Responding to the booming development of SSDs and the growing demands from users, QNAP Systems, Inc. has announced the TS-451S Turbo NAS, a 4-bay NAS that is optimized for high-density 2.5" SSDs and features an Intel Celeron 2.41GHz processor. Meanwhile, QNAP's powerful SS-x53 Pro series (SMB models that are optimized for high-density SATA 6Gb/s 2.5" SSDs) have been renamed the TS-453S Pro (4-bay) and TS-853S Pro (8-bay) respectively to assist users in quickly recognizing different options in the same product category.
"Users can enjoy numerous benefits when using SSDs in a Turbo NAS, including a smaller physical size to host at least 4 SSDs, higher-density storage capacity, RAID 5 configuration for data protection, quieter system operations, a home theater multimedia experience with the HD Station, and the exclusive QvPC Technology that allows the Turbo NAS to be used as a PC," said Jason Hsu, product manager of QNAP. The TS-x53S Pro series can also work silently and reliably with 2.5" hard drives as well.
At Intel Corporation's annual investor meeting today, the company announced that its board of directors has approved an increase in its cash dividend to 96 cents-per-share on an annual basis, a 6-cent increase, beginning with the dividend that will be declared in the first quarter of 2015. Intel also provided the 2015 business outlook. "Today's dividend announcement reflects the board's confidence in Intel's strategy," said Intel Chairman Andy Bryant. "It also reflects the board's ongoing commitment to create value and return cash to Intel's stockholders."
At the investor meeting, Intel CEO Brian Krzanich emphasized that Intel's highest shareholder value will come from a strategy to utilize the core assets that drive the company's PC and data center businesses to move into profitable, complementary market segments. Intel's leading-edge manufacturing capability, Intel architecture, and the use of shared IP are key elements of the growth strategy.
Intel Corporation today unveiled silicon characterization results for its 1 to 32 Gbps high-speed SerDes on the 14nm process. This 32 Gbps SerDes is the second SerDes offering and adds to the previously announced 1 to 16 Gbps GP 14nm SerDes. It will be available by end of this year.
Intel's 14nm SerDes family is the second generation of SerDes offering and is built on the success of Intel's 12 and 28 Gbps SerDes, which is currently in production on Intel's 22nm Tri-gate process technology. Intel's 14nm SerDes extends the operating range while reducing power by 20 percent and area by more than 40 percent as compared to Intel's 22nm SerDes offering. This announcement marks the first time that a 32 Gbps, multiprotocol SerDes has been validated on any sub-20nm foundry process.
Intel Corporation todayannounced several new and enhanced technologies bolstering its leadership in high-performance computing (HPC). These include disclosure of the future generation Intel Xeon Phi processor, code-named Knights Hill, and new architectural and performance details for Intel Omni-Path Architecture, a new high-speed interconnect technology optimized for HPC deployments.
Intel also announced new software releases and collaborative efforts designed to make it easier for the HPC community to extract the full performance potential from current and future Intel industry-standard hardware. Together, these new HPC building blocks and industry collaborations will help to address the dual challenges of extreme scalability and mainstream use of HPC while providing the foundation for a cost-effective path to exascale computing.
Intel Corporation today reported third-quarter revenue of $14.6 billion, operating income of $4.5 billion, net income of $3.3 billion and EPS of $0.66. The company generated approximately $5.7 billion in cash from operations, paid dividends of $1.1 billion, and used $4.2 billion to repurchase 122 million shares of stock.
"We are pleased by the progress the company is making," said Intel CEO Brian Krzanich. "We achieved our best-ever revenue and strong profits in the third quarter. There is more to do, but our results give us confidence that we're successfully executing to our strategy of extending our products across a broad range of exciting new markets."
Synology today announced the new DiskStation DS415+, a powerful 4-bay NAS server designed to centralize data storage, backup, and file sharing for small and medium-sized businesses, as well as enthusiast home users. DS415+ features an Intel Atom 2.4Ghz quad-core processor with an AES-NI hardware encryption engine, a floating-point unit, as well as 2GB DDR3 RAM. The four drive bays accommodate huge amounts of storage capacity, while the USB 3.0, USB 2.0, and eSATA ports allow users to connect and access various external storage devices. Dual LAN ports support failover and link aggregation, thus improving resiliency and potential throughput.
"Thanks to its best-in-class combination of hardware specs and DSM software integration, DS415+ handles data transfer and encryption at blazingly fast speeds, bringing peace of mind to businesses or individuals who wish to safeguard their data while maintaining excellent performance," said Michael Wang, product manager at Synology Inc. As the first desktop DiskStation model to include a quad-core processor and AES-NI hardware encryption engine, DS415+ delivers performance and accelerated data encryption that is on par with more expensive high-end servers. With link aggregation enabled, DS415+ provides average reading and writing speeds that exceed 228 MB/s and 233 MB/s respectively, while encrypted file transfers retain an astoundingly similar level of performance, exceeding 232 MB/s reading and 206 MB/s writing.
The transition between DDR2 and DDR3 system memory types was slower than the one between DDR and DDR2. DDR3 made its mainstream debut with Intel's X38 and P35 Express platforms, at a time when the memory controller was still within the domain of a motherboard chipset, at least in Intel's case. The P35 supported both DDR2 and DDR3 memory types, and motherboard manufacturers made high-end products based on each of the two memory types, with some even supporting both.
Higher module prices posed a real, and higher latencies, posed a less real set of drawbacks to the initial adoption of DDR3. Those, coupled with the limited system bus bandwidth, to take advantage of DDR3. DDR3 only really took off with Nehalem, Intel's first processor with an integrated memory controller (IMC). An IMC, again in Intel's case, meant that the CPU came with memory I/O pins, and could only support one memory type - DDR3. Since then, DDR3 proliferated to the mainstream. Will the story repeat itself during the transition between DDR3 and the new DDR4 memory introduced alongside Intel's Core i7 "Haswell-E" HEDT platform? Not exactly.
ASUS today announced X99-E WS, a new Compact Electronics Bay (CEB) workstation motherboard based on the Intel X99 chipset and with support for four-way multi-GPU setups at full PCI Express 3.0 x16 speed for extreme graphics power. X99-E WS is engineered with premium components for premium efficiency, including an integrated Driver-MOSFET (Dr. MOS), exclusive Beat Thermal Chokes II, ultra-durable 12K capacitors and ProCool power connector. X99-E WS offers industry-leading storage opportunities with onboard M.2 x4 and support for the exclusive ASUS PIKE II (Proprietary I/O Kit Expansion) and ThunderboltEX II expansion cards. It also has many simple, efficient and ASUS-exclusive easy-maintenance tools, including Q-Code Logger and Dr. Power.
G.SKILL International Co., Ltd., the leading extreme performance memory manufacturer and designer, is excited to feature two extremely high end DDR4 memory at 3333MHz 32GB (4GBx8) and 3200MHz 32GB (8GBx4) during Intel Developer Forum 2014 (IDF 2014). Driven by the newest Intel i7-5960X CPU on the newest ASUS Rampage V Extreme X99 and X99-Deluxe motherboards, the Ripjaws 4 series DDR4 3333MHz 4GBx8 and 3200MHz 8GBx4 memory demonstrates the highest DDR4 speed available in 4GB and 8GB modules, respectively.
"It's very exciting to show the world what we can do with the new DDR4 memory standard for the latest Intel X99 platform. There is no doubt that breaking the 3000MHz memory barrier with ease is the next big thing in desktop performance, effectively doubling bandwidth throughput compared to the previous DDR3 memory standard," says Frank Hung, Product Marketing at G.SKILL.
Leveraging its data center storage insights, HGST, a Western Digital company (NASDAQ: WDC), is broadening its scope of innovation to capture new and growing opportunities in data center storage infrastructure. The company today announced six new offerings that will help organizations manage the increasing volume, velocity, variety and longevity of data in today's rapidly evolving data center.
In addition to maintaining its longstanding leadership in storage devices, the new offerings demonstrate HGST's commitment to transform the data center and itself through hardware and software solutions that elevate the value it provides to partners and customers. By creating innovative solutions that shape the emerging categories of Flash fabric solutions and active archive solutions, HGST is driving the data center evolution by helping organizations readily extract the information, knowledge and wisdom that lies within their data.
Enterprise storage leader HGST, a Western Digital company today announced it will extend the use of Intel NAND Flash technology as part of a cooperative agreement with Intel Corporation on Serial Attached SCSI (SAS) solid state drives (SSDs). Since 2008, HGST has successfully worked with Intel to develop industry-leading enterprise-class SAS SSDs for servers, workstations and storage systems. The resulting products have combined HGST's enterprise storage experience with Intel's NAND Flash expertise, and are the foundation for HGST's leading position in SAS SSDs.
Intel's focus and investment in NAND flash memory research and SSD development provides industry-leading advancements in next-generation NAND lithography and offers high-endurance SSD technology. HGST brings proven enterprise storage expertise in SAS design, firmware, reliability, customer qualification and system integration. This combination enables HGST to deliver world-class solutions with the performance, endurance and reliability that enterprise storage customers demand.
Intel Corporation CEO Brian Krzanich kicked off Intel's annual technical conference with a broad set of computing initiatives and projects showing how the company is moving quickly to enable new market segments where everything is smart and connected. Krzanich and other executives announced new hardware and software developer tools, previewed upcoming Intel technologies and announced new products across several technology segments.
"With our diverse product portfolio and developer tools that span key growth segments, operating systems and form factors, Intel offers hardware and software developers new ways to grow as well as design flexibility," said Brian Krzanich, Intel CEO. "If it's smart and connected, it is best with Intel."
ASUS' entry-level socket LGA2011-v3 motherboard, the X99-A, began selling. Although announced along with ASUS' mainline flagship, the X99-Deluxe, the X99-A, along with mid-range X99-Pro, weren't available immediately, as the company decided to go in with three flagship LGA2011-v3 products, the ROG Rampage V Extreme and X99-WS being the other two. The X99-A appears to be based on a slightly watered down version of a PCB it shares with the X99-Pro; different from that of the X99-Deluxe. It's targeted at high-end gaming PC and mid-range content-creation builds.
To begin with, the X99-A is built in the standard ATX form-factor. It draws power from a combination of 24-pin ATX and 8-pin EPS connectors. An 8-phase VRM conditions power for the CPU, with a 2+2 phase VRM for the eight DDR4 DIMM slots flanking the CPU socket on either sides. The CPU socket is wired to three PCI-Express 3.0 x16 slots (x16/x16/NC or x16/x8/x8 on i7-5960X and i7-5930K; and x16/NC/NC or x8/x8/NC or x8/x4/x4 on i7-5820K), and a 32 Gb/s M.2 slot, which features a PCI-Express 3.0 x4 physical layer. Other expansion slots include one PCI-Express 2.0 x16 (electrical x4), and two PCI-Express 2.0 x1. The board supports 3-way NVIDIA SLI and AMD CrossFireX.
Crucial, a leading global brand of memory and storage upgrades, has expanded its DDR4 memory portfolio with LRDIMM and VLP RDIMM modules. Designed to enable next-generation enterprise environments with increased speed, bandwidth, and energy efficiency, Crucial DDR4 load reduced DIMMs (LRDIMMs) and very low profile registered DIMMS (VLP RDIMMs) are available for immediate purchase through select global channel partners.
By utilising a memory buffer chip that helps reduce the electrical load presented to the memory bus, Crucial DDR4 LRDIMMs allow for more DIMMs per channel and are up to 50 percent more energy efficient and deliver up to 50 percent more memory bandwidth than DDR3 LRDIMMs. Furthermore, by using less voltage and standby current, Crucial DDR4 LRDIMMs transmit power in a more efficient manner to the CPU, allowing for additional power savings and lower total cost of ownership.
BIOSTAR has announced the J1800NH2, a mini ITX mainboard with CPU on board, (known as System on a Chip or SoC). These boards are small and efficient using a small form factor with a fan-less embedded CPU, and have low power consumption. It's a small, quiet solution for all manner of industrial applications. The BIOSTAR J1800NH2 is the latest in all-in-one board that takes advantage of the optimized performance of Intel's Bay Trail chipset by delivering a new generation of technology with value-added features and easy integration.
The J1800NH2 board, being in the mini-ITX form factor, is backwards compatible with ATX and micro-ATX form factors. The ITX form factor allows you to build small and energy efficient solutions. The J1800NH2 is a simple, affordable and internet centric computer design in a compact 17x17cm size. It is the ideal solution for an ultra small form factor system and easily used with various chassis makes.
Intel Corporation today introduced the Intel Xeon processor E5-2600/1600 v3 product families to address the requirements of diverse workloads and the rapidly evolving needs of data centers. The new processor families include numerous enhancements that provide performance increases of up to 3x over the previous generation, world-class energy efficiency and enhanced security. To facilitate the explosive demand for software defined infrastructure (SDI), the processors expose key metrics, through telemetry, which enable the infrastructure to deliver services with the best performance, resilience and optimized total cost of ownership.
The processors will be used in servers, workstations, storage and networking infrastructure to power a broad set of workloads such as data analytics, high-performance computing, telecommunications and cloud-based services, as well as back-end processing for the Internet of Things.
At IFA, a global trade show for consumer electronics and home appliances, Intel launched the new Intel Core M processor, which will power new 2 in 1 devices from a variety of manufacturers including: Acer, ASUS, Dell, HP, Lenovo and Toshiba. Delivering the optimal blend of mobility and performance, Intel's new processor was purpose-built for amazing performance in the thinnest, fanless ultra-mobile devices. The Intel Core M processor can power razor-thin devices with Intel Core processor-level performance and deliver up to double the battery life when compared to a 4-year-old system.
"We've been on a multi-year mission to address end-user requirements and transform mobile computing," said Kirk Skaugen, senior vice president and general manager of personal computing at Intel Corporation. "The introduction of Core M marks a significant milestone in that journey. Core M is the first of a new product family designed to deliver the promise of one of the world's thinnest laptops and highest performance tablets in a single 2 in 1 device."
HP today announced a new lineup of sleek consumer PCs including, two new powerful HP ENVY x2 detachable PCs designed to deliver a notebook experience for productivity, but quickly transform to a tablet for entertainment and apps; the ultra-portable HP Pavilion x2 detachable PC designed for customers who want to simplify their life with a single device that transforms from tablet to laptop; and two new colorful HP Chromebooks that bring the power of the Chrome OS for a fast, simple, protected internet experience.
"Customers have told us they want devices that offer flexibility and performance while reflecting their personal sense of style," said Mike Nash, vice president, Product Management, Consumer Personal Systems, HP. "The products we are announcing today include innovative designs, vibrant color options, choice of operating system and computing power to enable the way that customers communicate, play and live."
Intel launched its next-generation Core i7-5000 series high-end desktop platform, consisting of socket LGA2011-V3 Core i7 processors, and compatible motherboards based on the Intel X99 Express chipset. The platform is an upscaling of the "Haswell" micro-architecture, codenamed "Haswell-E" and targets Ultra HD gamers, media professionals, and PC enthusiasts. The platform begins with the "Haswell-E" silicon, which physically features eight "Haswell" CPU cores, a staggering 20 MB of L3 cache, a quad-channel DDR4 integrated memory controller, and a 40-lane PCI-Express Gen 3.0 root complex. Three SKUs are carved out of this silicon.
The series is led by the Core i7-5960X. Intel's first eight-core processor for the high-end desktop market, this chip features HyperThreading, which enables 16 logical CPUs for the OS to play with, 20 MB of L3 cache, and clock speeds of 3.00 GHz, with 3.50 GHz maximum Turbo Boost. It commands a price of $999. Next up, is the Core i7-5930K. A six-core chip with HyperThreading that enables 12 logical CPUs, this chip features 15 MB of L3 cache, clock speeds of 3.50 GHz with 3.70 GHz maximum Turbo Boost, and a US $583 price-tag. The most affordable chip is the Core i7-5820K. At US $389, it's the cheapest six-core HEDT chip by Intel (at launch). It features 12 MB of L3 cache, and clock speeds of 3.30 GHz, with 3.60 GHz of Turbo Boost. Too good to be true? Not so fast. It features a slimmer 28-lane PCIe root complex, so certain multi-GPU configurations won't run optimally. The Intel X99 Express chipset corrects many of the shortcomings of its predecessor, the X79 Express. It features a meaty storage controller that offers ten SATA 6 Gb/s ports, one or more SATA-Express, and M.2 slots. It also integrates a 6-port USB 3.0 host controller, and two independent 4-port USB 2.0 host controllers.
Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies. Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a breakthrough that enables a lower cost and simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package. Instead of an expensive silicon interposer with TSV (through silicon via), a small silicon bridge chip is embedded in the package, enabling very high density die-to-die connections only where needed.
Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate. EMIB eliminates the need for TSVs and specialized interposer silicon that add complexity and cost. "The EMIB technology enables new on-package functionality that may have been too costly to pursue with previous solutions," said Babak Sabi, Intel vice president and director, Assembly and Test Technology Development.
Intel will price its next-generation Core i7 "Haswell-E" HEDT processors along expected lines. The lineup will begin with the Core i7-5820K, priced at US $389 - just $50 more than a Core i7-4790K. There are some major trade-offs you need to consider when choosing between the two. The i7-5820K is a six-core chip, but its motherboard and newer, costlier DDR4 memory, will jack up your overall platform costs. The i7-4790K lets you buy a motherboard as cheap as $120, and memory that's as cheap as it gets. It's now confirmed that the i7-5820K features 6 cores, 12 threads enabled by HyperThreading, a quad-channel DDR4 memory interface, and 15 MB of L3 cache, but a narrower 28-lane PCI-Express 3.0 root complex. The chip features TurboBoost frequency of 3.60 GHz.
To use the platform to its fullest, you'd need to part with at least US $583 for a processor. That's what will get you the Core i7-5930K. Also a six-core chip, the i7-5930K features a wider 40-lane PCI-Express 3.0 root complex, letting you set up 3-way and 4-way high-end multi-GPU setups with sufficient bus width for each of the cards running in tandem. The chip features 6 cores, 12 threads, a quad-channel DDR4 IMC, 15 MB of L3 cache, and TurboBoost frequencies of up to 3.70 GHz. Leading the pack is the Core i7-5960X, Intel's first eight-core high-end client CPU. It's priced at a wallet-scorching $999. For close to a grand, you get 8 cores, 16 threads enabled with HyperThreading, a massive 20 MB of L3 cache, a quad-channel DDR4 IMC, and 40 PCI-Express 3.0 lanes. To keep the eight cores within Intel's desired 140W thermal envelope, the company had to go easy on the clocks. It offers TurboBoost frequencies of up to 3.50 GHz. All three chips feature unlocked base-clock multipliers.
G.SKILL International Co., Ltd., the leading high performance memory designer and manufacturer, reveals the long awaited next generation Ripjaws 4 series DDR4 memory kits! Featuring all new redesigned heatspreaders in three different colors, high performance frequencies, high capacity, DDR4 quad-channel ready, and ultra low voltages, the Ripjaws 4 series is all the benefits of DDR4 rolled into one sleek package.
With a standard of 2133MHz, DDR4 is the next generation definition of performance. Also available in 2400MHz, 2666MHz, 2800MHz, 3000MHz, and 3200MHz, the starting lineup is continuing where DDR3 left off. With capacities starting at 16GB (4GBx4), 32GB (8GBx4 / 4GBx8) and 64GB (8GBx8), your new X99 platform will have more memory space to do what you need it to do. That's not all! Ripjaws 4 also has an ultra low voltage rating of 1.2V for kits under 2800MHz and 1.35V for 3000/3200MHz.
The USB Implementers Forum (USB-IF) today announced that it will exhibit and present the latest USB developments at Intel Developer Forum (IDF) in San Francisco, September 9-11. At IDF, the USB-IF will host a Technology Community, present technical sessions on the new USB Type-C connector, and host press briefings featuring new technology demonstrations.
Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market share for 2014 2Q.
Graphics chips are without doubt one of the most powerful, exciting, and essential components in tech today: not only does every computer require one (or more), but the technology is entering into major new markets like supercomputers, remote workstations, and simulators almost on a daily basis. New technologies and compute programs are taking advantage of the ability of GPU power to scale. On top of that, PC gaming momentum continues to build. It would be no exaggeration to say that GPUs are becoming the 800-pound gorilla in the room.
SMS Audio LLC, a premier audio headphone and accessories brand from Curtis "50 Cent" Jackson, together with Intel Corporation announced a collaboration to develop the first heart-pounding personal audio system converging lifestyle and technology innovation for an exceptional fitness experience. The SMS Audio BioSport In-Ear Headphones powered by Intel will bring smart exercise capabilities to athletes of all levels later this year.
With today's announcement, Intel and SMS Audio are merging lifestyle requirements with technology innovation to enhance the fitness experience. The SMS Audio BioSport In-Ear Headphones powered by Intel will extend the recently launched SMS Audio Sport Collection and harness advanced technology features to deliver high-quality audio while gathering actionable data on fitness progress.
