the limits of AAA gaming, this motherboard is engineered to deliver. Powered by the latest AMD Ryzen 9000 series processors built on "Zen 5" architecture, with support for up to 192 GB of DDR5 memory and PCIe 5.0 technology, the X870E VALKYRIE ensures seamless, high-speed performance for even the most intensive tasks, including generative AI computing. With support for AMD EXPO & Intel XMP technologies, it can extract the maximum capability out of all hardware to deliver the best user experience.

T-FORCE, Team Group's gaming brand, and T-CREATE, its creator-focused brand, are launching dual-mode DDR5 overclocking memory modules for Intel and AMD platforms with speeds up to 8000 MHz. This highlights Team Group's industry-leading overclocking capabilities, delivering the ultimate performance for gamers and creators.

T-FORCE, known for pushing the boundaries of performance, and T-CREATE, focused on stable and efficient performance, will offer a range of DDR5 dual-mode overclocking memory modules under their product portfolio. These modules will come in eight speeds, ranging from 6400 MHz to 8000 MHz, catering to diverse needs and providing optimal performance for gaming enthusiasts and content creators managing complex workflows. The dual-mode memory modules will be available in 2x16GB and 2x24GB capacity options. A single 24 GB stick significantly expands memory capacity for handling large workloads, leading to smoother and more efficient performance. The memory modules are fully compatible with Intel XMP 3.0 (Extreme Memory Profile) and AMD EXPO (Extended Profiles for Overclocking) profiles, ensuring seamless one-click overclocking on the latest AMD X870E and Intel Z790 platforms, delivering an exceptional user experience across both platforms.

The world's leading brand for memory modules and flash memory - ADATA Technology's gaming brand, XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts announced today the launch of the LANCER NEON RGB DDR5 gaming memory module. LANCER NEON RGB adopts an exclusive heat dissipating PCB coating to greatly increase heat dissipation area, improve heat dissipation efficiency, and mitigate memory heat generation when running at high clock speeds. Enjoy extreme overclocking while maintaining high performance and never compromise on speed.

At the same time, LANCER NEON RGB boasts an RGB illuminated area of 60% and employs environmentally friendly processes inside and out, including a heatsink made from PCR (post-consumer recycled) plastic, IMR (In-Mold Roller) transfer technology, and FSC certified packaging. An outer box made from sustainable paper paired with an environmentally friendly PCR plastic inner tray fully embraces the ideals of environmental protection and carbon reduction.

As the leading global provider of premium storage solutions, Team Group Inc. aligns with international trends and prioritizes environmental sustainability by integrating eco-friendly practices into its core products and developing a wide selection of green products for its customers. Today, Team Group launched the T-FORCE DELTA RGB ECO DDR5 Desktop Memory and the Team Group PD20 ECO Mini External SSD, as a part of the ECO series that highlights the concept of circular economy. Both products feature PCR (post-consumer recycled) plastics and are packaged with FSC-certified materials, fully embodying Team Groupp's commitment to green innovation from product technology to packaging and fostering the spirit of environmental sustainability.

G.Skill, the world's leading brand of performance overclock memory and PC components, is releasing an overclock memory specification with ultra-low latency at DDR5-6400 CL30-39-39-102 in 32 GB (2x 16 GB) kit capacity. This high performance specification will be available under the Trident Z5 RGB and Trident Z5 Royal series with Intel XMP 3.0 overclock profile support, as well as under the Trident Z5 Neo RGB and Trident Z5 Royal Neo series with AMD EXPO overclock profile support.

The G.Skill R&D team strives to push the limits of memory performance, and low latency is a key factor in memory overclocking for enthusiasts and overclockers. Compared to the standard DDR5-4800 CL40, this new DDR5-6400 CL30 specification makes improvements upon the memory speed and latency. And since this is a high-performance specification, it's important to check the compatibility of the motherboard and CPU.

KLEVV, the premier consumer memory and storage brand introduced by Essencore, proudly presents all-new CRAS V RGB ROG-certified DDR5 Gaming Memory. Engineered by the masterful collaboration of KLEVV and ROG (Republic of Gamers)'s expert team, the CRAS V RGB ROG-certified DDR5 memory is purpose-built to unleash mind-bending performance with supreme stability. Available in 16 GB x2 and 24 GB x2 kits with a base clock speed of DDR5-7200, it is tailored for hardcore gamers and PC enthusiasts who demand the best.

Furthermore, when paired with a compatible ROG motherboard, the CRAS V RGB ROG-certified DDR5 can achieve blazing clock speeds of DDR5-7400, enabled by ROG's superior hardware synergy and software tuning, making them the ideal choice for high-end AAA games and power-hungry software. Inspired by KLEVV's award-winning CRAS V RGB series, which won the Red Dot and iF Design Awards in 2024, this special edition memory stands out with its unique and striking duotone color design. Rocking a sleek black-and-white aesthetic, complemented by an eye-catching advanced RGB light array, the CRAS V RGB ROG-certified DDR5 memory perfectly matches an all-ROG system that exudes undeniable power at a glance.

MSI is excited to announce the launch of the latest AMD Ryzen 9000 Series processors, set to debut on the AM5 platform. Powered by advanced 4 nm CPU process technology, the Ryzen 9000 Series promises to revolutionize the computing landscape with unmatched performance, efficiency, and versatility for gamers and content creators. At launch, August 8th, AMD Ryzen 7 9700X, and Ryzen 5 9600X are available while the Ryzen 9 9950X and 9900X will launch on August 15th. These processors will feature up to 16 cores and 32 threads, with a theoretical maximum boost clock speed of 5.7 GHz, 64 MB of L3 cache, and a maximum TDP of 170 W.

AMD Ryzen 9000 Series will also support PCIe 5.0 for the GPU and M.2 while enhancing DDR5 memory speed. Notably, the AMD Ryzen 7 9700X offers approximately 12% better overall performance than the first-gen AMD 3D V-cache CPU. All these processors are compatible with the AM5 socket, and existing AMD 600 Series motherboards and Ryzen 9000 Series processors can seamlessly integrate by updating to the latest BIOS, available on MSI's product support page.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce an ultra-low latency specification of DDR5-6000 CL28-36-36-96 in 32 GB (2x16GB) and 64 GB (2x32GB) kit capacities, and DDR5-6000 CL28-38-38-96 in 48 GB (2x24GB) and 96 GB (2x48GB) kit capacities under the new Trident Z5 Royal Neo series, designed for compatible AMD AM5 platforms. Including AMD EXPO technology for an easy memory overclock experience in BIOS, this overclock performance memory kit with low timing is the ideal DDR5 memory solution for enthusiasts and overclockers.

Optimization with Memory Timing
For enthusiasts and overclockers, memory timing or latency is a key factor in squeezing performance out of a memory kit. Since memory timing is the delay between specific actions, a lower latency is desired; and performance may be improved by finding the best mix of memory speed and latency. Compared to a standard DDR5 memory speed and latency of DDR5-4800 CL40, this new DDR5-6000 CL28 memory specification aims to deliver a more optimized combination on compatible AMD AM5 platforms.

AMD's upcoming Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture will see a slight improvement in memory overclocking capabilities. A chiplet-based processor, just like the Ryzen 7000 "Raphael," "Granite Ridge" combines one or two "Zen 5" CCDs, each built on the TSMC 4 nm process, with a client I/O die (cIOD) built on the 6 nm node. The cIOD of "Granite Ridge" appears to be almost identical to that of "Raphael." This is the chiplet that contains the processor's DDR5 memory controllers.

As part of the update, Ryzen 9000 "Granite Ridge" should be able to run DDR5-6400 with a 1:1 ratio between the MCLK and FCLK domains. This is a slight increase from the DDR5-6000 sweetspot speed of Ryzen 7000 "Raphael" processors. AMD is reportedly making it possible for motherboard manufacturers and prebuilt OEMs to enable a 1:2 ratio, making it possible to run high memory speeds such as DDR5-8000, although performance returns with memory speeds would begin to diminish beyond the DDR5-6400 @ 1:1 setting. Memory manufacturers should launch a new wave of DDR5 memory kits with AMD EXPO profiles for DDR5-6400.

KLEVV, the premier consumer memory and storage brand introduced by Essencore, is excited to unveil the brand-new FIT V DDR5 gaming memory with a sleek, ultra-low-profile design. KLEVV's FIT V DDR5 gaming memory modules are available in 16 GB (16 GB x1) and 32 GB (16 GB x2) kits, with diverse clock speeds of 5600MT/s, 6000 MT/s, and 6400 MT/s. Meticulously crafted for gamers, content creators, and casual users on a budget, these modules offer cutting-edge features and top-tier performance at an attractive price. They boast a streamlined, ultra-low-profile 33 mm form factor, made possible by an innovative aluminium heat spreader with a contemporary minimalist aesthetic, finished in an eye-catching white hue. This design significantly boosts performance and enhances the visual appeal of any build.

The FIT V DDR5 gaming memory modules offer cutting-edge features at an attractive price. Superior KLEVV memory technology, including a built-in PMIC, ensures consistent performance with efficient power delivery and dependability. KLEVV's signature multilayer PCB design improves signal strength and robustness. The FIT V DDR5 modules also incorporate a precision thermal sensor for optimal performance calibration and on-die ECC for effective error correction, ensuring peak functionality and reliability. The FIT V DDR5 gaming memory readily supports Intel XMP 3.0 and AMD EXPO technology to extract maximum performance.

Kingston at the 2024 Computex showed us their latest gaming and overclocking PC memory products, under its FURY brand. The star attraction here, is the FURY Impact DDR5 CAMM2 module. Kingston is partnering with MSI to bring this standard to the gaming PC space, as part of its new Project Zero ecosystem. A DDR5 CAMM2 is basically a dual-channel (4 sub-channel) DDR5 memory-on-a-stick. The module has wiring for both the channels and all four sub-channels, and a total of two ranks (1R/DPC). The module sits on a land-grid, just like the processor, and is held in place by a series of screws. When installed, a CAMM2 looks a lot more discreet than a bunch of DIMMs that stick out perpendicularly to the plane of the motherboard.

Kingston DDR5 CAMM2 will come in typical dual-channel capacities, such as 32 GB; with typical speeds. The CAMM2 standard was originally designed for mainstream notebooks and mini-PC desktops, but MSI adapted it to an ATX desktop motherboard with its Project Zero backside connectivity. Next up, we have the FURY Renegade RGB DDR5 series, with its high DDR5 speeds, and plenty of RGB bling. Densities range between 16 GB (1x 16 GB) to 96 GB (2x 48 GB), with popular densities along the way, such as 2x 16 GB, and 2x 24 GB. Speeds range between DDR5-6000, all the way till DDR5-8000 (with XMP 3.0).

AMD today announced its much awaited Ryzen 9000 series desktop processors. Built in the Socket AM5 package, and drop-in compatible with all current AM5 motherboards with a BIOS update, the processors are based on the new "Zen 5" CPU microarchitecture. The operational part of the processor, the CPU complex dies (CCDs), are built on the 4 nm process, wired to a 6 nm I/O die. AMD didn't get down into the nuts and bolts of the microarchitecture, but briefly mentioned an impressive 16% IPC increase over "Zen 4." Coupled with the fact that the first wave of processors lack 3D V-cache and can sustain higher boost frequencies and TDP, processors in the series should beat the Ryzen 7 7800X3D in gaming performance, which also means that AMD has beaten the 14th Gen Core "Raptor Lake Refresh" processor series by a significant margin.

The 16% IPC increase over "Zen 4" is backed by branch prediction improvements, wider pipelines and vectors, and deeper window sizes across the core design, for more parallelism. The core also features doubling in instruction bandwidth for front-end instructions, FPU to L1, and L1 to L2 data bandwidth, and a redesigned FPU to double AI performance and AVX512 throughput. The company hasn't put out a block design for "Zen 5," and we'll learn more about it in the run-up to the market availability of these chips some time in July 2024.

Corsair today announced it is entering the DDR5 Workstation market with the introduction of a range of WS DDR5 RDIMM memory kits. Engineered to offer uncompromising performance and reliability, these ECC RDIMM kits redefine the capabilities of the newest workstations, and are compatible with the latest 4th Gen Intel Xeon and AMD Ryzen Threadripper 7000 processors.

This new range of memory kits boasts capacities of up to 256 GB, setting a new standard for memory-intensive tasks such as high-resolution media editing, 3D rendering, and AI training. Rigorously tested and carefully screened, these modules surpass JEDEC specifications with tighter timings and higher frequencies, ensuring optimal performance for the most demanding workloads.

V-COLOR today introduced a series of overclocking memory RDIMM kits for workstations powered by AMD Ryzen Threadripper 7000WX processors on the WRX90 platform that features 8-channel DDR5 memory. The kits include 8 RDIMMs, with densities ranging between 16 GB per RDIMM (128 GB per kit), to 96 GB per RDIMM (768 GB per kit); and comes in speeds ranging between DDR5-5600 and DDR5-7200. The best part? These modules feature AMD EXPO profiles, which should make enabling their advertised speeds as easy as a couple of clicks in the motherboard's UEFI setup program.

An EXPO profile not just applies the kit's memory speed, timings, and voltages, but also several sub-timings and settings that are specific to the AMD platform, which are not found on Intel. V-COLOR has tested its overclocking RDIMMs on popular AMD WRX90 chipset motherboards, namely the ASRock WRX90 WS EVO, ASUS PRO WS WRX90E-SAGE SE, and certain unreleased WRX90 workstation motherboards by Supermicro. Although the RDIMMs lack heatspreaders for the DRAM chips, V-COLOR is including what it calls "micro heatsinks" for the PMIC and RCDs. The RCD in particular is crucial to get Threadrippers to operate at speeds such as DDR5-7200. The kits should be available starting today, with all models available from mid-March. The company didn't reveal pricing.

Micron Technology, Inc., today announced two new Crucial Pro Series products with the addition of overclocking-capable memory and the world's fastest Gen 5 SSD. The Crucial DDR5 Pro Memory: Overclocking Edition modules are available in 16 GB densities up to DDR5-6000 to deliver higher performance, lower latencies and better bandwidth to fuel gaming wins and reduce performance bottlenecks. These powerful DDR5 overclocking DRAM modules are compatible with the latest DDR5 Intel and AMD CPUs and support both Intel XMP 3.0 and AMD EXPO specifications on every module, eliminating compatibility hassles. Built with leading-edge Micron 232-layer TLC NAND, the Crucial T705 SSD unleashes the full potential of Gen 5 performance.

Lightning-fast sequential reads and writes up to 14,500 MB/s and 12,700 MB/s (up to 1,550K/1,800K IOPS random reads and writes) respectively, enable faster gaming, video editing, 3D rendering and heavy workload AI application processing. With DDR5 Pro Overclocking DRAM and the T705 SSD, enthusiasts, gamers and professionals can harness the speed, bandwidth and performance they need for AI-ready PC builds capable of processing, rendering and storing large volumes of AI generated content.

LIAN LI Industrial Co. Ltd., a leading chassis and PC accessories manufacturer, premieres the LIAN LI 2024 DIGITAL EXPO at 9 am EST on YouTube. In this 2-part video, LIAN LI shares updates on prototype cases, a standing desk, and unveils new concepts for an all-in-one cooler and power supply. The prototypes include the SUP-01, the case that experiments with a front GPU layout, the DAN Cases A3 M-ATX case, and the O11 VISION BACK CONNECT. LIAN LI also unveils the GALAHAD II LCD SHIFT, an AIO that minimizes the tubing, the EDGE Series PSU, a new form factor power supply that solves cable access in dual chamber cases, and the DK-07, a new standing desk with new features. The LIAN LI 2024 DIGITAL EXPO will be followed by a roundtable discussion hosted by Jameson Chen, CEO at LIAN LI, with YouTube influencers Stuart Tonks from GGF Events, Justin Robey from Robytech, and PCMR's founder Pedro Valadas.

The SUP-01, a compact 45-liter case, reimagines the PC layout with a front-positioned graphics card and innovative cooling. Equipped with airflow-optimized mesh panels, it surpasses the LANCOOL 216 in cooling performance. The GPU's unique placement optimizes cooling without sacrificing aesthetics and is supported by adjustable brackets. The airflow configuration strategically utilizes GPU fans and rear fans as intakes, and right-side fans as exhausts, ensuring optimal GPU and CPU cooling. The main chamber accommodates motherboard sizes up to ATX, pre-mounted PCIe 4.0 riser cable, and features clearance for 280 to 360 mm AIOs. Storage options include two SSDs or 3.5" HDDs, a removable drive cage, and magnetic dust filters to maintain system cleanliness. The price is set to be $149.99.

V-COLOR announces the launch of their DDR5 overclocking R-DIMM the TRX50 Motherboards powered by AMD Ryzen Threadripper 7000 series processors with capacity 192 GB (4x48GB) ready to hit the market in speeds ranging from 6400 MHz up to 7200 MHz for end users who require the maximum capacity and speed. This package is geared toward content makers, intensive 3D modelers, AI programmers, trading machines, and HFT (high frequency trading) firms.

With EXPO ready v-color DDR5 OC R-DIMM memory is ready to for full potential, designed for a diverse user base that includes both non-overclocking users and overclocking enthusiasts, with a specific focus on content creators, intensive 3D modelers, AI programmers, trading machines or HFT (high frequency trading) companies. This kit is meticulously crafted with the most advanced SK Hynix DDR5 chips and Automated Binning sort for more reliability and endurance, continuously tested for full compatibility with all the motherboards TRX50.

Patriot Memory brought their latest ware to the 2024 International CES that use recent advancements in tech on both the SSD and memory fronts. On the SSD front, this year sees 14 GB/s capable PCIe Gen 5 NVMe SSDs thanks to Phison's E26 Max14um controller; and a new crop of USB4 portable SSDs; while the memory front sees DDR5 speeds go far north of DDR5-6000, thanks to on-module CKDs. Patriot showed us examples of each.

First up, there's the Patriot Viper PV573 Gen 5 NVMe SSD. This thing comes in capacities of up to 4 TB, and combines a Phison E26 Max14um controller with Micron's latest B58R TLC NAND flash chips that offer 2400 MT/s per flash channel. The controller also gets some incremental thermal optimizations, which means the cooling solution for the PV573 is a 16.5 mm-tall fan-heatsink. The drive offers up to 14 GB/s sequential reads, with up to 12 GB/s sequential writes. There's also a slightly de-rated version of this drive, the Viper PV553, which has the same combination of controller and NAND flash, but with transfer speeds of up to 12.4 GB/s reads, with up to 11.8 GB/s writes.

KLEVV, the premier consumer memory and storage brand introduced by Essencore, today is excited to unveil the all-new CRAS V RGB Brilliant White edition memory kit available in extreme high speed of DDR5-8200 & DDR5-8400 configurations. As a testament to the immense popularity and growing demand for the CRAS V RGB memory kits, KLEVV has responded by introducing the long-awaited Brilliant White edition to its flagship memory lineup as well as two high-speed options for consumers. This new addition boasts striking aesthetics by keeping the tone-on-tone design, and upholds the exceptional performance standards synonymous with the CRAS V RGB series, solidifying its position as the preferred choice among enthusiasts and professionals alike.

Meticulously engineered for high-speed operation, KLEVV's CRAS V RGB memory kits deliver outstanding performance with remarkable speed options of DDR5-8200 (featuring timings of 38-49-49-131) and DDR5-8400 (with timings of 40-52-52-134), all while operating efficiently at a voltage of 1.45 V. Below screenshot demonstrates the test result of DDR5-8400 kit using AIDA64 Cache & Memory Benchmark tool.

Thermaltake announced the ToughRAM RC DDR5 memory kit in its first non-binary (24 GB of 48 GB) capacity. Model number RA50D524GX2-5600C46A comes with a capacity of 48 GB (2x 24 GB), and supports both Intel XMP and AMD EXPO profiles for a frequency of DDR5-5600 with timings of 46-46-46-90 at 1.1 V. The modules lack any RGB lighting but come with preparation for the company's Floe RC liquid cooling for memory; or an RGB lighting kit. Thermaltake is backing these with lifetime warranty. We expect a street price of $150.

ASUS today announced that an international group of elite overclockers has set nine world records and achieved sixteen first-place finishes in a variety of performance benchmarks with ASUS Pro WS WRX90E-SAGE SE and ASUS Pro WS TRX50-SAGE WIFI workstation motherboards. The motherboards leveraged AMD Ryzen Threadripper PRO 7000 WX-Series and AMD Ryzen Threadripper 7000 series processors which featured up to 96 cores and 192 threads. The group of overclockers included Der8auer, Elmor, Massman, OGS, Safedisk, Seby and Shamino.

Ready for CPU and memory overclocking
For AMD Threadripper 7000 series workstations and high-end desktop (HEDT) models, AMD offers CPU and DRAM overclocking options. To fully leverage the performance of the AMD processors, ASUS has incorporated an innovative dual power supply design on Pro WS WRX90E-SAGE SE and Pro WS TRX50-SAGE WIFI motherboards. Along with robust power delivery and advanced cooling modules, these boards exhibit rock-solid stability during overclocking.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the Zeta R5 Neo series overclocked DDR5 R-DIMM memory kits for the latest AMD Ryzen Threadripper 7000 series and AMD Ryzen Threadripper Pro 7000 WX-series processors with AMD TRX50 chipset motherboards. This is the first R-DIMM platform from AMD that officially supports memory overclocking, so the Zeta R5 Neo features AMD EXPO memory overclocking profiles for easy memory overclocking. Built with hand-screened ICs and will be available in DDR5-6400 CL32 16 GB x4 and 32 GB x4 kit specifications at launch, Zeta R5 Neo series is the ideal R-DIMM memory solution to build an overclocked performance AMD workstation.

Overclocked DDR5-6400 R-DIMM Kits Designed for Quad-Channel AMD TRX50 Platform
With the launch of the AMD TRX50 workstation platform that supports DDR5 R-DIMM overclocking, G.SKILL is bringing AMD EXPO memory overclocking profile support to its R-DIMM memory lineup under the Zeta R5 Neo series. Available in quad-channel configurations of DDR5-6400 CL32-39-39-102 64 GB (16 GB x4) and 128 GB (32 GB x4) specifications, visit the G.SKILL product pages for more product information.

Lexar, a leading global brand of flash memory solutions, is excited to announce THOR OC DDR5 Desktop Memory. Featuring a complete redesign that pays homage to Thor's hammer, this memory also boasts a durable, solid aluminium heatsink that more than stands up to the challenges of overclocking by providing superior heat dissipation. Lexar THOR OC DDR5 Desktop Memory delivers up to 6000MT/s with timing as low as CL32 for a truly next-gen experience. It features a low-profile form factor that is perfect for compact PC builds. It also supports Intel XMP 3.0 and AMD EXPO overclocking and is compatible with most DDR5 motherboards.

Lexar THOR OC DDR5 Desktop Memory's on-die Error Correction Code (ECC) offers improved stability and reliability while its on-board Power Management IC (PMIC) enhances power efficiency. Another option for PC users is THOR OC DDR4 Desktop Memory. It offers 3200MT/s performance with timing of CL16 and is designed for PC enthusiasts and extreme gamers. It has an aluminium heat spreader with a winged design to keep systems running cool and is compatible with INTEL XMP 2.0 and AMD Ryzen.