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Bad Intel Quality Assurance Responsible for Apple-Intel Split?

Apple's decision to switch from Intel processors for its Mac computers to its own, based on the Arm architecture, has shaken up the tech world, even though rumors of the transition have been doing rounds for months. Intel's first official response, coupled with facts such as Intel's CPU technology execution being thrown completely off gear due to foundry problems; pointed toward the likelihood of Intel not being able to keep up with Apple's growing performance/Watt demands. It turns out now, that Intel's reasons are a lot more basic, and date back to 2016.

According to a sensational PC Gamer report citing former Intel principal engineer François Piednoël, Apple's dissatisfaction with Intel dates back to some of its first 14 nm chips, based on the "Skylake" microarchitecture. "The quality assurance of Skylake was more than a problem," says Piednoël. It was abnormally bad. We were getting way too much citing for little things inside Skylake. Basically our buddies at Apple became the number one filer of problems in the architecture. And that went really, really bad. When your customer starts finding almost as much bugs as you found yourself, you're not leading into the right place," he adds.

Intel Gives its First Comments on Apple's Departure from x86

Apple on Monday formalized the beginning of its departure from Intel x86 machine architecture for its Mac computers. Apple makes up to 4 percent of Intel's annual CPU sales, according to a MarketWatch report. Apple is now scaling up its own A-series SoCs that use Arm CPU cores, up to performance levels relevant to Macs, and has implemented support for not just new and upcoming software ported to the new Arm machine architecture, but also software over form the iOS and iPadOS ecosystems on Mac, starting with its MacOS "Big Sur" operating system. We reached out to Intel for some of its first comments on the development.

In a comment to TechPowerUp, an Intel spokesperson said "Apple is a customer across several areas of our business, and we will continue to support them. Intel remains focused on delivering the most advanced PC experiences and a wide range of technology choices that redefine computing. We believe Intel-powered PCs—like those based on our forthcoming Tiger Lake mobile platform—provide global customers the best experience in the areas they value most, as well as the most open platform for developers, both today and into the future."

Acer Announces Swift 5 Notebooks Powered by Intel "Tiger Lake" Processors

Acer today announced its new Swift 5 notebook that offers a new take on productivity, powerful yet light enough to be carried around throughout the day. The ultraportable device is a beacon of both design and performance, sporting a professional aesthetic that is backed up by impressive functionality. This year's model features ultra-narrow bezels that allow for a 90% screen-to-body ratio, a touchscreen with Antimicrobial Corning Gorilla Glass and new colors, such as mist green.

"The new Swift 5 pushes the envelope on what thin-and-light notebooks can be," said James Lin, General Manager, Notebooks, IT Products Business, Acer Inc. "A productivity powerhouse housed in a sleek and ultraportable chassis, the Swift 5 is an excellent option for professionals who are always on the move and seeking a device capable of keeping up with them."

Intel Plans to Volume Manufacture Nanowire/Nanoribbon Transistors in Five Years

Semiconductor manufacturing is a hard business. There is a constant need for manufacturers to compete with each other and if they don't, they get left behind. Intel, as one of the biggest semiconductor makers in the world, is always trying to invent new technologies spending massive R&D funds on semiconductors. New technologies such as nanowire/nanoribbon transistors, which are supposed to enable transistor sizes unimaginable now, are on its way to make it in the hand of consumers. During the international VLSI conference, Intel's CTO Mike Mayberry held a presentation about how Intel plans to address the demand for more compute by showing off new technologies.

With a presentation titled "The Future of Compute", Mr. Mayberry made some exciting claims and predictions. So far, we have been used to FinFET transistors since the 22 nm node from Intel. However, as nodes get smaller the gate of the transistor is not enough to keep it from switching randomly. So to avoid that problem Intel, along with other semiconductor manufacturers like Samsung, created a solution called Gate-All-Around FET (GAAFET). This technology takes a transistor fin and wraps in around all sides (see picture below), so the gate has better switching control, preventing random switching and errors. As a fin, nanowire or nanosheet (wider option from nanowire) can be used and they can be stacked. These allow for additional control of tailoring whatever a node will be used for high performance or low power. Intel predicts that they will start high volume manufacturing of silicon based on this technology in five years. This is setting an important milestone for Intel as well as other industry players, as now everyone will rush to deliver it first. It is now a waiting game to see who will actually come out with it first.
Intel Nanowire/Nanoribbon Samsung GAAFET

Intel oneAPI Gets its First Academic Center of Excellence

The Swedish e-Science Research Center (SeRC) announced that it has extended its support of the oneAPI initiative as Intel's first oneAPI academic center of excellence (COE). Hosted at Stockholm University and the KTH Royal Institute of Technology, the center will use oneAPI's unified and heterogeneous programming model to accelerate research conducted with GROMACS, a widely-used free and open-source application designed for molecular dynamics simulation.

As a oneAPI COE, SeRC will work closely with Intel engineers on oneAPI performance optimizations across CPUs and GPUs used to investigate scenarios that would be extremely difficult to replicate in a traditional lab. This work will allow researchers using GROMACS to take full advantage of upcoming exascale machines powered by oneAPI to deliver unprecedented visibility into the molecular mechanisms of life.

GIGABYTE Launches R292 Servers Supporting 4-way 3rd Gen Intel Xeon Scalable Processors

GIGABYTE, an industry leader in high-performance servers and workstations, today announced the launch of the GIGABYTE R292 servers featuring four 3rd Gen Intel Xeon Scalable processors, supporting four double-slot accelerators in the R292-4S0, and eight full-height half-length expansion cards in the R292-4S1.

The R292 series server supports four 3rd Gen Intel Xeon Scalable processors. Each processor can perform data transfer or share workload at 20.8GT/s with the other three processors on the motherboard. Its breakthrough computing power can be used to power mission-critical application at scale and analyze growing data at extraordinary speeds.

Intel Announces "Cooper Lake" 4P-8P Xeons, New Optane Memory, PCIe 4.0 SSDs, and FPGAs for AI

Intel today introduced its 3rd Gen Intel Xeon Scalable processors and additions to its hardware and software AI portfolio, enabling customers to accelerate the development and use of AI and analytics workloads running in data center, network and intelligent-edge environments. As the industry's first mainstream server processor with built-in bfloat16 support, Intel's new 3rd Gen Xeon Scalable processors makes artificial intelligence (AI) inference and training more widely deployable on general-purpose CPUs for applications that include image classification, recommendation engines, speech recognition and language modeling.

"The ability to rapidly deploy AI and data analytics is essential for today's businesses. We remain committed to enhancing built-in AI acceleration and software optimizations within the processor that powers the world's data center and edge solutions, as well as delivering an unmatched silicon foundation to unleash insight from data," said Lisa Spelman, Intel corporate vice president and general manager, Xeon and Memory Group.

Lenovo Launches New ThinkPad P Series Mobile Workstations, Premiering Ultra Performance Mode

Lenovo is building on the reliability and performance of its mobile workstations, launching the next generation of the ThinkPad P Series: the ThinkPad P15, ThinkPad P17, ThinkPad P1 Gen 3 and the all new ThinkPad P15v. In addition, the ThinkPad X1 Extreme Gen 3 will also make its debut, as the most powerful X Series commercial laptop. All equipped with high-performance 10th Gen Intel H series mobile processors and wrapped in an enhanced design, these new ThinkPads are available in versatile configurations, giving users more autonomy over their experience.

The ThinkPad P Series and the ThinkPad X1 Extreme Gen 3 will feature the new Ultra Performance Mode, exclusive to these systems, allowing users to take full control of their performance settings. Understanding the need to complete a render as fast as possible or demo high-fidelity VR content while maintaining a stable framerate, users can now dial up the system, ensuring peak performance.

Intel Elects Dion J. Weisler to Board of Directors

Intel Corporation today announced that Dion J. Weisler, former president and CEO of HP Inc., was elected to Intel's board of directors. Weisler will serve as an independent director and member of the compensation and finance committees. "We are excited to welcome Dion to the board," said Intel Chairman Omar Ishrak. "He brings a deep understanding of the Intel customer experience and a wealth of technical industry knowledge spanning client, cloud and network computing. Dion also shares Intel's strong commitment to corporate responsibility, having championed diversity and inclusion as well as sustainability while leading HP."

Weisler, 52, has extensive global executive experience, including serving as the president and chief executive officer of HP Inc. from 2015 to 2019. Prior to that, he held senior executive roles at HP Co. and Lenovo Group Inc., where he was responsible for various operations in Asia Pacific and globally. His experience also includes management positions with Telstra Corp. Ltd., a telecommunications company, and Acer Inc. Weisler also has significant public company board experience. This includes serving on the HP Inc. board from 2015 to May 2020. He currently serves as a director on the boards of Thermo Fisher Scientific Inc. and BHP.

Lenovo Delivers on 5G Computing with Leading Global Network Operators

Lenovo is blazing a path for mass adoption of ultra-fast, low-latency laptop connectivity through a series of mobile network operator partnerships committed to making 5G computing a reality for consumers around the world. On the heels of the earlier unveiling of the Lenovo Yoga 5G (known as Lenovo Flex 5G in the US)—the world's first 5G PC in market—Lenovo has formed strategic partnerships with leading 5G service providers around the world: Verizon, EE, Sunrise and CMCC. Powered by the Qualcomm ️ Snapdragon 8cx 5G compute platform, the Yoga 5G laptop delivers high-speed 5G network connectivity (through a 5G service provider) that's up to 10 times faster than 4G.

"Lenovo introduced the world's first 5G laptop in market to equip the mobile generation with smarter technology for always-on connectivity and computing. The hardware is just the first step," says Johnson Jia, Senior Vice President and General Manager of the Consumer Business Segment in Lenovo's Intelligent Devices Group. "With our strategic partnerships with global 5G network carriers, consumers will now be able to access easier, faster and more secure connectivity seamlessly from virtually anywhere. As 5G computing holds the power to transform user experiences, we believe it can ultimately disrupt the PC industry for the better."

CORSAIR Announces the Vengeance Range of Gaming Desktops

CORSAIR, a world leader in high-performance gaming peripherals and enthusiast components, today announced the launch of the new CORSAIR VENGEANCE a4100 and i4200 Series Gaming PCs, delivering outstanding gaming performance, eye-catching aesthetics, and easy upgradeability with either an AMD Ryzen 3000 Series processor or a 10th Gen Intel Core processor and GeForce RTX -powered graphics from NVIDIA. Equipped with renowned CORSAIR components and ready to game, stream, or both, the new VENGEANCE systems set a high bar for prebuilt gaming PCs.

The CORSAIR VENGEANCE a4100 Series is the latest system in the VENGEANCE line to boast the power of AMD Ryzen, achieving outstanding single-threaded and multi-threaded performance thanks to an AMD Ryzen 7 3700X CPU. An NVIDIA GeForce RTX 2070 SUPER graphics card outputs incredibly lifelike graphics with real-time ray-tracing technology. In a first for the CORSAIR VENGEANCE line of systems, the a4100 is available with a pre-installed Elgato 4K60 PRO capture card, perfect for content creators looking to record or stream their gameplay out-of-the-box. With reliable CORSAIR components such as 16 GB of 3,200 MHz VENGEANCE RGB PRO memory, a Hydro Series H60 Liquid CPU cooler, and an RM750 80 PLUS Gold-rated power supply, the VENGEANCE a4100 is ready to tackle today's most demanding games while you share the action with the world.

Supply Chain Confused with Intel, AMD, and NVIDIA Launch Dates

According to the report from DigiTimes, which cites industry sources, the global supply chain of Intel, AMD, and NVIDIA has been rather confused recently by their launch dates and launch procedures. Due to worldwide pandemic, there are no electronics shows like Computex that are designed for companies to showcase their products there, and thus, there is no unified launch window where you can expect a product to be launched. What's even worse is the fact that the companies have now started to keep their launch dates as a secret in the latest edition of playing with the competition. Launch dates have started to change and now the launch is uncertain even if the launch day is provided.

This has a massive effect on the industry supply chain. By not giving concrete dates to them, companies have left them to wonder when the product will launch. This is hurting their ability to prepare themselves for an upcoming product and possibly cause some delays later on. If not given enough time, the supply chain could not adapt fast enough and the product could come later in the hands of consumers.

Intel Showcases Intelligent Edge and Energy-efficient Performance Research

This week at the 2020 Symposia on VLSI Technology and Circuits, Intel will present a body of research and technical perspectives on the computing transformation driven by data that is increasingly distributed across the core, edge and endpoints. Chief Technology Officer Mike Mayberry will deliver a plenary keynote, "The Future of Compute: How Data Transformation is Reshaping VLSI," that highlights the importance of transitioning computing from a hardware/program-centric approach to a data/information-centric approach.

"The sheer volume of data flowing across distributed edge, network and cloud infrastructure demands energy-efficient, powerful processing to happen close to where the data is generated, but is often limited by bandwidth, memory and power resources. The research Intel Labs is showcasing at the VLSI Symposia highlights several novel approaches to more efficient computation that show promise for a range of applications - from robotics and augmented reality to machine vision and video analytics. This body of research is focused on addressing barriers to the movement and computation of data, which represent the biggest data challenges of the future," said Vivek K. De, Intel fellow and director of Circuit Technology Research, Intel Labs.

Intel CET Answers Call to Protect Against Common Malware Threats

The security of our customers' data is a top priority at Intel. As part of Intel's Security First Pledge, our engineers continue to deliver advancements to help safeguard our technology from evolving cyber-threats. It begins with designing and engineering security features into our products and continues in our work with the industry to move security innovation forward.

Today, we are announcing a new security capability. Intel Control-Flow Enforcement Technology (Intel CET) will be first available on Intel's upcoming mobile processor code-named "Tiger Lake." Intel CET delivers CPU-level security capabilities to help protect against common malware attack methods that have been a challenge to mitigate with software alone.

Jim Keller Resigns from Intel

Intel today announced that systems designer-extraordinaire Jim Keller has departed the company citing personal reasons. Whether or not this is a blow to Intel likely depends on how far Jim Keller brought their Technology, Systems Architecture and Client Group throughout his two-year tenure at the company whilst serving as its Vice President. The semiconductor and chip architecture world isn't being driven by Mr. Keller himself, obviously; there are a number of architects and designers that bring the industry forward through their concerted efforts. However, it's hard to look past Jim Keller's pedigree when it comes to doing his job - if anything, AMD's Zen architecture is a testament to that, and has put Intel in the place we now see it in the CPU world.

To fill in the void, Intel has announced a reshuffling inside their Technology, Systems Architecture and Client Group. Jim Keller will still be serving with Intel for the next six months as a consultant, thus easing the transition. Read the full press-release below.

Intel "Rocket Lake-S" a Multi-Chip Module of 14nm Core and 10nm Uncore Dies?

VLSI engineer and industry analyst, @chiakokhua, who goes by "Retired Engineer" on Twitter, was among the very first voices that spoke about 3rd gen Ryzen socket AM4 processors being multi-chip modules of core- and uncore dies built on different silicon fabrication processes, which was an unbelievable theory at the time. He now has a fantastic theory of what "Rocket Lake-S" could look like, dating back to November 2019, which is now re-surfacing on tech communities. Apparently, Intel is designing these socket LGA1200 processors to be multi-chip modules, similar to "Matisse" in some ways, but different in others.

Apparently, "Rocket Lake-S" is a multi-chip module of a 14 nm die that holds the CPU cores; and 10 nm die that holds the uncore components. AMD "Matisse" and "Vermeer" too have such a division of labor, but the CPU cores are located on dies with a more advanced silicon fabrication process (7 nm), than the die with the uncore components (12 nm).

Intel Launches Lakefield Hybrid Processors: Uncompromised PC Experiences for Innovative Form-Factors

Today, Intel launched Intel Core processors with Intel Hybrid Technology, code-named "Lakefield." Leveraging Intel's Foveros 3D packaging technology and featuring a hybrid CPU architecture for power and performance scalability, Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility across productivity and content creation experiences for ultra-light and innovative form factors.

"Intel Core processors with Intel Hybrid Technology are the touchstone of Intel's vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs. Combined with Intel's deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future," said Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms.

CrossTalk is Another Intel-exclusive Security Vulnerability

Intel has had quite a lot of work trying to patch all vulnerabilities discovered in the past two years. Starting from Spectre and Meltdown which exploited speculative execution of the processor to execute malicious code. The entire process of speculative execution relies on the microarchitectural technique for adding more performance called speculative branch prediction. This technique predicts branch paths and prepared them for execution, so the processor spends less time figuring out where and how will instructions flow through the CPU. So far, lots of these bugs have been ironed out with software, but a lot of older CPUs are vulnerable.

However, an attacker has always thought about doing malicious code execution on a CPU core shared with the victim, and never on multiple cores. This is where the new CrossTalk vulnerability comes in. Dubbed Special Register Buffer Data Sampling (SRBDS) by Intel, it is labeled as CVE-2020-0543 in the vulnerability identifier system. The CrossTalk is bypassing all intra-core patches against Spectre and Meltdown so it can attack any CPU core on the processor. It enables attacker-controlled code execution on one CPU core to leak sensitive data from victim software executing on a different core. This technique is quite dangerous for users of shared systems like in the cloud. Often, one instance is shared across multiple customers and until now they were safe from each other. The vulnerability uses Intel's SGX security enclave against the processor so it can be executed. To read about CrossTalk in detail, please visit the page here.
Intel Meltdown and Spectre

Apple to Announce its own Mac Processor at WWDC (Late June)

Apple is planning to launch its own high-performance processors designed for Macs at the 2020 WWDC, held in the week of 22 June, 2020. This would be the the first step among many toward the replacement of Intel processors and the x86 machine architecture from the Apple Mac ecosystem, in the same fashion as the company replaced PowerPC with x86 last decade. Apple has codenamed the process of graduating to the new machine architecture "Kalamata," and besides detailing the new processor and its architecture, the company could announce a large-scale developer support initiative to help Mac software vendors to transition to the new architecture in time for the first Macs with the new processors to roll out in 2021.

A Bloomberg report on the new processors states that the chips will be based on the "same technology" as the company's A-series SoCs for iOS devices, meaning that Apple will leverage the Arm machine architecture, and has probably developed a high performance CPU core that can match Intel's x64 cores in IPC and efficiency. Macs based on the new processors, will however run MacOS and not iOS, which means much of the clean-break transition woes between PPC and x86 Macs are bound to return, but probably better managed by software vendors. It also remains to be seen how Apple handles graphics. The company could scale up the Metal-optimized iGPU found in its A-series SoCs on its new Mac processor, while also giving them the platform I/O capability to support discrete graphics from companies such as AMD.

Axiomtek Releases Intel SDM-based 15.6-inch Modular Panel PCs

Axiomtek - a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to launch the ITC150WM-300S and ITC150WM-500L, two 15.6-inch modular panel PCs with a swappable signage computer module which is based on the newest Intel Smart Display Module (Intel SDM) architecture. The swappable design makes the system maintenance easier in field replacement and upgrade. The ITC150WM-300S and ITC150WM-500L have a 15.6-inch full HD LCD display with 1920 x 1080 resolution, a 10-point projected capacity touchscreen, 300 nits of high brightness and LED backlights. The thickness of both interactive panel PCs is less than 40 mm, which is suitable for use in a space-constrained environment.

Another Nail on Intel Kaby Lake-G Coffin as AMD Pulls Graphics Driver Support

Kaby Lake-G was the result of one of the strangest collaborations in the industry - though that may not be a just way of looking at it. It made total sense at the time - a product that combined the world's best CPU design with one of the foremost graphics architectures seems a recipe for success. However, the Intel-AMD collaboration was an unexpected one, as these two rivals were never expected to look eye to eye in any sort of meaningful way. Kaby Lake-G was revolutionary in how it combined both AMD and Intel IP in an EMIB-capable design, but it wasn't one built to last.

Now, after Intel has announced a stop to product manufacturing and order capacity, it's come the time for AMD to pull driver support. The company's latest Windows 10 version 2004 update-compatible drivers don't install on Kaby Lake-G powered systems, citing an unsupported hardware configuration. Tom's Hardware contacted Intel, who said they're working with AMD to bring back "Radeon graphics driver support to Intel NUC 8 Extreme Mini PCs (previously codenamed "Hades Canyon")." AMD, however, still hasn't commented on the story.

Intel Posts 10th Gen Core Power Limit and Tau Values

Intel today updated the public data-sheet of its 10th Gen Core "Comet Lake-S" desktop processor to reveal precise power limit and tau values of each specific SKU. PL 1 or power level 1 is interchangeable with the processor's TDP as a power value. PL 1 is sufficient for a processor to sustain its base frequency (nominal clocks). For example, a processor with 65 W TDP has PL 1 at 65 W. PL 2 is what affords the processor the power to seek out boost frequencies. This value varies with between model to model, with the unlocked K/KF SKUs getting higher PL 2 values than the locked ones. The company also disclosed Tau. This is a timing variable that tells the processor how long (in seconds) can it stay within PL 2, before having to retreat to PL 1.

Intel "Sapphire Rapids," "Alder Lake" and "Tremont" Feature CLDEMOTE Instruction

Intel's three upcoming processor microarchitectures, namely the next-generation Xeon "Sapphire Rapids," Core "Alder Lake," and low-power "Tremont" cores found in Atom, Pentium Silver, Celeron, and even Core Hybrid processors, will feature a new instruction set that aims to speed up processor cache performance, called CLDEMOTE "cache line demote." This is a means for the operating system to tell a processor core that a specific content of a cache (a cache line), isn't needed to loiter around in a lower cache level (closer to the core), and can be demoted to a higher cache level (away from the core); though not flushed back to the main memory.

There are a handful benefits to what CLDEMOTE does. Firstly, it frees up lower cache levels such as L1 and L2, which are smaller in size and dedicated to a CPU core, by pushing cache lines to the last-level cache (usually L3). Secondly, it enables rapid load movements between cores by pushing cache lines to L3, which is shared between multiple cores; so it could be picked up by a neighboring core. Dr. John McCalpin from UT Austin wrote a detailed article on CLDEMOTE.

Intel "Tiger Lake" vs. AMD "Renoir" a Pitched Battle on 3DMark Database

Intel's 11th generation Core i7-1165G7 "Tiger Lake-U" processor armed with 4 "Willow Cove" cores and Gen12 Xe graphics fights a pitched battle against AMD Ryzen 7 4800U "Renoir" (8 "Zen 2" cores and Radeon Vega 8 graphics), courtesy of some digging by Thai PC enthusiast TUM_APISAK. The 4800U beats the i7-1165G7 by a wafer-thin margin of 1.9% despite double the CPU core-count and a supposedly advanced iGPU, with 6331 points as against 6211 points of the Intel chip, in 3DMark 11. A breakdown of the score reveals fascinating details of the battle.

The Core i7-1165G7 beats the Ryzen 7 4800U in graphics tests, with a graphics score of 6218 points, against 6104 points of the 4800U, resulting in a 1.9% lead. In graphics tests 1, 2, and 3, the Gen12 Xe iGPU is 7.3-8.9% faster than the Radeon Vega 8, through translating to 2-4 FPS. The Intel iGPU crosses the 30 FPS mark in these three tests. With graphics test 4, the AMD iGPU ends up 8.8% faster. Much of AMD's performance gains come from its massive 55.6% physics score lead thanks to its 8-core/16-thread CPU, which ends up beating the 4-core/8-thread "Willow Cove," with the 4800U scoring 12494 points compared to 8028 points for the i7-1165G7. This CPU muscle also plays a big role in graphics test 4. This battle provides sufficient basis to speculate that "Tiger Lake-U" will have a very uphill task matching "Renoir-U" chips such as the Ryzen 7 4800U, and the upcoming Ryzen 9 4900U (designed to compete with the i7-1185G7).

No Intel "Rocket Lake-S" or "Ice Lake-X" This Year?

A roadmap slide from an Intel Partner Connect presentation suggests that the company's client-segment processor lineup will be unchanged for the rest of 2020, with the company briskly launching its 10th generation "Comet Lake-S" desktop processor lineup through May-June, and "Comet Lake-H" a month prior. The Core X "Cascade Lake-X" processor lineup will continue to lead the company in the high core-count HEDT segment, with no indications of new models, at least none higher than 18 cores.

More importantly, this slide dulls expectations of the company refreshing its desktop process segment just before Holiday 2020 with the 11th generation "Rocket Lake-S" silicon that has next-gen "Willow Cove" CPU cores, Gen12 Xe integrated graphics, and PCIe gen 4.0 connectivity, especially with engineering samples of the chips already hitting the radar. Intel is expected to launch 10 nm "Ice Lake-SP" Xeon enterprise processors in 2020, and there was hope for some of this IP to power Intel's next HEDT platform, the fabled "Ice Lake-X," especially with AMD's "Castle Peak" 3rd gen Threadrippers dominating this segment. While there's little doubt that the slide may have originated from Intel, its context must be studied. Partner Connect is a platform for Intel to interact with its channel partners (distributors, retailers, system integrators, etc), and information about future products is far more restricted on these slides, than presentations intended for large OEMs, motherboard manufacturers, etc. Then again, with the COVID-19 pandemic throwing supply chains off rails, it wouldn't surprise us if this slide spells Gospel.
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