News Posts matching "Intel"

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Intel to Remove Legacy BIOS Support from Motherboard UEFI in 2020

Intel is guiding its motherboard partners to remove legacy BIOS support from their UEFI firmware by 2020. The company's client- and enterprise-platforms that come out in 2020 will lack CSM (compatibility support module), a component which lets UEFI-unaware operating systems and bootable devices run on newer machines with UEFI. Devices featuring this CSM-devoid runtime will be graded "UEFI Class 3," as the runtime only exposes UEFI or UEFI PI interfaces.

This practically marks the end of 32-bit operating systems on the newer machines, as 32-bit Windows and desktop Linux distributions require CSM. You'll still be able to use 32-bit software running on 64-bit Windows through WoW64 translation layers. The lack of CSM will also affect devices with 16-bit OpROM, such as older network adapters, and older RAID HBAs. You'll have to depend on OS-based programs to configure those devices. Newer versions of Windows Secure Boot will require UEFI Class 3 devices to function. This also affects booting with your main display plugged into graphics cards older than 4 years (launched roughly before 2013), which lack UEFI-ready video BIOS.

Intel to Bring Additional Assembly Online to Improve Supply of Coffee Lake CPUs

There were some rumors regarding an expected low availability of Intel's latest, 8th Gen "Coffee Lake" CPUs. Then, in a new report, those rumors were sort of confirmed by Newegg. Now, we have it straight from the blue giant themselves, as Intel has announced that they're adding another facility to their 8th Gen Coffee Lake production and certification facilities. Stock of Intel 8th Gen CPUs has been spotty, to say the least, and pricing of the lineup's unlocked CPUs (8600K and 8700K, which are the most interesting for enthusiasts) have been particularly affected. If current output isn't enough to satisfy demand, the oldest trick in the book is to simply improve output. And Intel is doing it.

While Intel has been mainly using its assembly and test facilities based in Malaysia, the company is adding a new, certified assembly to the list: one in Chengdu, China. That shouldn't send alarms ringing, however; Intel's assembly and test facilities are a part of Intel's Copy Exactly! (CE!) program. This means that in order to be certified, all facilities must have identical methodologies and process technologies across different production sites throughout the world - there should be no quantifiable difference in quality. Intel's customers will begin to receive the aforementioned processors assembled in China starting from December 15. There is no real way to know exactly how much difference the new assembly facility will make on the worldwide supply of Intel 8h Gen CPUs - but it should only improve.

Intel Set to Launch Their New 5G Modems in 2019

Intel today announced substantial advances in its wireless product roadmap to accelerate the adoption of 5G. Highlights include the introduction of the Intel XMM 8000 series, Intel's first family of 5G new radio (5G NR) multi-mode commercial modems, and Intel's latest LTE modem, the Intel XMM 7660. Intel also announced it has successfully completed a full end-to-end 5G call based on its early 5G silicon, the Intel 5G Modem - a key milestone in its development. Finally, the Intel XMM 7560 modem unveiled at Mobile World Congress 2017 has achieved gigabit-class speeds.

"Intel is committed to delivering leading 5G multi-mode modem technology and making sure the transition to 5G is smooth," said Dr. Cormac Conroy, Intel corporate vice president and general manager of the Communication and Devices Group. "Our investments in a full portfolio of modem technologies and products are critical to achieving the vision of seamless 5G connectivity."

Intel to Redeem 2.95% Junior Subordinated Convertible Debentures Due 2035

Intel announced today that it has issued a notice of redemption to redeem on December 18, 2017 all of its outstanding 2.95% Junior Subordinated Convertible Debentures due 2035 (CUSIP Number 458140AC4) (the "Securities"). As of November 15, 2017, approximately $1.6 billion of the Securities was outstanding.

The Securities called for redemption will be redeemed at a stated redemption price equal to 100% of the aggregate principal amount of such Securities, plus accrued and unpaid interest to (but excluding) the redemption date.

The conversion rate of the Securities as of November 16, 2017 is 37.1860 shares of Intel common stock per $1,000 principal amount of the Securities, which is equivalent to a conversion price of $26.89 per share of common stock. The Securities called for redemption may be converted at any time before 5:00 p.m., New York City time, on December 15, 2017, the business day immediately preceding the redemption date. Intel has elected to settle the conversion obligation with respect to the Securities in cash.

Live the CES 2018 Experience Like a VIP and Meet Intel CEO Brian Krzanich

Today, Intel launched a fundraising effort on Charitybuzz to benefit the Second Harvest Food Bank of Santa Clara and San Mateo counties. The company is auctioning a VIP experience at the 2018 Consumer Electronics Show in Las Vegas including travel, deluxe lodging and a backstage meet and greet with Intel CEO Brian Krzanich before his opening keynote on Jan. 8, 2018.

"CES is an incredible show for anyone interested in the future of technology, and I'm really excited to share a VIP CES experience while raising money for a great cause," Krzanich said. "The top bidder will be my guest at the show and get exclusive access to our opening keynote, exhibit space and more."

First Intel Z390 Chipset Motherboard Spotted in SANDRA Database

The first socket LGA1151 motherboard based on Intel's upcoming Z390 Express chipset was spotted on SiSoft SANDRA database. The board is SuperMicro C7Z390-PGW, a client-segment motherboard by SuperMicro under its SuperO brand. Intel is slating launch of the Z390 Express chipset for some time in the second half of 2018, following the early-2018 launches of H370 Express, B360 Express, and H310 Express.

The Z390 Express chipset adds to the feature-set of the platform, with an integrated Programmable Quad-Core Audio DSP, SoundWire digital audio interface, an integrated 10 Gbps USB 3.1 controller, integrated 802.11ac WLAN controller (with external PHY), an integrated SDIO controller (for card readers), and support for newer generation "Titan Ridge" Thunderbolt 3.0 controller.

Intel Readies Optane DIMM Roll-out for 2018

Intel has reportedly slated launch of its Optane DIMM for the second half of 2018. The Optane DIMM marks the biggest change in computer memory in over two decades, and heralds the era of "persistent memory," which combines the best characteristics of DRAM and NAND flash, in that it has the speed and low-latency of DRAM, but the persistence (ability to store data in the absence of power) of NAND flash. Combining the two will be made possible with improvements to the speed and latency of 3D XPoint memory. Intel is currently selling consumer SSDs based on the technology, and has increased production of 3D XPoint chips.

Intel presented the Optane DIMM at the 2017 USB Global Technology Conference. It described Optane DIMM as a primary storage device that will function as a memory-mapped device, but with much higher storage densities than what's possible with current DDR4 DRAM. The enterprise segment, as usual, will have the first take of the technology, with Intel targeting the exascale computing (supercomputers nearing ExaFLOP/s compute throughput) industry, trickling down to other enterprise segments, before finally making its way to the client/consumer segments. This development is also a polite nudge to the DRAM industry to get its act together, and either bring down prices or scale up densities, or miss the bus of change.

China Pulls Ahead of U.S. in Latest TOP500 List

The fiftieth TOP500 list of the fastest supercomputers in the world has China overtaking the US in the total number of ranked systems by a margin of 202 to 143. It is the largest number of supercomputers China has ever claimed on the TOP500 ranking, with the US presence shrinking to its lowest level since the list's inception 25 years ago.

Just six months ago, the US led with 169 systems, with China coming in at 160. Despite the reversal of fortunes, the 143 systems claimed by the US gives them a solid second place finish, with Japan in third place with 35, followed by Germany with 20, France with 18, and the UK with 15.

Intel, Micron Increase 3D XPoint Manufacturing Capacity Through Fab Expansion

Today, Intel and Micron announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory media, a building block of Intel Optane technology that includes Intel Optane memory for clients, the recently announced Intel Optane SSD 900P Series and new capacities and form factors of the Intel Optane SSD DC P4800X Series. A ribbon-cutting was held at the facility with Utah Gov. Gary Herbert, employees of the facility and representatives from Intel and Micron.

The IM Flash joint venture was created in 2006 to manufacture non-volatile memory for both Intel and Micron, starting with NAND for use in SSDs, phones, tablets and more. In 2015, IM Flash began manufacturing 3D XPoint technology, the first entirely new memory media in 25 years. The technology was developed to meet the quickly expanding data needs for all types of customers. 3D XPoint technology uses a crosspoint structure to deliver a cell and array architecture that can switch states significantly faster than NAND.

Fujitsu Refreshes LIFEBOOK Notebook Line with New Thin, Value-Focused Models

Fujitsu unveils a new generation of its best-selling notebook, the Fujitsu Notebook LIFEBOOK E5 and LIFEBOOK E4 series. A refreshed, slimmer design gives the business notebook line a contemporary look. Under the skin, the fully featured LIFEBOOK E5 is based on the latest Intel processors and is packed with connectivity options, ensuring secure, convenient access to corporate networks via cable, wireless or mobile networks.

All new LIFEBOOK E4 and LIFEBOOK E5 series models feature the new area type fingerprint sensor that responds instantly to provide one-touch login and system unlock. Also focusing on ease-of-use, Fujitsu introduces a precision touchpad that is more accurate, with support for three-finger gestures as featured in the latest version of Microsoft Windows 10, and a sculpted, ergonomic palm rest.

Kingmax Announces the Zeus Dragon DDR4 Memory Series

Kingmax, a memory expert, released Zeus Dragon DDR4 on November 13, 2017. This is made for gamers and DIY enthusiasts. The innovative design is integrated with aesthetics and functions which amazes everyone. Gamers can enjoy its appearance and function.

Zeus Dragon DDR4 uses aluminum alloy heat sink to effectively emit heat, therefore protecting memory and extending the service life. Zeus Dragon uses the dragon symbol blending both Eastern and Western style. The luxurious etchings present the superiority of the dragon and display the assertiveness and dignity of royalty. The dragon is above all other creatures and has extraordinary power and stunning speed. Besides its shiny scales, its powerful magic is neck and neck when it fights against Zeus, the ruler of all gods, in order to protect treasure.

MINIX Creator Andrew Tanenbaum Sends Open Letter to Intel Over MINIX Drama

We recently reported about MINIX, the hidden Unix-like OS that Intel was secretly shipping in all of their modern processors. This came as a shock to most of us and to MINIX creator Andrew Tanenbaum as well. Although Andrew wasn't completely surprised by the news, since Intel approached him couple years back asking him to make a few changes to the MINIX system. He stated in the open letter that he wasn't looking for economic remuneration, but it would have been nice if Intel had told him about their plans to distribute his operating system in their processors.

Intel Doubles Capacity of World's Most Responsive Data Center SSD

Today, Intel announced the Intel Optane SSD DC P4800X Series, the world's most responsive data center solid state drive, is now available in a new 750GB capacity in both half-height, half-length add-in card and a hot-swappable 2.5-inch U.2 form factor. Both form factors and capacities will be broadly available this month.

Increased capacity and multiple form factors expand data center implementation options and deliver both solution-level and total cost of ownership flexibility for customers. Intel Optane technology for data centers combines the attributes of memory and storage with low latency, high endurance, outstanding quality of service and high throughput, creating a new data tier that increases scale per server and reduces transaction costs.

Intel Discontinues Broadwell-E Processors

All things must come to an end, and Intel has decided that it's time to retire their Broadwell-E line of processors. The Broadwell-E family is comprised of four models: the Intel Core i7-6800K, 6850K, 6900K and 6950X. According to the Product Change Notification (PCN) document, Intel is still accepting orders until May 25, 2018, while the last shipment is scheduled for November 9 of the same year. So, there is still sufficient time left for those who plan to acquire one of the aforementioned models. However, we don't see any reason to do so now considering that there are far better options on the market.

Broadwell-E processors debuted last year and were received with mixed reactions. With just one year under their belt, they were eventually replaced by the more powerful Skylake-X models. Intel is probably getting rid of their unsold inventory of Broadwell-E models. Who knows? Maybe we'll even see some price cuts in the not-so-near future.

ECS Intros Liva Q, its Smallest 4K Capable Mini PC

Elitegroup Computer System (ECS), the global leading motherboard, Mini-PC, Notebooks and mobile device manufacturer, is proud to announce the new LIVA Q, pocket-sized mini-pc featuring Intel Apollo Lake SOC processors, along with 4GB RAM, 64GB eMMC storage and HDMI 2.0; this little monster is capable of handling 4K content playback with ease.

The new LIVA Q pocket-sized mini-pc allows you to stay connected with dual network options, a standard RJ45 LAN connector for more stabilized connection and 802.11ac + Bluetooth 4.1 for wireless connections. There's also a MicroSD card slot that support up to 128GB memory cards for those who seeks more storage and x2 USB slots for peripherals.

Intel Hires Raja Koduri, to Develop Discrete GPUs, This Time for Real

Intel hired Raja Koduri, who resigned as head of AMD's Radeon Technologies Group (RTG), earlier this week. Koduri has been made Senior Vice President and Chief Architect of Intel's future discrete GPUs. That's right, Intel has renewed its dreams to power high-end graphics cards that compete with AMD and NVIDIA. Intel's last attempt at a discrete GPU was "Larrabee," which evolved into a super-scalar multi-core processor for HPC applications under the Xeon Phi line.

This development heralds two major theories. One, that Intel's collaboration with AMD RTG on graphics IP could only go further from here, and what is a multi-chip module of Intel and AMD IP now, could in the future become a true heterogeneous die of Intel's and AMD's IP. Two, that the consolidation of AMD's graphics assets and IP into a monolithic entity as RTG, could make it easier to sell it lock, stock, and barrel, possibly to Intel.

Latest Intel Graphics Driver Enables Netflix HDR

Intel today released its latest Graphics Driver for Windows (GDW). Version 15.60 WHQL (15.60.0.4849), which is applicable for integrated graphics embedded into 6th generation "Skylake," 7th generation "Kaby Lake," and 8th generation "Coffee Lake" processors. The drivers are WDDM 2.3 compliant (Windows 10 Fall Creators Update), and add support for Netflix HDR and YouTube HDR on Windows 10. The drivers also add support for 10-bpc (1.07 billion colors) displays over HDMI, and adds video decode hardware acceleration for several formats introduced after DirectX 12.

For those with beefier Iris Pro graphics, Intel GDW 15.60 adds optimization for "Middle-earth: Shadow of War," "Pro Evolution Soccer 2018," "Call of Duty: WWII," "Destiny 2," and "Divinity: Original Sin." As a WDDM 2.3 compliant driver, version 15.60 enables Windows Mixed Reality headsets plugged into the integrated graphics connectors. Download the driver from the link below.
DOWNLOAD: Intel Graphics Driver for Windows 15.60

Intel Xeon Scalable Processors Supercharge Amazon Web Services

Intel Xeon Scalable processors are deployed by today's cloud service providers to deliver disruptive performance efficiency across a diverse range of cloud workloads. Today, Intel announced Amazon Web Services' (AWS) public cloud customers can now harness the workload-optimized performance that the Intel Xeon Scalable platform delivers in Amazon's latest cloud instance. Available now, the Amazon EC2 C5 instances are AWS' latest generation, most powerful compute-optimized instances with the best price-to-compute performance.

Intel Xeon Scalable processors are highly agile, high-performance compute engines that allow public cloud environments to seamlessly transition among general purpose compute, high-performance computing (HPC) and AI/deep learning compute. This agility provides public cloud users a wide range of options for their target workloads. Intel Xeon Scalable processors are uniquely architected for today's evolving cloud data center infrastructure, offering energy efficiency and system-level performance that average 1.65x higher performance over the prior generation Xeon processors.

Kontron Releases the KBox C-102-4 with Four PCIe Slots

Kontron, a leading global provider of Embedded Computing Technology (ECT), introduces a new member of its high-end industrial computer platforms for control cabinet environments - the Kontron KBox C-102-4. The new model allows the integration of up to four PCIe expansions slots and is thus ideally suited for users requiring a large number of additional interfaces, industrial I/Os, or fieldbuses.

The KBox C-102 series is now available in four alternative design variants: the compact KBox C-102-0 without additional expansion slots, the KBox C-102-1 and KBox C-102-2 with one or two PCI(e) expansion slots respectively, and the new KBox C-102-4 with four PCI(e) expansion slots. The industrial computers are used mainly for control, visualization, and inspection in the production process.

Intel, AMD MCM Core i7 Design Specs, Benchmarks Leaked

Following today's surprise announcement of an Intel-AMD collaboration (of which NVIDIA seems to be the only company left in a somewhat more fragile position), there have already been a number of benchmark leaks for the new Intel + AMD devices. While Intel's original announcement was cryptic enough - to be expected, given the nature of the product and the ETA before its arrival to market - some details are already pouring out into the world wide web.

The new Intel products are expected to carry the "Kaby Lake G" codename, where the G goes hand in hand with the much increased graphics power of these solutions compared to other less exotic ones - meaning, not packing AMD Radeon graphics. For now, the known product names point to one Intel Core i7-8705G and Intel Core i7-8809G. Board names for these are 694E:C0 and 694C:C0, respectively.

Intel Announces "Coffee Lake" + AMD "Vega" Multi-chip Modules

Rumors of the unthinkable silicon collaboration between Intel and AMD are true, as Intel announced its first multi-chip module (MCM), which combines a 14 nm Core "Coffee Lake-H" CPU die, with a specialized 14 nm GPU die by AMD, based on the "Vega" architecture. This GPU die has its own HBM2 memory stack over a 1024-bit wide memory bus. Unlike on the AMD "Vega 10" and "Fiji" MCMs, in which a silicon interposer is used to connect the GPU die to the memory stacks, Intel deployed the Embedded Multi-Die Interconnect Bridge (EMIB), a high-density substrate-level wiring. The CPU and GPU dies talk to each other over PCI-Express gen 3.0, wired through the package substrate.

This multi-chip module, with a tiny Z-height, significantly reduces the board footprint of the CPU + discrete graphics implementation, when compared to having separate CPU and GPU packages with the GPU having discrete GDDR memory chips, and enables a new breed of ultra portable notebooks that pack a solid graphics muscle. The MCM should enable devices as thin as 11 mm. The specifications of the CPU and dGPU dies remain under the wraps. The first devices with these MCMs will launch by Q1 2018.
A video presentation follows.

Intel CPU On-chip Management Engine Runs on MINIX

With the transition to multi-core processors, and multi-core processors with integrated core-logic (chipset), the need arose for a low-level SoC embedded into the processor with just enough compute power to make sure all the components you pay for start-up and function as advertised. Enter the Intel ME (management engine). This is a full-fledged computer within your Intel processor, which isn't exposed to you. It runs on its very own tiny x86 CPU core that isn't exposed, and its software is driven on an infinitesimally small ROM and RAM. Since you can't have software without some sort of operating-system, Intel chose MINIX for the job.

MINIX is a Unix-like OS with an extremely small memory footprint. The OS was designed by Andrew Tanenbaum, originally as an educational tool to demonstrate that machines can still be built with extremely tiny code. If you're familiar with the "ring-level" system of hardware-access privilege by software, ring 0 would designate the "highest" level of access. A software with ring 0 access can erase your disk, flash your system BIOS, and even make your CPU run at any C-state. The OS kernel needs these privileges, and hence is a ring 0 software. Most user software, like the web-browser you're reading this on, runs at ring 3 (with the browser's own sandbox, the user-level, and API level forming inner levels). Intel ME runs at ring -3 (negative 3), and your OS has no power over it. Most system BIOS updates for Intel motherboards include a ROM update for ME. ME governs the functioning of the rest of the processor, its start-up, and booting. It also governs silicon-level security and management features that can't be compromised by malware.

Intel Launches High-Density ARM-based Stratix 10 FPGA on 14 nm

Intel today announced it has begun shipping its Intel Stratix 10 SX FPGA - the only high-end FPGA family with an integrated quad-core ARM Cortex-A53 processor. With densities greater than 1 million logic elements (MLE), Intel Stratix 10 SX FPGAs provide the flexibility and low latency benefit of integrating an ARM processor with a high-performance, high-density FPGA needed to tackle the design challenges of next-generation, high-performance systems.

By integrating the FPGA and the ARM processor, Intel Stratix 10 SX FPGAs provide an ideal solution for 5G wireless communication, software defined radios, secure computing for military applications, network function virtualization (NFV) and data center acceleration.

HP and Intel Become Official Overwatch League Sponsors

Tech leaders HP Inc. and Intel today joined forces with Blizzard Entertainment in major Overwatch League sponsorship deals that represent an extended investment in the groundbreaking professional league. As part of the multiyear agreements, Intel will sponsor future Overwatch competitive events in addition to the Overwatch League. Players taking part in these events will be equipped with cutting-edge gaming hardware from both HP and Intel. HP, and more specifically, its OMEN by HP gaming PCs and displays will be used exclusively for Overwatch League games, with PCs powered by Intel Core i7 processors.

"We're thrilled to be joining forces with HP and Intel to ensure that the teams competing professionally in Overwatch are equipped with top-end technology," said Pete Vlastelica, president & CEO of Blizzard Entertainment's Major League Gaming division. "Multiyear collaborations such as this illustrate the momentum behind the Overwatch League as well as a long-term commitment by us and our partners in what we see as the future of esports."

Intel 10 nm CPUs to See Very Limited Initial Launch in 2017

UPDATE: Some slides have surfaced today on Reddit that actually place Intel's updated 10 nm roadmap as starting initial risk production in 2Q 2018. The same leaks also point towards a yearly advancement in process technology (akin to Intel's current 14 nm+ and 14 nm++ production processes), with 10 nm+ risk production on 1Q 2019 and 10 nm++ on 1Q 2020. This roadmap, however, is relative to Intel's Custom Foundry partners; as such, this doesn't go directly against Intel CEO's Brian Kzarnich remarks on the latest investor call, since he was likely talking about the 10 nm ramp-up on Intel's own products.

Intel CEO Brian Krzanich has come out to say that the company's first 10 nm CPUs based on the "Cannon Lake" micro-architecture will see the light of day before this year's end. Intel has been having a slew of ramp-up delays with its 10 nm products, which prompted a slippage from an expected 2016, full-scale launch (whose ship has sailed, clearly) towards a timed, product-tier based strategy. Intel opted to first introduce 10 nm technology to FPGA accelerators, which due to their redundancy, would suffer less from yield issues.
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