Hewlett Packard Enterprise, the company focused on making enterprise hardware and software, has today mistakenly listed some of Intel's upcoming 3rd generation Xeon Scalable processors. Called Ice Lake-SP, the latest server processor generation is expected to launch sometime in the coming days, with a possible launch date being the March 23rd "Intel Unleashed" webcast. The next generation of processors will finally bring a new vector of technologies Intel needs in server space. That means the support for PCIe 4.0 protocol for higher speed I/O and octa-channel DDR4 memory controller for much greater bandwidth. The CPU lineup will for the first time use Intel's advanced 10 nm node called 10 nm SuperFin.

Today, in the leaked HPE listing, we get to see some of the Xeon models Intel plans to launch. Starting from 32-core models, all the way to 40-core models, all SKUs above 28 cores are supposed to use dual die configuration to achieve high core counts. The limit of a single die is 28 cores. HPE listed a few models, with the highest-end one being the Intel Xeon Platinum XCC 8380 processor. It features 40 cores with 80 threads and a running frequency of 2.3 GHz. If you are wondering about TDP, it looks like the 10 nm SuperFin process is giving good results, as the CPU is rated only for 270 Watts of power.

Intel highlighted the company's focus on execution of core products and showcased the company's broader portfolio, in addition to sharing more on what's coming in the year ahead. As part of its disclosures, Intel announced the recent production of its 3rd Gen Intel Xeon Scalable processors (code-named "Ice Lake") with volume ramp taking place during the first quarter of 2021. Intel's 10 nm Xeon Scalable processors feature architectural and platform innovations that boost performance, security and operational efficiency within data centers.

"Today marks a significant milestone for Intel as we continue to accelerate the delivery of our 10 nm products and maintain an intense focus on delivering a predictable cadence of leadership products for our customers," said Navin Shenoy, executive vice president and general manager of the Data Platforms Group at Intel. "Our 3rd Gen Intel Xeon Scalable platform represents a strategic part of our data center strategy and one that we've created alongside some of our biggest customers to enable the data center of tomorrow."

Hey, we're live from Intel's Event at CES. We expect to hear about Rocket Lake, and possibly get a glimpse into the future beyond that.

The percentage distribution of 2021 NAND Flash bit demand by application currently shows that client SSD accounts for 31%, enterprise SSD 20%, eMMC/UFS 41%, and NAND wafer 8%, according to TrendForce's latest investigations. TrendForce expects NAND Flash ASP to undergo QoQ declines throughout 2021, since the number of NAND suppliers far exceeds DRAM suppliers, and the bit supply remains high. As Samsung, YMTC, SK Hynix, and Intel actively expand their NAND Flash bit output in 1Q21, the oversupply situation in the industry will become more severe, with a forecasted 6% QoQ increase in NAND Flash bit output and a 10-15% QoQ decline in NAND Flash ASP in 1Q21.

Intel needs a platform refresh to battle the competition, mainly speaking to battle AMD and its Ryzen 5000 series processors. That is why the company is developing 500 series of chipsets covering the low-end (H510), mid-range (B560), and high-end markets (Z590) that pair with the upcoming Rocket Lake-S processor generation. Dubbed 11th generation of Core processors, the 11th generation of Intel Core CPUs are going to be built on Intel's refined 14 nm process. The CPUs are supposed to feature a Cypress Cove core, which is a backport of Golden Cove found in Ice Lake. The 500 series motherboards are the last in the DDR4 generation, launching in the timeframe when DDR5 is supposed to take over in the coming years.

Today, thanks to Weixin, a Chinese media outlet that posted a short story on the WeChat platform, we have information about the launch date of these new chipsets. According to the source, we are allegedly going to see these new chipsets on January 11th, the day that Intel CES 2021 event is supposed to happen. The platform will include a range of motherboards from Intel's partners and is supposed to bring support for the much-needed PCIe 4.0 protocol. The launch date should be taken with a grain of salt, of course, before taking it as a fact.

Today, in the latest GeekBench 5 submission by ASUS, we have discovered something rather interesting. Intel's Ice Lake-SP processors were rumored to arrive with up to 28 cores and 56 threads at maximum, on a single chip. That was due to the 10 nm process used to make these chips, with suspicions that the yield of the node was not good enough to make any higher core count parts. Thanks to the GB5 listing, discovered by Leakbench on Twitter, the Intel Ice Lake-SP CPU engineering sample appeared with an amazing 36 cores with 72 threads. This is supposedly Intel's efforts to try and match the 64 cores and 128 threads of AMD's EPYC "Rome" CPUs, which are winning many server applications due to their performance.

The 36C/72T chip was paired with another similar chip in a 2P dual-socket configuration, which made the total core count rise to 72 cores and 144 threads, running inside of Asustek's Y4R-A1-ASUS-G1 server. The system was reporting a clock frequency of 3.6 GHz base speed, which means that the possible boost clocks could be higher. The CPU features a 1.25 MB level two (L2) cache per core (45 MB in total) and 54 MB of unified level three (L3) cache. That makes this CPU core quite an improvement over the past Cooper Lake generation. We are waiting for more information about these CPUs, and we are going to report on it in the coming time.

Just a few days ago, Intel has decided to surprise us and give out information about its upcoming Rocket Lake-S platform designed for desktop users. Arriving early next year (Q1) the Rocket Lake-S platform is yet another iteration of the company's 14 nm node. However, this time we are getting some real system changes with a new architecture design. Backporting its Golden Cove core to 14 nm, Intel has named this new core type Cypress Cove. What used to be the heart of Ice Lake CPUs, is now powering the Rocket Lake-S platform. Besides the new core, there are other features of the platform like PCIe 4.0, new Xe graphics, and updated media codecs. You can check that out here.

Today, we have gotten the first benchmarks of the Intel Rocket Lake-S system. In the Userbenchmark bench, an unknown eight-core Rocket Lake CPU has been compared to Intel's 10th generation Comet Lake-S processors. The Rocket Lake engineering sample ran at 4.2 GHz while scoring a single-core score of 179. Compared to the Core i9-10900K that runs at 5.3 GHz, which scored 152 points, the Cypress Cove design is 18% faster. And if the new design is compared to the equivalent 8C/16T Compet Lake CPU like Core i7-10700K clocked at 5.1 GHz and scoring 148 points, the new CPU uarch is up to 22% faster. This represents massive single-threaded performance increases, however, please take the information with a grain of salt, as we wait for the official reviews.

Today, Intel has decided to surprise us and give an update to its upcoming CPU lineup for desktop. With the 11th generation, Core CPUs codenamed Rocket Lake-S, Intel is preparing to launch the new lineup in the first quarter of 2021. This means that we are just a few months away from this launch. When it comes to the architecture of these new processors, they are going to be based on a special Cypress Cove design. Gone are the days of Skylake-based designs that were present from the 6th to 10th generation processors. The Cypress Cove, as Intel calls it, is an Ice Lake adaptation. Contrary to the previous rumors, it is not an adaptation of Tiger Lake Willow Cove, but rather Ice Lake Sunny Cove.

The CPU instruction per cycle (IPC) is said to grow in double-digits, meaning that the desktop users are finally going to see an improvement that is not only frequency-based. While we do not know the numbers yet, we can expect them to be better than the current 10th gen parts. For the first time on the Intel platform for desktops, we will see the adoption of PCIe 4.0 chipset, which will allow for much faster SSD speeds and support the latest GPUs, specifically, there will be 20 PCIe 4.0 lanes coming from the CPU only. The CPU will be paired with 12th generation Xe graphics, like the one found in Tiger Lake CPUs. Other technologies such as Deep Learning Boost and VNNI, Quick Sync Video, and better overclocking tuning will be present as well. Interesting thing to note here is that the 10C/20T Core i9-10900K has a PL1 headroom of 125 W, and 250 W in PL2. However, the 8C/16T Rocket Lake-S CPU also features 125 W headroom in PL1, and 250 W in PL2. This indicates that the new Cypress Cove design runs hotter than the previous generation.

Intel today unveiled the suite of new security features for the upcoming 3rd generation Intel Xeon Scalable platform, code-named "Ice Lake." Intel is doubling down on its Security First Pledge, bringing its pioneering and proven Intel Software Guard Extension (Intel SGX) to the full spectrum of Ice Lake platforms, along with new features that include Intel Total Memory Encryption (Intel TME), Intel Platform Firmware Resilience (Intel PFR) and new cryptographic accelerators to strengthen the platform and improve the overall confidentiality and integrity of data.

Data is a critical asset both in terms of the business value it may yield and the personal information that must be protected, so cybersecurity is a top concern. The security features in Ice Lake enable Intel's customers to develop solutions that help improve their security posture and reduce risks related to privacy and compliance, such as regulated data in financial services and healthcare.

Intel 10 nm products have seen massive delays over the years, and Intel has built many IPs on the new node, however, not many of them have seen the light of the day due to problems the company has experienced with the manufacturing of the new node. That has caused delays in product shipments in the past, meaning that the time for 10 nm is just ahead. According to the latest DigiTimes Taiwan report, we have information that Intel is going to delay its Ice Lake-SP server processors manufactured on a 10 nm node. And it is going to be a whole quarter late according to the report. Instead of launching in Q4 this year, we can expect to see new processors in Q1 of 2021. It is yet unknown whatever the launch will happen at the beginning of Q1 or its end, however, we will report on it as we hear more information.

Update: DigiTimes has also released another report regarding server shipments. It is reported that server vendors are decelerating the shipments as they are making fewer orders in Q4 to wait for the new Intel CPUs. Judging by this move, the demand for these new processors is going to be rather high and the supply chain is preparing slowly for it.

Here's is the first schematic of Intel's upcoming "Whitley" enterprise platform for the upcoming Xeon Scalable "Ice Lake-SP" processors, courtesy momomo_us. The platform sees the introduction of the new LGA4189 socket necessitated by Intel increasing the memory channels per socket to 8, compared to 6 of the current-gen "Cascade Lake-SP." The new platform also sees the introduction of PCI-Express gen 4.0 bus, with each socket putting out up to 64 PCI-Express gen 4.0 CPU-attached lanes. This are typically wired out as three x16 slots, two x8 slots, an x4 chipset bus, and a CPU-attached 10 GbE controller.

The processor supports up to 8 memory channels running at DDR4-3200 with ECC. The other key component of the platform is the Intel C621A PCH. The C621A talks to the "Ice Lake-SP" processor over a PCI-Express 3.0 x4 link, and appears to retain gen 3.0 fabric from the older generation C621. momomo_us also revealed that the 10 nm "Ice Lake-SP" processor could have TDP of up to 270 W.

Intel in the opening presentation of the Hot Chips 32 virtual conference detailed its next-generation Xeon Scalable "Ice Lake-SP" enterprise processor. Built on the company's 10 nm silicon fabrication process, "Ice Lake-SP" sees the first non-client and non-mobile deployment of the company's new "Sunny Cove" CPU core that introduces higher IPC than the "Skylake" core that's been powering Intel microarchitectures since 2015. While the "Sunny Cove" core itself is largely unchanged from its implementation in 10th Gen Core "Ice Lake-U" mobile processors, it conforms to the cache hierarchy and tile silicon topology of Intel's enterprise chips.

The "Ice Lake-SP" die Intel talked about in its Hot Chips 32 presentation had 28 cores. The "Sunny Cove" CPU core is configured with the same 48 KB L1D cache as its client-segment implementation, but a much larger 1280 KB (1.25 MB) dedicated L2 cache. The core also receives a second fused multiply/add (FMA-512) unit, which the client-segment implementation lacks. It also receives a handful new instruction sets exclusive to the enterprise segment, including AVX-512 VPMADD52, Vector-AES, Vector Carry-less Multiply, GFNI, SHA-NI, Vector POPCNT, Bit Shuffle, and Vector BMI. In one of the slides, Intel also detailed the performance uplifts from the new instructions compared to "Cascade Lake-SP".

Intel is preparing to launch an 8-core mobile processor based on its 10 nm "Tiger Lake" microarchitecture, according to a corporate memo by leading notebook OEM Compal, which serves major notebook brands such as Acer. The memo was drafted in May, but unearthed by momomo_us. Compal expects Intel to launch the 8-core "Tiger Lake-H" processor in Q1 2021. This is big, as it would be the first large 10 nm client-segment silicon that goes beyond 4 cores. The company's first 10 nm client silicon, "Ice Lake," as well as the "Tiger Lake-U" silicon that's right around the corner, feature up to 4 cores. As an H-segment part, the new 8-core processor could target TDPs in the range of 35-45 W, and notebooks in the "conventional thickness" form-factor, as well as premium gaming notebooks and mobile workstations.

The 8-core "Tiger Lake-H" silicon is the first real sign of Intel's 10 nm yields improving. Up until now, Intel confined 10 nm to the U- and Y-segments (15 W and below), addressing only ultra-portable form-factors. Even here, Intel launched U-segment 14 nm "Comet Lake" parts at competitive prices, to take the market demand off "Ice Lake-U." The H-segment has been exclusively held by "Comet Lake-H." Intel is planning to launch "Ice Lake-SP" Xeon processors later this year, but like all server parts, these are high-margin + low-volume parts. Compal says Intel will refresh the H-segment with a newer 8-core "Comet Lake-H" part in the second half of 2020, possibly to bolster the high-end against the likes of AMD's Ryzen 9 4900H. Later in 2021, Intel is expected to introduce its 10 nm "Alder Lake" processor, including a mobile variant. These processors will feature Hybrid technology, combining "Golden Cove" big CPU cores with "Gracemont" small ones.

Intel is preparing to launch its next-generation for server processors and the next in line is the Ice Lake-SP 10 nm CPU. Featuring a Golden Cove CPU and up to 28 cores, the CPU is set to bring big improvements over the past generation of server products called Cascade Lake. Today, thanks to the sharp eye of TUM_APISAK, we have a new benchmark of the Ice Lake-SP platform, which is compared to AMD's EPYC Rome offerings. In the latest GeekBench 4 score, appeared an engineering sample of unknown Ice Lake-SP model with 28 cores, 56 threads, a base frequency of 1.5 GHz, and a boost of 3.19 GHz.

This model was put in a dual-socket configuration that ends up at a total of 56 core and 112 threads, against a single 64 core AMD EPYC 7442 Rome CPU. The dual-socket Intel configuration scored 3424 points in the single-threaded test, where AMD configuration scored notably higher 4398 points. The lower score on Intel's part is possibly due to lower clocks, which should improve in the final product, as this is only an engineering sample. When it comes to the multi-threaded test, Intel configuration scored 38079 points, where the AMD EPYC system did worse and scored 35492 points. The reason for this higher result is unknown, however, it shows that Ice Lake-SP has some potential.

As we approach the launch of the Intel's Ice Lake-SP Xeon processors, which will be the company's first 10 nm product for servers, we find more details on the ways CPU operates and today's discovery is an interesting one. In the latest patch submitted to Linux kernel by Intel's engineers, we find out that Intel Ice Lake Xeons have a slower frequency ramp up, meaning that there could be some latency added. However, the engineers have patched this and it should perform as expected. The patch is described as the following: "On ICX platform, the CPU frequency will slowly ramp up when woken up from C-states deeper than/equals to C1E. Although this feature does save energy in many cases this might also cause unexpected result. For example, workload might get unstable performance due to the uncertainty of CPU frequency. Besides, the CPU frequency might not be locked to specific level when the CPU utilization is low."

Intel CPUs have been rather notorious for system bugs recently. Starting from 2018's Spectre and Meltdown which used speculative execution to exploit systems, the string of new vulnerabilities just continued to this day. Recently we had CrossTalk exploit which represents a threat to cloud providers, where one user could compromise another just by using the same CPU from which the virtual instances are powered. These types of exploits are even more dangerous than ones that require local access, as that is already dangerous by itself. A lot of these issues are said to be ironed out by Intel's new microarchitecture designs like Ice Lake, Tiger Lake, and future revisions.

However, it seems like Intel is encountering some problems with even the latest Ice Lake CPUs when it comes to system bugs. JetBrains, a Czech provider of software development tools has a Java programming language development environment called IntelliJ integrated development environment. It was recently reported that on MacBook Air 2020 and Microsoft Surface Pro models equipped with 10th generation Intel Ice Lake CPUs, IntelliJ IDE causes system restart or a complete OS crash. In the report, the CPU ran in a Linux VM that isolates itself from MacOS so the macOS XNU kernel is not to blame. In the report thread, another user running Windows on Microsoft Surface Pro experienced the crash as well.

Intel plans to update its Xeon Scalable server processor family this year with the new "Ice Lake-SP" microarchitecture. Built on the 10 nm+ silicon fabrication process, "Ice Lake-SP" is a high- thru extreme core-count monolithic silicon that features "Sunny Cove" CPU cores that introduce the first real IPC increases over "Skylake." A 24-core/48-thread processor likely based on this silicon surfaced on the Geekbench database, where it posted some impressive numbers given its low clock speeds.

The processor comes with an identification string "GenuineIntel Family 6 Model 106 Stepping 4," with a nominal clock speed of 2.20 GHz, and boost frequency of 2.90 GHz, which points to the possibility of this being an engineering sample. Besides clock speeds and core counts, some basic hardware specs were detected by Geekbench 4. For starters, the processor has an L1D cache size of 48 KB and L1I cache size of 32 KB, which is similar to the client-segment "Ice Lake-U" silicon based Core i7-1065G7, and confirms that this processor uses "Sunny Cove" cores. "Cascade Lake" and "Skylake" cores use 32 KB L1D caches. Also, the dedicated L2 cache per core is 1.25 MB, up from the 1 MB L2 caches on "Cascade Lake." Client-segment "Ice Lake" chips use 512 KB L2 caches. The shared L3 cache is 36 MB (or 1.5 MB slice per core), which loosely aligns with the cache balance of Intel's server and HEDT processors. In this bench run, the processor is backed by 256 GB of memory, of an unknown type or configuration. In the three bench runs, the setup scores roughly 4100 points single-core, and roughly 42000 points multi-core.

Intel's Investor Relations head Trey Campbell, in a "fire-side chat" with top investors at the Cowen Virtual Technology Media and Telecom Conference, reaffirmed Intel's commitment to its server processor roadmap. Intel is on course to introducing its 10 nm Xeon "Ice Lake-SP" enterprise processor family by the end of 2020, and "Sapphire Rapids" sometime within 2021.

"Ice Lake-SP" processor will introduce the new "Whitley" platform, with a new 4,189-pin LGA socket, which leverages PCI-Express gen 4.0. While retaining the DDR4 memory standard, the memory interface has been broadened to 8-channel, and reference memory clock speeds are expected to be increased to DDR4-3200. The company's "Sapphire Rapids" processor is expected to shake up the market, as it introduces next-generation I/O, when it launches alongside the "Eagle Stream" platform in 2021. The processor will be built on the refined 10 nm+ silicon fabrication node, feature "Willow Cove" CPU cores, and I/O feature set that sees the introduction of DDR5 memory standard, and PCI-Express gen 5.0.

Intel's next-generation Atom processor is codenamed "Elkhart Lake." Built on the 10 nm silicon fabrication process, the chip combines up to four CPU cores based on the "Tremont" microarchitecture, with an iGPU based on the Gen11 architecture, and a single-channel memory interface that supports DDR4 and LPDDR4. Differentiation of the processor include 2-core and 4-core CPU variants, and TDP variants spanning 6 W, 9 W, and 12 W. "Tremont" is a lightweight CPU core by Intel that lacks AVX capabilities. Besides "Elkhart Lake," the core is featured in the "Lakefield" Core heterogenous processors as the their low-power cores.

Chinese electronics B2B marketplace CogoBuy.com has the processor listed, although without listing out any processor model numbers. The marketplace is accepting RFQs (requests for quotations) for bulk purchase of these BGA chips on trays, without listing prices. Also listed is an "industrial variant" of the chip, which has an increased TJmax of 110 °C (compared to 105 °C of the standard variant). The Gen11 iGPU wasn't detailed, but it's likely to have a lower execution unit count than the variant found on "Ice Lake" processors, while retaining its display- and media-engines (ability to pull 8K60 displays).

Intel is preparing to launch its next-generation Tiger Lake lineup of processors for the middle of 2020. The processors are based on the new "Willow Cove" CPU core, which supposedly brings even more IPC gains compared to previous "Golden Cove" CPU cores found in Ice Lake processors. The Tiger Lake lineup will use Intel's advanced 10 nm+ manufacturing process. This alone should bring some gains in frequency compared to the 10 nm Ice Lake processor generation, which was spotting a maximum of 4.1 GHz boost frequency on 28 W TDP model named Core i7-1068NG7. This processor is labeled as the highest-performing Ice Lake parts available today and the best 10 nm products available so far from Intel.

Thanks to the popular hardware leaker Rogame, we have evidence that the gains from 10 nm+ manufacturing process are real and that Tiger Lake will show us an amazing boost frequency of 5 GHz. In the benchmark, an unknown OEM laptop was spotted running the benchmark with a Tiger Lake CPU. This CPU is a 4 core, 8 threaded model with a base frequency of 2.3 GHz and a surprising boost frequency of 5 GHz. This information should, of course, be taken with a grain of salt until we get more information about the Tiger Lake lineup and their specifications.

As we reported earlier this week, the release of Adobe Premiere Pro 14.2 brought GPU acceleration to select NVIDIA and AMD GPUs taking advantage of NVIDIA's NVENC chips to boost encoding and decoding speeds. Intel has now showcased the improvements to encoding and decoding with Intel Quick Sync Video (QSV) on 11th generation iGPUs found in mobile Ice Lake chips with Adobe Premiere Pro 14.2.

Compared to the previous 9th generation graphics found in Skylake and Kabylake CPUs the new 11th generation iGPUs perform anywhere from 49-82% better. While impressive, these performance gains can only be found on limited low power 10 nm mobile chips with a maximum of four cores and are yet to arrive on desktop platforms.

Intel Xe graphics architecture makes its commercial debut as an iGPU solution in the company's upcoming "Tiger Lake" mobile processors. The iGPU can be configured along three tiers, with GT1 featuring 48 execution units (EUs), GT2 80 EUs, and GT3 leading the pack with 96 EUs, all within a 15 W envelope (for the total chip). There's a higher tier still of GT3 that comes with higher boost frequencies, tapping into the chip's overall increased 28 W TDP, but this variant of "Tiger Lake" could likely be an Apple-exclusive like its "Ice Lake" based predecessor.

NotebookCheck compiled a 3DMark FireStrike comparison between the various tiers of the Xe iGPU, and compared it to the Gen11 iGPU found with current-generation "Ice Lake-U" processors. The graph doesn't put out scores, but relative performance. Apparently, the 48 EU version of Gen12 Xe is a little over twice as fast as Gen11 GT1, and faster than even the 64 EU Gen11 GT2. The Gen12 GT2 with 80 EUs is around 1.7x faster than the Gen11 GT2 (64 EU). The 96 EU GT3 trim is over twice as fast, and its 28 W variant faster still. These performance give Gen12 a shot against AMD's Radeon Vega-based iGPU solution found in "Renoir." AMD has slimmed the number of CUs down to 8 (512 SP) with "Renoir," down from 11 CUs in the previous generation, compensating for it with higher GPU engine clocks.

The idea of an ARK is to preserve that which enters it; however, the legend on the basis of arks and their concept must've slipped Intel's internal memos. The company has de-listed a previously detailed Ice Lake mobile CPU from its database - the Core i7-1068G7 - which was a 28 W part available for system integrators to build machines around. That part was special, because it was - then - the only 28 W part listed for mobile Ice Lake, with the rest of the CPU lineup having configurable TDPs between 12 W and 25 W - thus having a lesser maximum theoretical performance due to reduced TDP.

In its stead, Intel has entered a new, Core i7-1068NG7 (yes, the same naming with an extra N), which places this as an Apple-exclusive CPU, according to the folks over at Notebookcheck. Besides this entry, Intel has also listed the i5-1038NG7, which also features a 28 W TDP that's higher than the other available CPUs for other system integrators. If this is true, then Intel is reserving its cream-of-the-crop CPUs for Apple. Since the California-based company wouldn't be using parts with worse thermal and power consumption figures than what's available for others, the only answer to how these products came to being is that they are binned CPUs with better than average characteristics. Intel could be doing this to keep Apple happy even as the California-based company is well on its way to eschew its dependence on x86 with a fully internally-developed ARM CPU.

Intel spoke of a "double digit percentage performance growth generation on generation" at its product reveal for "Tiger Lake" along the sidelines of its CES event. We now have a theory as to how they arrived at that. The company's 11th generation Core "Tiger Lake" processor, scheduled to launch sometime mid-2020, could bring about big gains in per-core performance for the ultraportable segment. PC enthusiast MebiuW, who has had a high hit-rate with Intel leaks, revealed that the flagship "Tiger Lake" part, the Core i7-1185G7, could ship with a CPU Turbo Boost speed of 4.70 GHz, a steep increase from the 3.90 GHz of the top current "Ice Lake" part, the i7-1065G7. The increased clock speeds, coupled with the more advanced "Willow Cove" CPU cores appear to be the 11th generation chip's value proposition.

GDP, a company specializing in the creation of tiny laptops designed for gaming, has just announced the latest addition to its family of tiny notebooks - the GDP Win Max gaming laptop. This model is an 8-inch gaming laptop packing a lot for its size. On the outside, this laptop is equipped with joysticks on both sides, so there is even an option to directly play games using these joysticks instead of the built-in keyboard. The display of the device is an IPS screen that features a 1280×800 resolution, resulting in a 16:10 aspect ratio of the display. What's more important, however, is what is under the hood of the small body.

It is powered by Intel's latest Ice Lake CPU - the Intel Core i5-1035G7. Being a 4 core/ 8 threaded CPU with Gen11 Iris Plus 940 graphics it is accompanied by 16 GB of LPDDR4X RAM and 512 GB SSD. GDP has provided some of the benchmark results of this configuration which you can check out below, however, please take these with a grain of salt. As far as I/O goes, this small laptop is rather well equipped with plenty of ports. There is one Thunderbolt 3 port to connect to external GPU is it is needed. There is one USB Type-C 3.1 Gen2 port and two USB Type-A 3.1 Gen1 ports for the connection of external peripherals. If you wish to connect the laptop to the outside screen, there are options of HDMI, USB Type-C or Thunderbolt 3 ports for connection. A welcome addition to I/O is the inclusion of the RJ45 connector, meaning that if you have access to ethernet you can easily plug it into this laptop.