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High-End Notebook Panels Projected to Surpass 20% Market Share in 2022 as Spotlight Falls on Oxide/LTPS/OLED Technologies, Says TrendForce

The massive rise in market demand for notebook computers in response to distance learning needs and WFH applications from 2020 to 2021 has generated not only a double-digit growth in notebook panel shipment, but also a price hike of more than 40% for notebook panels, according to TrendForce's latest investigations. As various suppliers subsequently scramble to manufacture OLED, LTPS, and oxide panels, TrendForce forecasts these high-end notebook panels to reach a 17.8% market share in 2021 and 21.4% in 2022.

Panels based on OLED technology are primarily supplied by SDC, whose OLED notebook panel shipment for 2020 reached 800,000 pcs. SDC is expected to ship more than four million pcs of OLED notebook panels in 2021, with room for further growth in 2022. In addition to SDC, EDO is also expected to begin mass producing OLED notebook panels in 2H21-1H22. As such, TrendForce expects OLED panels to reach a 1.3% penetration rate in the overall notebook panel market this year. Although BOE and CSOT are currently fully engaged in Hybrid OLED development, Hybrid OLED panels will not enter mass production until 2023 due to technological and cost-related bottlenecks that are yet to be resolved.

ASUS Introduces RTX 3080 Ti ROG Strix LC Hybrid-Cooled Graphics Cards

ASUS today has extended their hybrid-cooling technology to NVIDIA's top-tier graphics cards by officially listing ROG Strix LC versions of NVIDIA's RTX 3080 Ti to market availability. Initially only offered in AMD's RX 6000-series lineup, the new cards from ASUS feature a hybrid cooling system and aggressive aesthetics. The cooling system in itself features a hybrid air and liquid cooling solution: a single fan in the graphics' card shroud is responsible for cooling the VRM subsystem and 2.5-slot aluminium heatsink, while the GA-102 chip at the heart of the RTX 3080 Ti is handed a more premium way of offloading heat via a watercooling solution - itself guaranteed by a 240 mm radiator and dual 120 mm fans. As is par for the course these days, there's an RGB bonanza in both the shroud and the radiator fans.

ASUS is introducing a vanilla, NVIDIA-reference clock version (the ROG Strix LC RTX3080Ti-12G Gaming, at 1,665 MHz) and an OC version (ROG Strix LC RTX3080Ti-O12G Gaming) which ups the reference clocks to 1,860 MHz. Both cards feature custom-engineered PCBs, and power delivery is handled by 3x 8-pin connectors. I/O is taken care of by 3x DisplayPort 1.4a and 2x HDMI 2.1 connectors. Expect pricing to completely disregard MSRP and to float according to market conditions - which while much improved in recent weeks, still carries the added chaff of months of mining and scalping demand.

AMD Files Patent for its Own x86 Hybrid big.LITTLE Processor

AMD is innovating its own x86 hybrid processor technology formulated along the Arm big.LITTLE hybrid CPU core topology that inspired Hybrid processors by Intel. Under this, the processor has two kinds of CPU cores with very different performance/Watt bands—one kind focuses on performance and remains dormant under mild processing loads; while the other hand handles most lightweight processing loads that don't require powerful cores. This is easier said than done, as the two kinds of cores feature significantly different CPU core microarchitectures, and instruction sets.

AMD has filed a patent describing a method for processing workloads to be switched between the two CPU core types, on the fly. Unlike homogenous CPU core designs where workload from one core is seamlessly picked up by another over a victim cache like the L3, there is some logic involved in handover between the two core types. According to the patent application, in an AMD hybrid processor, the two CPU core types are interfaced over the processor's main switching fabric, and not a victim cache, much in the same way as the CPU cores and integrated GPU are separated in current-gen AMD APUs.

NVIDIA Unveils AI Enterprise Software Suite to Help Every Industry Unlock the Power of AI

NVIDIA today announced NVIDIA AI Enterprise, a comprehensive software suite of enterprise-grade AI tools and frameworks optimized, certified and supported by NVIDIA, exclusively with VMware vSphere 7 Update 2, separately announced today.

Through a first-of-its-kind industry collaboration to develop an AI-Ready Enterprise platform, NVIDIA teamed with VMware to virtualize AI workloads on VMware vSphere with NVIDIA AI Enterprise. The offering gives enterprises the software required to develop a broad range of AI solutions, such as advanced diagnostics in healthcare, smart factories for manufacturing, and fraud detection in financial services.
NVIDIA AI Enterprise Software Suite

Apple Patents Multi-Level Hybrid Memory Subsystem

Apple has today patented a new approach to how it uses memory in the System-on-Chip (SoC) subsystem. With the announcement of the M1 processor, Apple has switched away from the traditional Intel-supplied chips and transitioned into a fully custom SoC design called Apple Silicon. The new designs have to integrate every component like the Arm CPU and a custom GPU. Both of these processors need good memory access, and Apple has figured out a solution to the problem of having both the CPU and the GPU accessing the same pool of memory. The so-called UMA (unified memory access) represents a bottleneck because both processors share the bandwidth and the total memory capacity, which would leave one processor starving in some scenarios.

Apple has patented a design that aims to solve this problem by combining high-bandwidth cache DRAM as well as high-capacity main DRAM. "With two types of DRAM forming the memory system, one of which may be optimized for bandwidth and the other of which may be optimized for capacity, the goals of bandwidth increase and capacity increase may both be realized, in some embodiments," says the patent, " to implement energy efficiency improvements, which may provide a highly energy-efficient memory solution that is also high performance and high bandwidth." The patent got filed way back in 2016 and it means that we could start seeing this technology in the future Apple Silicon designs, following the M1 chip.

Update 21:14 UTC: We have been reached out by Mr. Kerry Creeron, an attorney with the firm of Banner & Witcoff, who provided us with additional insights about the patent. Mr. Creeron has provided us with his personal commentary about it, and you can find Mr. Creeron's quote below.

EVGA Announces Liquid-Cooled GeForce RTX 30-series Graphics Cards

EVGA over the weekend launched an extensive lineup of GeForce RTX 30-series graphics cards that either feature liquid cooling, or come with preparation for DIY liquid cooling. The EVGA Hydro Copper line of graphics cards include the RTX 3090 FTW3 Hydro Copper, RTX 3090 XC3 Hydro Copper, RTX 3080 FTW3 Hydro Copper, and RTX 3080 XC3 Hydro Copper. These are essentially the same FTW3 or XC3 graphics cards EVGA debuted its RTX 3090 and RTX 3080 lineups with, but come with factory-fitted, full-coverage water blocks. These blocks are made of nickel-plated copper, with clear acrylic tops that have a plastic top-plate with a printed pattern similar to the one found on the back-plates. The tops are studded with addressable RGB LEDs which are connected directly to RGB controllers on the PCB, and can be controlled via the Precision X1 software. These cards have the same factory-overclocked speeds as their air-cooled siblings, but are priced about $150-200 higher.

Next up, are the Hybrid Cooling line of graphics cards, which feature factory-fitted, all-in-one, closed-loop, liquid cooling solutions. Much like the FTW3 and XC3 Hydro Copper series, we see EVGA reuse its RTX 3090 and RTX 3080 FTW3 and XC3 PCBs to carve out their Hybrid Cooling variants. The FTW3 Hybrid Cooling cards feature addressable RGB illumination on the radiator fans, while the XC3 Hybrid Cooling series cards lack illumination on the cards. All four variants feature 240 mm x 120 mm radiators, and a pair of included 120 mm fans. The cooling solution features a pump-block cooling the GPU, while a series of heatsinks and a lateral fan cool the memory and VRM components. These cards have a similar $150-200 premium over the air-cooled FTW3 and XC3 cards.

Intel Alder Lake-S Processor with 16c/32t (Hybrid) Spotted on SANDRA Database

Intel's upcoming Core "Alder Lake-S" desktop processor, which is shaping up to be the first Hybrid desktop processor, surfaced on the SiSoft SANDRA benchmark database, as dug up by TUM_APISAK. The chip is reported by SANDRA to be 16-core/32-thread, although this is expected to be a combination of eight "big" high-performance cores, and eight "small" high-efficiency cores, in a multi-core topology similar to Arm big.LITTLE. Other specs read by SANDRA include clock speeds around "1.40 GHz," ten 1.25 MB L2 caches (possibly 8x 1.25 MB for the big "Golden Cove" cores, 2x 1.25 MB for the two groups of small "Gracemont" cores), and 30 MB of L3 cache. The Hybrid processor architecture is expected to introduce several platform-level innovations to the modern desktop, taking advantage of the extremely low power draw of the "Gracemont" cores when the machine isn't grinding serious workloads.

New Arm Technologies Enable Safety-capable Computing Solutions for an Autonomous Future

Today, Arm unveiled new computing solutions to accelerate autonomous decision-making with safety capability across automotive and industrial applications. The new suite of IP includes the Arm Cortex -A78AE CPU, Arm Mali -G78AE GPU, and Arm Mali-C71AE ISP, engineered to work together in combination with supporting software, tools and system IP to enable silicon providers and OEMs to design for autonomous workloads. These products will be deployed in a range of applications, from enabling more intelligence and configurability in smart manufacturing to enhancing ADAS and digital cockpit applications in automotive.

"Autonomy has the potential to improve every aspect of our lives, but only if built on a safe and secure computing foundation," said Chet Babla, vice president, Automotive and IoT Line of Business at Arm. "As autonomous decision-making becomes more pervasive, Arm has designed a unique suite of technology that prioritizes safety while delivering highly scalable, power efficient compute to enable autonomous decision-making across new automotive and industrial opportunities."

Lenovo Announces the Lightest ThinkPad Ever - ThinkPad X1 Nano

Lenovo is very excited to unveil the latest addition to our premium X1 portfolio, ThinkPad X1 Nano. The lightest ThinkPad ever at just 1.99 pounds (907 g) breaks new ground for performance and functionality in an incredibly featherweight package. Lenovo's first ThinkPad based on Intel Evo platform and powered by 11th Gen Intel Core processors, the X1 Nano delivers supreme speed and intelligence while maintaining outstanding battery life. Stunning visuals are delivered through a narrow bezel 13-inch 2K display with a 16:10 aspect ratio, and four speakers and four 360-degree microphones enhance the audio-visual capabilities. For a truly immersive user experience, the X1 Nano supports Dolby Vision and Dolby Atmos. State of the art connectivity is provided by WiFi 65 and optional 5G will deliver higher bandwidth capability and drive new levels of always on always connected efficiency and collaboration in a new hybrid working world.

Lenovo today is also delighted to announce that the world's first foldable PC, ThinkPad X1 Fold, is available to order and will ship in a few weeks. A pinnacle of engineering innovation, the X1 Fold offers a revolutionary mix of portability and versatility that defines a new computing category enabled by Intel Core processors with Intel Hybrid Technology and made possible by Intel's Project Athena innovation program. Blending familiar functionality that we all know from smartphones, tablets and laptops into a single foldable PC device that will forever reshape the way you work, play, create and connect. With optional 5G, you can trust that your connection speed is more secure and optimized where available and that you are better protected with ThinkShield security features. Find out more how ThinkPad X1 Fold is pioneering a new category: A Game Changing Category

EVGA Teases the GeForce RTX 3090 KINGPIN: 360mm AIO Hybrid Cooler, RGB OLED Screen

NVIDIA's announcement of the new RTX 3000-series cards has led to simultaneous announcement of add-in card partners with their solutions and custom takes on the same. These typically come in the form of a press release, with common specifications shared and emphasis on the cooling systems as well as other brand-specific features. EVGA was no different, and the PR shows off their new iCX3 cooling technology in it. More interesting to the enthusiasts and overclockers among us is newer information on their halo card- the RTX 3090 K|NGP|N (Kingpin)- with product management director Jacob revealing it will continue to use a hybrid AIO cooler as with the RTX 2080 Ti variant, but with a massive 360 mm radiator and three 120 mm fans for the behemoth GA102 die and accompanying power delivery solution. No word on pricing or retail availability yet, but look forward to your friendly neighborhood TPU reviews in due course of time to help make a purchase decision on your next GPU.

IBM Reveals Next-Generation IBM POWER10 Processor

IBM today revealed the next generation of its IBM POWER central processing unit (CPU) family: IBM POWER10. Designed to offer a platform to meet the unique needs of enterprise hybrid cloud computing, the IBM POWER10 processor uses a design focused on energy efficiency and performance in a 7 nm form factor with an expected improvement of up to 3x greater processor energy efficiency, workload capacity, and container density than the IBM POWER9 processor.

Designed over five years with hundreds of new and pending patents, the IBM POWER10 processor is an important evolution in IBM's roadmap for POWER. Systems taking advantage of IBM POWER10 are expected to be available in the second half of 2021. Some of the new processor innovations include:
IBM POWER10 Processor IBM POWER10 Processor

AMD Files Patent for its Own big.LITTLE Tech - Processor Clusters

In a sign of AMD's answer to Intel Hybrid tech being quite far away from implementation in a product, the company filed patents to a rival/similar technology only as recently as June 30, 2020, with the patent application being dug up by Underfox. The patent calls for a multi-core processor topology with two kinds of CPU cores - a "high-feature" core (big core), and a "low-feature" one (small core).

Here's where AMD's design is different: it calls for closely integrated groups of the two kinds of cores (one big core, and one small core), called "Processor Clusters." The dedicated L1 caches of the big and small cores in each group shadow data, while an L2 cache is shared between the two cores. Several such big+small Processor Clusters sit across a die, sharing the chip's last-level cache (L3 cache). This is unlike Intel's Hybrid design, where the big and small cores are spread apart on the die, with little cache coherency (Lakefield die-shot by le Comptoir du Hardware below). The patent also details the workflow of how the processor reconciles the ISA differences between the two core types.

QNAP Releases HybridMount 1.2, Enabling Users to Locally Mount Remote Server Folders

QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today released HybridMount 1.2, which allows users to mount folders from remote servers on a local NAS to act as local shared folders. HybridMount allows NAS users to access mounted remote folders based on local access rights, making it an ideal remote file sharing solution for multi-site workplaces and international companies.

"Remote folders that were mounted on a local NAS through HybridMount were previously only accessible to those who performed the mounting task. From HybridMount 1.2, IT staff can set access permissions to mounted remote folders for local users, allowing their entire organization to benefit from greater file sharing convenience and coordinated access to cloud-based files," said Josh Chen, Product Manager of QNAP.

Intel 8-core "Tiger Lake-H" Coming in 2021: Leaked Compal Document

Intel is preparing to launch an 8-core mobile processor based on its 10 nm "Tiger Lake" microarchitecture, according to a corporate memo by leading notebook OEM Compal, which serves major notebook brands such as Acer. The memo was drafted in May, but unearthed by momomo_us. Compal expects Intel to launch the 8-core "Tiger Lake-H" processor in Q1 2021. This is big, as it would be the first large 10 nm client-segment silicon that goes beyond 4 cores. The company's first 10 nm client silicon, "Ice Lake," as well as the "Tiger Lake-U" silicon that's right around the corner, feature up to 4 cores. As an H-segment part, the new 8-core processor could target TDPs in the range of 35-45 W, and notebooks in the "conventional thickness" form-factor, as well as premium gaming notebooks and mobile workstations.

The 8-core "Tiger Lake-H" silicon is the first real sign of Intel's 10 nm yields improving. Up until now, Intel confined 10 nm to the U- and Y-segments (15 W and below), addressing only ultra-portable form-factors. Even here, Intel launched U-segment 14 nm "Comet Lake" parts at competitive prices, to take the market demand off "Ice Lake-U." The H-segment has been exclusively held by "Comet Lake-H." Intel is planning to launch "Ice Lake-SP" Xeon processors later this year, but like all server parts, these are high-margin + low-volume parts. Compal says Intel will refresh the H-segment with a newer 8-core "Comet Lake-H" part in the second half of 2020, possibly to bolster the high-end against the likes of AMD's Ryzen 9 4900H. Later in 2021, Intel is expected to introduce its 10 nm "Alder Lake" processor, including a mobile variant. These processors will feature Hybrid technology, combining "Golden Cove" big CPU cores with "Gracemont" small ones.

Intel Reports Second-Quarter 2020 Financial Results

Intel Corporation today reported second-quarter 2020 financial results. "It was an excellent quarter, well above our expectations on the continued strong demand for computing performance to support cloud-delivered services, a work- and learn-at-home environment, and the build-out of 5G networks," said Bob Swan, Intel CEO. "In our increasingly digital world, Intel technology is essential to nearly every industry on this planet. We have an incredible opportunity to enrich lives and grow this company with a continued focus on innovation and execution."

Intel achieved record second-quarter revenue with 34 percent data-centric revenue growth and 7 percent PC-centric revenue growth YoY. These results were driven by strong sales of cloud, notebook, memory and 5G products in an environment where digital services and computing performance are essential to how we live, work and stay connected.

Intel Linux Patch Confirms "Alder Lake" is a Hybrid Core Processor

A Linux kernel patch contributed and signed off by Intel confirms that its upcoming Core "Alder Lake" processor will feature a hybrid core topology, much like Core Hybrid "Lakefield." The patch references "Lakefield" and "Alder Lake" under "Hybrid Core/Atom Processors." The patch possibly gives the Linux kernel awareness of the hybrid core topology, so it can schedule its work between the two types of cores on the silicon accordingly, and avoid rotating between the two core groups. Under the Android project, Linux has been aware of a similar tech from Arm since 2013.

Analogous with Arm big.LITTLE, the Intel Hybrid Core technology involves two kinds of CPU cores on a processor die, the first kind being "high performance," and the second being "low power." On "Lakefield," Intel deployed one "Sunny Cove" high performance core, and four "Tremont" low power cores. The low power cores keep the machine ticking through the vast majority of time when processing workloads requiring the high performance cores aren't present. With "Alder Lake," Intel is expected to scale up this concept, with the silicon rumored to feature eight "Golden Cove" high performance cores, and eight "Gracemont" low power ones. The chip is also expected to feature a Gen12 Xe iGPU.

Intel "Alder Lake" CPU Core Segmentation Sketched

Intel's 12th Gen Core "Alder Lake-S" desktop processors in the LGA1700 package could see the desktop debut of Intel's Hybrid Technology that it introduced with the mobile segment "Lakefield" processor. Analogous to Arm big.LITTLE, Intel Hybrid Technology is a multi-core processor topology that sees the combination of high-performance CPU cores with smaller high-efficiency cores that keep the PC ticking through the vast majority of the time/tasks when the high-performance cores aren't needed and hence power-gated. The high-performance cores are woken up only as needed. "Lakefield" combines one "Sunny Cove" high-performance core with four "Tremont" low-power cores. "Alder Lake-S" will take this concept further.

According to Intel slides leaked to the web by HXL (aka @9550pro), the 10 nm-class "Alder Lake-S" silicon will physically feature 8 "Golden Cove" high-performance cores, and 8 "Gracemont" low-power cores, along with a Gen12 iGPU that comes in three tiers - GT0 (iGPU disabled), GT1 (some execution units disabled), and GT2 (all execution units enabled). In its top trim with 125 W TDP, "Alder Lake-S" will be a "16-core" processor with 8 each of "Golden Cove" and "Gracemont" cores enabled. There will be 80 W TDP models with the same 8+8 core configuration, which are probably "locked" parts. Lastly, there the lower wrungs of the product stack will completely lack "small" cores, and be 6+0, with only high-performance cores. A recurring theme with all parts is the GT1 trim of the Gen12 iGPU.

Intel Launches Lakefield Hybrid Processors: Uncompromised PC Experiences for Innovative Form-Factors

Today, Intel launched Intel Core processors with Intel Hybrid Technology, code-named "Lakefield." Leveraging Intel's Foveros 3D packaging technology and featuring a hybrid CPU architecture for power and performance scalability, Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility across productivity and content creation experiences for ultra-light and innovative form factors.

"Intel Core processors with Intel Hybrid Technology are the touchstone of Intel's vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs. Combined with Intel's deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future," said Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms.

Lenovo ThinkPad X1 Fold is a Force Multiplier for Road Warriors at CES 2020

The ThinkPad brand from Lenovo has always represented serious business on the move, right from its IBM origins. At CES 2020, the company unveiled what is possibly the best foldable PC design we've seen till date, the ThinkPad X1 Fold. The X1 Fold is a 13.3-inch tablet that folds perfectly along the middle to either a book-like orientation, or as a laptop, in which the top half becomes the display, and the bottom half your keyboard of whichever possible layout. If a touchscreen keyboard doesn't appeal to you, you can dock an accessory that has a physical keyboard and trackpad.

Under the hood of the X1 Fold is an Intel "Lakefield" Hybrid x86 SoC that combines high-performance and high-efficiency x86 cores and dynamically allots workload to them while power-gating on the fly (a la ARM big.LITTLE). When it comes out mid-2020 (likely a Computex 2020 launch), the ThinkPad X1 Fold will be driven by Windows 10X, a new operating system Microsoft is designing specifically for dual-screen mobile computing devices. The Flex 5G is Lenovo's first business notebook with an integrated 5G modem (in addition to Wi-Fi 6), so you can enjoy high-speed mobile Internet on the move. Lastly, we spotted the Lenovo Ducati notebook, a co-branded product of the company's MotoGP team sponsorship.

Brand New Models for Happy Hacking Keyboard and HHKB Accessories Now Available!

Fujitsu Computer Products of America, Inc. introduces new Happy Hacking Keyboard (HHKB) models including a Bluetooth enabled model, as well as HHKB branded accessories for avid HHKB fans!

The HHKB was developed by programmers for programmers to provide a smooth and fast keying experience while minimizing hand and finger fatigue. The keyboard only has the most necessary keys resulting in a light, compact and minimalist device. Since its introduction, the HHKB has been used by many customers including programmers and engineers and has sold over 500,000 units worldwide. The core concepts for the HHKB are its intelligent key layout and compact size. While these features have never changed for more than 20 years, keymap customization software and multi-platform support have been introduced to meet the changes in today's technology and work environment.

"I've personally used HHKB for over 20 years for professional and personal use, and I'm very excited to bring the latest generation of this cult classic to the U.S. market." said Yasunari Shimizu, CEO of Fujitsu Computer Products of America.

Ausounds Announces AU-X ANC Planar Headphones and AU-Stream Hybrid True Wireless Earbuds

Ausounds is a newcomer to the audio market as a retail product provider, but the founders have decades of experience in the music industry, and have been creating audio solutions for musicians for a while now. The company invited us to check out the brand, as well as their new products, at CES 2020 and we obliged as we usually do in an attempt to shine more light on relatively unknown companies in addition to the mainstream ones. They took the time to introduce their new AU-X active noise cancelling planar magnetic driver headphones to us, which feature 54 mm planar drivers on each earcup and four noise cancelling microphones working in a hybrid mode to allow up to 28 dB of ANC. The headphones are tuned for a transparent frequency response combined with a large soundstage and, in my limited testing, offered excellent discerning of the mid-high tones, especially when it comes to jazz and classical music.

The AU-X ANC Planar headphones have dual microphones also for calling/audio out, an included battery of 800 mAh for a rated 25 hours of battery life which the company claims is on the conservative side (think closer to 28 hours), and touch controls on the earcups for volume and media playback. Bluetooth 5.0 and 3.5 mm aux inputs complement the headphones for portability, and AptX-HD + Hi-Res certification round off the headphones which are rated for a 20 Hz-40 KHz frequency response, 32 Ω impedance, an SPL of 98 +/- 3 dB, and 280 grams in mass with protein leather earpads similar to those in the Bose QC35. The AU-X headphones cost $299.95 and will ship in March 2020. Read past the break for more on their equally new AU-Stream Hybrid earbuds.

Compete at the Speed Of Light With the Razer Huntsman Tournament Edition

Razer, the leading global lifestyle brand for gamers, today announced the Huntsman Tournament Edition (TE) compact gaming keyboard designed for esports tournaments.

The Huntsman TE joins the Huntsman premium keyboard family built with Razer's ultra-fast light activated Optical Switches. After its introduction in June 2018, the critically acclaimed Razer Huntsman Elite has taken the world by storm, becoming the best selling gaming keyboard in the U.S. The Huntsman TE, the latest addition to Razer's lineup of high-performance gaming keyboards, now features a new type of optical switch that actuates even faster - the Razer Linear Optical Switch.

IBM Unveils z15 With Industry-First Data Privacy Capabilities

IBM (NYSE: IBM) today announced IBM z15, a new enterprise platform delivering the ability to manage the privacy of customer data across hybrid multicloud environments. With z15, clients can manage who gets access to data via policy-based controls, with an industry-first capability to revoke access to data across the hybrid cloud.

The movement of data between partners and third parties is often the root cause of data breaches. In fact, 60 percent of businesses reported they suffered a data breach caused by a vendor or third party in 2018. With the growing adoption of hybrid multicloud environments, the importance of maintaining data security and privacy only grows more acute and challenging.

Dell Recalls Hybrid Laptop Power Adapters With Power Banks Due to Safety Risk

While Dell's hybrid power adapters with power banks were a great idea on paper as they allow users to charge their laptop while still on the go, there have been reports some of these units pose a safety risk. For now, there have been 11 reports of hybrid power adapters breaking and thereby exposing internal components. To fix the problem, Dell has issued a recall for hybrid adapters with manufacture code -"CN-05G53P - LOC00 - XXX - XXXX - AXX" (X representing various numerical values). Said manufacture code can be located on the back of the adapter as seen in the third image below. Dell has also determined that all problem units were produced between January 2017 and March 2017 and were sold on the Dell website, Amazon, Microcenter, and other affiliated retailers.

In total, roughly 8900 units are to be recalled and replaced with 475 having been sold in Canada. To find out if your hybrid charger is affected, you can contact Dell by phone or go to www.dellproduct.com and enter the manufacture code without dashes for verification. Anyone with a unit manufactured during the date noted above can have it replaced for free. While no injuries have been reported it would likely be better safe than sorry.

Intel's Foveros-based, Hybrid x86 CPUs Mean the Company Needed to Sprinkle some ARM

Intel at its architecture day revealed one of the more exquisite in-house designs for the company in recent years: a hybrid x86 chip that seems to imbibe from ARM's own big.Little design mantra. The new Hybrid x86 CPU that was announced takes this design choice in pairing a single, high-performance Sunny Cove core with four smaller Atom cores. This chip is built using Intel's Foveros manufacturing technology, which means a 22FFL IO chip serves as an active interposer, connected via TSVs to a 10nm die that contains both types of cores. The tiny chips measures just 12 x 12 x 1 mm (144 mm²), and looks to reduce footprint even further by including a POP (package on package) memory design.

The new Intel design is aimed at low-power environments, with the chip having been designed to work on a 2 mW standby power ratio, with less than a 7 W of power - for a big.Little five-core design and a 64 EU design with Gen11 graphics core. Intel's Jim Keller said that the company is testing the intricacies and advantages of this design internally, so more products based on this manufacturing and packaging mantra could pop up sometime in the future.
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