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ATP's New 3D TLC SSDs Match MLC Endurance with 66% Higher Endurance

ATP Electronics, the global leader in specialized storage and memory solutions, introduces the A750Pi and A650Si/Sc Series embedded SSDs built on 3D triple level cell (TLC) NAND flash. Manufactured using a new die package, the Serial ATA solid state drives (SATA SSDs) deliver 66% higher endurance in native TLC mode and 50% higher in pseudo single level cell (pSLC) mode, making them on par with drives built on multi-level cell (MLC) and SLC flash, respectively.

The new SSDs come in M.2 2280 and 2242 as well as 2.5" and mSATA form factors. A750Pi/A650Si SSDs support industrial temperature (I-Temp) ranges from -40°C to 85°C to perform reliably even when operating under extreme and harsh conditions. A650Sc SSDs can support commercial operating temperatures (C-Temp) from 0°C to 70°C. A650Si/Sc with native TLC NAND flash have capacities from 120 to 1920 GB, while A750Pi drives configured in pSLC offer 80 to 640 GB. Depending on project and specific part number request, ATP's new SATA embedded SSDs are also available as self-encrypting drives (SEDs) featuring AES-256 encryption and Opal TCG 2.0-compliant security.

Digi-Key Electronics Introduces New 3D Printing Service

Digi-Key Electronics, which offers the world's largest selection of electronic components in stock for immediate shipment, announced that it is launching a new 3D Printing and Additive Manufacturing tool, powered by Jabil Inc. Through this new tool, Digi-Key customers can upload design files, receive instant quotes and have custom 3D products and items shipped directly to their door from Jabil. Featuring a seamless upload and "add to cart" experience for users, this new additive manufacturing tool provides fast turnaround times and free shipping to customers in the U.S.

"We are very excited to launch our new 3D Printing and Additive Manufacturing service in order to give electrical, mechanical and industrial engineers the ability to easily create custom 3D products for manufacturing purposes," said Missy Hall, senior director, new market development, at Digi-Key. "This introduction is a flagship option of Digi-Key's additive manufacturing services portfolio, and we look forward to continuing to expand our offerings to include many suppliers to serve the needs of the additive manufacturing market."

EU Commission Pushing Forward with Unified Electronics Charger Standard and Unbundling of Chargers

What can only be called a long running drama, the EU has once again put its foot down when it comes to chargers for various consumer electronics devices, although it's mostly about smartphones and regular old mobile phones these days. The whole thing took off some time in 2009, although back then, it was a voluntary effort and according to today's press release by the EU Commission, we're down from 30 to three "competing" standards (micro USB, lightning and USB-C), but apparently that is still not good enough.

As such, the EU Commission has now decided that USB-C is the answer to their prayers and it'll now be an enforced standard for a wide range of devices if they're to be allowed to be sold in the EU. We doubt this will go down well with many device manufacturers, Apple being the obvious one here, even though the company has been slowly transitioning to USB-C on its tablets, none of its phones are using USB-C today. The following device categories are affected: smartphones, tablets, cameras, headphones, portable speakers and handheld video game consoles.

Rare Earth Metal Prices Are Skyrocketing, Electronics Prices Expected To Follow

If it wasn't bad enough that we're in the middle of a pandemic, which has resulted in major shipping issues globally and a semiconductor shortage, it now looks like electronics are likely to get even more expensive due to skyrocketing prices of many rare earth metals.
Nikkei is reporting that many often overlooked materials, such as neodymium and the lesser known praseodymium, have increased by almost 74 percent since the same time last year and that's only one of several key materials that have increased in price by 50 percent or more in a year.

It's no secret that lithium has increased in price and it now costs about 150 percent of what it was costing last year. However, many other, less obvious materials have also increased in price, with copper up over 37 percent and tin up almost 82 percent in a year. To TPU's readers this mainly means that you can expect higher costs for PCBs and all the components that are soldered onto them, as tin is used to solder just about every component in place.

Samsung Electronics Announces Second Quarter 2021 Results

Samsung Electronics today reported financial results for the second quarter ended June 30, 2021. Total consolidated revenue was KRW 63.67 trillion, a 20% increase from the previous year and a record for the second quarter. Operating profit increased 34% from the previous quarter to KRW 12.57 trillion as market conditions improved in the memory market, operations normalized at the Austin foundry fab, and as effective global supply chain management (SCM) helped maintain solid profitability for the finished product businesses.

The Semiconductor business saw a significant improvement in earnings as memory shipments exceeded previous guidance and price increases were higher than expected, while the Company strengthened its cost competitiveness. For the Display Panel Business, a one-off gain and an increase in overall prices boosted profits.

Monitor Shipment for 2021 Expected to Reach 150 Million Units, Says TrendForce

Owing to high demand generated by the proliferation of WFH and distance education, monitor shipment for 2020 reached 140 million units, an 8.6% growth YoY, which represents the highest growth in about 10 years, according TrendForce's latest investigations. With demand persisting through 1H21, monitor shipment for 1Q21 underwent a staggering YoY increase of 34.1%, and this figure is projected to exceed 10% for 2Q21. Total monitor shipment for 2021 will likely reach 150 million units, a 7.3% growth YoY. Gaming monitors, which have been gaining attention in the monitor market, are expected to make up 17.3% of this total and reach 25.9 million units in shipment in 2021. In addition to being one of the most in-demand applications in the stay-at-home economy, this product category has long been a resource-intensive focus of monitor brands and panel suppliers alike.

Arm Announces Neoverse N2 and V1 Server Platforms

The demands of data center workloads and internet traffic are growing exponentially, and new solutions are needed to keep up with these demands while reducing the current and anticipated growth of power consumption. But the variety of workloads and applications being run today means the traditional one-size-fits all approach to computing is not the answer. The industry demands flexibility; design freedom to achieve the right level of compute for the right application.

As Moore's Law comes to an end, solution providers are seeking specialized processing. Enabling specialized processing has been a focal point since the inception of our Neoverse line of platforms, and we expect these latest additions to accelerate this trend.

Samsung Could Become Apple's Newest Chip Supplier

Apple has recently announced its transition to Apple Silicon, meaning that every processor inside its products will be custom designed by the company. However, that seems to be becoming a bit of a problem. The sole supplier of chips for Apple has been Taiwan Semiconductor Manufacturing Company (TSMC), which Apple collaborated with for the past few years. The sheer capacity of TSMC is enough to satisfy the demand from several companies and thus it allows some of them to book its capacity. With Apple demanding more and more capacity than ever before, it is becoming quite hard to keep up with it. That is why Apple is, according to some analysts for Business Korea, looking for a foundry beyond TSMC's to manufacture its chips.

According to the source, Apple is looking at the direction of Samsung Electronics and its silicon manufacturing facilities. Samsung has recently started the production of its 5 nm silicon manufacturing node. We have reported that the first SoCs are set to arrive soon. However, it may be possible that Apple's M1 lineup of SoCs will be a part of that first wave. Apple is reportedly going to tap both TSMC and Samsung to qualify enough supply for the huge demand of the products based on the latest 5 nm technology.

Samsung's 5 nm Node in Production, First SoCs to Arrive Soon

During its Q3 earnings call, Samsung Electronics has provided everyone with an update on its foundry and node production development. In the past year or so, Samsung's foundry has been a producer of a 7 nm LPP (Low Power Performance) node as its smallest node. That is now changed as Samsung has started the production of the 5 nm LPE (Low Power Early) semiconductor manufacturing node. In the past, we have reported that the company struggled with yields of its 5 nm process, however, that seems to be ironed out and now the node is in full production. To contribute to the statement that the new node is doing well, we also recently reported that Samsung will be the sole manufacturer of Qualcomm Snapdragon 875 5G SoC.

The new 5 nm semiconductor node is a marginal improvement over the past 7 nm node. It features a 10% performance improvement that is taking the same power and chip complexity or a 20% power reduction of the same processor clocks and design. When it comes to density, the company advertises the node with x1.33 times increase in transistor density compared to the previous node. The 5LPE node is manufactured using the Extreme Ultra-Violet (EUV) methodology and its FinFET transistors feature new characteristics like Smart Difusion Break isolation, flexible contact placement, and single-fin devices for low power applications. The node is design-rule compatible with the previous 7 nm LPP node, so the existing IP can be used and manufactured on this new process. That means that this is not a brand new process but rather an enhancement. First products are set to arrive with the next generation of smartphone SoCs, like the aforementioned Qualcomm Snapdragon 875.

Raja Koduri to Present at Samsung Foundry Forum amid Intel's Outsourcing Efforts

Intel's chief architect and senior vice president of discrete graphics division, Mr. Raja Koduri, is said to be scheduled to present at Samsung Electronics Event day. With a presentation titled "1000X More Compute for AI by 2025", the event is called Samsung Foundry SAFE Forum. It is a global virtual conference designed to be available to everyone. So you might be wondering what is Mr. Koduri doing there. Unless you have been living under a rock, you know about Intel's struggles with node manufacturing. Specifically, the 10 nm node delays that show the company's efforts to deliver a node on time. The same is happening with the 7 nm node that also experienced significant delays.

Intel has a contract to develop an exascale supercomputer at Argonne National Laboratory, called Aurora. That supercomputer is using Intel's CPUs and the company's upcoming Xe GPUs. Since the company has problems with manufacturing and has to deliver the products (it is bound by several contracts) to its contractors and customers, it decided to look at external manufacturers for its products, specifically Xe graphics. Being that Mr. Koduri tweeted an image of him visiting Samsung Giheung Fab in Korea, and now presenting at the Samsung Foundry event, it is possible that Intel will tap Samsung's semiconductor manufacturing process for its Xe GPU efforts and that Samsung will be the contractor in charge.

Samsung and SK Hynix to Impose Sanctions Against Huawei

Ever since the Trump administration imposed sanctions against Huawei to stop it from purchasing parts from third-party vendors to bypass the ban announced back in May, some vendors continued to supply the company. So it seems like some Korean manufacturers will be joining the doings of the US government, and apply restrictions to Huawei. According to the reports of South Korean media outlets, Samsung Electronics and SK Hynix will be joining the efforts of the US government and the Trump administration to impose sanctions against Chinese technology giant - Huawei.

It is reported that on September 15th, both Samsung and SK Hynix will stop any shipments to Huawei, where Samsung already stopped efforts for creating any new shipments. SK Hynix is said to continue shipping DRAM and NAND Flash products until September 14th, a day before the new sanctions are applied. Until the 14th, Huawei will receive some additional chips from SK Hynix. And it is exactly SK Hynix who is said to be a big loser here. It is estimated that 41.2% of SK Hynix's H1 2020 revenue came from China, most of which was memory purchased for Huawei phones and tablets. If the company loses Huawei as a customer, it would mean that the revenue numbers will be notably lower.

Phison Launches World's Highest Capacity QLC Customizable Enterprise SSD Solution in a 2.5" Form Factor

Phison Electronics , the industry's leader in NAND flash controllers and storage solutions, announces availability of the world's first 15.36 TB QLC customizable Enterprise SSD solution based on Phison's S12DC controller. Phison provides its customers with industry leading SSDs that are customized to their needs by leveraging Phison's firmware, controller, PCBA design, and manufacturing. The S12DC QLC SSD is an ideal storage solution by delivering higher performance, lower power consumption, and greater rack storage density for read intensive storage applications that currently source hard disk drives.

Arm and DARPA Sign Partnership Agreement to Accelerate Technological Innovation

Arm today announced a three-year partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA), establishing an access framework to all commercially available Arm technology. With DARPA's Electronics Resurgence Initiative gaining momentum, the new agreement will enable the research community that supports DARPA's programs to quickly and easily take advantage of Arm's leading IP, tools and support, accelerating innovation in a variety of fields.

"The span of DARPA research activity opens up a huge range of opportunities for future technological innovation," said Rene Haas, president, IP Products Group, Arm. "Our expanded DARPA partnership will provide them with access to the broadest range of Arm technology to develop compute solutions supported by the world's largest ecosystem of tools, services and software."

Samsung Announces New V-NAND Flash Facility

Samsung Electronics, the world leader in advanced memory technology, today announced plans to expand its NAND flash production capacity in Pyeongtaek, Korea, reinforcing the company's ability to meet demands from emerging technologies. Construction, which began this May, will pave the way for mass production of Samsung's cutting-edge V-NAND memory in the second half of 2021.

"The new investment reaffirms our commitment to sustain undisputed leadership in memory technologies, even in uncertain times," said Cheol Choi, executive vice president of Memory Global Sales & Marketing at Samsung Electronics. "We will continue to serve the market with the most optimized solutions available, while contributing to growth of the overall IT industry and the economy in general."

Samsung Electronics Begins Mass Production at New EUV Manufacturing Line

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its new cutting-edge semiconductor fabrication line in Hwaseong, Korea, has begun mass production.

The facility, V1, is Samsung's first semiconductor production line dedicated to the extreme ultraviolet (EUV) lithography technology and produces chips using process node of 7 nanometer (nm) and below. The V1 line broke ground in February 2018, and began test wafer production in the second half of 2019. Its first products will be delivered to customers in the first quarter.

Samsung Launches 3rd-Generation "Flashbolt" HBM2E Memory

Samsung Electronics, the world leader in advanced memory technology, today announced the market launch of 'Flashbolt', its third-generation High Bandwidth Memory 2E (HBM2E). The new 16-gigabyte (GB) HBM2E is uniquely suited to maximize high performance computing (HPC) systems and help system manufacturers to advance their supercomputers, AI-driven data analytics and state-of-the-art graphics systems in a timely manner.

"With the introduction of the highest performing DRAM available today, we are taking a critical step to enhance our role as the leading innovator in the fast-growing premium memory market," said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. "Samsung will continue to deliver on its commitment to bring truly differentiated solutions as we reinforce our edge in the global memory marketplace."

Panasonic Exits Silicon Manufacturing Business

Panasonic, an electronics manufacturing giant, has today sold its silicon manufacturing business, marking the end of an era of Japanese semiconductor manufacturing. Once a big player in silicon manufacturing scene, particularly in the '80s and '90s era when Japan's silicon output was huge, Panasonic was considered one of the main players in the silicon manufacturing business. However, due to some difficulties like operating a business with a loss of over $215 million yearly, and having to compete with Chinese and Taiwanese silicon manufacturing firms, Panasonic is selling its silicon production lines.

The subsidiary of Panasonic called "Semiconductors Solutions" is being sold to Nuvoton Technology Corporation, a semiconductor company that spun-off from Winbond Electronics Corporation in 2008, where Winbond still owns 61% stake in Nuvoton despite the spinoff. Additionally, Panasonic forecasts a 27% drop in operating profit for this physical year, with the declining semiconductor manufacturing business counted. The reasoning behind this sale is that the company plans to exit all declining businesses that also include LCD manufacturing, as Chinese alternative manufacturers are stiff competition for Panasonic when it comes to pricing and panel output.

LG Launches Slim New Bluetooth 5.0 Headsets Backed By Meridian Audio

Three all-new Bluetooth 5.0 wireless headsets from LG Electronics combine a slim, seamless design with stunning sound performance thanks to built-in Meridian Audio technology. These latest additions to the popular LG TONE family of wearable audio systems (models HBS-XL7, HBS-SL5 and HBS-SL6S) are available for purchase on LG.com starting today and coming soon through major wireless providers nationwide. Prices and availability will vary by provider and retailer.

For music lovers, each model, backed by a Hi-fi Sound Solution with Meridian Audio, comes with improvements to the design of the original LG TONE, crafted for a clearer and more balanced sound. A composite diaphragm inside the speaker unit produces clarity in high and low ranges. The high-strength metal layer creates accurate treble, while a plastic layer produces rich, deep bass.

University of Leeds Develops 2D Gold Substrate Technology for More Efficient Precious Metal Deployment

Scientists with the University of Leeds have managed to deploy gold in an ultra-efficient layer that's just two atoms thick, paving the way for much improved efficiency in the usage of the precious metal. The development, which university representatives claim marks a "landmark achievement", will open doors for the medical device and electronics industries-and also as a catalyst to speed up chemical reactions in a range of industrial processes. Because this 2D gold technology is up to 10x more efficient than current gold nanoparticle deployment (since all the gold particles are part of the surface, with no gold being left unused due to it being below the surface, in a bulk dispersion that's unavoidable with current coating technologies).

This means that materials savings can be achieved - which will likely be a magnet to the electronics industry, which will be able to not only increase efficiency of deployed gold, but also reduce waste of the precious material. Scientists behind the breakthrough claim this could also serve as a gateway for the development of other 2D materials, since lessons learned here may be applicable to other materials. All that remains (and that's putting it nicely) is being able to develop ways to scale-up the process, which deploys gold in a flake-like manner (scientists call it nanoseaweed of gold) that is flexible enough to be built into bendable devices.
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